JP2011158584A - Optical data link - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical data link which thermally connects a data link housing and the body part of an optical subassembly (OSA) while absorbing the variation in the relative positions of the data link housing and the body part of OSA without using a thick heat conduction sheet. <P>SOLUTION: The optical data link includes, in the housing: a transmitting optical subassembly (TOSA) 4 which incudes a photoelectric conversion element in the body part 4a and has a sleeve 4b in which the ferrule of an optical connector is inserted; and a circuit substrate 6 (7) electrically connected to the TOSA 4. The optical data link further includes: a metal member 9 which is fitted while the inner face thereof is made contact to the heat radiation face of the body part 4a of TOSA 4 to conduct the heat generated in the body part 4a of the TOSA 4 to the housing and radiate the heat outside; and a holding member 8 which holds the TOSA 4 which is made contact to the outer face of the metal member 9 and holds the circuit substrate 6 (7), and forms the heat conduction to the housing. The holding member 8 includes an elastically deformable spring part, and the spring part pressurizes itself against the housing thus pressurizes itself against the metal member 9, too. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an optical data link having a heat dissipation structure for an optical subassembly for transmitting / receiving a built-in signal light.

  An optical data link for optical communication incorporates an optical sub-assembly (OSA: Optical Sub-Assembly) that transmits and / or receives signal light. This OSA has a main body housing a photoelectric conversion element, and a sleeve in which a ferrule of an optical connector is inserted and aligns the ferrule with respect to the photoelectric conversion element, and the sleeve includes a light in the photoelectric conversion element and the ferrule. The fibers are aligned and attached to the main body so that the optical axes of the fibers coincide with each other. In the optical OSA, since alignment is performed in this way, (1) the central axes of the main body and the sleeve do not always coincide with each other (there is a positional shift).

FIG. 7 is an external view of an example of a general optical data link. In the illustrated optical data link 100, (2) an optical receptacle 101 to which an optical connector is connected is fixed with high positional accuracy to a housing 102 of the data link. Further, when the optical connector is connected to the optical receptacle 101, the ferrule of the optical connector is inserted into the sleeve of the OSA without applying extra force to the OSA (not shown) in the housing 102 ( 3) The relative positional accuracy between the optical receptacle 101 and the OSA sleeve in the housing 102 is ensured. As a result of (2) and (3) above, (4) the relative position between the data link housing 102 and the OSA sleeve is constant.
Since the optical data link 100 is configured as described in the above (1) and (4), the relative position between the casing 102 and the main body of the OSA in the casing 102 varies. Has occurred.

  Even in the case where there is such a variation, the heat of a heat-generating component such as a laser diode (LD) in the OSA main body can be reliably released from the OSA main body to the outside via the optical data link housing. Conventionally, a soft resin sheet having a high thermal conductivity is sandwiched between the OSA main body and the optical data link housing, and both are thermally connected (for example, see Patent Documents 1 and 2).

JP 2006-184708 A JP 2008-227279 A

  However, in order to absorb the above-described variation by the resin heat conductive sheet and thermally connect the OSA main body and the optical data link housing, the heat conductive sheet needs to have a certain thickness. Since the heat conductive sheet has a higher thermal resistance than the metal material, it may not be able to sufficiently dissipate heat when the amount of heat generated in the OSA is large.

  The present invention has been made in view of the above-described circumstances, and absorbs variations in the relative positions of the data link housing and the OSA main body without using a thick heat conductive sheet, and heats them. It is an object of the present invention to provide an optical data link that can be connected to each other.

  In order to solve the above problems, an optical data link of the present invention includes an optical subassembly including a photoelectric conversion element in a main body portion and a sleeve into which a ferrule of an optical connector is inserted, and is electrically connected to the optical subassembly. A circuit board, and the heat generated from the optical sub-assembly main body is conducted to the housing and released to the outside. A metal member to be attached, and a holding member that is in contact with the outer surface of the metal member to hold the optical subassembly and hold the circuit board, and to form heat conduction to the housing. A spring portion that is elastically deformed is provided, and the spring portion is also pressed against the metal member when pressed against the casing.

  According to the present invention, since the relative position between the data link housing and the OSA main body can be thermally coupled without using a thick heat conductive sheet, these can be thermally coupled. The heat can be efficiently released to the outside through the housing.

It is a figure explaining the outline of an example of the optical data link of this invention. It is a perspective view of a mode that the metal member was attached to TOSA of FIG. It is a figure explaining the holding member which comprises the heat dissipation structure in the optical data link of this invention. It is a figure explaining the heat dissipation path from LD in the optical data link of this invention. It is a figure explaining the other example of the metal member in connection with this invention. It is a figure explaining the other example of the metal member and holding member which concern on this invention. It is an external view of a general optical data link.

  An example of the optical data link of the present invention will be outlined with reference to FIG. The optical data link of the present invention is used, for example, by being detachably attached to a cage of a host device, and the assembly 1 in FIG. 1 is used as a housing (see reference numeral 11 in FIG. 4 and reference numeral 102 in FIG. 5). ).

  An optical data link assembly 1 shown in FIG. 1 includes an optical receptacle 2 on which an optical connector provided at an end of an optical cable for optical communication (not shown) is detachably mounted, and the optical data link in a cage of a host device. And a bale 3 used for insertion and removal. The assembly 1 includes an optical transmission OSA (TOSA: Trasmitting OSA) 4 in which a sleeve 4b is attached to a main body 4a in which an LD as a photoelectric conversion element and a thermoelectric conversion element for adjusting the temperature of the LD are incorporated. And a light receiving OSA (ROSA: Receiving OSA) 5 in which a sleeve 5b is attached to a main body 5a incorporating a semiconductor light receiving element (PD: Photo Diode) as a photoelectric conversion element. In the sleeves 4b and 5b, a ferrule of an optical connector mounted on the optical receptacle 2 is inserted, and the ferrule is aligned with the LD or PD. For example, a metal member 9 described later is attached to the main body 4a of the TOSA 4.

Further, the assembly 1 is formed by stacking circuit boards 6 and 7 on which electronic circuits such as an LD driving circuit and a control circuit for a heat transfer conversion element are configured, and circuit boards 6 and 7 to which TOSA 4 and ROSA 5 are connected. And a holding member 8 for fixing to the optical data link housing while being suppressed from the direction of the arrow X in the figure.
The optical data link having the above-described components is an optical transceiver that transmits and receives optical signals, and an electrical signal supplied from the outside via the circuit board 6 or the like is transmitted to the optical signal by the LD in the main body 4a of the TOSA 4. And converted to an optical signal from the ferrule inserted into the sleeve 5b of the ROSA 5 into an electrical signal by the PD in the main body 5a of the ROSA 5 It can be taken out.

  Next, a characteristic structure of the present invention, that is, a heat dissipation structure from the LD in the main body 4a of the TOSA 4 in the present optical data link will be described with reference to FIGS. 2 is a perspective view of a state in which the metal member 9 is attached to the TOSA 4 of FIG. 1, FIG. 3 is a view for explaining the holding member 8 constituting the heat dissipation structure, and FIG. 4 is the present optical data link. It is a figure explaining the heat dissipation path from LD in.

  In this optical data link, a metal member 9 obtained by processing a copper plate having a thickness of 0.5 mm, for example, is attached to the main body 4a of the TOSA 4 as shown in FIG. The metal member 9 has a heat exhausting portion 9a that faces the upper surface 4c that is the heat exhausting surface of the main body 4a when attached to the TOSA 4 and has an area equivalent to that of the upper surface 4c. One surface of the exhaust heat part 9a and the main body part 4a of the TOSA 4 are in contact with each other through a heat conductive sheet (see reference numeral 10 in FIG. 4) having a minimum thickness. The purpose of using the heat conductive sheet is different from the conventional technique in the present invention in that the relative position between the main body 4a of the TOSA 4 and the optical data link housing (see reference numeral 11 in FIG. 4 and reference numeral 102 in FIG. 5). The purpose is not to absorb the variation but to simply reduce the thermal resistance (contact thermal resistance) due to the contact between the upper surface 4c of the main body portion 4a and the exhaust heat portion 9a. Therefore, it is not necessary to increase the thickness of the heat conductive sheet in order to absorb the variation. In the present invention, the dispersion is absorbed by the holding member 8.

  As shown in FIG. 3, the holding member 8 is formed by pressing a material that is thinner and easier to process than the metal member 9 (for example, a copper plate having a thickness of 0.3 mm). The holding member 8 includes a flat plate portion 8a that covers the entire heat exhaust portion 9a (see FIG. 2) of the metal member 9 attached to the main body portion 4a of the TOSA 4 and contacts the heat exhaust portion 9a, and an optical data link housing. (See reference numeral 11 in FIG. 4 and reference numeral 102 in FIG. 5) and a spring portion 8 b that presses and elastically deforms the entire holding member 8 in the direction of the main body portion 4 a of the TOSA 4. When the spring portion 8b is pressed against the casing, the flat plate portion 8a of the holding member 8 is pressed against the metal member 9 due to the stress. In this manner, the housing of the optical data link and the main body 4a of the TOSA 4 are thermally connected via the holding member 8 by the spring 8b.

In the present optical data link having the metal member 9 and the holding member 8 as described above, as shown in FIG. 4, the heat generated in the LD 4d in the TOSA 4 is converted into a heat transfer element (TEC: Thermo-Electric Cooler) 4e. And is transmitted from the heat radiating surface 4f to the upper plate (heat radiating plate) 4g of the main body portion 4a composed of a CuW plate or the like. Then, the heat transmitted to the upper plate 4g is transferred from the upper surface 4c to the heat exhausting portion 9a of the metal member 9 through the heat conductive sheet 10, and is conducted to the flat plate portion 8a of the holding member 8, and from the holding member 8 to the housing. It is discharged to the outside through the body 11. A heat radiation path between the optical data link housing 11 and the main body 4 a of the TOSA 4 is secured by the spring portion 8 b of the holding member 8.
As described above, in the present optical data link, the metal member 9 and the holding member 8 cooperate to form heat conduction from the main body 4a of the TOSA 4 to the housing 11, so that the housing 11 The variation in the relative position of the TOSA 4 with respect to the main body 4a can be absorbed and the two can be thermally connected.

  Unlike the conventional optical data link, this optical data link does not use a thick heat conductive sheet in the heat dissipation path, so the thermal resistance in the heat dissipation path is small, and the ratio of the metal part occupying the heat dissipation path is large, so the thickness direction of the metal part is Since heat can be diffused in the vertical direction, the heat from the LD 4d can be efficiently cooled. In the above example, the thin thermal conductive sheet 10 is used for the purpose of reducing the thermal resistance between the TOSA main body 4a and the metal member 9, but grease having good thermal conductivity is used instead. Alternatively, a screwing mechanism may be provided so that the two are pressed against each other to reduce the thermal resistance.

  In addition, a structure in which the holding member 8 having the spring portion 8b is thickened and efficiently cooled without using the metal member 9 of the present optical data link is also conceivable. It is technically difficult to press and produce a flat plate. Moreover, although it is possible to produce by methods other than press work, the cost will increase accordingly. In other words, although it is technically possible to produce the metal member 9 and the holding member 8 by integral molding, it is generally considered that the metal member 9 and the holding member 8 have a complicated shape, and considering the initial investment required for component molding, The division structure as in this example is preferable from the viewpoint of total cost.

Next, returning to FIG. 2, a structure for attaching the metal member 9 to the TOSA 4 will be described.
As shown in FIG. 2A, the metal member 9 includes a hook-shaped hook portion 9b extending from one end of the exhaust heat portion 9a in a direction perpendicular to the extending direction of the exhaust heat portion 9a, and exhaust heat. A forward holding portion 9c extending from the other end of the portion 9a in the same direction as the hook portion 9b. Further, as shown in FIG. 2B, the metal member 9 includes a first side restraining portion 9d extending in the same direction as the hook portion 9b from one side end of the heat exhausting portion 9a, and a front restraining portion. A second side restraining portion 9e extending from one side end of 9c in the direction of the first side restraining portion 9d. Further, the front holding portion 9c is formed with a curved surface portion 9f having a shape corresponding to the sleeve 4b.

  Even if force is applied to the metal member 9 after the TOSA 4 is attached to the main body portion 4a, the respective portions 9b to 9f come into contact with the main body portion 4a and the sleeve 4b as follows, so that they can be easily detached. There is no. That is, when a force is applied to the metal member 9, the hook portion 9b comes into contact with the convex portion 4h protruding on the opposite side to the sleeve 4b of the main body portion 4a of the TOSA 4, or the front holding portion 9c is in contact with the main body portion 4a. The first and second side restraining portions 9d and 9e are in contact with the side surface 4j of the main body portion 4a, and the curved surface portion 9f of the front restraining portion 9c is in contact with the front surface 4i (see FIG. 2A). It contacts the sleeve 4b. Therefore, the metal member 9 is not easily detached from the main body 4a of the TOSA 4 in the above case.

  In the above description, the metal member 9 is formed by processing a copper plate. However, the material actually used for the metal member 9 is not limited to this, and any metal material having a thermal conductivity of 250 w / mk or more is applicable. The metal member 9 is preferably thicker from the viewpoint of heat capacity, and is not limited to the above-mentioned 0.5 mm.

  In the above description, the holding member 8 is formed by processing a copper plate. However, like the metal member 9, the material actually used for the holding member is not limited to this, and any metal having a thermal conductivity of 250 w / mk or more. Materials are also applicable. For the same reason as the metal member 9, the holding member 8 is also preferably thicker from the viewpoint of heat dissipation, and is not limited to the above-described 0.3 mm.

  Further, the metal member and the holding member are not limited to the above-described shapes. For example, as shown in FIGS. 5 and 6, the holding member is slid into the metal member and fitted, It is also possible to adopt a structure that simultaneously realizes simple connection and mechanical fixing. FIG. 5 is a view showing another example of the metal member according to the present invention, and FIG. 6 is a view showing a state when the holding member is slid and fitted into the metal member of FIG. In addition, about the structure similar to the metal member 9 and the holding member 8 of FIG.2 and FIG.3 in the metal member 9 'and the holding member 8' of FIG.5 and FIG.6, the description is abbreviate | omitted by attaching | subjecting the same referential mark. .

  The metal member 9 ′ in FIG. 5 is a saddle-shaped bent portion 9b ′ that extends from both ends of the heat exhaust portion 9a in a direction perpendicular to the extending direction of the heat exhaust portion 9a and away from the TOSA 4. Have As shown in FIG. 6, the flat plate portion 8 a ′ of the holding member 8 ′ is slid and fitted between the bent portion 9 b ′ and the exhaust heat portion 9 a, so that the metal member 9 ′ and the holding member 8 ′ are fitted. It can be thermally connected and mechanically fixed. The flat plate portion 8a ′ of the holding member 8 ′ is wider than the flat plate portion 8a of the holding member 8 of FIG. 3 so that it can be inserted between the bent portion 9b ′ of the metal member 9 ′ and the heat exhausting portion 9a. It is narrowly formed.

  5 and 6, the bent portion 9b 'of the metal member 9' abuts on the first heat radiating portion 102a (see FIG. 7) of the housing 102, and the spring portion 8b of the holding member 8 is The housing 102 abuts on the second heat radiating portion 102b protruding inward from the first heat radiating portion 102a. Thereby, the heat dissipation path is ensured.

  The above example is based on the assumption of clearance fitting. For example, the shape of the curved surface portion of the front holding portion of the metal member in FIGS. 2 and 5 is more than the outer shape of the TOSA sleeve with which the curved surface portion is engaged. A spring structure that can be made smaller or that the distance between the heat exhausting portion and the bent portion of the metal member in FIG. 5 is smaller than the thickness of the flat plate portion of the holding member, and that is movable within the range of elastic deformation; By doing so, the stability after attachment can be improved more.

DESCRIPTION OF SYMBOLS 1 ... Assembly, 2 ... Optical receptacle, 3 ... Bale, 4 ... TOSA, 5 ... ROSA, 6, 7 ... Circuit board, 8, 8 '... Holding member, 9, 9' ... Metal member, 10 ... Thermal conductive sheet , 11. Case.

Claims (1)

An optical subassembly having a sleeve in which a photoelectric conversion element is incorporated in a main body portion and into which a ferrule of an optical connector is inserted, and a circuit board electrically connected to the optical subassembly are provided in a housing, and the main body of the optical subassembly An optical data link that conducts heat generated from a portion to the housing and emits the heat to the outside,
A metal member attached with an inner surface in contact with a heat radiating surface of the body portion of the optical subassembly, and holding the optical subassembly in contact with an outer surface of the metal member and holding the circuit board; A holding member that forms the heat conduction to
The holding member includes a spring portion that is elastically deformed, and the spring portion is pressed against the metal member when pressed against the housing.

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