JP2013089871A5 - - Google Patents
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- Publication number
- JP2013089871A5 JP2013089871A5 JP2011230920A JP2011230920A JP2013089871A5 JP 2013089871 A5 JP2013089871 A5 JP 2013089871A5 JP 2011230920 A JP2011230920 A JP 2011230920A JP 2011230920 A JP2011230920 A JP 2011230920A JP 2013089871 A5 JP2013089871 A5 JP 2013089871A5
- Authority
- JP
- Japan
- Prior art keywords
- solid
- drive circuit
- light receiving
- receiving surface
- imaging device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000003384 imaging method Methods 0.000 claims 12
- 238000006243 chemical reaction Methods 0.000 claims 11
- 238000007689 inspection Methods 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011230920A JP2013089871A (ja) | 2011-10-20 | 2011-10-20 | 固体撮像素子ウエハ、固体撮像素子の製造方法、および固体撮像素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011230920A JP2013089871A (ja) | 2011-10-20 | 2011-10-20 | 固体撮像素子ウエハ、固体撮像素子の製造方法、および固体撮像素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013089871A JP2013089871A (ja) | 2013-05-13 |
| JP2013089871A5 true JP2013089871A5 (OSRAM) | 2014-11-27 |
Family
ID=48533468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011230920A Abandoned JP2013089871A (ja) | 2011-10-20 | 2011-10-20 | 固体撮像素子ウエハ、固体撮像素子の製造方法、および固体撮像素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013089871A (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9117879B2 (en) * | 2013-12-30 | 2015-08-25 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor device and manufacturing method thereof |
| TWI676280B (zh) * | 2014-04-18 | 2019-11-01 | 日商新力股份有限公司 | 固體攝像裝置及具備其之電子機器 |
| JP2019160866A (ja) * | 2018-03-08 | 2019-09-19 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
| JP2022089275A (ja) * | 2020-12-04 | 2022-06-16 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置、電子機器、製造方法 |
| JP2024127035A (ja) * | 2023-03-08 | 2024-09-20 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置 |
| WO2025062837A1 (ja) * | 2023-09-19 | 2025-03-27 | ソニーセミコンダクタソリューションズ株式会社 | 半導体チップ及び電子機器 |
-
2011
- 2011-10-20 JP JP2011230920A patent/JP2013089871A/ja not_active Abandoned
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