JP2013065841A - Methods of manufacturing laminate for printed-circuit board and printed-circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide methods of manufacturing a laminate for a printed-circuit board and the printed-circuit board.SOLUTION: A method of manufacturing a printed-circuit board includes the steps of: forming a preliminary connection of an electronic element onto a face of an insulator in a semi-cured state; applying pressure on the electronic element to prepare a laminate for a printed-circuit board where the electronic element is inserted into the insulator; and forming, on a surface of the laminate for a printed-circuit board, a circuit pattern connected electrically to the electronic element.

Description

  The present invention relates to a laminate for a printed circuit board and a method for manufacturing the printed circuit board.

  In recent years, with the widespread use of portable terminals and notebook computers, electronic devices that are required to operate at high speed are being widely used. Accordingly, printed circuit boards capable of high-speed operation are required. For this high-speed operation, the printed circuit board is required to have a high density of wiring and electronic components. In order to achieve such high density, a build-up method is used, and circuits are miniaturized by SAP (Semi-Additive Processes), MSAP (Modified Semi-Additive Processes), and the like. . On the other hand, an embedded substrate (embedded PCB) in which components such as resistors, capacitors, and ICs are embedded in the substrate has been developed. This built-in printed circuit board has advantages such as a reduction in board size, further securing a surface mounting area, securing an interconnection area, and a reduction in impedance, and needs to be continuously researched and developed. .

  As a technique related to this, there is Patent Document 1.

Korean Published Patent No. 2011-0047016

  It is an object of the present invention to provide a printed circuit board laminate and a printed circuit board manufacturing method in which an electronic element is inserted without forming a cavity in an insulator and the manufacturing process is simplified.

  According to one embodiment of the present invention, a laminate for a printed circuit board comprising the steps of temporarily contacting an electronic element on one surface of a semi-cured insulator and inserting the electronic element into the insulator by pressurizing the electronic element A method of manufacturing a board is provided.

  In the step of inserting the electronic element, carriers each having a conductive layer laminated on one surface can be disposed on both surfaces of the insulator, and the carrier can be pressurized.

  The method may further include removing the carrier after inserting the electronic element.

  After the step of inserting the electronic element into the insulator, the method may further include the step of curing the insulator so that the conductive layer and the insulator are bonded.

  The insulator can be heated and pressurized so that the electronic elements are bonded.

  According to another embodiment of the present invention, there is provided a step of temporarily contacting an electronic element on one surface of a semi-cured insulator, and a laminate for a printed circuit board in which the electronic element is inserted by pressurizing the electronic element. There is provided a method of manufacturing a printed circuit board, comprising the steps of preparing and forming a circuit pattern electrically connected to an electronic element on the surface of the laminate for a printed circuit board.

  The step of inserting the electronic element may be a step of placing carriers having a conductive layer laminated on one side on both sides of the insulator and pressurizing the carrier.

  The method may further include removing the carrier after inserting the electronic element.

  After the step of inserting the electronic element into the insulator, the method may further include the step of curing the insulator so that the conductive layer and the insulator are bonded.

  The method may further include forming a circuit pattern on the conductive layer.

  In the step of temporarily contacting the electronic element, the insulator can be heated and pressurized so that the electronic element is adhered.

  According to the embodiments of the present invention, the time and cost required for manufacturing the printed circuit board laminate and the printed circuit board can be obtained by immediately pressing and inserting the electronic element without the step of forming the cavity in the insulator. Since the interface due to the cavity is not formed in the insulator, the noise of the electric signal can be reduced.

It is a flowchart which shows the manufacturing method of the laminated board for printed circuit boards which concerns on one Example of this invention. 3 is a flowchart illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention. 1 is a diagram illustrating a process of a printed circuit board manufactured according to an embodiment of the present invention. It is drawing which shows the process following the process shown in FIG. 5 is a drawing showing a step that follows the step shown in FIG. 4. 6 is a diagram showing a step that follows the step shown in FIG. 5.

  Since the present invention can be modified in various ways and have various embodiments, specific embodiments are illustrated in the drawings and described in detail. However, this is not to be construed as limiting the invention to the specific embodiments, but is to be understood as including all transformations, equivalents, and alternatives falling within the spirit and scope of the invention. In describing the present invention, when it is determined that the specific description of the known technology is not clear, the detailed description thereof will be omitted.

  The terms such as “first” and “second” are merely used to describe various components, and the components are not limited by these terms. These terms are only used to distinguish one component from another.

  The terms used in the present application are merely used to describe particular embodiments, and are not intended to limit the present invention. A singular expression includes the plural expression unless it is explicitly expressed in a sentence. In this application, terms such as “comprising” or “having” specify the presence of a feature, number, step, action, component, part, or combination thereof described in the specification, It should be understood that the existence or additional possibilities of one or more other features or numbers, steps, operations, components, parts or combinations thereof are not excluded in advance.

  Hereinafter, embodiments of a printed circuit board laminate and a printed circuit board manufacturing method according to the present invention will be described in detail with reference to the accompanying drawings. The same and corresponding components are denoted by the same reference numerals, and a duplicate description thereof is omitted.

  FIG. 1 is a flowchart illustrating a method for manufacturing a laminated board for a printed circuit board according to an embodiment of the present invention, and FIG. 2 is a flowchart illustrating a method for manufacturing a printed circuit board according to an embodiment of the present invention. . 3 to 6 are diagrams illustrating a printed circuit board manufactured according to an embodiment of the present invention in order.

  Hereinafter, a method for manufacturing a laminated board for a printed circuit board according to an embodiment of the present invention will be described with reference to FIGS. 1 and 3 to 5.

  Referring to FIG. 1, according to an embodiment of the present invention, the electronic element 120 is temporarily contacted with one surface of the semi-cured insulator 110 (S 110), and the electronic element 120 is pressurized so that the electronic element 120 is insulated. A method of manufacturing a laminated board for a printed circuit board, including a step of inserting into 110 (S120) is provided.

  The step (S110) of temporarily contacting the electronic element 120 is a step of placing the electronic element 120 on one surface of the semi-cured insulator 110 and then attaching the electronic element 120 to the insulator 110 as shown in FIG. is there.

  The electronic element 120 may not be fully bonded to the insulator 110 and may be adhered to such an extent that it does not move in a subsequent step. Since the insulator 110 is in a semi-cured state, the electronic element 120 can be pressed to be bonded, and the insulator 110 may be pressed and the electronic element 120 may be pressed for more stable bonding.

  The insulator 110 is formed in a semi-cured state as described above, and may be a prepreg as an example. The thickness of the insulator 110 may be at least twice the thickness of the electronic element 120 to be inserted.

  The step (S120) of inserting the electronic element 120 is a step of pressing the electronic element 120 and inserting it into the semi-cured insulator 110.

  At this time, as shown in FIG. 4, carriers 140 each having a conductive layer 130 laminated on one surface can be disposed on both surfaces of the insulator 110. Instead of pressurizing the electronic element 120, the carrier 140 can be pressed to insert the electronic element 120 into the insulator 110. The insulator 110 and the conductive layer 130 may include copper, and may be formed of different materials so that the carrier 140 can be easily removed in a later step.

  The method may further include a step (S130) of pressurizing the carrier 140 and curing the semi-cured insulator 110 after the electronic element 120 is inserted into the insulator 110 to bond the insulator 110 and the conductive layer 130 together. it can. When the insulator 110 and the conductive layer 130 are combined, the carrier 140 can be easily removed in a later step.

  As described above, when the insulating layer is cured, the method may further include removing the carrier 140 from the conductive layer 130 (S140), as shown in FIG. As a method for removing the carrier 140, a normal method can be used. For example, the carrier 140 can be removed by etching or peeling.

  After the carrier 140 is removed, as shown in FIG. 5, the printed circuit board in which the conductive layer 130 is formed on the surface of the insulator 110 and the electronic element 120 is built in the insulator 110 without forming a cavity. A laminated board can be provided.

  In the above, the method for providing the printed circuit board laminate in which the electronic element 120 is embedded in the insulator 110 without forming the cavity has been described. However, in the following, the electronic element 120 is formed in the insulator 110 without forming the cavity. A method for manufacturing a printed circuit board including a laminate for a printed circuit board inserted and provided in advance will be described with reference to FIGS.

  As shown in FIG. 2, according to another embodiment of the present invention, a step (S210) of temporarily contacting the electronic element 120 to one surface of the semi-cured insulator 110, and pressurizing the electronic element 120 to form the insulator 110 Preparing a printed circuit board laminate having the electronic element 120 inserted therein (S220), and forming a circuit pattern 132 electrically connected to the electronic element 120 on the surface of the printed circuit board laminate (S230). And a method for manufacturing a printed circuit board.

  The step of temporarily contacting the electronic element 120 (S210) and the step of preparing the printed circuit board laminate in which the electronic element 120 is inserted into the insulator 110 by pressurizing the electronic element 120 (S220) are for the printed circuit board described above. Since it is the same as the manufacturing method of a laminated board, the description is abbreviate | omitted.

  When a laminate for a printed circuit board in which the conductive layer 130 is formed on the surface of the insulator 110 and the electronic element 120 is inserted into the insulator 110 is prepared (S220), as shown in FIG. The circuit pattern 132 may be further formed on the conductive layer 130 formed on the surface 110 (S230).

  The step of forming the circuit pattern 132 is a step of forming the circuit pattern 132 so as to be electrically connected to the electronic element 120 inserted into the insulator 110. As a method of forming the circuit pattern 132, a normal method can be used. For example, the circuit pattern 132 can be formed by a method such as wet etching using a photoresist.

  According to the present invention, in the printed circuit board laminate and the printed circuit board manufacturing method, since the electronic element 120 is immediately inserted without forming the cavity in the insulator 110, the manufacturing steps are simplified and the cavity is formed. Since there is no interface with the insulator due to the formation of, the noise of the electronic signal transmitted from the electronic element 120 is reduced.

  In the above, one embodiment of the present invention has been described. However, those who have ordinary knowledge in the technical field can add components without departing from the spirit of the present invention described in the claims. It will be understood that the present invention can be modified and changed in various ways by changes, deletions, additions, and the like, and that these are also included in the scope of the present invention.

110 Insulator 120 Electronic Element 130 Conductive Layer 132 Circuit Pattern 140 Carrier

Claims (11)

Temporarily attaching an electronic element to one surface of a semi-cured insulator;
Pressurizing the electronic element and inserting the electronic element into the insulator. Inserting the electronic element comprises:
2. The method for manufacturing a laminated board for a printed circuit board according to claim 1, wherein the carrier is a step of placing a carrier having a conductive layer laminated on one side thereof on both sides of the insulator and pressurizing the carrier. After the step of inserting the electronic element,
The method for manufacturing a laminated board for a printed circuit board according to claim 2, further comprising a step of removing the carrier. After inserting the electronic element into the insulator,
The method for manufacturing a laminated board for a printed circuit board according to claim 2, further comprising a step of curing the insulator so that the conductive layer and the insulator are bonded to each other. The step of temporarily touching the electronic element comprises:
The method for manufacturing a laminated board for a printed circuit board according to claim 1, wherein the insulator is heated and pressurized so that the electronic element is bonded. Temporarily attaching an electronic element to one surface of a semi-cured insulator;
Preparing a laminate for a printed circuit board by pressurizing the electronic element and inserting the electronic element into the insulator;
Forming a circuit pattern electrically connected to the electronic element on a surface of the printed circuit board laminate. A method of manufacturing a printed circuit board. Inserting the electronic element comprises:
The method of manufacturing a printed circuit board according to claim 6, wherein the carrier is a step in which a carrier having a conductive layer laminated on one surface is disposed on both surfaces of the insulator, and the carrier is pressurized. After the step of inserting the electronic element,
The method of manufacturing a printed circuit board according to claim 7, further comprising a step of removing the carrier. After inserting the electronic element into the insulator,
The method of manufacturing a printed circuit board according to claim 7, further comprising a step of curing the insulator so that the conductive layer and the insulator are bonded to each other.   The method of manufacturing a printed circuit board according to claim 6, further comprising forming the circuit pattern on the conductive layer. The step of temporarily touching the electronic element comprises:
The method of manufacturing a printed circuit board according to claim 6, wherein the insulator is heated and pressurized so that the electronic element is bonded.

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