JP2013077588A - 基板処理方法 - Google Patents
基板処理方法 Download PDFInfo
- Publication number
- JP2013077588A JP2013077588A JP2011214831A JP2011214831A JP2013077588A JP 2013077588 A JP2013077588 A JP 2013077588A JP 2011214831 A JP2011214831 A JP 2011214831A JP 2011214831 A JP2011214831 A JP 2011214831A JP 2013077588 A JP2013077588 A JP 2013077588A
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- Prior art keywords
- solvent
- substrate
- groove
- fine particles
- holding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
- H01L21/743—Making of internal connections, substrate contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76229—Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
Abstract
【解決手段】 基板10の表面に形成された溝内に溶媒を埋め込むための基板処理方法であって、基板10の表面上に溶媒42を供給しながら、基板10の表面に弾性材料で形成された溶媒保持材22を接触させた状態で、基板10の表面と溶媒保持材22とが摺動するように、基板10及び前記溶媒保持材22をそれぞれ回転させる。
【選択図】 図1
Description
図1は、第1の実施形態に係る基板処理方法に用いた溶媒充填装置の概略構成を示す斜視図である。
図2は、第2の実施形態に係る基板処理方法に用いた溶媒充填装置の概略構成を示す斜視図である。なお、図1と同一部分には同一符号を付して、その詳しい説明は省略する。
図3は、第3の実施形態に係る基板処理方法に用いた溶媒充填装置の概略構成を示す斜視図である。なお、図1及び図2と同一部分には同一符号を付して、その詳しい説明は省略する。
次に、前記図1乃至図3に示す装置を用いた半導体装置の製造方法を、図4(a)(b)を参照して説明する。
図7は、第5の実施形態に係る半導体装置の製造工程を示す断面図である。この実施形態は、基板表面部に溝配線パターンを形成する方法である。
なお、本発明は上述した各実施形態に限定されるものではない。
11,12,51…溝
21…定盤
22…溶媒保持材
23,24…溶媒保持具
25…アーム
30…基板保持具
41…溶媒供給ノズル
42,43,52…溶媒
44,54…微粒子
46…空洞
47…スラリー
55…配線層
Claims (6)
- 表面に溝が形成された基板の表面上に溶媒を供給する工程と、
前記基板の表面に弾性材料で形成された溶媒保持材を接触させた状態で、前記基板の表面と前記溶媒保持材とが摺動するように、前記基板及び前記溶媒保持材をそれぞれ回転させる工程と、
を含むことを特徴とする基板処理方法。 - 前記基板及び前記溶媒保持材の回転と前記溶媒の供給とを同時に、又は交互に行うことを特徴とする請求項1記載の基板処理方法。
- 前記溶媒保持材は円板状に形成され、前記基板の回転軸と前記溶媒保持材の回転軸とは平行で且つ離間していることを特徴とする請求項1又は2に記載の基板処理方法。
- 前記溶媒保持材は円柱状に形成され、前記基板の回転軸と前記溶媒保持材の回転軸とは直交していることを特徴とする請求項1又は2に記載の基板処理方法。
- 前記溶媒は、微粒子を含むことを特徴とする請求項1乃至4の何れかに記載の基板処理方法。
- 前記微粒子は、中空構造を有することを特徴とする請求項5記載の基板処理方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011214831A JP2013077588A (ja) | 2011-09-29 | 2011-09-29 | 基板処理方法 |
US13/427,267 US20130084400A1 (en) | 2011-09-29 | 2012-03-22 | Substrate processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011214831A JP2013077588A (ja) | 2011-09-29 | 2011-09-29 | 基板処理方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013077588A true JP2013077588A (ja) | 2013-04-25 |
Family
ID=47992826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011214831A Withdrawn JP2013077588A (ja) | 2011-09-29 | 2011-09-29 | 基板処理方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20130084400A1 (ja) |
JP (1) | JP2013077588A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8662008B2 (en) * | 2008-02-07 | 2014-03-04 | Sunpower Corporation | Edge coating apparatus for solar cell substrates |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5234867A (en) * | 1992-05-27 | 1993-08-10 | Micron Technology, Inc. | Method for planarizing semiconductor wafers with a non-circular polishing pad |
US6602439B1 (en) * | 1997-02-24 | 2003-08-05 | Superior Micropowders, Llc | Chemical-mechanical planarization slurries and powders and methods for using same |
US6069085A (en) * | 1997-07-23 | 2000-05-30 | Lsi Logic Corporation | Slurry filling a recess formed during semiconductor fabrication |
US6015499A (en) * | 1998-04-17 | 2000-01-18 | Parker-Hannifin Corporation | Membrane-like filter element for chemical mechanical polishing slurries |
US6328872B1 (en) * | 1999-04-03 | 2001-12-11 | Nutool, Inc. | Method and apparatus for plating and polishing a semiconductor substrate |
US20030108664A1 (en) * | 2001-10-05 | 2003-06-12 | Kodas Toivo T. | Methods and compositions for the formation of recessed electrical features on a substrate |
US8628828B2 (en) * | 2008-04-04 | 2014-01-14 | Belanger, Inc. | Automotive tire dressing applicator |
US20100024935A1 (en) * | 2008-08-04 | 2010-02-04 | Ecolab Inc. | Usage of micron or submicron size transparent or translucent beads to improve reflectance |
-
2011
- 2011-09-29 JP JP2011214831A patent/JP2013077588A/ja not_active Withdrawn
-
2012
- 2012-03-22 US US13/427,267 patent/US20130084400A1/en not_active Abandoned
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US20130084400A1 (en) | 2013-04-04 |
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