JP2014052587A - Communication module and communication apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a communication module and a communication apparatus which conduct heat generated from a circuit component to a radiator and allows secure electrical connection between a connector of the communication module and a mating connector.SOLUTION: The communication module comprises: a first substrate 27 on which an optical element array 26 and a semiconductor circuit element 25 are mounted; a male connector 21 provided on an end of a second substrate 28; and a heat transmission member 4 conducting heat generated from the optical element array 26 and the semiconductor circuit element 25 to a radiator 7. The heat transmission member 4 includes: a heat absorption part 40 absorbing the heat generated from the optical element array 26 and the semiconductor circuit element 25; a heat radiation part 42 in contact with the radiator 7; and a transmission part 41 conducting the heat absorbed by the heat absorption part 40 to the heat radiation part 42. The heat radiation part 42 projects to a direction intersecting with the first substrate 27 and the second substrate 28, and is brought into contact with the radiator 7 by fitting of the male connector 21 and a female connector 3 to regulate a relative displacement between the male connector 21 and the female connector 3.

Description

  The present invention relates to a communication device including, for example, a communication module used for signal transmission of a high-performance server or a high-speed network device, and a communication module and a radiator that dissipates heat generated from the communication module.

  Conventionally, in order to increase the mounting efficiency of electronic components on a mother board, for example, a communication device is known in which a card-like communication module (optical module) that performs optical communication is arranged perpendicular to the mother board. This type of communication module includes a heat sink (heat radiator) for releasing heat generated by an optical element or control IC mounted on the substrate and suppressing a temperature rise (for example, Patent Document 1). reference).

  In the communication module described in Patent Document 1, a plurality of terminals are formed at the end of a rigid board on which an optical element and a control IC are mounted. The plurality of terminals formed on the rigid board are fitted and electrically connected to a connector socket mounted on the mother board, and the rigid board is arranged perpendicular to the mother board by the fitting. A heat sink for heat dissipation is attached to the non-mounting surface opposite to the mounting surface on which the optical element and the control IC are mounted on the rigid substrate. Heat generated by the optical element and the control IC is conducted to the heat sink via the rigid substrate, and is radiated from the fins formed on the heat sink.

JP 2011-128378 A

  The communication module described in Patent Document 1 is fixed to the motherboard by fitting a rigid board and a connector socket. The weight and vibration of components mounted or attached to the rigid board, or the tension of a cable for communication, etc. If the rigid board wobbles with respect to the mother board due to the above, loosening occurs in the fitting, and there is a possibility that the electrical connection at the contact of the terminal is not surely made.

  Further, generally, when the terminal is fitted to the connector until the end, good connection at the contact point may be obstructed. However, in the communication module described in Patent Document 1, the upper side of the horizontally arranged motherboard is used. When the communication module is arranged, the plurality of terminals of the rigid board are always pressed against the connector socket side by the weight of the component, and the rigid board is abutted against the connector socket.

  As described above, in the communication module described in Patent Document 1, the electrical connectivity at the contact of the terminal is affected by the wobbling of the rigid board with respect to the motherboard and the fitting between the terminal and the connector socket. There was a risk of receiving it.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a communication module and a communication device that can transfer heat generated from a circuit component to a radiator and ensure electrical connection between a connector of the communication module and a counterpart connector. There is.

  In order to solve the above problems, the present invention provides a board on which a circuit component for communication is mounted on a mounting surface, a connector provided at an end of the board, and a heat dissipated from the circuit component. A heat transfer member that transfers heat to the circuit component, a heat absorption part that absorbs heat from the circuit component, a heat dissipation part that contacts the radiator, and heat that is absorbed from the heat absorption part. And the heat radiating portion protrudes in a direction intersecting the substrate, and contacts the radiator by fitting the connector and the mating connector, and the connector and the mating connector. Provided is a communication module that regulates relative movements of

  Moreover, the said heat radiating part is good to be fixed to the said heat radiator with a fixing tool.

  The fitting direction of the connector and the mating connector may be a direction orthogonal to the motherboard on which the mating connector is mounted.

  Moreover, the said heat radiating part is good to protrude in the direction orthogonal to the said board | substrate.

  Moreover, the said heat absorption part is good to oppose the mounting position of the said circuit component through the said board | substrate.

  Further, the substrate is accommodated in a case member having a pair of side walls sandwiched in the thickness direction thereof, and the heat transfer member is configured such that the heat absorbing portion is disposed inside the case member, and the heat radiating portion is disposed on the case member. It should be placed outside.

  In addition, the case member integrally includes the heat absorbing portion, a first plate portion facing the substrate, and a second plate portion bent with respect to the first plate portion, and the first plate portion As the transmission part, the second plate part may function as the heat dissipation part.

  The circuit component may include an optical element optically coupled to an optical fiber and a semiconductor circuit element electrically connected to the optical element.

  Moreover, the communication apparatus provided with the said communication module with the said solution means, the said heat radiator, and the motherboard by which the said other party connector was mounted is provided.

  The communication module may include a plurality of the communication modules and the plurality of radiators, and the communication module may be disposed between a pair of radiators adjacent to each other among the plurality of radiators.

  According to the communication module and the communication device of the present invention, it is possible to efficiently dissipate heat generated from the circuit components, and to ensure electrical connection between the connector of the communication module and the counterpart connector.

It is a perspective view of the optical module and female connector which concern on 1st Embodiment. It is AA sectional drawing of FIG. It is BB sectional drawing of FIG. It is a schematic diagram which shows the structural example of the optical communication apparatus which concerns on 1st Embodiment. It is a perspective view of the optical module and female connector which concern on 2nd Embodiment. It is CC sectional drawing of FIG. It is a schematic diagram which shows the structural example of the optical communication apparatus which concerns on 2nd Embodiment. It is a perspective view of the optical module and female connector which concern on a modification. It is a schematic diagram which shows the structural example of the optical communication apparatus which concerns on a modification.

[First Embodiment]
FIG. 1 is a perspective view of the optical module 2 and the female connector 3 according to the first embodiment.

(Configuration of optical module 2)
An optical module 2 as a communication module includes a module case 20 having a first side wall 201 and a second side wall 202 that sandwich a substrate on which a circuit component for optical communication described later is mounted in the thickness direction, And a heat transfer member 4 for transferring heat generated from the circuit component to a radiator described later. On the bottom surface 205 of the module case 20 facing the mounting surface 6a of the mother board 6, there is provided a male connector 21 as a connector that fits into the female connector 3 as a mating connector mounted on the mounting surface 6a of the mother board 6. Yes. The male connector 21 is formed with a plurality of male terminals 21 a along the extending direction of the optical fiber cable 5.

  The module case 20 includes a third side wall 203 provided between one end of each of the first side wall 201 and the second side wall 202 along the normal direction of the mounting surface 6a of the mother board 6, and And a fourth side wall 204 provided between the other end portions of the first side wall 201 and the second side wall 202 so as to face the third side wall 203. The third side wall 203 and the fourth side wall 204 have a pair of convex portions 22 (only one convex portion 22 is shown in FIG. 1) that fits into a pair of mounting holes 31a formed in the female connector 3. Is formed. Further, the rubber boot 50 of the optical fiber cable 5 is attached to the fiber attachment portion 23 formed on the third side wall 203, and the optical fiber cable 5 is pulled out perpendicularly with respect to the third side wall 203.

  The module case 20 has a total length along the extending direction of the optical fiber cable 5 of, for example, 23 mm, and a thickness-direction dimension orthogonal to the direction is, for example, 3.6 mm. The dimension of the optical module 2 in the height direction (direction perpendicular to the mother board 6) is, for example, 24 mm.

  The heat transfer member 4 has a rectangular parallelepiped heat radiation portion 42 that contacts the heat radiator. The heat radiating portion 42 passes through a through hole 201 a formed in the first side wall 201 of the module case 20 and protrudes in a direction orthogonal to the first side wall 201.

(Configuration of female connector 3)
The female connector 3 includes a connector case 30 in which a housing space 300 for housing a plurality of female terminals 32 electrically connected to the plurality of male terminals 21 a is formed, and the male connector 21 and the female connector 3 from the connector case 30. It has the extension part 31 extended along the fitting direction. The extending portion 31 is in contact with the third side wall 203 and the fourth side wall 204 of the module case 20. The extension portion 31 is formed with a rectangular attachment hole 31 a that engages with the convex portion 22 formed on the third side wall 203 and the fourth side wall 204. A plurality of lead wires 33 are formed along the extending direction of the optical fiber cable 5 on the bottom surface of the connector case 30 facing the mounting surface 6 a of the mother board 6. The plurality of lead wires 33 are connected to the mounting surface 6a of the mother board 6 by soldering.

  FIG. 2 is a cross-sectional view taken along the line AA of FIG. 3 is a cross-sectional view taken along line BB in FIG.

  The optical module 2 includes, as circuit components for optical communication, a pair of optical element arrays 26 in which a plurality of optical elements are arranged, a pair of semiconductor circuit elements 25 electrically connected to the pair of optical element arrays 26, The first substrate 27 on which these circuit components for optical communication are mounted, the lens block 24 having the lens 240 that optically couples the plurality of optical elements and the optical fiber cable 5, the lens block 24, and the first The second board 28 sandwiched between the board 27 and the board 27 is housed in the module case 20.

  The first substrate 27 is disposed on the first side wall 201 side of the module case 20, and the lens block 24 is disposed on the second side wall 202 side of the module case 20. A pair of optical element arrays 26 and a pair of semiconductor circuit elements 25 are mounted on the mounting surface 27 a of the first substrate 27. The pair of semiconductor circuit elements 25 are disposed with the pair of optical element arrays 26 interposed therebetween. In FIG. 2, only one semiconductor circuit element 25 and the optical element array 26 are shown.

  The second substrate 28 is electrically connected via the mounting surface 27 a of the first substrate 27. Furthermore, the end of the second substrate 28 on the side of the mother board 6 is fitted into a recess 21 b formed in the male connector 21, and the second substrate 28 and the male connector 21 are electrically connected. The male connector 21 and the female connector 3 are fitted in a direction orthogonal to the mother board 6, and the male terminal 21a and the female terminal 32 (shown in FIG. 1) are electrically connected.

  The heat transfer member 4 includes a heat absorption unit 40 that absorbs heat from the circuit components for optical communication, a heat dissipation unit 42, and a transmission unit 41 that transmits heat absorbed from the heat absorption unit 40 to the heat dissipation unit 42. It is integrally formed. The heat absorption part 40 and the heat dissipation part 42 are connected by a transmission part 41. The heat absorption part 40 is attached to a position corresponding to the mounting position of the semiconductor circuit element 25 and the optical element array 26 on the surface of the first substrate 27 opposite to the mounting surface 27a. Therefore, the heat absorption part 40 is disposed inside the module case 20. The heat radiating portion 42 passes through a rectangular through hole 201 a formed in the module case 20 and protrudes from the module case 20 in a direction orthogonal to the first substrate 27. That is, the heat radiation part 42 is disposed outside the module case 20. The heat transfer member 4 is made of a heat conductive member such as aluminum or copper.

(Mechanism of optical communication)
An optical element is an element that converts electrical energy into light or converts light into electrical energy. Examples of the former light emitting element include a laser diode and a VCSEL (Vertical Cavity Surface Emmitting LASER). An example of the latter light receiving element is a photodiode. The optical element is configured to emit or enter light into the lens block 24.

  When the optical element is an element that converts electrical energy into light, the semiconductor circuit element 25 is a driver IC that drives the optical element based on an electrical signal input from the mother board 6 side. When the optical element is an element that converts received light into electrical energy, the semiconductor circuit element 25 is a receiving IC that amplifies an electrical signal input from the optical element and outputs the amplified signal to the mother board 6 side.

  In the present embodiment, one optical element array 26 is a light emitting element, and the other optical element array 26 is a light receiving element. Therefore, also for the semiconductor circuit element 25, one semiconductor circuit element 25 is a driver IC, and the other semiconductor circuit element 25 is a receiving IC.

  The plurality of lenses 240 formed in the lens block 24 are arranged to face the optical element array 26. The light (optical axis L) emitted from the optical elements of the optical element array 26 is collected by the lens 240, reflected by the mirror surface 24a of the lens block 24, and enters the core of the optical fiber 5a. Further, the light (optical axis L) emitted from the core of the optical fiber 5a is reflected by the mirror surface 24a, collected by the lens 240, and enters the optical element. The optical fiber 5 a is positioned on the second side wall 202 side with respect to the lens block 24 and is pressed against the lens block 24 by the pressing member 29.

  The optical element array 26 and the semiconductor circuit element 25 are heating elements that generate heat by their operation. This heat is absorbed mainly by the heat absorbing portion 40 of the heat transfer member 4 and is transmitted to the heat radiating portion 42 via the transmission portion 41.

  FIG. 4 is a schematic diagram illustrating a configuration example of the optical communication device 1 according to the present embodiment.

(Configuration of optical communication apparatus 1)
The optical communication device 1 includes a plurality of optical modules 2, a mother board 6, and a plurality of radiators 7 that absorb heat from the heat transfer member 4. The radiator 7 has a cooling mechanism such as an air cooling type or a water cooling type. The optical module 2 is disposed between a pair of adjacent radiators 7 (the first radiator 70 and the second radiator 71 shown in FIG. 4) among the plurality of radiators 7. The first side wall 201 of the module case 20 faces the side surface 70 a of the first radiator 70, and the second side wall 202 faces the side surface 71 a of the second radiator 71.

  The first radiator 70 has a recess 700 formed on the side surface 70a side of the upper surface 70b. The heat dissipating part 42 of the heat transfer member 4 is fixed to the first heat radiator 70 by the pressing member 8 and the bolt 9. More specifically, the heat radiating part 42 is fitted in the recess 700, pressed from above by the pressing member 8, and fixed by the bolt 9. The pressing member 8 and the bolt 9 are an example of the fixture of the present invention. Thereby, the bottom surface 42b of the heat radiating part 42 and the inner surface 700a of the recess 700 are in contact with each other, and the upper surface 42a of the heat radiating part 42 and the bottom surface 8a of the pressing member 8 are in contact with each other. The heat of the heat transfer member 4 is dissipated by the first heat radiator 70 when the bottom surface 42 b of the heat dissipating part 42 and the inner surface 700 a of the recess 700 abut. The bolt 9 passes through the through hole 80 of the pressing member 8 and is inserted into the attachment portions 701 and 711 of the pair of radiators 7, respectively. Similarly to the first radiator 70, the second radiator 71 is also provided with a recess into which a heat radiating portion of a heat transfer member provided in another optical module not shown is fitted.

(Operation and effect of the first embodiment)
According to the embodiment described above, the following operations and effects can be obtained.

(1) Since the heat transfer member 4 integrally including the heat absorption part 40, the transmission part 41, and the heat radiation part 42 is provided in the optical module 2, the heat generated from the semiconductor circuit element 25 and the optical element array 26 is efficiently obtained. It can be well transmitted to the radiator 7 to dissipate heat. In addition, when the male connector 21 and the female connector 3 are fitted together, the fitting that maintains the electrically optimal connection state by the heat radiating portion 42 coming into contact with the inner surface 700 a of the concave portion 700 of the first radiator 70. It is possible to regulate the position. Furthermore, since the heat radiation part 42 is fixed in the recess 700 of the first heat radiator 70 by the pressing member 8 and the bolt 9, wobbling in fitting between the male connector 21 and the female connector 3 can be suppressed.

(2) Since the heat absorbing portion 40 of the heat transfer member 4 is attached at a position corresponding to the mounting position of the semiconductor circuit element 25 and the optical element array 26, the heat generated from the semiconductor circuit element 25 and the optical element array 26 is absorbed. The amount to do increases. Therefore, the amount of heat radiation from the semiconductor circuit elements 25 and the optical element array 26 increases, and the cooling efficiency of the semiconductor circuit elements 25 and the optical element array 26 increases.

(3) Since the male connector 21 and the female connector 3 are fitted in a direction perpendicular to the mother board 6, the mounting area of the optical module 2 can be reduced. That is, since the optical module 2 can be mounted with high density, other electronic components can effectively use the mounting area of the motherboard 6. Further, the optical module 2 can be easily attached and detached without removing the radiator 7 itself from the mother board 6.

(4) Since the heat dissipating part 42 of the heat transfer member 4 protrudes in a direction orthogonal to the first substrate 27, the area in contact with the inner surface 700 a of the first heat radiator 70 is widened. Therefore, the first radiator 70 can absorb heat from a wider area, and the cooling efficiency of the optical module 2 is further increased.

(5) Since the optical module 2 is disposed between the first radiator 70 and the second radiator 71, the heat generated through the second side wall 202 of the module case 20 is the second radiator. The heat is transmitted to the side surface 71a of 71 and radiated. Therefore, the optical module 2 is further cooled by absorbing heat from the second radiator 71.

[Second Embodiment]
FIG. 5 is a perspective view of the optical module 2A and the female connector 3 according to the second embodiment. 6 is a cross-sectional view taken along the line CC of FIG.

  The optical module 2A according to the present embodiment is different from the optical module 2 according to the first embodiment in that the shape of the heat transfer member 4A is different from that of the optical module 2 according to the first embodiment. Since they are common, members having the same function are denoted by common reference numerals, and redundant description thereof is omitted.

  The heat transfer member 4A includes a heat absorbing portion 40, a first plate portion 41A facing the first substrate 27 accommodated in the module case 20, and a second bent in a direction perpendicular to the first plate portion 41A. The plate portion 42A is integrally provided. The second plate portion 42A is bent in a direction parallel to the mother board 6. In the heat transfer member 4A, the first plate portion 41A functions as a transmission portion, and the second plate portion 42A functions as a heat dissipation portion. That is, as shown in FIG. 6, the heat transfer member 4A functions as the first side wall 201 of the module case 20 according to the first embodiment.

  FIG. 7 is a schematic diagram illustrating a configuration example of the optical communication device 1A according to the second embodiment. Note that the second radiator 71 is omitted.

  The second plate portion 42 </ b> A of the optical module 2 </ b> A is sandwiched between the first radiator 70 and the pressing member 8, pressed by the pressing member 8 from above, and fixed by the bolt 9. That is, the upper surface 42Aa of the second plate portion 42A and the bottom surface 8a of the pressing member 8 are in contact with each other, and the bottom surface 42Ab of the second plate portion 42A and the upper surface 70b of the first radiator 70 are in contact with each other. The first plate portion 41A faces the side surface 70a of the first radiator 70.

(Operation and effect of the second embodiment)
In addition to the operations and effects (1) to (5) described in the first embodiment, there are the following operations and effects.

(6) Since the heat transfer member 4A also has a function as the module case 20, it is not necessary to separately manufacture the heat transfer member 4A as in the first embodiment, leading to cost reduction. Further, since the second plate portion 42A is interposed between the pressing member 8 and the upper surface 70b of the first radiator 70, it is not necessary to form a recess for fitting the second plate portion 42A.

  Further, the optical module 2A according to the second embodiment can be implemented with the following modifications, for example.

(Modification)
FIG. 8 is a perspective view of the optical module 2B and the female connector 3 according to a modification. FIG. 9 is a schematic diagram illustrating a configuration example of an optical communication device 1B according to a modification.

  A through hole 420 for allowing the bolt 9 to pass therethrough is formed in the second plate portion 42A of the heat transfer member 4A. In order to attach the second plate portion 42 </ b> A to the first radiator 70, the bolt 9 is passed through the through hole 420 and is fastened and fixed to the attachment portion 701 of the first radiator 70. Therefore, the second plate portion 42A is fastened and fixed by the bolt 9.

  In the case of this modification, when the second plate portion 42A is fixed to the first radiator 70, it is possible to fix the second plate portion 42A without using the pressing member 8. This leads to cost reduction for manufacturing the pressing member 8.

  While the embodiments of the present invention have been described above, the embodiments described above do not limit the invention according to the claims. In addition, it should be noted that not all the combinations of features described in the embodiments are essential to the means for solving the problems of the invention.

  For example, in the above-described embodiment, the case where the communication module is the optical module 2, 2A, 2B that performs optical communication via the optical fiber cable 5 has been described. However, the present invention is not limited to this, and for example, a differential signal The present invention can also be applied to a communication module that performs communication using a line.

  Moreover, the position of the heat radiating part 42 of the heat transfer member 4 does not need to be the central part of the heat absorbing part 40, and there is no limitation on the position where it is formed within the range of the heat absorbing part 40.

  Moreover, the heat radiating part 42 of the heat transfer member 4 does not need to have a rectangular parallelepiped shape, and the shape is not limited.

  Further, the holding member 8 and the bolt 9 do not necessarily have to be used as a fixture for fixing the heat radiation portion 42 to the first heat radiator 70. For example, the heat radiating portion 42 may be directly fastened and fixed with the bolt 9.

DESCRIPTION OF SYMBOLS 1,1A, 1B ... Optical communication apparatus, 2, 2A, 2B ... Optical module, 3 ... Female connector, 4, 4A ... Heat transfer member, 5 ... Optical fiber cable, 5a ... Optical fiber, 6 ... Motherboard, 6a ... Mounting Surface, 7 ... Radiator, 8 ... Holding member (fixing tool), 8a ... Bottom surface, 9 ... Bolt (fixing tool), 20 ... Module case (case member), 21 ... Male connector, 21a ... Male terminal, 21b ... Recess , 22 ... convex part, 23 ... fiber mounting part, 24 ... lens block, 24a ... mirror surface, 25 ... semiconductor circuit element, 26 ... optical element array, 27 ... first substrate, 27a ... mounting surface, 28 ... second 29 ... Presser member, 30 ... Connector case, 31 ... Extension part, 31a ... Mounting hole, 32 ... Female terminal, 33 ... Lead wire, 40 ... Heat absorption part, 41 ... Transmission part, 41A ... First plate part , 42 ... heat radiation part, 4 A ... second plate portion, 42a, 42Aa ... upper surface, 42b, 42Ab ... bottom surface, 50 ... rubber boot, 70 ... first radiator, 70a ... side surface, 70b ... upper surface, 71 ... second radiator, 71a ... side surface , 80 ... through hole, 201 ... first side wall, 201a ... through hole, 202 ... second side wall, 203 ... third side wall, 204 ... fourth side wall, 205 ... bottom surface, 240 ... lens, 300 ... accommodating Space 420, through hole, 700, recess, 700a, inner surface, 701, 711, mounting portion

Claims (10)

A circuit board on which communication circuit components are mounted; and
A connector provided at an end of the substrate;
A heat transfer member that transfers heat from the circuit component to a radiator,
The heat transfer member includes a heat absorption part that absorbs heat from the circuit component, a heat dissipation part that contacts the radiator, and a transmission part that transmits heat absorbed from the heat absorption part to the heat dissipation part,
The heat dissipating part protrudes in a direction intersecting the substrate, and the relative movement between the connector and the mating connector is restricted by contacting the radiator by fitting the connector with the mating connector.
Communication module. The heat radiating part is fixed to the radiator with a fixture,
The communication module according to claim 1. The mating direction between the connector and the mating connector is a direction orthogonal to the motherboard on which the mating connector is mounted.
The communication module according to claim 1 or 2. The heat dissipation part protrudes in a direction orthogonal to the substrate.
The communication module according to any one of claims 1 to 3. The heat absorption part is opposed to the mounting position of the circuit component via the substrate.
The communication module according to any one of claims 1 to 4. The substrate is accommodated in a case member having a pair of side walls sandwiched in the thickness direction,
In the heat transfer member, the heat absorbing portion is disposed inside the case member, and the heat radiating portion is disposed outside the case member.
The communication module according to any one of claims 1 to 5. The case member integrally includes the heat absorbing portion, a first plate portion facing the substrate, and a second plate portion bent with respect to the first plate portion, and the first plate portion is the transmission member. As the part, the second plate part functions as the heat radiating part,
The communication module according to claim 6. The circuit component includes an optical element optically coupled to an optical fiber and a semiconductor circuit element electrically connected to the optical element.
The communication module according to any one of claims 1 to 7. The communication module according to any one of claims 1 to 8,
The radiator,
A motherboard on which the mating connector is mounted;
Communication device. A plurality of the communication modules;
A plurality of the radiators;
The communication module is disposed between a pair of adjacent radiators among the plurality of radiators.
The communication apparatus according to claim 9.

Images