JP2013058471A - 導電性組成物および製造法 - Google Patents
導電性組成物および製造法 Download PDFInfo
- Publication number
- JP2013058471A JP2013058471A JP2012167378A JP2012167378A JP2013058471A JP 2013058471 A JP2013058471 A JP 2013058471A JP 2012167378 A JP2012167378 A JP 2012167378A JP 2012167378 A JP2012167378 A JP 2012167378A JP 2013058471 A JP2013058471 A JP 2013058471A
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- Prior art keywords
- oxide
- metal
- conductive composition
- silver
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 70
- 238000004519 manufacturing process Methods 0.000 title abstract description 14
- 229910052709 silver Inorganic materials 0.000 claims abstract description 47
- 239000004332 silver Substances 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 40
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 37
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 37
- 239000000945 filler Substances 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000011521 glass Substances 0.000 claims abstract description 17
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 38
- 238000005245 sintering Methods 0.000 claims description 20
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 12
- 239000000654 additive Substances 0.000 claims description 11
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 8
- 230000000996 additive effect Effects 0.000 claims description 8
- 239000011787 zinc oxide Substances 0.000 claims description 8
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 7
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 7
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 7
- 229960004643 cupric oxide Drugs 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 230000002708 enhancing effect Effects 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 39
- 239000002245 particle Substances 0.000 abstract description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 15
- -1 silver aluminum Chemical compound 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 24
- 238000006243 chemical reaction Methods 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 15
- 229910052782 aluminium Inorganic materials 0.000 description 14
- 230000008569 process Effects 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000007650 screen-printing Methods 0.000 description 7
- 238000012360 testing method Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000000156 glass melt Substances 0.000 description 2
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 2
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- 150000003376 silicon Chemical class 0.000 description 2
- 229940035637 spectrum-4 Drugs 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- NPNMHHNXCILFEF-UHFFFAOYSA-N [F].[Sn]=O Chemical compound [F].[Sn]=O NPNMHHNXCILFEF-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- OGFYIDCVDSATDC-UHFFFAOYSA-N silver silver Chemical compound [Ag].[Ag] OGFYIDCVDSATDC-UHFFFAOYSA-N 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/023—Alloys based on aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
【解決手段】導電性機能的相混合物を含む導電性組成物では、導電性機能的相混合物は、金属および金属酸化物で作られており、金属酸化物は充填剤として、および、金属は本体として用いられる。導電性機能的相混合物は金属および金属酸化物で製造され、金属酸化物は充填剤としてであり、また、金属は本体としてである。少なくとも銀または銅を含む被覆部は、充填剤の少なくとも一部表面を実質的に被覆する。
【選択図】なし
Description
実施形態1
実施形態2
実施形態3
実施形態4
Claims (15)
- 導電性組成物であって、導電性機能的相混合物を含むことを特徴とし、前記導電性機能的相混合物は、金属および金属酸化物で製造され、前記金属酸化物は充填剤としてであり、および、前記金属は接着性を増強するための本体としてであり;前記金属は銀を含み、および、前記金属酸化物の重量パーセントは約0.5〜5であり、および前記金属酸化物は、酸化アルミニウム(アルミナ)、酸化ジルコニウム(ジルコニア)、酸化シリコン(シリカ)、酸化亜鉛、酸化第二銅およびその組み合わせを含む導電性組成物。
- 前記銀の重量パーセントが50以下である、請求項1に記載の導電性組成物。
- 前記酸化アルミニウムの重量パーセントが2〜4である、請求項1に記載の導電性組成物。
- 前記金属酸化物の融点が焼結温度より高い、請求項1に記載の導電性組成物。
- ガラスおよび添加剤をさらに含み、前記金属酸化物、前記ガラスおよび前記添加剤が有機ビヒクルと混合される、請求項1に記載の導電性組成物。
- 導電性機能的相混合物を含む導電性組成物であって、前記導電性機能的相混合物が金属および金属酸化物で製造され、前記金属酸化物が充填剤としてであり、および、前記金属が接着性を増強するための本体としてである導電性機能的相混合物と;前記充填剤の材料費が前記導電性被覆部のそれ未満であり、前記充填剤の少なくとも一部表面を実質的に被覆する導電性被覆部とを含むことを特徴とし、前記金属は銀を含み、前記金属酸化物は酸化アルミニウム(アルミナ)、酸化ジルコニウム(ジルコニア)、酸化シリコン(シリカ)、酸化亜鉛、酸化第二銅およびその組み合わせを含む、導電性組成物。
- 前記銀の重量パーセントが50以下である、請求項6に記載の導電性組成物。
- 前記金属酸化物の融点が焼結温度より高い、請求項6に記載の導電性組成物。
- ガラスおよび添加剤をさらに含み、前記金属酸化物、前記ガラスおよび前記添加剤が有機ビヒクルと混合される、請求項6に記載の導電性組成物。
- 前記酸化アルミニウムの重量パーセントが2〜4である、請求項6に記載の導電性組成物。
- 太陽電池に使用される導電性組成物であって、導電性機能的相混合物を含むことを特徴とし、前記導電性機能的相混合物は、金属および金属酸化物で製造され、前記金属酸化物は充填剤としてであり、また、前記金属は接着性を増強するための本体としてであり;前記金属は銀を含み、また、前記金属酸化物の重量パーセントは約0.5〜5であり、また前記金属酸化物は、酸化アルミニウム(アルミナ)、酸化ジルコニウム(ジルコニア)、酸化シリコン(シリカ)、酸化亜鉛、酸化第二銅およびその組み合わせを含む導電性組成物。
- 前記銀の重量パーセントが50以下である、請求項11に記載の導電性組成物。
- 前記金属酸化物の融点が焼結温度より高い、請求項11に記載の導電性組成物。
- ガラスおよび添加剤をさらに含み、前記金属酸化物、前記ガラスおよび前記添加剤が有機ビヒクルと混合される、請求項11に記載の導電性組成物。
- 前記酸化アルミニウムの重量パーセントが2〜4である、請求項11に記載の導電性組成物。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100127295 | 2011-07-29 | ||
TW100127295 | 2011-07-29 | ||
TW101100998 | 2012-01-10 | ||
TW101100998A TWI528382B (zh) | 2011-07-29 | 2012-01-10 | 導電組合物及其製造方法 |
TW101125409 | 2012-07-13 | ||
TW101125409A TWI550641B (zh) | 2011-07-29 | 2012-07-13 | 導電組合物及其製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015112860A Division JP6068559B2 (ja) | 2011-07-29 | 2015-06-03 | 太陽電池およびその電極 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013058471A true JP2013058471A (ja) | 2013-03-28 |
Family
ID=47575617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012167378A Pending JP2013058471A (ja) | 2011-07-29 | 2012-07-27 | 導電性組成物および製造法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20130026425A1 (ja) |
JP (1) | JP2013058471A (ja) |
CN (1) | CN102903418B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140191167A1 (en) * | 2013-01-04 | 2014-07-10 | Giga Solar Materials Corporation | Conductive Composition |
US9994951B2 (en) * | 2013-03-15 | 2018-06-12 | The United States Of America, As Represented By The Secretary Of The Navy | Photovoltaic sputtering targets fabricated from reclaimed materials |
CN107564987B (zh) * | 2017-09-07 | 2019-07-19 | 泰州隆基乐叶光伏科技有限公司 | 一种应用于叠片组件的焊带结构 |
CN112002458A (zh) * | 2020-08-03 | 2020-11-27 | 浙江泰仑电力集团有限责任公司 | 无机填料表面包银和其水性光固化导电银浆及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5871507A (ja) * | 1981-10-23 | 1983-04-28 | 住友金属鉱山株式会社 | 導電ペ−スト |
JPS6396809A (ja) * | 1986-10-13 | 1988-04-27 | 株式会社村田製作所 | 導電ペ−スト |
JPH08153414A (ja) * | 1994-11-28 | 1996-06-11 | Murata Mfg Co Ltd | 導電ペースト |
JP2011054313A (ja) * | 2009-08-31 | 2011-03-17 | Sharp Corp | 導電性ペースト、半導体装置用電極、半導体装置および半導体装置の製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4450188A (en) * | 1980-04-18 | 1984-05-22 | Shinroku Kawasumi | Process for the preparation of precious metal-coated particles |
US4419279A (en) * | 1980-09-15 | 1983-12-06 | Potters Industries, Inc. | Conductive paste, electroconductive body and fabrication of same |
GB2119571B (en) * | 1982-03-30 | 1985-12-11 | Standard Telephones Cables Ltd | Terminals for multilayer ceramic dielectric capacitors |
GB9518033D0 (en) * | 1995-09-05 | 1995-11-08 | Cookson Matthey Ceramics Plc | Composition |
GB0710425D0 (en) * | 2007-06-01 | 2007-07-11 | Hexcel Composites Ltd | Improved structural adhesive materials |
CN101373646A (zh) * | 2008-10-09 | 2009-02-25 | 彩虹集团公司 | 一种中低温固化导电银浆料 |
JP5559510B2 (ja) * | 2009-10-28 | 2014-07-23 | 昭栄化学工業株式会社 | 太陽電池素子及びその製造方法 |
US9023254B2 (en) * | 2011-10-20 | 2015-05-05 | E I Du Pont De Nemours And Company | Thick film silver paste and its use in the manufacture of semiconductor devices |
-
2012
- 2012-07-27 US US13/560,381 patent/US20130026425A1/en not_active Abandoned
- 2012-07-27 JP JP2012167378A patent/JP2013058471A/ja active Pending
- 2012-07-30 CN CN201210269736.XA patent/CN102903418B/zh not_active Expired - Fee Related
-
2015
- 2015-06-18 US US14/743,194 patent/US20150287850A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5871507A (ja) * | 1981-10-23 | 1983-04-28 | 住友金属鉱山株式会社 | 導電ペ−スト |
JPS6396809A (ja) * | 1986-10-13 | 1988-04-27 | 株式会社村田製作所 | 導電ペ−スト |
JPH08153414A (ja) * | 1994-11-28 | 1996-06-11 | Murata Mfg Co Ltd | 導電ペースト |
JP2011054313A (ja) * | 2009-08-31 | 2011-03-17 | Sharp Corp | 導電性ペースト、半導体装置用電極、半導体装置および半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20150287850A1 (en) | 2015-10-08 |
CN102903418B (zh) | 2018-02-27 |
US20130026425A1 (en) | 2013-01-31 |
CN102903418A (zh) | 2013-01-30 |
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