JP2013062015A5 - - Google Patents

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Publication number
JP2013062015A5
JP2013062015A5 JP2012196761A JP2012196761A JP2013062015A5 JP 2013062015 A5 JP2013062015 A5 JP 2013062015A5 JP 2012196761 A JP2012196761 A JP 2012196761A JP 2012196761 A JP2012196761 A JP 2012196761A JP 2013062015 A5 JP2013062015 A5 JP 2013062015A5
Authority
JP
Japan
Prior art keywords
pad
head slider
suspension lead
pads
hga
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012196761A
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English (en)
Japanese (ja)
Other versions
JP5869451B2 (ja
JP2013062015A (ja
Filing date
Publication date
Priority claimed from US13/229,631 external-priority patent/US8477457B2/en
Application filed filed Critical
Publication of JP2013062015A publication Critical patent/JP2013062015A/ja
Publication of JP2013062015A5 publication Critical patent/JP2013062015A5/ja
Application granted granted Critical
Publication of JP5869451B2 publication Critical patent/JP5869451B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012196761A 2011-09-09 2012-09-07 パッド間半田ブリッジの形成を防止すべく構成された形状を有するサスペンションリードパッドを備えたヘッドジンバルアセンブリ Active JP5869451B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/229,631 2011-09-09
US13/229,631 US8477457B2 (en) 2011-09-09 2011-09-09 Head-gimbal assembly with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge

Publications (3)

Publication Number Publication Date
JP2013062015A JP2013062015A (ja) 2013-04-04
JP2013062015A5 true JP2013062015A5 (enExample) 2015-10-29
JP5869451B2 JP5869451B2 (ja) 2016-02-24

Family

ID=47829659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012196761A Active JP5869451B2 (ja) 2011-09-09 2012-09-07 パッド間半田ブリッジの形成を防止すべく構成された形状を有するサスペンションリードパッドを備えたヘッドジンバルアセンブリ

Country Status (2)

Country Link
US (1) US8477457B2 (enExample)
JP (1) JP5869451B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9728211B1 (en) 2016-02-04 2017-08-08 Western Digital Technologies, Inc. Suspension pad for head-gimbal assembly that inhibits formation of an inter-pad solder bridge
US9786308B1 (en) 2016-06-07 2017-10-10 Seagate Technology Llc Interconnect interposer attachable to a trailing edge of a slider
US10460754B2 (en) 2018-02-05 2019-10-29 Western Digital Technologies, Inc. Slider and suspension arm interconnection for magnetic storage device
JP7145707B2 (ja) * 2018-09-19 2022-10-03 株式会社東芝 電子機器
US11062731B1 (en) * 2020-05-11 2021-07-13 Western Digital Technologies, Inc. Solder bump height stabilization for micro and fine pitch electrode pads
CN115376565A (zh) * 2021-05-20 2022-11-22 日本发条株式会社 磁盘装置用悬架、电子部件以及悬架和电子部件的连接方法
US11676628B1 (en) 2021-12-02 2023-06-13 Western Digital Technologies, Inc. Multiple-portion hard disk drive slider pad configuration
US11631426B1 (en) 2021-12-15 2023-04-18 Western Digital Technologies, Inc. Hard disk drive suspension pad peel-prevention configuration
US11705153B1 (en) 2022-03-23 2023-07-18 Western Digital Technologies, Inc. Hard disk drive suspension pad pre-solder formation and guiding
US11908497B2 (en) 2022-03-29 2024-02-20 Western Digital Technologies, Inc. Hard disk drive suspension pad pre-solder sidewalls
US11626133B1 (en) * 2022-03-30 2023-04-11 Sae Magnetics (H.K.) Ltd. Method of manufacturing head gimbal assembly, head gimbal assembly and hard disk drive
US12094501B1 (en) 2023-04-05 2024-09-17 Western Digital Technologies, Inc. Hard disk drive slider split pad configuration
US12260886B2 (en) 2023-06-28 2025-03-25 Western Digital Technologies, Inc. Suspension arm and slider contact for magnetic storage device

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5929521A (en) * 1997-03-26 1999-07-27 Micron Technology, Inc. Projected contact structure for bumped semiconductor device and resulting articles and assemblies
JP2001043647A (ja) 1999-07-15 2001-02-16 Internatl Business Mach Corp <Ibm> ハードディスク装置、スライダ保持構造、ヘッド・ジンバル・アッセンブリ及びその製造方法
US6700746B1 (en) 2001-09-19 2004-03-02 Maxtor Corporation Disk drive suspension having controlled slider attachment
JP3753968B2 (ja) * 2001-10-11 2006-03-08 ヒタチグローバルストレージテクノロジーズネザーランドビーブイ 配線一体型サスペンション及びその製造方法
JP4255859B2 (ja) * 2004-02-26 2009-04-15 ヒタチグローバルストレージテクノロジーズネザーランドビーブイ 回転円板形記憶装置及び配線一体型ヘッド・サスペンション・アセンブリ
US20050195528A1 (en) * 2004-03-05 2005-09-08 Bennin Jeffry S. Coined ground features for integrated lead suspensions
JP2006185479A (ja) * 2004-12-27 2006-07-13 Hitachi Global Storage Technologies Netherlands Bv ヘッド・ジンバル・アセンブリ及び磁気ディスク装置
JP2006236489A (ja) * 2005-02-25 2006-09-07 Hitachi Global Storage Technologies Netherlands Bv ヘッド・ジンバル・アセンブリの製造方法及びヘッド・ジンバル・アセンブリ
US8503132B2 (en) * 2005-08-25 2013-08-06 HGST Netherlands B.V. Head gimbal assembly, slider, and method of manufactuing a head gimbal assembly with reduced lead length
JP2008065878A (ja) * 2006-09-05 2008-03-21 Hitachi Global Storage Technologies Netherlands Bv 磁気スライダとヘッド・ジンバル・アセンブリ及びその製造方法
US20080180856A1 (en) 2007-01-31 2008-07-31 Toshiki Hirano Method and apparatus for a microactuator bonding pad structure for solder ball placement and reflow joint
US8335050B2 (en) 2007-04-03 2012-12-18 Hitachi Global Storage Technologies, Netherlands B.V. Disk drive with a solder preform hermetic seal
US8213121B2 (en) 2007-10-09 2012-07-03 Hitachi Global Storage Technologies, Netherlands B.V. HGA suspension pad barrier for elimination of solder bridging defect
US8363356B2 (en) 2008-07-28 2013-01-29 Hgst, Netherlands B.V. High bandwidth and mechanical strength between a disk drive flexible circuit and a read write head suspension
JP2010123195A (ja) * 2008-11-19 2010-06-03 Hitachi Global Storage Technologies Netherlands Bv ヘッド・ジンバル・アセンブリ、マイクロアクチュエータ及びマイクロアクチュエータの製造方法
US8259415B2 (en) * 2009-06-22 2012-09-04 Seagate Technology Llc Slider bond pad with a recessed channel
JP2011121070A (ja) * 2009-12-08 2011-06-23 Hitachi Global Storage Technologies Netherlands Bv ヘッド・ジンバル・アセンブリの製造方法及びヘッド・ジンバル・アセンブリの接続パッドを相互接続する装置
US8174793B2 (en) * 2010-06-22 2012-05-08 Tdk Corporation Thin film magnetic head and magnetic disk device and electronic component
CN102915746B (zh) * 2011-08-04 2016-08-24 新科实业有限公司 悬臂件、磁头折片组合以及硬盘驱动单元

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