KR101477380B1 - Optical Interconnection Module, Receptacle and Optical Connector using thereof - Google Patents

Abstract

The present invention relates to an optical wiring module, a receptacle, and an optical connector using the same. More particularly, the present invention relates to an optical wiring module, a receptacle, and an optical connector using the same. An optical block which is integrally formed with the first lead frame and the optoelectronic device, the optical block having the same number of insertion holes as the optoelectronic device, the optical block inserted into the optical block through the insertion hole and aligned with the optoelectronic device And an outer circumferential surface of the contact portion includes two contact surfaces for double contact with the receptacle contact.

Description

TECHNICAL FIELD [0001] The present invention relates to an optical interconnection module, a receptacle, and an optical connector using the same.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical wiring module, a receptacle, and an optical connector using the same. More particularly, the present invention relates to a photoelectric wiring module, a receptacle, and an optical connector using the same.

Recent advances in IT technology have led to the development of high-performance, high-speed, integrated, and miniaturized (thin) devices in recent electronic devices such as smartphones, smart TVs, computers, tablet PCs, displays, digital cameras, camcorders, MP3 players, It is progressing.

Recent trends in electronic devices require high-speed, high-speed data transmission technologies such as high image quality and 3D image content among the devices in the device. This enables signal attenuation, noise, EMI / EMC, impedance matching, cross talk, skew, Has become a big issue.

Generally, copper-based wiring, that is, electrical connectors, is used for data transmission within the device.

However, copper wiring can not meet the high-speed data transmission needs of large capacity, and it does not solve various technical issues that meet the above-mentioned recent electronic device trends.

Recently, optical wiring technology has been researched and developed as a technology to solve this problem. In other words, optical wiring can replace high-capacity data at a high speed by replacing dozens of channels of parallel electrical signal lines with serial optical signal lines, and can solve technical problems such as noise, EMI / EMC, impedance matching, cross talk, skew, Can be solved.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of an optical cable module of the prior art used for connection between boards in an apparatus. Fig.

The optical cable module shown in Fig. 1 is disclosed in Japanese Patent No. 4631671 (hereinafter referred to as " Prior Art ") and will be described as follows.

The optical cable module shown in Fig. 1 is composed of a transmitting section 10a and a receiving section 10b. The transmitting section includes a VCSEL (Vertical Cavity Surface Emitting Laser) chip 3a on the substrate 6a, 5b, a bonding wire 7b, a bonding wire 7a, a liquid resin 8a, and a height supporting member 4a. The receiving portion includes a PD chip 3b, an electrode pad 5b, a bonding wire 7b, A liquid resin 8b and a height supporting member 4b and is constituted by an optical waveguide 2 as a connection wiring between a transmitter and a receiver.

1, an electric signal (i.e., image data) of a main board connected to a transmitter is supplied to a VCSEL chip (not shown) through a control of a Driver IC (not shown) through an electrode pad 5a on a substrate 6a Is vertically emitted upward from the VCSEL chip 3a and is reflected on a 45 ° mirror surface at the end of the optical waveguide 2 and is transmitted to the receiver through the optical waveguide 2. [

In the receiver, the optical signal is vertically reflected downward through the 45 ° mirror surface at the end of the optical waveguide 2, converted into an electric signal from the PD chip 3b on the substrate 6b, and input to a display board connected to the receiver.

In the prior art, since the vertical alignment structure using the 45 ° mirror surface and the height supporting member are used between the VCSEL chip and the optical waveguide, there arises a problem that the optical loss problem, the problem of the optical coupling separation distance, .

In addition, since the sealing liquid resin is used for protecting the VCSEL chip in the prior art, the optical waveguide is affected by the expansion of the liquid resin, so that the optical focusing can not be performed properly.

In addition, in the prior art, a manufacturing process is required to process the optical waveguide at 45 degrees in the manufacturing process, and the alignment between the VCSEL chip and the optical waveguide must be finely adjusted by hand.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made to solve the above-mentioned problems and to meet the above-mentioned needs, and it is an object of the present invention to provide a light- In order to guarantee the physical stability of parts mounting, we intend to provide a photoelectric wiring module for high-speed data transfer between boards in a device.

That is, the present invention is to provide a commercially available photoelectric wiring module that can be universally applied to a board in a device while having a manufacturing process of low cost and high reliability, and in particular, has an automatic alignment structure of photoelectric elements and optical transmission lines, And a dual contact structure of the module and the receptacle.

In order to accomplish these objects, the present invention provides a photoelectric interconnection module comprising at least a pair of seat frames, a bonding frame, and a first lead frame having a contact portion for electrical connection with the receptacle contact when the receptacle is engaged, An optical block integrally formed with the first lead frame and the photoelectric device, the optical block having the same number of insertion holes as the photoelectric device, and an optical path inserted into the optical block through the insertion hole and aligned with the photoelectric device And the outer circumferential surface of the contact portion has two contact surfaces for double contact with the receptacle contact.

Further, the contact portion is formed by being bent in a " U "shape to have the two contact surfaces.

Further, the seat frame is characterized in that a protrusion is formed.

In addition, the photoelectric device is mounted on the protrusion, and the wire is bonded to the bonding frame, which is a pair with the seating frame.

Further, the optical block is formed of a transparent material.

In addition, the receptacle according to the present invention includes a second lead frame, a housing integrally molded with the second lead frame, an integrated circuit mounted on the housing and wire-bonded to the second lead frame, And a plurality of contacts connected to the first lead frame of the photoelectric interconnection module and configured to be in double contact with the first lead frame of the photoelectric interconnection module.

In addition, the contact is characterized in that the contact includes a bent portion at one end.

The contact portion is formed in a U-shape, and a plurality of protrusions are formed on an inner circumferential surface of the contact portion so as to be in double contact with the first lead frame of the photoelectric module.

In addition, a seating part on which the photoelectric module is seated is formed on an upper portion of the housing.

According to another aspect of the present invention, there is provided an optical connector comprising: a lead frame on which a photoelectric element is mounted and on which a wire is bonded and a contact portion is formed at one end; an optical block integrally formed with the lead frame, And an optical transmission line inserted into the optical block through the insertion hole and aligned with the optoelectronic device, and a receptacle including a contact formed in the same shape as the bending of the lead frame .

Further, the contact portion is formed in a " U " shape.

Further, the contact is formed in a " U " shape so that the outer circumferential surface of the contact portion is in close contact with the inner circumferential surface of the contact.

In addition, the contact has a plurality of protrusions formed on the inner circumferential surface thereof and is in double contact with the outer circumferential surface of the contact portion.

As described above, the present invention has a structure in which the photoelectric interconnection module and the receptacle are in double contact with each other, thereby ensuring the contact stability between the photoelectric interconnection module and the receptacle.

In addition, the present invention can be used as it is without any additional processing of elements and components of the photoelectric wiring module, and is easy to mass-produce with low cost and high reliability. It is easy to mount such elements and components on a substrate, Mass productivity can be guaranteed. In addition, there is an effect that the mirror surface processing step of the optical path can be omitted.

In addition, since the present invention includes an automatic alignment structure of photoelectric elements and optical transmission paths by using an optical block, it has an effect of facilitating optical alignment, minimizing the optical coupling separation distance, There is an effect.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an optical cable module of the prior art,
2 is a perspective view of an optical connector according to an embodiment of the present invention.
3 is a perspective view of the optoelectric wiring module shown in FIG.
4A to 4C are perspective views illustrating a process of generating a photoelectric wiring module.
Figure 5 is a perspective view of the receptacle shown in Figure 2;
6A to 6D are perspective views for explaining a process of creating a receptacle;
7 and 8 are cross-sectional views for explaining the combination of the photoelectric interconnection module and the receptacle according to the embodiment of the present invention

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the exemplary embodiments of the present invention, descriptions of techniques which are well known in the art and are not directly related to the present invention will be omitted. This is to omit the unnecessary description so as to convey the key of the present invention more clearly without fading.

As described in the related art, an optical cable module (hereinafter, referred to as a photoelectric wiring module) includes a transmitter and a receiver. For example, in the case of a photoelectric wiring module for high-speed transfer of large-capacity data between boards in a device, the transmission unit is mounted on the main board on which the CPU is mounted, and the reception unit is mounted on the display board. An optical transmission path is formed between the transmission unit and the reception unit, and data is transmitted through the optical transmission path.

The transmitter and the receiver of the photoelectric interconnection module of the present invention are the same in shape and structure as shown in the drawing. In the transmitter, a light emitting control device, a light emitting device package (e.g., Vertical Cavity Surface Emitting Laser (VCSEL) Package), and a light receiving control element and a light receiving element package (for example, PD (PhotoDiode) package) are provided in the receiving portion.

That is, the light emission control element converts an electric signal input through the electric terminal into a light signal by processing the signal, and the light reception control element converts the light signal inputted from the light transmission path into an electric signal.

In addition, the optical path may be implemented by an optical waveguide, an optical fiber (e.g., POF (Plastic Optical Fiber) or the like), and a core or clad as an optical transmission medium.

2 is a perspective view of an optical connector according to an embodiment of the present invention. 3 is a perspective view of the optoelectric wiring module shown in FIG. 4A to 4C are perspective views illustrating a process of forming a photoelectric wiring module.

Referring to FIG. 2, the optical connector 100 of the present invention includes a photoelectric module 200 and a receptacle 300. The photoelectric module 200 includes a first lead frame 210 for mounting and connecting elements, a photoelectric element 215, a photoelectric element 215 for automatically aligning the photoelectric elements 215 and the optical path 230, An optical block 220, and an optical path 230 for emitting an optical signal emitted from a printed circuit board (not shown) or incident on a printed circuit board.

3 to 4C, the first lead frame 210 constituting the photoelectric wiring module 200 according to the present invention includes at least a pair of seating frames 211, And a frame 212, and a projection 214 is formed on the seat frame 211. [ 3 to 4C, one end of the seat frame 211 and the other end of the bonding frame 212 are bent into a U-shape to form the contact portion 213, The pilot frame 217 is connected to the seat frame 211 and the bonding frame 212 to be formed into a plate shape. A hole formed in the pilot frame 217 serves to determine the position of the opto-electronic device 215 with a pilot hole.

The opto-electronic device 215 is mounted on the protrusion 214 of the mount frame 211 and the mounted optoelectronic device 215 is wire-bonded to the bonding frame 212 which forms a pair with the mount frame. This is shown in FIG. The photoelectric element 215 is a component that emits light from the surface of the photoelectric element 215 or receives light from the surface of the photoelectric element 215 and may be a light emitting element chip such as a VCSEL or a light receiving element chip such as a PD. That is, the opto-electronic device 215 in the case of the VCSEL converts the electrical signal input through the first lead frame 210 into an optical signal and outputs the optical signal to the optical path 230. A wire 216 bonded between the opto-electronic device 215 and the bonding frame 212 performs a connection between the bonding frame 212 and the opto-electronic device 215, that is, an electrical signal wiring function. Can be implemented.

The optical block 220 is formed integrally with the mounting frame 211 and the bonding frame 212 except for the pilot frame 217 and the pilot frame 217 217) are etched. This can be shown in FIG. 4C. The optical block 220 integrally formed with the first lead frame 210 is provided with an insertion hole 221 into which the optical path 230 is inserted to prevent the core end of the optical path 230 from contacting the photoelectric element 215 (Not shown) are formed on the lower surface of the base plate. The insertion hole 221 serves to automatically align the optoelectronic devices 215 and the optical path 230 located in the seating frame 211 when the optical path 230 is inserted. At this time, four insertion holes 221 are formed in the upper portion of the optical block 220, and the optical path 230 is inserted into the insertion hole 221. At this time, it is preferable that the optical transmission path 230 is inserted into the insertion holes 221 with the same number as the number of the opto-electronic devices 215, and the optical block 220 is formed of a transparent material.

The core of the optical path 230 is inserted through the insertion hole 221 of the optical block 220 until the locking block 220 is formed integrally with the first lead frame 210. The core end of the optical path 230 is positioned at a position substantially close to the exit surface (or entrance surface) of the photoelectric device 215 located in the mount frame 211 Mu m or less).

Since the optical connector 100 according to the present invention has a four-channel connector as an example, four optical devices 215 are mounted and four optical transmission paths 230 are inserted into the optical block 220 However, the present invention is not limited thereto, and it is clarified that a channel can be reduced or expanded by a person skilled in the art.

As described above, the optoelectric wiring module 200 having the optical coupling structure between the opto-electronic device 215 and the optical path 230 of the present invention has an effect of facilitating optical alignment. In addition, the elements and components of the photoelectric wiring module 200 can be used without any additional processing, and mass production is easy with low cost and high reliability. In addition, it is easy to mount the elements and components on the mount frame 211, thereby ensuring mass production such as a manufacturing speed, and omitting the mirror surface machining process of the optical path 230.

In particular, the light transmissive epoxy can be filled around the optical block 220 insertion hole 221 and / or inside and around the end of the optical path 230. This can compensate for the optical coupling between the optical path 230 and the exit surface (or entrance surface) of the opto-electronic device 215 and allow the core of the optical path 230 to be fixedly attached to the insertion hole 221 . At this time, it is preferable that the light transmissive epoxy has a refractive index similar to that of the optical path 230, and a polymer-based epoxy having good optical transparency is used. For example, a light transmissive epoxy having a refractive index of 1.2 to 1.8 and a light transmittance of 80 to 95% in a wavelength band of the optical path 230 can be used.

The optical block 220 may be fabricated using a plastic injection molding method or the like and may be fabricated by using an optical block 220 such that the light from the optoelectronic device 215 is accurately emitted to the core of the optical path 230 ), Or a lens may be inserted. Since the optical path 230 is inserted into the optical block 220 as described above, it is possible to solve the problem that the optical path 230 is not physically fixed, thereby assuring the optical alignment reliability. After the optical block 220 is integrally formed with the first lead frame 210, the optical path 230 is inserted into the insertion hole 221 formed in the optical block 220, .

Fig. 5 is a perspective view of the receptacle shown in Fig. 2. Fig. 6A to 6D are perspective views for explaining a process of generating a receptacle.

2 and 5 to 6D, the receptacle 300 according to the present invention mainly includes a second lead frame 310, a housing 320, a seating portion 321 formed in the housing 320, 323, and at least one contact 322 which is fastened to the fastening groove 323. [

More specifically, the housing 320 is integrally formed on the upper portion of the second lead frame 310 formed as shown in FIG. 6A, as shown in FIG. 6B. At this time, a seating part 321 for seating the optoelectric wiring module 200 is formed on the upper part of the housing 320, and an integrated circuit 324 (Driver IC) can be mounted on the second lead frame 310 (Not shown) is formed.

6C, the integrated circuit 324 is mounted on the second lead frame 310 through a space formed in the housing 320 and is wire-bonded to the second lead frame 310 through an electrical connection. 6D, at least one contact 322 is fastened to the coupling groove 323 formed in the housing 320 for electrical connection with the optoelectric wiring module 200 to be mounted on the seating portion 321. As shown in FIG. Finally, the space in which the integrated circuit 324 is mounted is filled with the epoxy 330 to fix the integrated circuit to the second lead frame 310. At this time, the contact 322 is curved at one end to form a "U" -shaped contact portion (not shown), and a plurality of protrusions 322a are formed on the inner circumferential surface of the contact portion. This will be described in detail in FIG. 7 and FIG.

FIGS. 7 and 8 are cross-sectional views for explaining a combination of a photoelectric interconnection module and a receptacle according to an embodiment of the present invention.

2 to 8, the optical connector 100 is produced by fastening the photoelectric module 200 and the receptacle 300. [

The contact portion 213 formed at one end of the first lead frame 210 of the optoelectronic interconnection module 200 at the time of tightening is inserted into the receptacle 300 via the receptacle 300 300 can be electrically connected to each other by engaging with the contacts 322 fastened to the housing 320 of the optical wiring module 200 and the receptacle 300.

More specifically, as described with reference to FIGS. 3 to 4C, one end of the first lead frame 210 of the photoelectric conversion module 200 forms a contact portion 213 bent in a " U " shape. 5 to 6D, the contact 322 of the receptacle 300, which is in contact with the contact portion 213 of the photoelectric module 200, is also formed with one end bent in a U-shape. At this time, two protrusions 322a are formed on the inner circumferential surface of the contact 322.

The outer peripheral surface of the contact portion 213 comes into contact with the inner peripheral surface of the contact 322 when the first lead frame 210 contacts the contact 322. [ 7, two protrusions 322a are formed on the inner circumferential surface of the contact 322. The contact portion 213 of the first lead frame 210 inserted into the contact 322 is formed on the two protrusions 322a Contact with the contact 322. Thus, the contact safety between the contact 322 and the first lead frame 210 can be improved.

Up to now, a description has been given of a photoelectric interconnection module, a receptacle, and an optical connector using the same according to the present invention. Although the present invention has been described in connection with what is presently considered to be preferred embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, The present invention is not limited thereto. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments described above.

100: optical connector 200: photoelectric wiring module
210: first lead frame 211: seat frame
212: bonding frame 213:
214: protrusion 215: photoelectric element
216: wire 217: pilot frame
220: optical block 221: insertion hole
230: Optical pathway 300: Receptacle
310: second lead frame 320: housing
321: seat part 322:
322a: projecting portion 323: fastening groove
324: Integrated Circuit 330: Epoxy

Claims (14)

A first lead frame having at least a pair of seat frames, a bonding frame, and a contact portion to be electrically connected to the receptacle contacts when the receptacle is coupled with the first frame;
A photoelectric device mounted on said at least one seat frame;
An optical block integrally formed with the first lead frame and the photoelectric element, wherein the same number of insertion holes as the photoelectric elements are formed;
And an optical path inserted into the optical block through the insertion hole and aligned with the photoelectric device,
Wherein the outer circumferential surface of the contact portion has two contact surfaces for double contact with the receptacle contact.
delete The method according to claim 1,
The contact portion
U "-shaped to provide the two contact surfaces. The method according to claim 1,
And a protrusion is formed on the seating frame. 5. The method of claim 4,
The photoelectric element
And the wire is bonded to the bonding frame which is seated on the projection and forms a pair with the seating frame. The method according to claim 1,
The optical block
Wherein the first electrode is formed of a transparent material. A second lead frame;
A housing integrally molded with the second lead frame;
An integrated circuit mounted on the housing and wire-bonded to the second lead frame;
And a plurality of contacts electrically connected to the second lead frame and formed in a double contact with the first lead frame of the photoelectric module. 8. The method of claim 7,
The contact
And one end of which includes a curved contact portion. 9. The method of claim 8,
The contact portion
And a plurality of projections are formed on an inner circumferential surface of the receptacle so as to double contact with the first lead frame of the photoelectric interconnection module. 10. The method of claim 9,
And a seating portion on which the photoelectric wiring module is seated is formed on an upper portion of the housing. A lead frame having a photoelectric element mounted thereon and bonded with a wire and having a contact portion formed at one end thereof; an optical block integrally formed with the lead frame, the optical block having the same number of insertion holes as the photoelectric device; An optoelectronic wiring module including an optical transmission line inserted and aligned with the optoelectronic devices;
And a receptacle including contacts formed in the same form of bending as the bending of the lead frame. 12. The method of claim 11,
The contact portion
&Quot; U ".< / RTI > 13. The method of claim 12,
The contact
And the outer peripheral surface of the contact portion is formed in a " U " shape so as to be in close contact with the inner peripheral surface of the contact. 14. The method of claim 13,
The contact
Wherein a plurality of protrusions are formed on the inner circumferential surface to double contact the outer circumferential surface of the contact portion.

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