JP7398223B2 - Board-mounted connectors and boards with connectors - Google Patents

Description

The present invention provides a board-mounted connector that includes a photoelectric conversion module that has a photoelectric conversion element and can be connected to a circuit board, and a shield case for noise reduction that covers the photoelectric conversion module, and the connector and the circuit board. and a board with a connector.

Conventionally, optical connectors have been used for the purpose of connecting optical fibers to electronic devices and connecting optical fibers to each other. For example, one conventional optical connector includes a photoelectric conversion module (for example, FOT (Fiber Optical Transceiver)) having a photoelectric conversion element, a resin housing that accommodates the photoelectric conversion module, and a noise transceiver that is attached to cover the housing. A metal shield case for reduction is provided (for example, see Patent Document 1).

JP2009-069710A

The above-described shield case is generally provided in a connector for the purpose of suppressing electromagnetic waves that cause electrical noise etc. from entering the shield case from the outside and from being emitted from the inside to the outside. The shield case of the conventional connector described above is manufactured by bending a thin metal plate. Therefore, due to manufacturing tolerances, small gaps may exist between the end faces of the thin plates. Further, a spring portion formed by cutting and raising a portion of the thin plate into a cantilever shape may be provided to press and fix the photoelectric conversion module (FOT) against the housing. With such cutting and raising of the spring portion, holes, notches, etc. are defined in the thin plate.

However, locations such as the above-mentioned gaps, holes, and notches that communicate between the inside and outside of the shield case (i.e., penetrating spaces) cause unintentional intrusion and release of electromagnetic waves, reducing the electromagnetic wave shielding performance of the shield case. This could be the cause. Therefore, it is desired to suppress such deterioration of shielding performance as much as possible, reduce electromagnetic waves emitted from the connector to the outside, and improve the reliability of communication via the connector.

One of the objects of the present invention is to provide a board-mounted connector that can reduce electromagnetic waves emitted to the outside and improve communication reliability, and a board with a connector using the connector. be.

In order to achieve the above-mentioned object, a board-mounted connector and a board with a connector according to the present invention are characterized by the following [1] to [ 2 ].
[1]
A board-mounted connector comprising a photoelectric conversion module having a photoelectric conversion element and connectable to a circuit board, and a shield case for noise reduction that covers the photoelectric conversion module,
The photoelectric conversion module includes:
having a conductive film provided on the outer surface of the photoelectric conversion module,
The shield case is
It has a contact part that comes into contact with the conductive film, and a ground part that can be connected to a conductor pattern that the circuit board has,
The shield case is
a first shield portion having the contact portion projecting like a beam toward the photoelectric conversion module; and a first shield portion having a shape so as to communicate between the inside and outside of the first shield portion as the contact portion protrudes. a second shield part that covers the through space formed by the photoelectric conversion module;
The second shield part covers the entire through space from the outside of the first shield part,
The contact portion is
contacting the conductive film of the photoelectric conversion module and contacting the second shield portion;
Must be a board-mounted connector.
[ 2 ]
The board-mounted connector according to [1] above, and a circuit board on which the connector is mounted,
The ground portion of the photoelectric conversion module and the shield case is electrically connected to the conductor pattern of the circuit board.
Must be a board with a connector.

According to the board-mounted connector having the configuration [1] above, a conductive film (for example, metal plating) is provided on the outer surface of the photoelectric conversion module. Furthermore, the shield case is adapted to come into contact with this conductive film. Therefore, electromagnetic waves emitted from the inside of the photoelectric conversion module to the outside and electromagnetic waves directed from the outside to the inside of the photoelectric conversion module can be reduced by collecting them with the conductive film. Furthermore, the current caused by the electromagnetic waves collected in the conductive film can be released from the conductive film to the conductor pattern of the circuit board (e.g., earth circuit, GND circuit) via the contact part and the ground part of the shield case. . Therefore, the connector with this configuration can reduce electromagnetic waves emitted to the outside and improve communication reliability compared to a case where the photoelectric conversion module is not provided with a conductive film.

Further, according to the board-mounted connector having the configuration described in [ 1 ] above, the contact portion is formed so as to project like a beam (eg, cut and raised) from the first shield portion of the shield case. By pressing this contact portion against the conductive film of the photoelectric conversion module, contact resistance between the conductive film and the contact portion can be reduced. As a result, current caused by electromagnetic waves collected in the conductive film can be efficiently discharged toward the shielding case. Furthermore, even if a gap (through space) is created in the first shield part when the contact part is formed in the first shield part, the through space is closed by the second shield part. With such a laminated structure of the first shield part and the second shield part, even if a through space exists in the first shield part, it is possible to suppress the deterioration of the electromagnetic wave shielding performance of the shield case. In addition, the first shield part and the second shield part may be integrally continuous members, or may be mutually independent and separate members.

Furthermore, according to the board-mounted connector having the configuration described in [ 1 ] above, the beam-shaped contact portion extending from the first shield portion contacts the photoelectric conversion module and also contacts the second shield portion. Therefore, the current caused by the electromagnetic waves collected in the conductive film is transmitted through multiple paths (i.e., a path through the contact portion, the first shield portion, and the ground portion, and a path through the contact portion and the second shield portion). can be released to the outside via a path that passes through the ground and goes to the ground. As a result, the shield case can exhibit appropriate electromagnetic wave shielding performance even against high-intensity electromagnetic waves. Furthermore, the photoelectric conversion module is supported by both the first shield part and the second shield part via the contact part, and it is possible to suppress positional shift (wobble) of the photoelectric conversion module. As a result, the quality of signal transmission via the photoelectric conversion module can be improved, and the reliability of communication using the connector can be improved.

According to the connector-equipped board having the configuration [ 2 ] above, a conductive film (for example, metal plating) is provided on the outer surface of the photoelectric conversion module within the board-mounted connector. Furthermore, a shield case included in the connector is brought into contact with this conductive film. Therefore, electromagnetic waves emitted from the inside of the photoelectric conversion module to the outside and electromagnetic waves directed from the outside to the inside of the photoelectric conversion module can be reduced by collecting them with the conductive film. Furthermore, the current caused by the electromagnetic waves collected in the conductive film can be released from the conductive film to the conductor pattern (earth circuit, GND circuit) of the circuit board via the contact part and the ground part of the shield case. Therefore, the board with a connector of this configuration can reduce the electromagnetic waves emitted to the outside from the connector and improve the reliability of communication of the connector, compared to the case where the photoelectric conversion module is not provided with a conductive film.

According to the present invention, it is possible to provide a board-mounted connector that can improve communication reliability, and a board with a connector using the connector.

The present invention has been briefly described above. Furthermore, the details of the present invention will be further clarified by reading the mode for carrying out the invention (hereinafter referred to as "embodiment") described below with reference to the accompanying drawings. .

FIG. 1(a) is a perspective view of a board with a connector seen from the front side according to an embodiment of the present invention, and FIG. 1(b) is a perspective view of the board with a connector seen from the rear side. FIG. 2 is an exploded perspective view of the board with a connector shown in FIG. 1. 3(a) is a perspective view of a photoelectric conversion module included in the board with a connector shown in FIG. 1, and FIG. 3(b) is a cross section BB in FIG. It is a diagram. 4(a) is a perspective view of a shield case included in the board with a connector shown in FIG. 1, and FIG. 4(b) is a sectional view taken along line CC in FIG. 4(a). 5(a) is a sectional view taken along line AA in FIG. 1(b), and FIG. 5(b) is an enlarged view of section D in FIG. 5(a).

<Embodiment>
Hereinafter, a board-mounted connector 1 and a board with a connector 3 according to an embodiment of the present invention will be described with reference to the drawings. The connector 1 is an optical connector for the purpose of connecting an optical fiber and an electronic device or connecting optical fibers to each other, and as shown in FIGS. 1 and 2, it is mounted on a circuit board 2 and used as a board 3 with a connector. be done.

Hereinafter, for convenience of explanation, as shown in FIG. 2, "front-back direction", "up-down direction", "width direction", "front", "rear", "top", and "bottom" will be defined. The "front-back direction", the "up-down direction", and the "width direction" are orthogonal to each other. The front-rear direction corresponds to the fitting direction of the connector 1 and a mating optical connector (not shown). Hereinafter, each member constituting the connector 1 will be explained in order.

As shown in FIG. 2, the connector 1 includes a photoelectric conversion module 10, a resin housing 20 that accommodates the photoelectric conversion module 10, and a metal shield for noise reduction that is attached to the housing 20 so as to cover the housing 20. A case 30 is provided.

First, the photoelectric conversion module 10 (eg, FOT, Fiber Optical Transceiver) will be described. As shown in FIG. 3, the photoelectric conversion module 10 includes a substantially rectangular box-shaped resin main body part 11 and a cylindrical resin-made cylindrical part 12 that protrudes forward from the center of the front wall of the main body part 11. and.

As shown in FIG. 5(a), a lens body 13 made of a transparent resin having light-guiding properties is installed at a location on the front wall of the main body 11 where the rear end opening (base opening) of the cylindrical part 12 connects. , is built in so as to be coaxially adjacent to the rear end opening of the cylindrical portion 12. A photoelectric conversion element 14 is housed inside the main body 11 so as to be located coaxially with the lens body 13 at a predetermined distance rearward from the lens body 13 .

A plurality of metal lead frames 15 are integrated into the rear wall of the main body portion 11 by insert molding. The plurality of lead frames 15 are electrically connected to the photoelectric conversion element 14 and extend downward and rearward from the lower end of the rear end surface of the main body 11 so as to be lined up in the width direction. The extending ends (rear ends) of the plurality of lead frames 15 are soldered to a plurality of pads 41 (see FIG. 2) arranged in the width direction on the upper surface of the circuit board 2. Become.

In the connector 1, as shown in FIG. 2, a pair of photoelectric conversion modules 10 are used. One of the pair of photoelectric conversion modules 10 is a light emitting side photoelectric conversion module 10. The photoelectric conversion element 14 of the photoelectric conversion module 10 on the light emitting side is, for example, a light emitting element such as an LED (Light Emitting Diode) or a VCSEL (Vertical Cavity Surface Emitting LASER). The other of the pair of photoelectric conversion modules 10 is the photoelectric conversion module 10 on the light receiving side. The photoelectric conversion element 14 of the photoelectric conversion module 10 on the light receiving side is, for example, a light receiving element such as a PD (Photo Diode).

As shown in FIGS. 2 and 3(b), a conductive film 16 is formed on substantially the entire outer surface of the main body 11 except for the region near the roots of the plurality of lead frames 15. As shown in FIGS. The conductive film 16 is formed by, for example, metal plating. The conductive film 16 can function to collect and reduce electromagnetic waves emitted from the photoelectric conversion element 14 to the outside of the photoelectric conversion module 10 and electromagnetic waves directed from the outside to the inside of the photoelectric conversion module 10.

Next, the housing 20 will be explained. As shown in FIG. 2, the housing 20 is a resin molded body having a substantially rectangular parallelepiped shape. As shown in FIGS. 1(a) and 5(a), the front surface of the housing 20 is formed with a rectangular parallelepiped-shaped fitting space 21 that is open toward the front and recessed toward the rear. A mating optical connector is fitted into the fitting space 21 .

As shown in FIG. 2, on the rear surface of the housing 20, a pair of rectangular parallelepiped-shaped accommodating portions 22 that are open to the rear and recessed to the front are formed so as to be lined up in the width direction. A pair of photoelectric conversion modules 10 are housed in the pair of housing sections 22 .

As shown in FIG. 5(a), a pair of cylindrical portions 23 projecting forward are integrally provided at locations corresponding to the pair of accommodating portions 22 on the bottom surface (rear end surface) of the fitting space 21. It is being The rear end openings (base openings) of the pair of cylindrical portions 23 communicate with the pair of accommodating portions 22, respectively. A tip opening 24 having a slightly smaller opening diameter than the other portion of the cylindrical portion 23 is formed at the tip (front end) of the cylindrical portion 23 . When the connector 1 and the mating optical connector are mated, the mating optical fiber (not shown) housed in the mating optical connector is inserted into the cylindrical part 23 through the tip opening 24. .

Next, the shield case 30 will be explained. The shield case 30 is formed by performing predetermined press working, bending work, etc. on a single metal plate. As shown in FIG. 4, the shield case 30 includes a rectangular flat top plate 31 and a pair of rectangular flat side plates 32 that hang down from both ends of the top plate 31 in the width direction.

A pair of rectangular flat rear plates 33 extend from the rear edge of the pair of side plates 32 so as to close the rear opening of the shield case 30 defined by the rear edge of the top plate 31 and the pair of side plates 32. It extends inward in the width direction (see FIG. 4(b)). The vertically extending edges of the pair of rear plates 33 face each other with a slight gap at the center position in the width direction of the rear end opening of the shield case 30, but even if they are brought into face-to-face contact, good. A rectangular flat shielding plate 34 hangs down from the rear edge of the top plate 31 (see FIG. 4(a)). The shielding plate 34 covers the entire pair of rear plates 33 from behind.

As shown in FIGS. 4(b) and 5, each rear plate 33 is partially cut and raised to form a contact portion 35 extending upward in a cantilever shape. In the vicinity of the extending end of the contact portion 35, as shown in FIG. 5(b), a protrusion portion 35a is formed that curves forward and protrudes forward. An extending end portion 35b is provided at the extending end of the contact portion 35. The extending end portion 35b extends obliquely upward and rearward.

Since the contact portion 35 is cut and raised from the rear plate 33, a gap (through space) passing through the front and rear of the rear plate 33 is defined around the contact portion 35 on the rear plate 33. These gaps are closed by a shielding plate 34 that covers the entire pair of rear plates 33 from behind. With such a laminated structure, even if these gaps exist, the electromagnetic wave shielding performance of the shield case 30 can be maintained. The protruding portion 35a of the contact portion 35 elastically presses the conductive film 16 formed on the rear surface of the main body 11 of the photoelectric conversion module 10 forward, and the extending end portion 35b of the contact portion 35 serves as a shield. It will come into contact with the shielding plate 34 of the case 30.

As shown in FIG. 4, three rod-shaped ground portions 36 extend downward from the lower end edges of each side plate 32 extending in the front-rear direction so as to be lined up at a predetermined distance in the front-rear direction. As shown in FIG. 4(b), a rod-shaped ground portion 37 extends downward from the lower edge near one of the extending ends of the pair of rear plates 33. As shown in FIG. As shown in FIG. 4(a), a rod-shaped ground portion 38 extends downward from the widthwise center of the lower edge of the shielding plate 34. As shown in FIG. Each member constituting the connector 1 has been described above.

Next, a procedure for assembling the connector 1 will be explained. First, a pair of photoelectric conversion modules 10 are placed in a pair of accommodating parts 22 (see FIG. 2) of a housing 20, respectively, so that the cylindrical part 12 of the photoelectric conversion module 10 is inserted into the cylindrical part 23 of the housing 20. (See Figure 5(a)). The insertion continues until the front surface of the main body 11 of the photoelectric conversion module 10 comes into contact with the bottom surface of the housing section 22 . When the insertion is completed, a state is obtained in which the pair of photoelectric conversion modules 10 are housed in the pair of housing sections 22 of the housing 20.

Next, as shown in FIG. 2, the shield case 30 is attached to the housing 20 from above so as to cover the housing 20. When the attachment of the shield case 30 to the housing 20 is completed, the assembly of the connector 1 is completed, and the connector 1 shown in FIG. 1 is obtained.

In the connector 1 that has been assembled, the photoelectric conversion module 10 is covered by the shield case 30 that covers the housing 20. Furthermore, as shown in FIG. 5(b), the protruding part 35a of the contact part 35 elastically presses the conductive film 16 formed on the rear surface of the main body part 11 of the shield case 30 forward, and The extending end 35b of 35 is in contact with the shield plate 34 of the shield case 30.

Thereby, the current caused by the electromagnetic waves collected on the conductive film 16 passes through the contact portion 35, the pair of rear plates 33, and goes to the ground portions 36, 37, and the path through the contact portion 35 to the shielding plate. 34 and toward the grounding section 38, and is emitted to the outside through a plurality of routes. Furthermore, by elastically pressing the contact portion 35 against the conductive film 16, the contact resistance between the conductive film 16 and the contact portion 35 can be reduced, and the contact resistance caused by electromagnetic waves collected by the conductive film 16 can be reduced. The current can be efficiently discharged to the outside. Furthermore, the photoelectric conversion module 10 is supported by both the rear plate 33 and the shield plate 34 of the shield case 30 via the contact portion 35 . As a result, positional displacement of the photoelectric conversion module 10 within the housing portion 22 is suppressed, so that the transmission quality of signals via the photoelectric conversion module 10 can be improved.

Ground portions 36, 37, and 38 provided on the shield case 30 protrude downward from the lower surface of the housing 20. The extending ends of the plurality of lead frames 15 provided in the photoelectric conversion module 10 extend downward and rearward from the lower end edge of the shielding plate 34 of the shielding case 30.

The assembled connector 1 is mounted on the upper surface of the circuit board 2, as shown in FIGS. 1 and 2. Specifically, first, a plurality of (six in total) grounding portions 36, one grounding portion 37, and one grounding portion 38 provided on the shield case 30 are connected to a plurality of grounding portions 36, one grounding portion 37, and one grounding portion 38 provided on the circuit board 2. (six in total) through holes 42, one through hole 43, and one through hole 44, respectively.

Next, a positioning mechanism (not shown) formed on the lower surface of the housing is engaged with a positioning part (not shown) provided on the circuit board 2 to position the housing 20 with respect to the circuit board 2, and also to position the housing 20 with respect to the circuit board 2. 1 is placed on the circuit board 2. As a result, the extending ends of the plurality of lead frames 15 provided in the photoelectric conversion module 10 are placed on the plurality of pads 41 formed on the upper surface of the circuit board 2, respectively.

Next, the extending portions of the plurality of lead frames 15 of the photoelectric conversion module 10 are soldered to the plurality of pads 41 of the circuit board 2, and the plurality of ground portions 36 and one ground portion of the shield case 30 are soldered. 37 and one ground portion 38 are soldered to the plurality of through holes 42, one through hole 43, and one through hole 44 of the circuit board 2, respectively.

As described above, the mounting of the connector 1 on the circuit board 2 is completed, and the board 3 with a connector is completed (see FIG. 1). In the completed board 3 with connectors, the plurality of lead frames 15 of the pair of photoelectric conversion modules 10 are connected to predetermined circuits of the circuit board 2. As a result, when the mating optical connector is fitted to the connector 1 mounted on the circuit board 2, the electrical signal generated on the circuit board 2 is transmitted to the photoelectric conversion element 14 of the photoelectric conversion module 10 on the light emitting side. The converted optical signal is converted into an optical signal, enters the lens body 13 on the light emitting side, and is guided to one of the optical fibers accommodated in the optical connector on the other side. Further, the optical signal that enters the lens body 13 on the light receiving side from the other optical fiber housed in the optical connector on the other side is received by the photoelectric conversion element 14 of the photoelectric conversion module 10 on the light receiving side and is converted into an electrical signal. , the converted electrical signals are transmitted to the circuit board 2.

Further, in the completed board 3 with a connector, the ground portions 36, 37, and 38 of the shield case 30 are connected to the ground circuit (GND circuit) of the circuit board 2. As a result, the current caused by the electromagnetic waves collected in the conductive film 16 passes through the contact portion 35, passes through the pair of rear plates 33, and goes to the ground portions 36, 37, and the path through the contact portion 35 to the shielding plate. It can be emitted to the ground circuit of the circuit board 2 through a plurality of routes, including a route passing through 34 and heading to the ground portion 38 . As a result, appropriate electromagnetic wave shielding performance can be exhibited even against high-intensity electromagnetic waves.

As described above, according to the connector 1 (and the substrate with connector 3) according to the present embodiment, the conductive film 16 (for example, plating) is provided on the outer surface of the photoelectric conversion module 10. Further, the contact portion 35 of the shield case 30 is in contact with the conductive film 16. Therefore, electromagnetic waves emitted from the photoelectric conversion element 14 toward the outside of the photoelectric conversion module 10 and electromagnetic waves directed from the outside to the inside of the photoelectric conversion module 10 can be captured by the conductive film 16. Furthermore, the current caused by the electromagnetic waves collected in the conductive film 16 flows from the conductive film 16, through the contact portion 35 of the shield case 30, and through the ground portions 36, 37, and 38 to the ground circuit of the circuit board 2. (GND circuit). Therefore, the connector 1 according to the present embodiment can reduce electromagnetic waves emitted to the outside from the connector 1 and improve communication reliability of the connector 1 compared to a case where the photoelectric conversion module 10 is not provided with the conductive film 16. It is.

Furthermore, according to the connector 1 according to the present embodiment, the contact portion 35 is configured to protrude (cut and raised) from the rear plate 33 of the shield case 30 in a beam shape. Therefore, by elastically pressing the contact portion 35 against the conductive film 16 of the photoelectric conversion module 10, the contact resistance between the conductive film 16 and the contact portion 35 can be reduced, and the particles collected on the conductive film 16 can be reduced. Current caused by electromagnetic waves can be efficiently discharged to the outside. Further, when forming the contact portion 35 on the rear plate 33 , a gap (through space) created around the contact portion 35 in the rear plate 33 is closed by the shielding plate 34 of the shield case 30 . With such a laminated structure, the connector 1 according to the present embodiment can suppress deterioration of the electromagnetic wave shielding performance of the shield case 30 even if a through space exists in a part of the shield case 30.

Furthermore, according to the connector 1 according to the present embodiment, the beam-shaped contact portion 35 extending from the rear plate 33 contacts the shield case 30 as well as the photoelectric conversion module 10 . Therefore, the current caused by the electromagnetic waves collected on the conductive film 16 passes through the contact portion 35, the pair of rear plates 33, and goes to the ground portions 36, 37, and the path through the contact portion 35 to the shielding plate 34. It can be emitted through a plurality of routes, including a route passing through the ground unit 38 and a route passing through the ground unit 38 . As a result, appropriate electromagnetic wave shielding performance can be exhibited even against high-intensity electromagnetic waves. Further, the photoelectric conversion module 10 is supported by the pair of rear plate 33 and the shielding plate 34 via the contact portion 35, so that positional displacement of the housing 20 in the photoelectric conversion module 10 within the housing portion 22 can be suppressed. As a result, the transmission quality of signals via the photoelectric conversion module 10 can be improved.

<Other aspects>
Note that the present invention is not limited to the above embodiments, and various modifications can be adopted within the scope of the present invention. For example, the present invention is not limited to the embodiments described above, and can be modified, improved, etc. as appropriate. In addition, the material, shape, size, number, arrangement location, etc. of each component in the above-described embodiments are arbitrary as long as the present invention can be achieved, and are not limited.

For example, in the embodiment described above, the pair of rear plate 33 and shield plate 34 in the shield case 30 are integrally continuous members. On the other hand, the pair of rear plate 33 and shielding plate 34 in the shield case 30 may be separate members that are independent from each other. Furthermore, the shielding plate 34 may be omitted.

Furthermore, in the embodiment described above, the extending end portion 35b of the contact portion 35 is in contact with the shielding plate 34 of the shielding case 30 (see FIG. 5(b)). On the other hand, the contact portion 35 does not need to be in contact with the shielding plate 34 of the shield case 30.

Here, the features of the embodiments of the connector 1 and the connector-attached board 3 according to the present invention described above are briefly summarized and listed below in [1] to [4].
[1]
A board comprising a photoelectric conversion module (10) having a photoelectric conversion element (14) and connectable to a circuit board (2), and a shield case (30) for noise reduction that covers the photoelectric conversion module (10). A mounting type connector (1),
The photoelectric conversion module (10) includes:
It has a conductive film (16) provided on the outer surface of the photoelectric conversion module (10),
The shield case (30) includes:
A contact part (35) that contacts the conductive film (16), and a ground part (36, 37, 38) connectable to the conductor pattern (42, 43, 44) of the circuit board (2). have,
Board-mounted connector (1).
[2]
In the connector (1) described in [1] above,
The shield case (30) includes:
A first shield part (33) having the contact part (35) projecting like a beam toward the photoelectric conversion module (10); ) a second shield part (34) that covers a through space defined in the first shield part (33) so as to communicate between the inside and outside of the photoelectric conversion module (10); have,
Board-mounted connector (1).
[3]
In the connector (1) described in [2] above,
The contact portion (35) is
contacting the conductive film (16) of the photoelectric conversion module (10) and contacting the second shield portion (34);
Board-mounted connector (1).
[4]
The board-mounted connector (1) according to any one of [1] to [3] above, and a circuit board (2) on which the connector (1) is mounted,
The ground portions (36, 37, 38) of the photoelectric conversion module (10) and the shield case (30) are electrically connected to the conductor patterns (42, 43, 44) of the circuit board (2). It is connected,
Board with connector (3).

1 Board-mounted connector 2 Circuit board 3 Board with connector 10 Photoelectric conversion module 14 Photoelectric conversion element 16 Conductive film 30 Shield case 33 Rear plate (first shield part)
34 Shielding plate (second shield part)
35 Contact part 36 Earth part 37 Earth part 38 Earth part 42 Through hole (conductor pattern)
43 Through hole (conductor pattern)
44 Through hole (conductor pattern)

Claims (2)

A board-mounted connector comprising a photoelectric conversion module having a photoelectric conversion element and connectable to a circuit board, and a shield case for noise reduction that covers the photoelectric conversion module,
The photoelectric conversion module includes:
having a conductive film provided on the outer surface of the photoelectric conversion module,
The shield case is
It has a contact part that comes into contact with the conductive film, and a ground part that can be connected to a conductor pattern that the circuit board has,
The shield case is
a first shield portion having the contact portion projecting like a beam toward the photoelectric conversion module; and a first shield portion having a shape so as to communicate between the inside and outside of the first shield portion as the contact portion protrudes. a second shield part that covers the through space formed by the photoelectric conversion module;
The second shield part covers the entire through space from the outside of the first shield part,
The contact portion is
contacting the conductive film of the photoelectric conversion module and contacting the second shield portion;
Board-mounted connector. comprising the board-mounted connector according to claim 1 and a circuit board on which the connector is mounted,
The ground portion of the photoelectric conversion module and the shield case is electrically connected to the conductor pattern of the circuit board.
Board with connector.

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