JP4395959B2 - Method for manufacturing printed wiring board - Google Patents

Method for manufacturing printed wiring board Download PDF

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Publication number
JP4395959B2
JP4395959B2 JP2000023672A JP2000023672A JP4395959B2 JP 4395959 B2 JP4395959 B2 JP 4395959B2 JP 2000023672 A JP2000023672 A JP 2000023672A JP 2000023672 A JP2000023672 A JP 2000023672A JP 4395959 B2 JP4395959 B2 JP 4395959B2
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JP
Japan
Prior art keywords
wiring board
printed wiring
hole
resin
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000023672A
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Japanese (ja)
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JP2001217540A (en
Inventor
潤 江原
利光 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2000023672A priority Critical patent/JP4395959B2/en
Publication of JP2001217540A publication Critical patent/JP2001217540A/en
Application granted granted Critical
Publication of JP4395959B2 publication Critical patent/JP4395959B2/en
Anticipated expiration legal-status Critical
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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、パソコン、移動体通信用電話機、ビデオカメラ等の各種電子機器に用いられるプリント配線板の製造方法に関するものである。
【0002】
【従来の技術】
近年、電子機器の高機能化、高密度化に伴い、電子部品は、益々小型化、高集積化、高速化の傾向にある。
【0003】
このために、プリント配線板の形態も益々低誘電率、薄型、軽量化の傾向が進む中で配線密度も高密度化し、配線のライン幅とスペース幅は年々狭くなっている。
【0004】
以下に従来のプリント配線板の回路形成方法について説明する。
【0005】
プリント配線板には、ディスクリート部品のハンダ接着強度を向上させるために一部の貫通孔内壁にのみ金属めっきを必要とされる。しかし、一部の貫通孔内壁にのみ金属めっきを実施することが困難であるため、以下の方法で一部の貫通孔内壁にのみ金属めっきを形成している。
【0006】
図3において、1はプリント配線板、2は銅はく、3は貫通孔、7はドライフィルム、9は金属めっきである。まず、(a)、(b)において回路形成前にプリント配線板の表面及び全ての貫通孔3の内壁に金属めっき9を行う。次に(c)においてドライフィルム7をラミネートして、さらに、(d)において、ドライフィルム7を露光し、(e)において、金属めっき9が必要とされる貫通孔3a部分にはドライフィルム7を残し、金属めっき9が不必要な貫通孔3b部分のドライフィルムは除去する。(f)において、エッチングを行い、(g)において、膜除去を行う。この結果、一部の貫通孔3の内壁にのみ金属めっき9が形成されると同時に、回路形成が行われる。
【0007】
図4において、1はプリント配線板、2は銅はく、3は貫通孔、6は樹脂、7はドライフィルムである。まず、(a)、(b)において回路形成前にプリント配線板1の表面及び全ての貫通孔3の内壁に金属めっき9を行う。次に(c)において、樹脂6を充填する。(e)において、樹脂6を硬化させ、(f)において、表面を研磨し、表面に密着している樹脂6を削除する。さらに(g)において、ドライフィルム7をラミネートして、さらに、(h)において、ドライフィルム7を露光し、(i)において、現像、エッチングを行う。最後に、(j)において、膜剥離、樹脂除去を行う。この結果、貫通孔3の内壁にのみ金属めっき9が形成されると同時に、回路形成が行われる。
【0008】
【発明が解決しようとする課題】
しかしながら上記の従来のプリント配線板の製造方法では、以下の課題がある。図3の工法では、回路形成前に表面に金属めっきが行われるために、(b)において、基板表面導体厚さが大きくなってしまい、{図3(h)}、回路形成時のエッチング時に導体厚さ方向のエッチングバラツキが大きくなる。つまり、線幅のトップ値とボトム値の差が大きくなり、回路形成の精度が低下する。
【0009】
回路形成の精度を上げるためには、回路形成前に表面導体を均一に厚さ方向に薄くすればよいが、そのためには、金属めっきが必要とされる貫通孔内壁を何らかの方法で保護しなければならないという問題点を有していた。
【0010】
また、図4の工法では、樹脂充填を印刷により行うが、全ての貫通孔に樹脂が充填されてしまい、任意の貫通孔にのみ樹脂を充填することができない。さらに表面に密着した樹脂を除去するために研磨を行うと研磨により基板が歪んでしまい、回路パターン形成時の合致性に悪影響を及ぼす。
【0011】
本発明は上記従来の問題点を解決するものであり、狭ライン幅と狭スペース幅を持った高密度の回路を精度良く形成することのできるプリント配線板の製造方法を提供することを目的とする。
【0012】
【課題を解決するための手段】
この目的を達成するために本発明のプリント配線板は、エッチングにより回路形成を行うプリント配線板の製造方法において、フィルムとインジェクターによりプリント配線板の一部の貫通孔、非貫通孔のビア等にエッチング液に溶解しない物質を選択的に形成し、その後、表面導体を均一に薄くし、さらに、エッチングで回路形成するプリント配線板の製造方法である。
【0013】
この発明によれば、プリント配線板の一部の貫通孔、ビア内壁にのみ金属めっきを行うことができ、しかも、表面導体層を均一に薄くしてからエッチングを行うため、精度の高い回路を持つプリント配線板を効率良く製造することができる。
【0014】
【発明の実施の形態】
本発明の請求項1、請求項2、請求項4および請求項5に記載した発明により、一部の貫通孔、非貫通孔ビア内壁に導通孔を形成するとともに、精度の高い回路を得ることが可能となるという作用を有する。
【0015】
また本発明の請求項1、請求項3、請求項6及び請求項7に記載した発明により、必要な貫通孔または非貫通孔のみに選択的にかつ孔内からにじみでることなく均一に樹脂を注入し、金属めっき層をエッチング液から保護し、剥離することにより貫通または非貫通の導通孔を確実に形成することができるという作用を有する。
【0016】
本発明の請求項及び請求項に記載した発明により、高精度の回路形成を行うことができるとともに、パターンランド径を小またはランドレスの貫通、非貫通の導通孔を形成することができ、設計配線密度を向上させることができ、さらに感光性のエッチングレジストと樹脂を同時に除去することで、生産性の向上をも図ることができるという作用を有する。
【0017】
本発明の請求項10乃至請求項12に記載した発明により、内層に導通孔、いわゆるインナーバイアホール(以下IVHと称す)構造を有する多層配線板の最外層の導体回路の細線・高密度化を図ることができ、また内層基板の接続を導電性ペーストを用いて行うことで全層IVH構造を有する高密度かつ設計が容易な多層配線板を提供することができる。さらにエポキシ樹脂を含浸した芳香族ポリアミドからなる被圧縮性多孔質基材を用いることにより、導通孔と導体回路の電気的接続信頼性を向上させ、軽量かつ最外層の導体回路の細線・高密度化を図ることができるという作用を有する。
【0018】
(実施の形態1)
以下本発明の一実施の形態について、図面を用いて説明する。
【0019】
図1は、本発明の一実施の形態におけるプリント配線板の製造方法を示す図である。図1、図2において、1は銅張積層板等からなるプリント配線板、2は銅はく、3は貫通孔、4はフィルム、5はインジェクター、6は硬化性の樹脂、7は感光性エッチングレジストとしてのドライフィルム、8は非貫通孔としてのビア、9は金属めっき、ランドパターン10である。
【0020】
以上のように構成されたプリント配線板の製造方法について、以下に説明する。
【0021】
図1(a)に示したように孔加工を施したプリント配線板1の表面及び全ての貫通孔3の内壁に金属めっき9を行う(図1(b))。
【0022】
次に、図1(c)においてプリント配線板の両面にエッチング液に耐性を有する剥離可能なフィルム4を密着させる。この時、加熱・加圧することによリフィルム4の密着性をより向上させることができる。
【0023】
次に図1(d)、図1(e)において、金属めっき9を保護する必要のある貫通孔3にのみ樹脂6を選択的に注入する。
【0024】
この時、インジェクター5の先端から貫通孔3内部の空気を抜いてから樹脂6を注入する。空気を抜くことによリ、樹脂6が均一に、しかも短時間で注入される。
【0025】
次に図1(f)において、加熱、紫外線照射、赤外線照射等により樹脂6を硬化した後、プリント配線板1表面のフィルム4を除去する。
【0026】
次に図1(g)において、酸性溶液等で表面処理を行い、樹脂6で保護されている貫通孔3以外の金属めっき9部分を均一に除去する。これによりプリント配線板1の表面導体層を均一に薄くすることができる。
【0027】
次に図1(h)において、アルカリ又は中性の溶液で樹脂6のみを除去する。
【0028】
そして図1(i)〜(l)に示すように、ドライフィルム7をラミネートし、露光、現像、エッチング、さらに膜剥離を行い、導体回路を形成する。
【0029】
次に非貫通孔を有するプリント配線板の製造方法について説明する。
【0030】
図2(a),(b)に示すように、プリント配線板1の表面及び全てのビア内壁に金属めっき9を行う。
【0031】
次に図2(c)において、プリント配線板1の両面にフィルム4を密着させる。この時、加熱・加圧することによリフィルム4の密着性をより向上させることができる。
【0032】
次に図2(d),(e)において、ビア8に樹脂6を注入する。
【0033】
この時、インジェクター5の先端から貫通孔3の内部の空気を抜いてから樹脂6を注入する。空気を抜くことによリ、樹脂6が均一に、しかも短時間で注入される。
【0034】
次に図2(f)において、加熱、紫外線照射、赤外線照射等により樹脂6を硬化した後、プリント配線板1のフィルム4を除去する。
【0035】
次に図2(g)において、酸性溶液等で表面処理を行い、樹脂6で保護されているビア以外の金属めっき9部分を均一に除去する。これによりプリント配線板1の表面導体層を均一に薄くすることができる。
【0036】
次に(h)〜(j)において、ドライフィルム7をラミネートし、露光、現像、エッチングを行う。
【0037】
最後に、図2(h)に示すように、ドライフィルム7及び樹脂6を同時に剥離・除去する。これによりビア8に接続するランドパターン10のランド径を小さくすることができ、さらにはランドレスビアホールといわれるランドパターン10をなくした導通孔を形成することもできる。
【0038】
上記のプリント配線板の製造方法により、プリント配線板の一部の貫通孔、ビア内壁にのみ金属めっきを行うことができ、しかも、表面導体層を均一に薄くしてからエッチングを行うため、精度の高い回路を持つプリント配線板を効率良く製造することができる。
【0039】
尚、多層構造を有する銅張積層板を用いて、多層のプリント配線板を製造することも可能である。
【0040】
【発明の効果】
以上のように本発明は、プリント配線板の一部の貫通孔、ビア内壁にのみ金属めっきを行うことができ、しかも、表面導体層を均一に薄くしてからエッチングを行うため、精度の高い回路を持つプリント配線板を効率良く製造することを可能にするプリント配線板の製造方法を実現できるものである。
【図面の簡単な説明】
【図1】本発明の一実施の形態におけるプリント配線板の製造方法を示す工程断面図
【図2】本発明の一実施の形態におけるプリント配線板の製造方法を示す工程断面図
【図3】従来のプリント配線板の製造方法を示す工程断面図
【図4】他の従来のプリント配線板の製造方法を示す工程断面図
【符号の説明】
1 プリント配線板
2 銅はく
3 貫通孔
4 フィルム
5 インジェクター
6 樹脂
7 ドライフィルム
8 ビア
9 金属めっき
10 ランドパターン
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a printed wiring board used in various electronic devices such as a personal computer, a mobile communication telephone, and a video camera.
[0002]
[Prior art]
In recent years, as electronic devices have higher functions and higher densities, electronic components are increasingly becoming smaller, more integrated, and faster.
[0003]
For this reason, the printed wiring board is also becoming increasingly low in dielectric constant, thin, and light in weight, and the wiring density is also increased, and the line width and space width of the wiring are becoming smaller year by year.
[0004]
A conventional circuit forming method for a printed wiring board will be described below.
[0005]
The printed wiring board requires metal plating only on the inner wall of some through holes in order to improve the solder bonding strength of the discrete components. However, since it is difficult to carry out metal plating only on some inner walls of the through holes, the metal plating is formed only on some inner walls of the through holes by the following method.
[0006]
In FIG. 3, 1 is a printed wiring board, 2 is copper foil, 3 is a through hole, 7 is a dry film, and 9 is metal plating. First, in (a) and (b), metal plating 9 is performed on the surface of the printed wiring board and the inner walls of all the through holes 3 before circuit formation. Next, the dry film 7 is laminated in (c), and further, the dry film 7 is exposed in (d). In (e), the dry film 7 is formed in the through-hole 3a portion where the metal plating 9 is required. The dry film of the through-hole 3b portion that does not require the metal plating 9 is removed. Etching is performed in (f), and film removal is performed in (g). As a result, the metal plating 9 is formed only on the inner walls of some of the through holes 3, and at the same time, the circuit is formed.
[0007]
In FIG. 4, 1 is a printed wiring board, 2 is copper foil, 3 is a through hole, 6 is a resin, and 7 is a dry film. First, in (a) and (b), metal plating 9 is performed on the surface of the printed wiring board 1 and the inner walls of all the through holes 3 before circuit formation. Next, in (c), the resin 6 is filled. In (e), the resin 6 is cured, and in (f), the surface is polished, and the resin 6 adhered to the surface is deleted. Further, in (g), the dry film 7 is laminated, and in (h), the dry film 7 is exposed, and in (i), development and etching are performed. Finally, in (j), film peeling and resin removal are performed. As a result, the metal plating 9 is formed only on the inner wall of the through hole 3, and at the same time, the circuit is formed.
[0008]
[Problems to be solved by the invention]
However, the conventional printed wiring board manufacturing method has the following problems. In the method of FIG. 3, since the surface is plated with metal before circuit formation, the substrate surface conductor thickness increases in (b), {FIG. 3 (h)}, during etching during circuit formation. Etching variation in the conductor thickness direction increases. That is, the difference between the top value and the bottom value of the line width increases, and the accuracy of circuit formation decreases.
[0009]
In order to increase the accuracy of circuit formation, the surface conductor may be thinned uniformly in the thickness direction before forming the circuit. To that end, however, the inner wall of the through hole that requires metal plating must be protected by some method. Had the problem of having to.
[0010]
Further, in the construction method of FIG. 4, resin filling is performed by printing. However, the resin is filled in all the through holes, and the resin cannot be filled only in arbitrary through holes. Further, if polishing is performed to remove the resin adhered to the surface, the substrate is distorted by the polishing, which adversely affects the conformity when forming a circuit pattern.
[0011]
The present invention solves the above-described conventional problems, and an object thereof is to provide a printed wiring board manufacturing method capable of accurately forming a high-density circuit having a narrow line width and a narrow space width. To do.
[0012]
[Means for Solving the Problems]
In order to achieve this object, the printed wiring board of the present invention is a method of manufacturing a printed wiring board in which a circuit is formed by etching. This is a method for manufacturing a printed wiring board in which a substance that does not dissolve in an etching solution is selectively formed, a surface conductor is then uniformly thinned, and a circuit is formed by etching.
[0013]
According to this invention, metal plating can be performed only on a part of the through-holes and via inner walls of the printed wiring board, and etching is performed after the surface conductor layer is uniformly thinned. The printed wiring board can be efficiently manufactured.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
According to the first, second , fourth, and fifth aspects of the present invention, a conduction hole is formed in the inner wall of a part of the through holes and the non-through holes, and a highly accurate circuit is obtained. Has the effect of becoming possible.
[0015]
Further, according to the invention described in claim 1, claim 3, claim 6 and claim 7 of the present invention, the resin can be uniformly applied only to the necessary through hole or non-through hole and without bleeding from the inside of the hole. By injecting, protecting the metal plating layer from the etching solution, and peeling off, there is an effect that a through hole or a non-through hole can be reliably formed.
[0016]
According to the invention described in claims 8 and 9 of the present invention, it is possible to form a circuit with high accuracy, and to form a conductive hole having a small pattern land diameter or a landless penetrating / non-penetrating hole. In addition, the design wiring density can be improved, and the productivity can be improved by removing the photosensitive etching resist and the resin at the same time.
[0017]
According to the invention described in claims 10 to 12 of the present invention, it is possible to reduce the fine lines and the density of the outermost conductor circuit of the multilayer wiring board having a conduction hole, so-called inner via hole (hereinafter referred to as IVH) structure in the inner layer. It is possible to provide a multilayer wiring board having an all-layer IVH structure and easy to design by connecting the inner layer substrates using a conductive paste. In addition, by using a compressible porous substrate made of aromatic polyamide impregnated with epoxy resin, the electrical connection reliability between the conduction hole and the conductor circuit is improved, and the thin and high density of the lightest and outermost conductor circuit It has the effect | action that can be achieved.
[0018]
(Embodiment 1)
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[0019]
FIG. 1 is a diagram showing a method for manufacturing a printed wiring board according to an embodiment of the present invention. 1 and 2, 1 is a printed wiring board made of a copper-clad laminate, 2 is copper foil, 3 is a through hole, 4 is a film, 5 is an injector, 6 is a curable resin, and 7 is photosensitive. A dry film as an etching resist, 8 is a via as a non-through hole, 9 is a metal plating, and a land pattern 10.
[0020]
A method for manufacturing the printed wiring board configured as described above will be described below.
[0021]
As shown in FIG. 1A, metal plating 9 is performed on the surface of the printed wiring board 1 subjected to hole processing and the inner walls of all the through holes 3 (FIG. 1B).
[0022]
Next, in FIG.1 (c), the peelable film 4 which has resistance to an etching liquid is stuck on both surfaces of a printed wiring board. At this time, the adhesiveness of the refilm 4 can be further improved by heating and pressurizing.
[0023]
Next, in FIG. 1D and FIG. 1E, the resin 6 is selectively injected only into the through hole 3 where the metal plating 9 needs to be protected.
[0024]
At this time, the resin 6 is injected after the air inside the through hole 3 is removed from the tip of the injector 5. By removing the air, the resin 6 is injected uniformly and in a short time.
[0025]
Next, in FIG.1 (f), after hardening the resin 6 by heating, ultraviolet irradiation, infrared irradiation, etc., the film 4 on the surface of the printed wiring board 1 is removed.
[0026]
Next, in FIG. 1G, surface treatment is performed with an acidic solution or the like, and the metal plating 9 portion other than the through holes 3 protected by the resin 6 is uniformly removed. Thereby, the surface conductor layer of the printed wiring board 1 can be made thin uniformly.
[0027]
Next, in FIG. 1 (h), only the resin 6 is removed with an alkali or neutral solution.
[0028]
Then, as shown in FIGS. 1 (i) to (l), a dry film 7 is laminated, and exposure, development, etching, and film peeling are performed to form a conductor circuit.
[0029]
Next, the manufacturing method of the printed wiring board which has a non-through-hole is demonstrated.
[0030]
As shown in FIGS. 2A and 2B, metal plating 9 is performed on the surface of the printed wiring board 1 and all the inner walls of the vias.
[0031]
Next, in FIG. 2C, the film 4 is adhered to both surfaces of the printed wiring board 1. At this time, the adhesiveness of the refilm 4 can be further improved by heating and pressurizing.
[0032]
Next, in FIGS. 2D and 2E, a resin 6 is injected into the via 8.
[0033]
At this time, the resin 6 is injected after the air inside the through hole 3 is removed from the tip of the injector 5. By removing the air, the resin 6 is injected uniformly and in a short time.
[0034]
Next, in FIG.2 (f), after hardening the resin 6 by heating, ultraviolet irradiation, infrared irradiation, etc., the film 4 of the printed wiring board 1 is removed.
[0035]
Next, in FIG. 2G, surface treatment is performed with an acidic solution or the like, and the metal plating 9 portion other than the via protected by the resin 6 is uniformly removed. Thereby, the surface conductor layer of the printed wiring board 1 can be made thin uniformly.
[0036]
Next, in (h) to (j), the dry film 7 is laminated, and exposure, development, and etching are performed.
[0037]
Finally, as shown in FIG. 2 (h), the dry film 7 and the resin 6 are peeled and removed simultaneously. As a result, the land diameter of the land pattern 10 connected to the via 8 can be reduced, and further, a conduction hole without the land pattern 10 called a landless via hole can be formed.
[0038]
With the above printed wiring board manufacturing method, metal plating can be performed only on some through holes and via inner walls of the printed wiring board, and etching is performed after the surface conductor layer is uniformly thinned. A printed wiring board having a high circuit can be efficiently manufactured.
[0039]
In addition, it is also possible to manufacture a multilayer printed wiring board using the copper clad laminated board which has a multilayer structure.
[0040]
【The invention's effect】
As described above, the present invention can perform metal plating only on a part of the through-holes and via inner walls of the printed wiring board, and moreover, since etching is performed after the surface conductor layer is uniformly thinned, high accuracy is achieved. It is possible to realize a method of manufacturing a printed wiring board that makes it possible to efficiently manufacture a printed wiring board having a circuit.
[Brief description of the drawings]
FIG. 1 is a process cross-sectional view showing a method for manufacturing a printed wiring board in an embodiment of the present invention. FIG. 2 is a process cross-sectional view showing a method for manufacturing a printed wiring board in an embodiment of the present invention. Process cross-sectional view showing a conventional printed wiring board manufacturing method [FIG. 4] Process cross-sectional view showing another conventional printed wiring board manufacturing method [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Copper foil 3 Through-hole 4 Film 5 Injector 6 Resin 7 Dry film 8 Via 9 Metal plating 10 Land pattern

Claims (12)

銅張積層板に複数の貫通孔または非貫通孔を形成する工程と、前記貫通孔または非貫通孔の内壁を含む銅張積層板の全面に金属めっき層を形成する工程と、金属めっき層を形成した前記貫通孔または非貫通孔をフィルムにて被覆する工程と、前記貫通孔または非貫通孔を被覆した前記フィルムにインジェクターを貫通させ、その先端から樹脂を注入することにより前記貫通孔または非貫通孔を選択的に保護する工程と、金属めっき層を薄くする工程と、回路形成を行う工程を有するプリント配線板の製造方法。A step of forming a plurality of through holes or non-through holes in the copper clad laminate, a step of forming a metal plating layer on the entire surface of the copper clad laminate including the inner walls of the through holes or non-through holes, and a metal plating layer. A step of covering the formed through-hole or non-through hole with a film; and passing through an injector through the film covering the through-hole or non-through hole, and injecting resin from the tip of the film. A method for manufacturing a printed wiring board, comprising: a step of selectively protecting a through hole; a step of thinning a metal plating layer; and a step of forming a circuit. 全面を均一にエッチングすることで金属めっき層を薄くすることを特徴とする請求項1に記載のプリント配線板の製造方法。  The method for manufacturing a printed wiring board according to claim 1, wherein the metal plating layer is thinned by uniformly etching the entire surface. インジェクター先端から樹脂を注入する前に、貫通孔または非貫通孔内部の空気を抜くことを特徴とする請求項に記載のプリント配線板の製造方法。The method for producing a printed wiring board according to claim 1 , wherein the air inside the through hole or the non-through hole is vented before injecting the resin from the tip of the injector. 金属めっき層を薄くする工程の前に、フィルムを除去することを特徴とする請求項に記載のプリント配線板の製造方法。Before the step of thinning the metal plating layer, a method for manufacturing a printed wiring board according to claim 1, characterized in that the removal of the film. フィルムが剥離性を有している請求項に記載のプリント配線板の製造方法。Method for manufacturing a printed wiring board according to claim 1 in which the film has release properties. 樹脂が硬化性樹脂であり、かつエッチング液に耐性を有していることを特徴とする請求項に記載のプリント配線板の製造方法。The method for manufacturing a printed wiring board according to claim 1 , wherein the resin is a curable resin and has resistance to an etching solution. アルカリ又は中性の剥離液に可溶な樹脂を用いた請求項に記載のプリント配線板の製造方法。The method for producing a printed wiring board according to claim 6 , wherein a resin soluble in an alkali or neutral stripping solution is used. 回路形成を感光性のエッチングレジストを用いて行うことを特徴とする請求項1に記載のプリント配線板の製造方法。  2. The method of manufacturing a printed wiring board according to claim 1, wherein the circuit is formed using a photosensitive etching resist. 回路形成を行う工程において、感光性のエッチングレジストと、アルカリ又は中性の剥離液に可溶な樹脂を同時に除去することを特徴とする請求項1に記載のプリント配線板の製造方法。  The method for producing a printed wiring board according to claim 1, wherein in the step of forming a circuit, the photosensitive etching resist and the resin soluble in an alkali or neutral stripping solution are simultaneously removed. 銅張積層板が少なくとも1枚の内層基板を有する多層の銅張積層板である請求項1に記載のプリント配線板の製造方法。  The method for producing a printed wiring board according to claim 1, wherein the copper clad laminate is a multilayer copper clad laminate having at least one inner layer substrate. エポキシ樹脂を含浸した芳香族ポリアミドからなる被圧縮性多孔質基材に貫通孔を形成し、前記貫通孔に導電性ペーストを充填し、前記多孔質基材の両面に金属箔を張り合わせ加熱加圧した後回路パターンを形成した内層基板を用いた請求項10に記載のプリント配線板の製造方法。A through-hole is formed in a compressible porous substrate made of an aromatic polyamide impregnated with an epoxy resin, a conductive paste is filled in the through-hole, and metal foil is laminated on both sides of the porous substrate to heat and press The method for manufacturing a printed wiring board according to claim 10 , wherein an inner layer substrate on which a circuit pattern is formed is used. 貫通孔に導電性ペーストを充填した半硬化状態の樹脂含浸絶縁基板と、回路パターンを形成した内層基板を、交互にかつ最外層に銅はくを積層させて形成した多層の銅張積層板を用いた請求項1に記載のプリント配線板の製造方法。  A multilayer copper-clad laminate formed by laminating copper foil on the outermost layer alternately and semi-cured resin-impregnated insulating substrate with through holes filled with conductive paste and inner layer substrate on which a circuit pattern is formed The manufacturing method of the printed wiring board of Claim 1 used.
JP2000023672A 2000-02-01 2000-02-01 Method for manufacturing printed wiring board Expired - Fee Related JP4395959B2 (en)

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