JP2010237640A - Optical module and cable with the module - Google Patents

Optical module and cable with the module Download PDF

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JP2010237640A
JP2010237640A JP2009232025A JP2009232025A JP2010237640A JP 2010237640 A JP2010237640 A JP 2010237640A JP 2009232025 A JP2009232025 A JP 2009232025A JP 2009232025 A JP2009232025 A JP 2009232025A JP 2010237640 A JP2010237640 A JP 2010237640A
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optical
photoelectric conversion
circuit board
conversion unit
module
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Koji Azegami
幸士 畔上
Naoki Kimura
直樹 木村
Masahito Takigahira
将人 瀧ヶ平
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Fujikura Ltd
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Fujikura Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical module capable of increasing an information transmission amount and achieving miniaturization, and to provide a cable with the module. <P>SOLUTION: The optical module 1 is assembled at the end portion of an photoelectric composite cable 4 including an optical transmission path 2 and an electric wire 3. The optical module 1 includes: a circuit board 8; a photoelectric conversion part 9 connected to the circuit board 8; and an electric connector 5 which can be connected to another device. The electric wire 3 can be electrically connected to the electric connector 5 through circuit wiring when connected to the circuit board 8. The optical transmission path 2 includes an optical axis crossing the optical axis of the photoelectric conversion part 9 with a predetermined angle, and the path 2 is optically connected to the photoelectric conversion part 9 through an optical coupling part 13. The optical coupling part 13 is made of a transparent resin, and tightly adhered to the light receiving/emitting part of the photoelectric conversion part 9 and the end portion of the optical transmission path 2, respectively. The outer resin surface of the optical coupling part 13 is recessed toward the light receiving/emitting part of the photoelectric conversion part 9 and toward the end portion of the light transmission path 2. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、光通信技術、光伝送技術、光情報記録技術に用いられる光モジュールおよびこれを用いたモジュール付きケーブルに関する。   The present invention relates to an optical module used for optical communication technology, optical transmission technology, and optical information recording technology, and a cable with a module using the same.

機器間の光伝送を行うには、例えば電気信号と光信号とを変換する光モジュールを各機器に設け、この光モジュールに光コネクタを介して光ファイバケーブルを接続し、この光ファイバケーブルにより光信号の送受信を行う方式を用いることができる。
この方式では、光モジュールに着脱される光コネクタに汚れや異物が付着すると信号の劣化が起こるという問題があるため、光モジュールと光ファイバケーブルとを一体化したモジュール付きケーブルが提案されている。
この種のモジュール付きケーブルとしては、光電複合ケーブルの使用により機器への電力供給等を可能としたものがある。 In order to perform optical transmission between devices, for example, an optical module that converts electrical signals and optical signals is provided in each device, an optical fiber cable is connected to the optical module via an optical connector, and light is transmitted by the optical fiber cable. A method for transmitting and receiving signals can be used.
In this system, there is a problem in that signal deterioration occurs when dirt or foreign matter adheres to an optical connector that is attached to and detached from the optical module. Therefore, a cable with a module in which an optical module and an optical fiber cable are integrated has been proposed.
As this type of cable with a module, there is a cable that can supply power to a device by using a photoelectric composite cable.

特許文献１には、光電複合ケーブルの両端に光電変換モジュールが設けられ、光信号の送受信だけでなく電力供給も行うことができるモジュール付きケーブルが開示されている。
図９は、この構造のモジュール付きケーブルを示すもので、このモジュール付きケーブルは、光ファイバ６２と電力線６３とを有する光電複合ケーブル６４の両端にそれぞれ光電複合モジュール６５、６６が設けられている。
光電複合モジュール６５、６６は、光ファイバ６２が接続される光電変換部であるトランシーバ６７、６８を有する。符号６９、７０は、電力線６３が接続される電源接続金具および電源接続金具受である。 Patent Document 1 discloses a cable with a module in which photoelectric conversion modules are provided at both ends of a photoelectric composite cable, and power can be supplied as well as transmission / reception of optical signals.
FIG. 9 shows a cable with a module having this structure. The cable with a module is provided with photoelectric composite modules 65 and 66 at both ends of a photoelectric composite cable 64 having an optical fiber 62 and a power line 63, respectively.
The photoelectric composite modules 65 and 66 have transceivers 67 and 68 which are photoelectric conversion units to which the optical fiber 62 is connected. Reference numerals 69 and 70 denote a power supply fitting and a power supply fitting receiver to which the power line 63 is connected.

特開２００４−３２５７８３号公報JP 2004-325783 A

近年、デジタル家電等の機器における情報伝送量の増大および小型化に伴い、小型でありながら多種類の信号を高速に伝送するための新しい規格、例えば、ＤＶＩ規格（Ｄｉｇｉｔａｌ Ｖｉｓｕａｌ Ｉｎｔｅｒｆａｃｅ）やＨＤＭＩ規格（Ｈｉｇｈ Ｄｉｆｉｎｉｔｉｏｎ Ｍｕｌｔｉｍｅｄｉａ Ｉｎｔｅｒｆａｃｅ）、ＵＳＢ規格（Ｕｎｉｖｅｒｓａｌ Ｓｅｒｉａｌ Ｂｕｓ）などが提案されている。
しかしながら、上記モジュール付きケーブルでは、光モジュールの構造上、情報伝送量の増加や小型化に対応するのは難しかった。
本発明は、上記事情に鑑みてなされたもので、情報伝送量の増加および小型化を実現できる光モジュールおよびモジュール付きケーブルを提供することを目的とする。 In recent years, with the increase in information transmission amount and miniaturization in devices such as digital home appliances, new standards for transmitting various types of signals at high speed while being small, such as the DVI standard (Digital Visual Interface) and the HDMI standard ( High definition multimedia interface), USB standard (Universal Serial Bus), and the like have been proposed.
However, in the cable with the module, it is difficult to cope with an increase in information transmission amount and downsizing due to the structure of the optical module.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an optical module and a cable with a module that can realize an increase in information transmission amount and a reduction in size.

本発明の請求項１にかかる発明は、光伝送路と電線とを備えた光電気複合ケーブルの端部に組み立てられる光モジュールであって、回路基板と、前記回路基板に接続された光電変換部と、前記回路基板に接続され、他の機器に接続可能な電気コネクタとを備え、前記電線が、前記回路基板に接続されることにより、前記回路基板の回路配線を介して前記電気コネクタに電気的に接続され、前記光伝送路が、前記光電変換部の光軸に対して所定の角度で交差する光軸を有し、前記光電変換部に光結合部を介して光学的に接続され、前記光結合部が、伝送される光に対して透明な樹脂からなり、前記樹脂が、前記光電変換部の受発光部の少なくとも一部および前記光伝送路の端部の少なくとも一部にそれぞれ密着し、前記光結合部を構成する樹脂の外面は、前記光電変換部の受発光部および前記光伝送路の端部の側に凹んだ形状となっている光モジュールを提供する。
本発明の請求項２にかかる発明は、請求項１において、前記光電変換部が、前記回路基板の一方の面側に設けられ、前記電線が、前記回路基板の他方の面に接続されている光モジュールである。
本発明の請求項３にかかる発明は、請求項１または２において、前記光電変換部が、前記回路基板の一方の面に設けられた光電変換部電極に直接実装されている光モジュールである。
本発明の請求項４にかかる発明は、請求項１または２において、前記光電変換部が、前記回路基板に接続された副基板に設けられている光モジュールである。
本発明の請求項５にかかる発明は、請求項１〜４のうちいずれか１項において、前記光電変換部が、面発光レーザである光モジュールである。
本発明の請求項６にかかる発明は、請求項１〜５のうちいずれか１項に記載の光モジュールが、前記光電気複合ケーブルの少なくとも一端に組み立てられたモジュール付きケーブルである。 The invention according to claim 1 of the present invention is an optical module that is assembled at an end of a photoelectric composite cable including an optical transmission line and an electric wire, and includes a circuit board and a photoelectric conversion unit connected to the circuit board. And an electrical connector that is connected to the circuit board and is connectable to another device, and the electric wire is connected to the circuit board, whereby the electric connector is electrically connected to the electrical connector via the circuit wiring of the circuit board. The optical transmission line has an optical axis that intersects the optical axis of the photoelectric conversion unit at a predetermined angle, and is optically connected to the photoelectric conversion unit via an optical coupling unit, The optical coupling portion is made of a resin that is transparent to transmitted light, and the resin is in close contact with at least a part of the light receiving and emitting part of the photoelectric conversion unit and at least a part of the end of the optical transmission path. And the resin constituting the optical coupling part Outer surface provides an optical module that has a concave shape on the side of the end portion of the light receiving and emitting unit and the optical transmission line of the photoelectric conversion unit.
According to a second aspect of the present invention, in the first aspect, the photoelectric conversion unit is provided on one surface side of the circuit board, and the electric wire is connected to the other surface of the circuit board. It is an optical module.
The invention according to claim 3 of the present invention is the optical module according to claim 1 or 2, wherein the photoelectric conversion unit is directly mounted on a photoelectric conversion unit electrode provided on one surface of the circuit board.
The invention according to claim 4 of the present invention is the optical module according to claim 1 or 2, wherein the photoelectric conversion unit is provided on a sub-board connected to the circuit board.
The invention according to claim 5 of the present invention is the optical module according to any one of claims 1 to 4, wherein the photoelectric conversion unit is a surface emitting laser.
The invention according to claim 6 of the present invention is a cable with a module in which the optical module according to any one of claims 1 to 5 is assembled to at least one end of the photoelectric composite cable.

本発明によれば、光伝送路と光電変換部とが、簡略な構造の光結合部を介して光学的に接続されているので、光結合構造の小型化（特に低背化および長さ寸法の短縮）が可能となる。
また、電線が回路基板に接続されているので、電線が電気コネクタに直接接続される場合に比べ、電線の配線のために確保するべきスペースを小さくできる。
従って、光モジュールの小型化、特に薄型化および長さ寸法の短縮を実現できる。
また、光モジュール内部に十分なスペースを確保できるため、光伝送路や電線の多線化が容易となることから、情報伝送量の増加に対応できる。 According to the present invention, since the optical transmission line and the photoelectric conversion unit are optically connected via the optical coupling unit having a simple structure, the optical coupling structure can be reduced in size (especially, reduced in height and length). Shortening).
Moreover, since the electric wire is connected to the circuit board, the space to be secured for the wiring of the electric wire can be reduced as compared with the case where the electric wire is directly connected to the electric connector.
Therefore, the optical module can be reduced in size, particularly reduced in thickness and shortened in length.
In addition, since a sufficient space can be secured inside the optical module, it is easy to increase the number of optical transmission lines and wires, and thus it is possible to cope with an increase in the amount of information transmission.

本発明の第１形態例に係る光モジュールを備えたモジュール付きケーブルを示す一部断面図である。It is a partial cross section figure showing the cable with a module provided with the optical module concerning the 1st example of the present invention. モジュール付きケーブルの内部構造を示す斜視図である。It is a perspective view which shows the internal structure of a cable with a module. 光モジュールの要部を示す断面図である。It is sectional drawing which shows the principal part of an optical module. モジュール付きケーブルを模式的に示す概略構成図である。It is a schematic block diagram which shows a cable with a module typically. 本発明の第２形態例に係る光モジュールを備えたモジュール付きケーブルを示す一部断面図である。It is a partial cross section figure which shows the cable with a module provided with the optical module which concerns on the 2nd form example of this invention. モジュール付きケーブルの内部構造を示す斜視図である。It is a perspective view which shows the internal structure of a cable with a module. 本発明の第３形態例に係るモジュール付きケーブルを示す一部断面図である。It is a partial cross section figure which shows the cable with a module which concerns on the 3rd form example of this invention. モジュール付きケーブルの内部構造を示す斜視図である。It is a perspective view which shows the internal structure of a cable with a module. 従来のモジュール付きケーブルの一例を模式的に示す概略構成図である。It is a schematic block diagram which shows typically an example of the conventional cable with a module.

以下、実施の形態に基づき、図面を参照して本発明を説明する。
図１〜図４は、本発明の第１形態例にかかる光モジュールである光電変換モジュール１を用いたモジュール付きケーブルを示すものである。
図４に示すように、このモジュール付きケーブルは、光伝送路２と電線３とを備えた光電気複合ケーブル４の両端に、それぞれ光電変換モジュール１（光モジュール）が組み立てられている。 Hereinafter, based on an embodiment, the present invention will be described with reference to the drawings.
1 to 4 show a cable with a module using a photoelectric conversion module 1 which is an optical module according to a first embodiment of the present invention.
As shown in FIG. 4, in this cable with a module, photoelectric conversion modules 1 (optical modules) are assembled at both ends of an optical / electrical composite cable 4 including an optical transmission line 2 and an electric wire 3.

図１および図２に示すように、光電変換モジュール１は、回路基板８と、回路基板８の一方の面８ａに設けられた受発光素子９（光電変換部）と、回路基板８に設けられた制御用半導体１０と、回路基板８に接続された電気コネクタ５とを備えている。
回路基板８、受発光素子９、および制御用半導体１０は、光電気複合ケーブル４から引き出された光伝送路２および電線３の先端部とともにハウジング１１に収容されている。
以下の説明において、図１における左方を前方といい、右方を後方ということがある。前後方向は光電気複合ケーブル４の端部における長さ方向に一致し、この方向は光電変換モジュール１の長さ方向でもある。 As shown in FIGS. 1 and 2, the photoelectric conversion module 1 is provided on a circuit board 8, a light emitting / receiving element 9 (photoelectric conversion unit) provided on one surface 8 a of the circuit board 8, and the circuit board 8. The control semiconductor 10 and the electrical connector 5 connected to the circuit board 8 are provided.
The circuit board 8, the light emitting / receiving element 9, and the control semiconductor 10 are accommodated in the housing 11 together with the optical transmission line 2 drawn from the optoelectric composite cable 4 and the distal end portion of the electric wire 3.
In the following description, the left side in FIG. 1 may be referred to as the front, and the right side may be referred to as the rear. The front-rear direction coincides with the length direction at the end of the photoelectric composite cable 4, and this direction is also the length direction of the photoelectric conversion module 1.

電気コネクタ５は、ハウジング１１の先端部にハウジング１１から突出して設けられており、他の機器に接続可能に構成されている。
回路基板８には、例えは、ガラスエポキシ基板、セラミック基板など、一般的な各種絶縁基板を使用することができる。回路基板８の面８ａ、８ｂには、所定の回路配線が形成されている。 The electrical connector 5 is provided at the front end of the housing 11 so as to protrude from the housing 11 and is configured to be connectable to other devices.
As the circuit board 8, for example, various general insulating boards such as a glass epoxy board and a ceramic board can be used. Predetermined circuit wiring is formed on the surfaces 8 a and 8 b of the circuit board 8.

光電気複合ケーブル４の電線３としては、例えば銅などからなる金属導体３ａの外周に樹脂被覆３ｂを設けた汎用品を使用できる。
図１に示すように、電線３は、回路基板８の他方の面８ｂに設けられた電線接続用電極７に接続されており、回路基板８の回路配線を介して電気コネクタ５に電気的に接続される。
このため、電気コネクタ５が接続される機器には、電気コネクタ５を通して電力供給や電気信号の送受信が可能である。
また、電線３より制御用半導体１０に電力を供給し、動作をさせることも可能である。 As the electric wire 3 of the photoelectric composite cable 4, for example, a general-purpose product in which a resin coating 3b is provided on the outer periphery of a metal conductor 3a made of copper or the like can be used.
As shown in FIG. 1, the electric wire 3 is connected to an electric wire connecting electrode 7 provided on the other surface 8 b of the circuit board 8, and is electrically connected to the electric connector 5 through the circuit wiring of the circuit board 8. Connected.
For this reason, the device to which the electrical connector 5 is connected can supply power and transmit / receive electrical signals through the electrical connector 5.
It is also possible to supply electric power from the electric wire 3 to the control semiconductor 10 to operate it.

光伝送路２としては、例えば石英系光ファイバ、プラスチック光ファイバ（ＰＯＦ）などの光ファイバが挙げられる。
光伝送路２は、回路基板８の一方の面８ａに沿って配線され、受発光素子９に接続されている。 Examples of the optical transmission line 2 include optical fibers such as quartz optical fibers and plastic optical fibers (POF).
The optical transmission line 2 is wired along one surface 8 a of the circuit board 8 and connected to the light emitting / receiving element 9.

図３に示すように、受発光素子９は、光信号を出射または入射させる部分として受発光部９ａを有する。図示例の受発光部９ａは、受発光素子９の上面９ｃに設けられている。
受発光素子９が受光素子である場合は、受発光部９ａは受光部である。受発光素子９が発光素子である場合は、受発光部９ａは発光部である。
発光素子としては、発光ダイオード（ＬＥＤ）、レーザダイオード（ＬＤ）、面発光レーザ（ＶＣＳＥＬ）等が挙げられる。受光素子としては、フォトダイオード（ＰＤ）等が挙げられる。
本発明における上下方向は、受発光素子９が回路基板８に実装される一方の面８ａを基準とし、回路基板８から遠ざかる方向を上方（図３の上方）、回路基板８に近づく方向を下方（図３の下方）とする。また、上下方向に垂直な方向（図３の左右方向）を水平方向とする。本発明における上下方向および水平方向は重力の方向に依存しない。 As shown in FIG. 3, the light emitting / receiving element 9 has a light emitting / receiving unit 9a as a part for emitting or entering an optical signal. The illustrated light emitting / receiving unit 9 a is provided on the upper surface 9 c of the light emitting / receiving element 9.
When the light emitting / receiving element 9 is a light receiving element, the light receiving / emitting part 9a is a light receiving part. When the light emitting / receiving element 9 is a light emitting element, the light emitting / receiving part 9a is a light emitting part.
Examples of the light emitting element include a light emitting diode (LED), a laser diode (LD), and a surface emitting laser (VCSEL). A photodiode (PD) etc. are mentioned as a light receiving element.
The vertical direction in the present invention is based on one surface 8a on which the light emitting / receiving element 9 is mounted on the circuit board 8, and the direction away from the circuit board 8 is upward (upward in FIG. 3), and the direction approaching the circuit board 8 is downward. (Lower part of FIG. 3). Further, a direction perpendicular to the up-down direction (left-right direction in FIG. 3) is defined as a horizontal direction. The vertical direction and horizontal direction in the present invention do not depend on the direction of gravity.

受発光素子９は、回路基板８の一方の面８ａに形成された光電変換部電極６に対して電気的に接続されている。
図示例では、受発光素子９は、上面９ｃ（表面）に接続された配線１７を介して１つの光電変換部電極６と電気的に接続されている。受発光素子９の下面９ｄ（裏面）は、導電性接着剤（図示せず）により他の光電変換部電極６に電気的に接続されている。
配線１７としては、例えば、金（Ａｕ）ワイヤ、アルミニウム（Ａｌ）ワイヤ、銅（Ｃｕ）ワイヤなどを使用できる。 The light emitting / receiving element 9 is electrically connected to the photoelectric conversion unit electrode 6 formed on the one surface 8 a of the circuit board 8.
In the illustrated example, the light emitting / receiving element 9 is electrically connected to one photoelectric conversion unit electrode 6 via a wiring 17 connected to the upper surface 9c (front surface). The lower surface 9d (back surface) of the light emitting / receiving element 9 is electrically connected to the other photoelectric conversion unit electrode 6 by a conductive adhesive (not shown).
As the wiring 17, for example, a gold (Au) wire, an aluminum (Al) wire, a copper (Cu) wire, or the like can be used.

受発光素子９は、その光軸９ｂが光伝送路２の光軸２ｂ（特に端部２ａ付近における光軸２ｂ）に所定の角度θ（例えば０＜θ＜１８０°）で交差するように配置されている。受発光素子９および光伝送路２は、これらの光軸９ｂ，２ｂが互いに垂直（または略垂直）に配置されることが好ましい。   The light emitting / receiving element 9 is arranged such that the optical axis 9b intersects the optical axis 2b of the optical transmission line 2 (particularly the optical axis 2b in the vicinity of the end 2a) at a predetermined angle θ (for example, 0 <θ <180 °). Has been. The light receiving / emitting element 9 and the optical transmission line 2 are preferably arranged such that their optical axes 9b, 2b are perpendicular (or substantially perpendicular) to each other.

受発光素子９は、光結合部１３を介して光伝送路２に接続されている。
光結合部１３は、伝送される光に対して透明な樹脂からなる。光結合部１３を構成する樹脂は、受発光素子９の受発光部９ａの少なくとも一部および光伝送路２の端部２ａの少なくとも一部にそれぞれ密着している。
ここでいう透明樹脂とは、受発光素子９と光伝送路２との間を伝送する光を透過させることが可能なものを指し、必ずしも可視光下で無色透明な色調のものに限定されるものではない。
透明樹脂としては、例えば、ＵＶ硬化性樹脂や熱硬化性樹脂などを用いることができる。透明樹脂の具体例としては、アクリル系樹脂、エポキシ系樹脂、シリコーン系樹脂等が挙げられる。 The light emitting / receiving element 9 is connected to the optical transmission line 2 via the optical coupling unit 13.
The optical coupling unit 13 is made of a resin that is transparent to transmitted light. The resin constituting the optical coupling unit 13 is in close contact with at least a part of the light emitting / receiving unit 9 a of the light emitting / receiving element 9 and at least a part of the end 2 a of the optical transmission path 2.
The transparent resin here refers to a material that can transmit light transmitted between the light emitting / receiving element 9 and the light transmission path 2 and is not necessarily limited to a colorless and transparent color tone under visible light. It is not a thing.
As the transparent resin, for example, a UV curable resin or a thermosetting resin can be used. Specific examples of the transparent resin include acrylic resins, epoxy resins, and silicone resins.

光結合部１３の形状は、図３では光結合部１３が光伝送路２の端部２ａの全面を覆っているが、光伝送路２の端部２ａの一部が光結合部１３に覆われていない構成も可能である。また、図３では受発光素子９の受発光部９ａの上面の全面が光結合部１３に覆われているが、受発光部９ａの一部が光結合部１３に覆われていない構成も可能である。   In FIG. 3, the shape of the optical coupling portion 13 is such that the optical coupling portion 13 covers the entire surface of the end portion 2 a of the optical transmission path 2, but a part of the end portion 2 a of the optical transmission path 2 covers the optical coupling portion 13. Unstructured configurations are possible. Further, in FIG. 3, the entire upper surface of the light emitting / receiving unit 9 a of the light emitting / receiving element 9 is covered with the optical coupling unit 13, but a configuration in which a part of the light receiving / emitting unit 9 a is not covered with the optical coupling unit 13 is also possible. It is.

光結合部１３は、受発光素子９と光伝送路２との間の光結合を容易に実現するため、以下のような構成が好ましい。
光結合部１３の外面１３ａが外部の気体（空気、窒素など）との界面を形成しており、光結合部１３を構成する透明樹脂は、光伝送路２の光軸２ｂと受発光素子９の光軸９ｂとが交差する交点Ｐの位置には存在せず、光結合部１３の外面１３ａが、受発光素子９の受発光部９ａおよび光伝送路２の端部２ａの側に凹んだ形状となっている。 The optical coupling unit 13 preferably has the following configuration in order to easily realize optical coupling between the light emitting / receiving element 9 and the optical transmission line 2.
The outer surface 13a of the optical coupling portion 13 forms an interface with an external gas (air, nitrogen, etc.), and the transparent resin constituting the optical coupling portion 13 is composed of the optical axis 2b of the optical transmission line 2 and the light emitting / receiving element 9. The outer surface 13a of the light coupling portion 13 is recessed toward the light emitting / receiving portion 9a of the light emitting / receiving element 9 and the end portion 2a of the optical transmission line 2 without crossing the optical axis 9b. It has a shape.

光結合部１３の外面１３ａが凹んだ形状となるためには、少なくとも、
（１）受発光部９ａに対向する位置Ａが受発光部９ａ側に凹んだ形状の凹面部２１、
（２）光伝送路２の端部２ａに対向する位置Ｂが光伝送路２の端部２ａ側に凹んだ形状の凹面部２２、
（３）受発光部９ａに対向する位置Ａと光伝送路２の端部２ａに対向する位置Ｂとの間が凹んだ形状の凹面部２３、
を有することが望ましい。 In order for the outer surface 13a of the optical coupling portion 13 to have a recessed shape, at least
(1) A concave surface portion 21 having a shape in which the position A facing the light emitting / receiving portion 9a is recessed toward the light emitting / receiving portion 9a,
(2) A concave surface 22 having a shape in which the position B facing the end 2a of the optical transmission line 2 is recessed toward the end 2a of the optical transmission line 2,
(3) a concave surface portion 23 having a concave shape between a position A facing the light emitting / receiving portion 9a and a position B facing the end 2a of the optical transmission line 2;
It is desirable to have

（１）の受発光部９ａ側の凹面部２１は、例えば、受発光素子９の光軸９ｂが樹脂の外面１３ａと交差する位置Ａの近傍において、樹脂の外面１３ａが樹脂側に凹となる凹面を形成していることが好ましい。
（２）の光伝送路２側の凹面部２２は、例えば、光伝送路２の光軸２ｂが樹脂の外面１３ａと交差する位置Ｂの近傍において、樹脂の外面１３ａが樹脂側に凹となる凹面を形成していることが好ましい。
（３）の中間部の凹面部２３は、例えば、受発光素子９の光軸９ｂが樹脂の外面１３ａと交差する位置Ａと、光伝送路２の光軸２ｂが樹脂の外面１３ａと交差する位置Ｂとの間を結ぶ線分ＡＢがＡ−Ｂ間で樹脂の外側（外部の気体側）を通り、樹脂の外面１３ａが凹となる凹面を形成していることが好ましい。 The concave surface portion 21 on the light emitting / receiving portion 9a side of (1) is, for example, in the vicinity of the position A where the optical axis 9b of the light emitting / receiving element 9 intersects the outer surface 13a of the resin, the outer surface 13a of the resin becomes concave on the resin side. It is preferable to form a concave surface.
In the concave surface portion 22 on the optical transmission line 2 side in (2), for example, in the vicinity of the position B where the optical axis 2b of the optical transmission line 2 intersects the external surface 13a of the resin, the external surface 13a of the resin is concave on the resin side. It is preferable to form a concave surface.
The concave portion 23 in the middle part of (3) is, for example, a position A where the optical axis 9b of the light emitting / receiving element 9 intersects the outer surface 13a of the resin, and an optical axis 2b of the optical transmission path 2 intersects the outer surface 13a of the resin. It is preferable that a line segment AB connecting to the position B passes through the outer side of the resin (external gas side) between A and B, and the outer surface 13a of the resin is formed as a concave surface.

光結合部１３の外面１３ａを凹んだ形状とすることによって、反射面としての位置および角度を精密に制御しなくても、より低い作製精度で確実な光結合を実現することができる。また、光伝送路２の端部２ａと受発光素子９の受発光部９ａとの間が単一の透明樹脂で構成された光結合部１３で光結合されるため、極めて低コストに、かつ簡易な工程で作製可能である。
光結合部１３は、受発光素子９の光軸９ｂと光伝送路２の光軸２ｂとが交差する交点Ｐの位置には前記樹脂が存在せず、樹脂の外面１３ａが受発光部９ａに対向する位置Ａが交点Ｐと受発光部９ａとの間にあり、かつ、樹脂の外面１３ａが光伝送路２の端部２ａに対向する位置Ｂが交点Ｐと光伝送路２の端部２ａとの間にあると、光が拡散する範囲が狭くなり、損失を低減することができる。 By making the outer surface 13a of the optical coupling portion 13 into a concave shape, it is possible to realize reliable optical coupling with lower fabrication accuracy without precisely controlling the position and angle as the reflecting surface. In addition, since the end portion 2a of the optical transmission line 2 and the light emitting / receiving portion 9a of the light emitting / receiving element 9 are optically coupled by the optical coupling portion 13 made of a single transparent resin, the cost is extremely low, and It can be manufactured by a simple process.
The optical coupling portion 13 has no resin at the intersection point P where the optical axis 9b of the light emitting / receiving element 9 and the optical axis 2b of the optical transmission path 2 intersect, and the outer surface 13a of the resin serves as the light emitting / receiving portion 9a. The facing position A is between the intersection P and the light emitting / receiving section 9a, and the position B where the outer surface 13a of the resin faces the end 2a of the optical transmission path 2 is the intersection P and the end 2a of the optical transmission path 2. If it is between, the range in which light diffuses becomes narrow, and loss can be reduced.

制御用半導体１０は、回路基板８の回路配線を経て入力された電気信号に、必要に応じてレベル調整や各種変換などを施すことができる。制御用半導体１０は回路基板８の一方の面８ａに設けてもよいし、他方の面８ｂに設けてもよい。
また、制御用半導体１０が成す機能が回路基板８以外に備わっている場合には、制御用半導体１０を回路基板８に設けず省略してもよい。 The control semiconductor 10 can perform level adjustment, various conversions, and the like, as necessary, on the electrical signal input through the circuit wiring of the circuit board 8. The control semiconductor 10 may be provided on one surface 8a of the circuit board 8, or may be provided on the other surface 8b.
In addition, when the function of the control semiconductor 10 is provided other than the circuit board 8, the control semiconductor 10 may be omitted without being provided in the circuit board 8.

受発光素子９が発光素子である場合には、電気コネクタ５から入力された電気信号は、回路基板８の回路配線を経て制御用半導体１０に入力され、必要に応じてレベル調整等が施された後、回路配線を経て光電変換部電極６から受発光素子９に入力される。
受発光素子９では、電気信号が光信号に変換され、受発光部９ａから発せられた光信号が光結合部１３に入射し、界面（外面１３ａ）で反射されて光伝送路２に入射する。 When the light emitting / receiving element 9 is a light emitting element, the electric signal input from the electric connector 5 is input to the control semiconductor 10 through the circuit wiring of the circuit board 8 and is subjected to level adjustment as necessary. After that, the light is input from the photoelectric conversion unit electrode 6 to the light receiving and emitting element 9 through the circuit wiring.
In the light emitting / receiving element 9, the electrical signal is converted into an optical signal, and the optical signal emitted from the light emitting / receiving unit 9 a enters the optical coupling unit 13, is reflected by the interface (outer surface 13 a), and enters the optical transmission line 2. .

受発光素子９が受光素子の場合には、光伝送路２から光結合部１３に入射した光は、界面（外面１３ａ）で反射されて受発光素子９の受発光部９ａに入射する。
受発光素子９では光信号が電気信号に変換され、この電気信号は光電変換部電極６に入力され、回路基板８の回路配線を経て制御用半導体１０に入力され、制御用半導体１０において必要に応じてレベル調整等が施された後、回路配線を経て電気コネクタ５に送られる。 When the light receiving / emitting element 9 is a light receiving element, the light incident on the optical coupling unit 13 from the optical transmission path 2 is reflected by the interface (outer surface 13a) and enters the light receiving / emitting unit 9a of the light receiving / emitting element 9.
In the light emitting / receiving element 9, the optical signal is converted into an electric signal, and this electric signal is input to the photoelectric conversion unit electrode 6, input to the control semiconductor 10 through the circuit wiring of the circuit board 8, and necessary in the control semiconductor 10. After level adjustment or the like is performed accordingly, it is sent to the electrical connector 5 via circuit wiring.

光電変換モジュール１は、光伝送路２と受発光素子９とが、簡略な構造の光結合部１３を介して光学的に接続されているので、光結合構造の小型化（特に低背化および長さ寸法の短縮）が可能となる。
また、電線３が回路基板８に接続されているので、電線３が電気コネクタ５に直接接続される場合に比べ、電線３の配線のためにハウジング１１内に確保するべきスペースを小さくできる。
従って、光電変換モジュール１の小型化、特に薄型化および長さ寸法の短縮を実現できる。
また、光電変換モジュール１内部に十分なスペースを確保できるため、光伝送路２や電線３の多線化が容易となることから、情報伝送量の増加に対応できる。 In the photoelectric conversion module 1, the optical transmission path 2 and the light emitting / receiving element 9 are optically connected via an optical coupling portion 13 having a simple structure, so that the optical coupling structure can be downsized (particularly, the height and height can be reduced). Shortening of the length dimension).
Moreover, since the electric wire 3 is connected to the circuit board 8, the space to be secured in the housing 11 for wiring of the electric wire 3 can be reduced as compared with the case where the electric wire 3 is directly connected to the electric connector 5.
Therefore, the photoelectric conversion module 1 can be reduced in size, particularly reduced in thickness and shortened in length.
In addition, since a sufficient space can be secured inside the photoelectric conversion module 1, it is easy to increase the number of optical transmission lines 2 and electric wires 3, and thus it is possible to cope with an increase in the amount of information transmission.

光電変換モジュール１では、光伝送路２が回路基板８の一方の面８ａ側に接続され、電線３が他方の面８ｂに接続されるため、回路配線を両面８ａ、８ｂに分けて形成することができ、実装効率を高めることにより回路基板８の小型化が可能となる。よって、いっそうの小型化を図ることができる。
また、受発光素子９が光電変換部電極６に直接接続されているため、内部構造の高さ寸法を抑え、光電変換モジュール１のさらなる薄型化が可能となる。 In the photoelectric conversion module 1, since the optical transmission line 2 is connected to the one surface 8a side of the circuit board 8 and the electric wire 3 is connected to the other surface 8b, the circuit wiring is divided into both surfaces 8a and 8b. The circuit board 8 can be downsized by increasing the mounting efficiency. Therefore, further downsizing can be achieved.
In addition, since the light emitting / receiving element 9 is directly connected to the photoelectric conversion unit electrode 6, the height of the internal structure is suppressed, and the photoelectric conversion module 1 can be further thinned.

図５および図６は、本発明の第２形態例にかかる光モジュールを用いたモジュール付きケーブルを示すものである。
以下の説明において、図１〜図４に示す第１形態例のモジュール付きケーブルと共通の構成については同じ符号を付してその説明を省略または簡略化する。
光電変換モジュール３１は、回路基板８と、回路基板８の一方の面８ａ側に設けられた副基板１５（第２の回路基板）と、副基板１５の一方の面１５ａに設けられた受発光素子９（光電変換部）と、制御用半導体１０とが光伝送路２および電線３の先端部とともにハウジング１１に収容されている。 5 and 6 show a cable with a module using the optical module according to the second embodiment of the present invention.
In the following description, the same reference numerals are given to the same configurations as those of the module-equipped cable of the first embodiment shown in FIGS. 1 to 4, and the description thereof is omitted or simplified.
The photoelectric conversion module 31 includes a circuit board 8, a sub-board 15 (second circuit board) provided on one side 8 a of the circuit board 8, and light reception / emission provided on one side 15 a of the sub-board 15. The element 9 (photoelectric conversion unit) and the control semiconductor 10 are accommodated in the housing 11 together with the optical transmission path 2 and the tip of the electric wire 3.

副基板１５は、回路基板８の上方に間隔をおいて回路基板８にほぼ平行に設けられている。副基板１５は、ガラスエポキシ基板、セラミック基板など、一般的な各種絶縁基板の表面に回路配線を形成したものを使用することができる。
副基板１５の一方の面１５ａには光電変換部電極１６が形成され、光電変換部電極１６には受発光素子９が電気的に接続されている。
図示例では、受発光素子９の上面９ｃは、配線１７を介して１つの光電変換部電極１６に電気的に接続され、受発光素子９の下面９ｄは、導電性接着剤（図示せず）により他の光電変換部電極１６に電気的に接続されている。 The sub-board 15 is provided substantially parallel to the circuit board 8 with an interval above the circuit board 8. As the sub-board 15, a substrate in which circuit wiring is formed on the surface of various general insulating substrates such as a glass epoxy substrate and a ceramic substrate can be used.
A photoelectric conversion unit electrode 16 is formed on one surface 15 a of the sub-substrate 15, and the light emitting / receiving element 9 is electrically connected to the photoelectric conversion unit electrode 16.
In the illustrated example, the upper surface 9c of the light emitting / receiving element 9 is electrically connected to one photoelectric conversion unit electrode 16 via the wiring 17, and the lower surface 9d of the light receiving / emitting element 9 is a conductive adhesive (not shown). Thus, the other photoelectric conversion unit electrode 16 is electrically connected.

副基板１５の他方の面１５ｂには基板コネクタ１５ｃが設けられ、回路基板８の一方の面８ａには基板コネクタ８ｃが設けられている。
基板コネクタ８ｃは、回路基板８の一方の面８ａに設けられた光電変換部電極６に接続されているため、基板コネクタ１５ｃ、８ｃが互いに接続されることで、受発光素子９は回路基板８に電気的に接続される。
受発光素子９は、光結合部１３を介して光伝送路２に接続されている。 A substrate connector 15 c is provided on the other surface 15 b of the sub-board 15, and a substrate connector 8 c is provided on the one surface 8 a of the circuit board 8.
Since the board connector 8c is connected to the photoelectric conversion unit electrode 6 provided on one surface 8a of the circuit board 8, the board connectors 15c and 8c are connected to each other, so that the light emitting / receiving element 9 is connected to the circuit board 8. Is electrically connected.
The light emitting / receiving element 9 is connected to the optical transmission line 2 via the optical coupling unit 13.

受発光素子９が発光素子である場合には、電気コネクタ５から入力された電気信号は、制御用半導体１０、光電変換部電極６、基板コネクタ１５ｃ、８ｃを経て副基板１５に至り、光電変換部電極１６から受発光素子９に入力される。
受発光素子９では、電気信号が光信号に変換され、受発光部９ａから発せられた光信号が光結合部１３に入射し、界面（外面１３ａ）で反射されて光伝送路２に入射する。 When the light emitting / receiving element 9 is a light emitting element, an electric signal input from the electric connector 5 reaches the sub-board 15 through the control semiconductor 10, the photoelectric conversion unit electrode 6, the board connectors 15c and 8c, and is subjected to photoelectric conversion. The light is input from the partial electrode 16 to the light emitting / receiving element 9.
In the light emitting / receiving element 9, the electrical signal is converted into an optical signal, and the optical signal emitted from the light emitting / receiving unit 9 a enters the optical coupling unit 13, is reflected by the interface (outer surface 13 a), and enters the optical transmission line 2. .

受発光素子９が受光素子の場合には、光伝送路２から光結合部１３に入射した光は、界面（外面１３ａ）で反射されて受発光素子９の受発光部９ａに入射して電気信号に変換され、光電変換部電極１６、基板コネクタ１５ｃ、８ｃを経て光電変換部電極６に入力され、回路基板８の回路配線、制御用半導体１０を経て電気コネクタ５に送られる。   When the light emitting / receiving element 9 is a light receiving element, the light incident on the optical coupling unit 13 from the optical transmission path 2 is reflected by the interface (outer surface 13a) and enters the light receiving / emitting unit 9a of the light receiving / emitting element 9 to be electrically It is converted into a signal, inputted to the photoelectric conversion unit electrode 6 through the photoelectric conversion unit electrode 16 and the board connectors 15 c and 8 c, and sent to the electrical connector 5 through the circuit wiring of the circuit board 8 and the control semiconductor 10.

光電変換モジュール３１を製造する際には、副基板１５上の受発光素子９に光伝送路２を接続する工程と、回路基板８に対し制御用半導体１０等を実装する工程とを別に行い、その後、回路基板８と副基板１５とを接続する方法をとることができる。   When manufacturing the photoelectric conversion module 31, the process of connecting the optical transmission line 2 to the light emitting / receiving element 9 on the sub-substrate 15 and the process of mounting the control semiconductor 10 and the like on the circuit board 8 are performed separately. Thereafter, a method of connecting the circuit board 8 and the sub board 15 can be taken.

光電変換モジュール３１は、光伝送路２と受発光素子９とが、簡略な構造の光結合部１３を介して光学的に接続されているので、光結合構造の小型化が可能となる。
また、電線３が回路基板８に接続されているので、電線３が電気コネクタ５に直接接続される場合に比べ、電線３の配線のためにハウジング１１内に確保するべきスペースを小さくできる。
従って、光電変換モジュール３１の小型化を実現できる。また、光電変換モジュール３１内部に十分なスペースを確保できるため、光伝送路２や電線３の多線化が容易となることから、情報伝送量の増加に対応できる。 In the photoelectric conversion module 31, the optical transmission path 2 and the light emitting / receiving element 9 are optically connected via the optical coupling part 13 having a simple structure, so that the optical coupling structure can be downsized.
Moreover, since the electric wire 3 is connected to the circuit board 8, the space to be secured in the housing 11 for wiring of the electric wire 3 can be reduced as compared with the case where the electric wire 3 is directly connected to the electric connector 5.
Therefore, the photoelectric conversion module 31 can be downsized. In addition, since a sufficient space can be secured inside the photoelectric conversion module 31, it is easy to increase the number of optical transmission lines 2 and electric wires 3, and thus it is possible to cope with an increase in the amount of information transmission.

光電変換モジュール３１では、受発光素子９が副基板１５に設けられているため、副基板１５上の受発光素子９に光伝送路２を接続する工程と、回路基板８に対し制御用半導体１０等を実装する工程とを別に行うことができる。このため、製造効率を高めることができる。   In the photoelectric conversion module 31, since the light emitting / receiving element 9 is provided on the sub-substrate 15, the step of connecting the optical transmission line 2 to the light emitting / receiving element 9 on the sub-substrate 15 and the control semiconductor 10 with respect to the circuit board 8. Etc. can be performed separately. For this reason, manufacturing efficiency can be improved.

図７および図８は、本発明の第３形態例にかかる光モジュールを用いたモジュール付きケーブルを示すものである。
光電変換モジュール４１は、回路基板８と、回路基板８の一方の面８ａ側に設けられた表面実装型光パッケージ２０（光電変換部）と、制御用半導体１０とが、光伝送路２および電線３の先端部とともにハウジング１１に収容されている。 7 and 8 show a cable with a module using the optical module according to the third embodiment of the present invention.
The photoelectric conversion module 41 includes a circuit board 8, a surface-mounted optical package 20 (photoelectric conversion unit) provided on one surface 8 a side of the circuit board 8, and the control semiconductor 10, the optical transmission line 2 and the electric wire. 3 is housed in the housing 11 together with the front end portion.

光伝送路２は、表面実装型光パッケージ２０に接続されている。
表面実装型光パッケージ２０は、光電変換部電極６から入力された電気信号を光信号に変換して光伝送路２に送出、または、光伝送路２から入力された光信号を電気信号に変換して光電変換部電極６に送出する機能を有する。
具体的には、例えば、受光素子または発光素子からなる受発光部（図示略）において電気信号を光信号に変換し、または光信号を電気信号に変換し、必要に応じこの受発光部と光電変換部電極６との間にある信号増幅回路（図示略）が、電気信号の増幅を行う構成が可能である。発光素子としてはＶＣＳＥＬ、ＬＥＤ、ＬＤ等が挙げられ、受光素子としてはＰＤ等が挙げられる。 The optical transmission line 2 is connected to the surface mount optical package 20.
The surface-mount optical package 20 converts the electrical signal input from the photoelectric conversion unit electrode 6 into an optical signal and sends it to the optical transmission path 2 or converts the optical signal input from the optical transmission path 2 into an electrical signal. Thus, it has a function of sending to the photoelectric conversion unit electrode 6.
Specifically, for example, an electrical signal is converted into an optical signal in a light emitting / receiving unit (not shown) composed of a light receiving element or a light emitting element, or an optical signal is converted into an electrical signal. A signal amplifying circuit (not shown) between the conversion unit electrode 6 can amplify an electric signal. VCSEL, LED, LD, etc. are mentioned as a light emitting element, PD etc. are mentioned as a light receiving element.

表面実装型光パッケージ２０における光結合部は、図３に示す光結合部１３と同様の構造を有する。
すなわち、光伝送路２は、上述の光結合部１３と同様の構成の光結合部（図示略）を介して表面実装型光パッケージ２０の受発光部（図示略）に光学的に接続されている。
光伝送路２の光軸２ｂは、表面実装型光パッケージ２０の光軸に対して所定の角度θ（例えば０＜θ＜１８０°）で交差している。
光結合部（図示略）を構成する透明樹脂は、表面実装型光パッケージ２０の受発光部の少なくとも一部および光伝送路２の端部２ａの少なくとも一部にそれぞれ密着している。
この光結合部を構成する樹脂の外面は、表面実装型光パッケージ２０の受発光部および光伝送路２の端部２ａの側に凹んだ形状となっている。 The optical coupling part in the surface mount optical package 20 has the same structure as the optical coupling part 13 shown in FIG.
In other words, the optical transmission line 2 is optically connected to the light receiving and emitting unit (not shown) of the surface mount optical package 20 through the optical coupling unit (not shown) having the same configuration as the optical coupling unit 13 described above. Yes.
The optical axis 2b of the optical transmission line 2 intersects the optical axis of the surface mount optical package 20 at a predetermined angle θ (for example, 0 <θ <180 °).
The transparent resin constituting the optical coupling part (not shown) is in close contact with at least a part of the light receiving / emitting part of the surface mount optical package 20 and at least a part of the end part 2 a of the optical transmission path 2.
The outer surface of the resin constituting this optical coupling portion has a shape recessed toward the light emitting / receiving portion of the surface mount optical package 20 and the end portion 2a of the optical transmission path 2.

表面実装型光パッケージ２０は、回路基板８の一方の面８ａに設けられたレセプタクル２０ａに装着することで、光電変換部電極６に電気的に接続できる。
電線３は、回路基板８の他方の面８ｂに設けられた電線接続用電極７に接続されている。 The surface mount type optical package 20 can be electrically connected to the photoelectric conversion unit electrode 6 by being mounted on the receptacle 20a provided on the one surface 8a of the circuit board 8.
The electric wire 3 is connected to an electric wire connecting electrode 7 provided on the other surface 8 b of the circuit board 8.

光電変換モジュール４１では、電線３が回路基板８に接続されているので、電線３の配線のためにハウジング１１内に確保するべきスペースを小さくでき、小型化を実現できる。
また、ハウジング１１内部に十分なスペースを確保できるため、光伝送路２や電線３の多線化が容易となることから、情報伝送量の増加に対応できる。
また、光伝送路２が回路基板８の一方の面８ａ側に接続され、電線３が他方の面８ｂに接続されるため、回路配線を両面８ａ、８ｂに分けて形成することができ、実装効率を高めることによりさらなる小型化が可能となる。 In the photoelectric conversion module 41, since the electric wire 3 is connected to the circuit board 8, the space to be secured in the housing 11 for the wiring of the electric wire 3 can be reduced, and downsizing can be realized.
In addition, since a sufficient space can be secured inside the housing 11, the optical transmission path 2 and the electric wires 3 can be easily multi-wired, so that an increase in the amount of information transmission can be accommodated.
Moreover, since the optical transmission line 2 is connected to the one surface 8a side of the circuit board 8 and the electric wire 3 is connected to the other surface 8b, the circuit wiring can be formed separately on both surfaces 8a and 8b. Further miniaturization is possible by increasing the efficiency.

なお、本発明は、光モジュールが光電気複合ケーブルの一端のみに設けられた構成も可能である。   In the present invention, a configuration in which the optical module is provided only at one end of the photoelectric composite cable is also possible.

１、３１、４１・・・光電変換モジュール（光モジュール）、２・・・光伝送路、２ａ・・・光伝送路の端部、２ｂ・・・光伝送路の光軸、３・・・電線、４・・・光電気複合ケーブル、５・・・電気コネクタ、６・・・光電変換部電極、８・・・回路基板、９・・・受発光素子（光電変換部）、９ａ・・・受発光部、９ｂ・・・受発光素子（光電変換部）の光軸、１３・・・光結合部、１３ａ・・・光結合部の外面、１５・・・副基板、２１、２２、２３・・・凹面部。 DESCRIPTION OF SYMBOLS 1, 31, 41 ... Photoelectric conversion module (optical module), 2 ... Optical transmission path, 2a ... End of optical transmission path, 2b ... Optical axis of optical transmission path, 3 ... Electric wire, 4 ... optoelectric composite cable, 5 ... electrical connector, 6 ... photoelectric conversion part electrode, 8 ... circuit board, 9 ... light emitting / receiving element (photoelectric conversion part), 9a ... Light receiving / emitting section, 9b: optical axis of light receiving / emitting element (photoelectric conversion section), 13: optical coupling section, 13a: outer surface of optical coupling section, 15: sub-board, 21, 22, 23 ... concave surface portion.

Claims (6)

光伝送路と電線とを備えた光電気複合ケーブルの端部に組み立てられる光モジュールであって、
回路基板と、前記回路基板に接続された光電変換部と、前記回路基板に接続され、他の機器に接続可能な電気コネクタとを備え、
前記電線が、前記回路基板に接続されることにより、前記回路基板の回路配線を介して前記電気コネクタに電気的に接続され、
前記光伝送路が、前記光電変換部の光軸に対して所定の角度で交差する光軸を有し、前記光電変換部に光結合部を介して光学的に接続され、
前記光結合部が、伝送される光に対して透明な樹脂からなり、前記樹脂が、前記光電変換部の受発光部の少なくとも一部および前記光伝送路の端部の少なくとも一部にそれぞれ密着し、
前記光結合部を構成する樹脂の外面は、前記光電変換部の受発光部および前記光伝送路の端部の側に凹んだ形状となっていることを特徴とする光モジュール。 An optical module assembled at the end of a photoelectric composite cable comprising an optical transmission line and an electric wire,
A circuit board, a photoelectric conversion unit connected to the circuit board, an electrical connector connected to the circuit board and connectable to other devices,
By connecting the electric wire to the circuit board, it is electrically connected to the electrical connector via the circuit wiring of the circuit board,
The optical transmission line has an optical axis that intersects the optical axis of the photoelectric conversion unit at a predetermined angle, and is optically connected to the photoelectric conversion unit via an optical coupling unit;
The optical coupling portion is made of a resin that is transparent to transmitted light, and the resin is in close contact with at least a part of the light receiving and emitting part of the photoelectric conversion unit and at least a part of the end of the optical transmission path. And
An optical module, wherein an outer surface of a resin constituting the optical coupling unit has a shape recessed toward a light emitting / receiving unit of the photoelectric conversion unit and an end of the optical transmission path. 前記光電変換部は、前記回路基板の一方の面側に設けられ、
前記電線は、前記回路基板の他方の面に接続されていることを特徴とする請求項１に記載の光モジュール。 The photoelectric conversion unit is provided on one surface side of the circuit board,
The optical module according to claim 1, wherein the electric wire is connected to the other surface of the circuit board. 前記光電変換部は、前記回路基板の一方の面に設けられた光電変換部電極に直接実装されていることを特徴とする請求項１または２に記載の光モジュール。   The optical module according to claim 1, wherein the photoelectric conversion unit is directly mounted on a photoelectric conversion unit electrode provided on one surface of the circuit board. 前記光電変換部は、前記回路基板に接続された副基板に設けられていることを特徴とする請求項１または２に記載の光モジュール。   The optical module according to claim 1, wherein the photoelectric conversion unit is provided on a sub-board connected to the circuit board. 前記光電変換部は、面発光レーザであることを特徴とする請求項１〜４のうちいずれか１項に記載の光モジュール。   The optical module according to claim 1, wherein the photoelectric conversion unit is a surface emitting laser. 請求項１〜５のうちいずれか１項に記載の光モジュールが、前記光電気複合ケーブルの少なくとも一端に組み立てられたことを特徴とするモジュール付きケーブル。   A cable with a module, wherein the optical module according to any one of claims 1 to 5 is assembled to at least one end of the photoelectric composite cable.
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