JP2013074041A5 - - Google Patents
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- JP2013074041A5 JP2013074041A5 JP2011211062A JP2011211062A JP2013074041A5 JP 2013074041 A5 JP2013074041 A5 JP 2013074041A5 JP 2011211062 A JP2011211062 A JP 2011211062A JP 2011211062 A JP2011211062 A JP 2011211062A JP 2013074041 A5 JP2013074041 A5 JP 2013074041A5
- Authority
- JP
- Japan
- Prior art keywords
- groove structure
- printing
- ink
- recess
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229920002050 silicone resin Polymers 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000007644 letterpress printing Methods 0.000 description 1
- 238000000813 microcontact printing Methods 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011211062A JP5838692B2 (ja) | 2011-09-27 | 2011-09-27 | Cmos半導体装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011211062A JP5838692B2 (ja) | 2011-09-27 | 2011-09-27 | Cmos半導体装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013074041A JP2013074041A (ja) | 2013-04-22 |
JP2013074041A5 true JP2013074041A5 (enrdf_load_stackoverflow) | 2014-07-17 |
JP5838692B2 JP5838692B2 (ja) | 2016-01-06 |
Family
ID=48478303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011211062A Expired - Fee Related JP5838692B2 (ja) | 2011-09-27 | 2011-09-27 | Cmos半導体装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5838692B2 (enrdf_load_stackoverflow) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6334216B2 (ja) * | 2014-03-14 | 2018-05-30 | 京セラ株式会社 | 半導体粒子ペースト |
JP6530591B2 (ja) * | 2014-07-25 | 2019-06-12 | 旭化成株式会社 | フレキシブル回路デバイス及びそれを備える筋電位測定装置 |
JP6492523B2 (ja) * | 2014-10-21 | 2019-04-03 | 凸版印刷株式会社 | 有機半導体薄膜トランジスタ素子 |
CN107104188A (zh) * | 2017-04-20 | 2017-08-29 | 上海幂方电子科技有限公司 | 有机互补型非门器件的制备方法 |
CN115956288A (zh) * | 2020-09-07 | 2023-04-11 | 株式会社大赛璐 | 安装构造体、led显示器以及安装方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7244626B2 (en) * | 2004-06-30 | 2007-07-17 | Motorola, Inc. | Semiconductor devices shared element(s) apparatus and method |
KR100634327B1 (ko) * | 2005-04-13 | 2006-10-13 | 한국기계연구원 | 롤-투-롤 윤전인쇄방식을 이용한 전자소자의 제조방법 및그 제조장치 |
JP4729963B2 (ja) * | 2005-04-15 | 2011-07-20 | パナソニック株式会社 | 電子部品接続用突起電極とそれを用いた電子部品実装体およびそれらの製造方法 |
JP2008159812A (ja) * | 2006-12-22 | 2008-07-10 | Sharp Corp | 半導体層形成装置および半導体層形成方法 |
JP2008166016A (ja) * | 2006-12-27 | 2008-07-17 | Toppan Printing Co Ltd | 有機機能性素子の製造方法 |
JP2009130165A (ja) * | 2007-11-26 | 2009-06-11 | Sanyo Electric Co Ltd | Cmos半導体装置 |
JP2010212587A (ja) * | 2009-03-12 | 2010-09-24 | Ricoh Co Ltd | 有機薄膜トランジスタ、有機薄膜トランジスタの製造方法、有機薄膜トランジスタアレイ及び表示装置 |
JP5587636B2 (ja) * | 2010-03-01 | 2014-09-10 | 富士紡ホールディングス株式会社 | 研磨パッド |
JP2011187750A (ja) * | 2010-03-09 | 2011-09-22 | Ricoh Co Ltd | 有機薄膜トランジスタの製造方法、有機薄膜トランジスタレイの製造方法及び表示装置の製造方法 |
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2011
- 2011-09-27 JP JP2011211062A patent/JP5838692B2/ja not_active Expired - Fee Related
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