JP2013070018A5 - - Google Patents
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- Publication number
- JP2013070018A5 JP2013070018A5 JP2012061826A JP2012061826A JP2013070018A5 JP 2013070018 A5 JP2013070018 A5 JP 2013070018A5 JP 2012061826 A JP2012061826 A JP 2012061826A JP 2012061826 A JP2012061826 A JP 2012061826A JP 2013070018 A5 JP2013070018 A5 JP 2013070018A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- temperature
- start temperature
- semiconductor element
- semiconductor module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012061826A JP2013070018A (ja) | 2011-09-09 | 2012-03-19 | 半導体モジュール及びその製造方法 |
| KR20147008956A KR20140070584A (ko) | 2011-09-09 | 2012-09-06 | 반도체 모듈, 회로기판 |
| US14/239,479 US20140217608A1 (en) | 2011-09-09 | 2012-09-06 | Semiconductor module, circuit board |
| PCT/JP2012/005668 WO2013035337A1 (ja) | 2011-09-09 | 2012-09-06 | 半導体モジュール、回路基板 |
| CN201280043286.0A CN103782379A (zh) | 2011-09-09 | 2012-09-06 | 半导体模块，电路基板 |
| DE201211003759 DE112012003759T5 (de) | 2011-09-09 | 2012-09-06 | Halbleitermodul, Schaltungs-Substrat |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011197069 | 2011-09-09 | ||
| JP2011197069 | 2011-09-09 | ||
| JP2012061826A JP2013070018A (ja) | 2011-09-09 | 2012-03-19 | 半導体モジュール及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013070018A JP2013070018A (ja) | 2013-04-18 |
| JP2013070018A5 true JP2013070018A5 (enrdf_load_stackoverflow) | 2015-03-05 |
Family
ID=48475309
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012061802A Pending JP2013070017A (ja) | 2011-09-09 | 2012-03-19 | 半導体モジュール及びその製造方法 |
| JP2012061826A Withdrawn JP2013070018A (ja) | 2011-09-09 | 2012-03-19 | 半導体モジュール及びその製造方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012061802A Pending JP2013070017A (ja) | 2011-09-09 | 2012-03-19 | 半導体モジュール及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP2013070017A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019065725A1 (ja) * | 2017-09-28 | 2019-04-04 | 京セラ株式会社 | 電子素子搭載用基板および電子装置 |
| WO2024150303A1 (ja) * | 2023-01-11 | 2024-07-18 | 三菱電機株式会社 | パワーモジュール |
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2012
- 2012-03-19 JP JP2012061802A patent/JP2013070017A/ja active Pending
- 2012-03-19 JP JP2012061826A patent/JP2013070018A/ja not_active Withdrawn