JP2013053339A - Plating device and plating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a rotary plating device and method with compact constitution, capable of applying a desired plating treatment even to ultrafine objects to be plated, and capable of preventing suspended solids or inferior articles in a plating liquid from coexisting in conforming articles to the utmost.SOLUTION: A plating treatment chamber 4 is provided with: a rotation body 11 having an opening 8 thereabove and a cathode 10 provided on an outer periphery; a cylindrical member 3 disposed at the rotational center of the body 11; and an anode 13 disposed inside the body 11. The rotation body 11 has its body 15 and a bottom plate 16 supporting the body 15, and the cathode 10 intervenes between the body 15 and the bottom plate 16. The plating treatment chamber 4 is rotatively driven by connecting the bottom plate 16 to a drive system 5, and the plating liquid is flowed in the cylindrical member 3 by overflow of the plating liquid 2 onto the member 3. The inflowed plating liquid 2 is refluxed from the opening 8 to the chamber 4 to circulate the plating liquid 2.

Description

  The present invention relates to a plating apparatus and a plating method, and more particularly to a plating apparatus suitable for forming a plating film when an object to be plated is extremely small, and a plating method using the plating apparatus.

  In a chip-type electronic component such as a multilayer ceramic capacitor, a plating film is usually formed on the surface of an electrode formed on the surface of the component body in order to ensure heat resistance, solder wettability, and the like.

  As such a plating apparatus for forming a plating film, as shown in Patent Document 1, an object to be plated and a plating solution are accommodated in a rotating body, and the object to be plated is utilized by utilizing a centrifugal force generated by the rotation of the rotating body. 2. Description of the Related Art There is known a plating apparatus that applies a plating process to an object.

  That is, in this type of plating apparatus, as shown in FIG. 4, a horizontal circular bottom plate 102 fixed to the upper end of a vertical drive shaft 101, a mounting flange 103 on the outer periphery, and an opening 104 in the center. And a cover 106 in which a plating chamber 105 is formed between the bottom plate 102, a contact ring (cathode) 107 attached to the lower portion of the mounting flange 103, and the contact ring 107 and the bottom plate 102. The porous body window 108 through which only the plating solution passes, the supply pipe 110 for supplying the plating liquid to the plating processing chamber 105 from the opening 104, the container 109 for receiving the plating liquid scattered from the porous body window 108, and the supply pipe 110 includes a pump 111 interposed in 110 and an electrode (anode) 112 that is inserted from the opening 104 and contacts the plating solution.

  In Patent Document 1, the porous body window 108 is formed of a porous material made up of a large number of small holes so that the plating solution can pass but the object to be plated does not pass through. The plating solution that has passed through the porous body window 108 is collected in a container 109 and circulated from the supply pipe 110 into the plating treatment chamber 105 by a pump 111.

  Moreover, in this patent document 1, in the state which the to-be-plated object was immersed in the plating solution in the plating process chamber 105, it supplied with electricity between the contact ring 107 and the electrode 112, and by repeating rotation and a stop of the drive shaft 101, A plating film is formed on the surface of the object to be plated using centrifugal force.

Japanese Patent No. 3126867

  However, in Patent Document 1, although the plated product and the plating solution are separated by the porous body window 108, there is a limit to reducing the small holes of the porous body window 108. For this reason, when the outer dimension of the object to be plated becomes extremely small, the object to be plated may be caught in the small holes of the porous body window 108. In particular, in the case of a chip-type electronic component whose progress in miniaturization is remarkable, such as a multilayer ceramic capacitor, the outer dimensions of the object to be plated are becoming extremely small. In the case of such an ultra-small chip-type electronic component, if an object to be plated is caught in a small hole in the porous body window 108 during the plating process, the desired plating process cannot be performed. As a result, defective plating products are mixed in non-defective products, which may reduce the product yield.

  The present invention has been made in view of such circumstances, and has a compact configuration and can perform a desired plating process even on an extremely minute object to be plated. It is an object of the present invention to provide a rotary plating apparatus capable of suppressing the mixing of non-defective products in the non-defective products as much as possible, and a plating method using the plating apparatus.

  In order to achieve the above object, a plating apparatus according to the present invention accommodates an object to be plated and a plating solution in a plating process chamber, and uses the centrifugal force generated by rotating the plating process chamber to plate the object to be plated. A plating apparatus for performing a treatment, wherein the plating treatment chamber has an opening at the top and a rotating body provided with a first electrode on an outer peripheral portion, and a cylindrical member disposed at a rotation center of the rotating body And overflow means for causing the plating solution to overflow with respect to the tubular member and for allowing the plating solution to flow into the tubular member, and the tube. And a circulating means for circulating the plating solution from the opening to the plating chamber through the opening.

  In the plating apparatus of the present invention, the rotating body includes a rotating body main body and a bottom plate that supports the rotating body main body, and the first electrode is interposed between the rotating body main body and the bottom plate. It is preferable.

  Furthermore, in the plating apparatus of the present invention, it is preferable that the bottom plate is connected to a drive system, and the plating chamber is rotationally driven via the bottom plate.

  Further, in the plating apparatus of the present invention, the circulation means includes a container for receiving the plating solution flowing into the cylindrical member, a circulation pipe connected to the container, and a circulation pump interposed in the circulation pipe. It is preferable to have.

  Further, in the plating apparatus of the present invention, the object to be plated is a chip-type component in which an electrode part is formed on the surface of a component element body, and energizes between the first electrode and the second electrode, It is preferable that the rotating body repeats rotation and stop to form a plating film on the surface of the electrode part.

  Further, the plating method according to the present invention is a plating method in which an object to be plated and a plating solution are accommodated in a plating treatment chamber, and a centrifugal force generated by rotating the plating treatment chamber is used to perform the plating treatment on the object to be plated. In the above, the first electrode is provided on the outer periphery of the rotating body having an opening on the upper side, the cylindrical member is disposed at the rotation center of the rotating body, and the second electrode is disposed inside the rotating body, A current is applied between the first electrode and the second electrode, and the plating object is plated while the rotating body repeatedly rotates and stops, while the plating solution supplied to the plating chamber is the tube. The plating solution overflows the cylindrical member so as to flow into the cylindrical member, the overflowed plating solution is recirculated to the opening of the rotating body, and the plating solution is circulated.

  In the plating method of the present invention, it is preferable that the object to be plated is a chip-type component in which an electrode part is formed on the surface of a component body, and a plating film is formed on the surface of the electrode part.

  According to the plating apparatus and the plating method of the present invention, the plating chamber has a rotating body having an opening at the top and the first electrode provided on the outer peripheral portion, and a cylinder disposed at the rotation center of the rotating body. And a second electrode disposed inside the rotating body, and there are no porous small holes through which only the plating solution is allowed to pass. Even if it exists, the desired plating process using centrifugal force can be performed without the object to be plated being caught on the inner wall or the like of the rotating body, and the occurrence of defective plating can be suppressed.

  In addition, since the plating solution is circulated by overflowing the cylindrical member, it is possible to collect defective plating products, dust, and other suspended matters floating on the surface of the plating solution. It is possible to prevent the product from being mixed into the product.

  Further, when the metal ions in the plating solution are gradually reduced by the plating treatment, the desired plating treatment can be ensured by increasing the circulation flow rate of the plating solution.

  In addition, as described above, the outer peripheral portion of the rotating body is not provided with a porous small hole that allows only the plating solution to pass therethrough, so that the plating solution does not scatter to the outside of the rotating body. A large container covering the container becomes unnecessary. In addition, since the plating solution is circulated through the cylindrical member, the apparatus can be made compact.

  Further, the plating treatment is usually performed in a state where the plating solution is heated to a constant temperature. However, since the plating solution does not scatter to the outside of the rotating body as described above, the temperature change of the plating temperature hardly occurs. Therefore, even when the plating solution needs to be heated, it is possible to suppress the increase in energy cost due to the temperature change as much as possible.

It is a schematic block diagram which shows one Embodiment of the plating apparatus which concerns on this invention. It is a front view which shows an example of the to-be-plated object provided to the said plating apparatus. It is a schematic block diagram which shows other embodiment of the plating apparatus which concerns on this invention. It is a schematic block diagram which shows an example of the conventional plating apparatus.

  Next, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic configuration diagram showing an embodiment of a plating apparatus according to the present invention.

  That is, this plating apparatus includes a plating processing chamber 4 that accommodates an object to be plated 1 and a plating solution 2 and a cylindrical member 3 is arranged at the center of rotation, a drive system 5 that rotationally drives the plating processing chamber 4, and plating. Overflow means 6 for overflowing the liquid 2 with respect to the cylindrical member 3 and allowing the plating liquid 2 to flow into the cylindrical member 3, and the plating liquid 2 flowing into the cylindrical member 3 is returned to the plating treatment chamber 4 for plating. Circulating means 7 for circulating the liquid 2 is provided.

  Specifically, the plating chamber 4 is positioned at the center of rotation in which the rotating body 11 having the opening 8 at the top and the cathode (first electrode) 10 provided on the outer periphery and the through hole 12 are formed. The above-described cylindrical member 3 and an anode (second electrode) 13 that is disposed inside the rotating body 11 and is loosely fitted to the cylindrical member 3 are provided.

  Furthermore, in this embodiment, the rotating body 11 includes a rotating body main body 15 having an outer frame formed in an inclined shape and a flange 14 formed on the outer periphery of the lower end, and supports the rotating body main body 15 and a cylindrical member. 3 and a disc-shaped bottom plate 16 that rotates integrally with the cylindrical member 3, and the cathode 10 is disposed between the flange 14 of the rotating body 15 and the outer periphery of the bottom plate 16. Is intervened. Thus, in the present invention, the rotating body 11 has the cathode 10 interposed between the rotating body main body 15 and the bottom plate 16, and accordingly, the outer periphery of the rotating body 11 has small holes made of a porous material or the like. Does not exist.

  The drive system 5 includes a first pulley 17 fixed to the bottom plate 16, a drive motor 18 that can rotate in the forward direction (clockwise) and the reverse direction (counterclockwise), and a rotation shaft of the drive motor 18. A second pulley 19 fixed to 18 a and a conductive belt 20 suspended between the first pulley 17 and the second pulley 19 are provided. The bottom plate 16 fixed to the first pulley 17 is configured to rotate by driving a drive motor 18, thereby rotating the rotator 11.

  The overflow means 6 is a cylindrical member in the plating treatment chamber 4 so that the plating solution 2 supplied to the plating treatment chamber 4 overflows the tubular member 3 as shown by a broken line in the figure. A height of 3 is set. That is, when the plating solution 2 supplied to the plating chamber 4 is filled and the level of the plating solution 2 exceeds the upper end of the cylindrical member 3, the plating solution 2 overflows with respect to the cylindrical member 3. It is configured to flow into the tubular member 3.

  In addition, the circulation means 7 appropriately replenishes the plating solution 2 and receives the plating solution flowing into the cylindrical member 3, and the base end is connected to the container 21 and the tip is the opening of the rotating body 15. A circulation pipe 22 disposed in the section 8 and a circulation pump 23 interposed in the circulation pipe 22 are provided.

  FIG. 2 is a front view showing an example of an object to be plated used in the plating apparatus.

  The workpiece 1 is composed of a component body 24 made of a ceramic material in which a large number of internal electrodes are embedded in parallel, and a conductive material such as Cu and Ag formed at both ends of the component body 24. It has external electrodes 25a and 25b, and is an ultra-small chip-type component having an outer diameter of, for example, length: 0.6 mm, width: 0.3 mm, and thickness: 0.3 mm.

  In the plating apparatus, the object to be plated 1 is plated as follows.

  First, a large number of objects to be plated 1 are put into the plating chamber 4 and the pump 23 is driven to rotate the plating solution 2 such as Ni plating solution stored in the container 21 from the opening 8 through the circulation pipe 22. Supply to the inside of the body 11. As described above, when the plating solution 2 fills the inside of the rotating body 11 and the liquid level of the plating solution 2 exceeds the upper end of the cylindrical member 3, the plating solution 2 overflows the cylindrical member 3. It flows into the cylindrical member 3. Then, the plating solution 2 that has flowed into the cylindrical member 3 is returned to the inside of the rotating body 11 through the circulation means 7.

  Next, while energizing between the anode 13 and the cathode 10, the motor 18 is rotationally driven in the forward direction, and the rotating body 11 is driven at a predetermined rotational speed (for example, 200 rpm) for a predetermined time (for example, 10 seconds). As a result, the object to be plated 1 is pressed against the cathode 10 by the centrifugal force of the rotating body 11, and a plating layer is formed on the external electrode (for example, the external electrode 25 a) of the object to be plated 1 facing the anode 13.

  Next, the rotation drive of the motor 18 is stopped for a predetermined time (for example, 0.5 seconds). As a result, the object to be plated 1 flows down onto the bottom plate 16 by being dragged by the action of gravity and the inertia of the plating solution 2, and the object to be plated 1 is mixed in the plating solution 2.

  Next, the motor 18 is rotationally driven in the reverse direction, and the rotating body 11 is driven at a predetermined rotational speed (for example, 200 rpm) for a predetermined time (for example, 10 seconds). As a result, the object to be plated 1 is again pressed against the cathode 10 by the centrifugal force of the rotating body 11, and a plating layer is formed on another external electrode (for example, the external electrode 25b) of the object to be plated 1 facing the anode 13. The

  As described above, by repeating the forward rotation → stop → reverse rotation → stop... Operation on the rotating body 11, a desired plating film is formed on the external electrodes 25 a and 25 b of the workpiece 1 existing in the rotating body 11. It is formed.

  And in this Embodiment, the plating process chamber 4 has the opening part 8 above, and the rotary body 11 in which the cathode 10 was provided in the outer peripheral part, and the cylindrical member distribute | arranged to the rotation center of this rotary body 11 3 and the anode 13 disposed inside the rotating body 11, and there are no porous small holes through which only the plating solution 2 is allowed to pass, so that the object to be plated 1 is very small. Even if it exists, this to-be-plated object 1 is not caught on the inner wall etc. of the rotary body 11, and the desired plating process using a centrifugal force can be performed, and generation | occurrence | production of a plating defect can be suppressed.

  In addition, since the plating solution 2 overflows and circulates with respect to the cylindrical member 3, it is possible to collect defective plating products floating on the surface of the plating solution 2, and suspended matters such as dust and moss, These floating substances can be prevented from being mixed into the product.

  Further, when metal ions (for example, Ni ions) in the plating solution 2 are gradually reduced by the plating treatment, the desired plating treatment can be ensured by increasing the circulation flow rate of the plating solution 2.

  Further, as described above, the outer periphery of the rotating body 11 is not provided with a porous small hole that allows only the plating solution 2 to pass therethrough, so that the plating solution 2 is not scattered outside the rotating body 11. A large container covering the rotating body 11 becomes unnecessary. In addition, since the plating solution 2 is circulated through the cylindrical member 3, the apparatus can be made compact.

  In addition, the plating treatment is normally performed in a state where the plating solution 2 is heated to a constant temperature (for example, 60 ° C.). However, as described above, the plating solution 2 does not scatter to the outside of the rotating body 11. It is difficult for temperature changes to occur. Therefore, even when the plating solution needs to be heated, it is possible to suppress the increase in energy cost due to the temperature change as much as possible.

  The present invention is not limited to the above embodiment. For example, the drive system 5 is also provided with a first gear 26 and a second gear 27, as shown in FIG. The plating apparatus may be configured to transmit.

  In addition, the shape of the rotating body 15 is also inclined in order to facilitate the recovery of the plated product after the plating process, but the embodiment is not limited to this. Needless to say, for example, the rotating body 15 may be formed in a cylindrical shape and a guide member may be provided therein.

  Further, in the above embodiment, the micro ceramic component for the multilayer ceramic capacitor is exemplified as the object to be plated, but it can be applied to other chip type electronic components such as a piezoelectric component and a coil component as well. Nor.

  In addition, since the present invention eliminates restrictions on the external dimensions, chip-type components are particularly useful as objects to be plated. However, when a porous material is used, the plating process is performed on fine particles that easily clog small holes. Is also useful.

  Even when the object to be plated is minute, a plating apparatus capable of suppressing the occurrence of defective products is realized.

DESCRIPTION OF SYMBOLS 1 To-be-plated object 2 Plating solution 3 Cylindrical member 4 Plating process chamber 5 Drive system 6 Overflow means 7 Circulating means 8 Opening part 10 Cathode (1st electrode)
11 Rotating body 13 Anode (second electrode)
15 Rotating body 16 Bottom plate 21 Container 22 Circulation pipe 23 Circulation pump

Claims (7)

A plating apparatus for storing a plating object and a plating solution in a plating treatment chamber, using a centrifugal force generated by rotating the plating treatment chamber, and performing a plating treatment on the plating object,
The plating chamber has an opening at the top and a rotating body provided with a first electrode on the outer periphery, a cylindrical member disposed at the center of rotation of the rotating body, and an interior of the rotating body. A second electrode formed,
Overflow means for causing the plating solution to overflow with respect to the tubular member, and for allowing the plating solution to flow into the tubular member;
A plating apparatus comprising: circulating means for circulating the plating solution through which the plating solution that has flowed into the cylindrical member flows back to the plating treatment chamber from the opening.   The rotating body includes a rotating body main body and a bottom plate that supports the rotating body main body, and the first electrode is interposed between the rotating body main body and the bottom plate. 1. The plating apparatus according to 1.   The plating apparatus according to claim 1, wherein the bottom plate is connected to a drive system, and the plating processing chamber is rotationally driven through the bottom plate.   The circulation means includes a container for receiving the plating solution flowing into the cylindrical member, a circulation pipe connected to the container, and a circulation pump interposed in the circulation pipe. The plating apparatus according to any one of claims 1 to 3.   The object to be plated is a chip-type component in which an electrode part is formed on the surface of a component element body. While the current is passed between the first electrode and the second electrode, the rotating body rotates and stops. The plating apparatus according to any one of claims 1 to 4, wherein a plating film is repeatedly formed on the surface of the electrode portion. In a plating method for containing a plating object and a plating solution in a plating treatment chamber, using a centrifugal force generated by rotating the plating treatment chamber, and performing a plating treatment on the plating object,
A first electrode is provided on the outer periphery of the rotating body having an opening above, a cylindrical member is disposed at the rotation center of the rotating body, and a second electrode is disposed inside the rotating body,
While energizing between the first electrode and the second electrode, while the rotating body repeats rotation and stop, the plating object is plated, while the plating solution supplied to the plating chamber is The plating solution overflows the cylindrical member so as to flow into the cylindrical member, the overflowed plating solution is returned to the opening of the rotating body, and the plating solution is circulated. Plating method to do.   The plating method according to claim 6, wherein the object to be plated is a chip-type component in which an electrode part is formed on a surface of a component element body, and a plating film is formed on the surface of the electrode part.

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