KR101057739B1 - Plated Barrel - Google Patents

Abstract

A plating barrel is disclosed. In a plating barrel immersed in a plating liquid and rotating, a case including a partition having an opening formed therein, a liquid collection part including a collection hole into which the plating liquid flows in accordance with the rotation of the plating barrel, and a communication port connected to the outside of the partition wall while communicating with the collection hole and the opening. The plating barrel including the portion may remove the water film formed in the hole or the mesh to circulate the plating liquid into the plating barrel, and settle the floating chip component to allow uniform plating.

Plating barrel, plating solution, circulation

Description

Plating barrel

The present invention relates to a plating barrel.

In general, in the process of manufacturing chip components such as varistors, chip inductors, and multi-layer ceramic capacitors (MLCCs), it is impossible to directly solder the terminated external electrodes. Accordingly, in order to smoothly solder, nickel (Ni) and tin (Sn) are sequentially plated by the outermost electrode, and a plating method using a plating barrel is mainly used.

Plating method using a plating barrel is a method of plating a large amount of articles, such as small chip parts at a time, by rotating the plating barrel immersed in the plating bath to frictionally polish the article and the article, while the rod of the cathode contacting the article The method of plating the article through.

In order to introduce the plating liquid into the plating barrel, it is common to form a hole in a wall or to form a part of the wall by a mesh.

However, the smaller the chip component, the smaller the size of the hole and the mesh, so that the shape of the water film is formed in the hole and the mesh. Accordingly, the plating solution does not flow smoothly into the plating barrel, thereby causing a problem that the plating is not made uniform.

In order to solve this problem, a method of forcibly circulating the plating liquid in the plating barrel and the plating tank using the pump has been proposed, but it requires a separate power and has a problem in that the configuration of the device is complicated.

In addition, due to the surface tension, a small chip component may also float in the plating barrel, thereby causing a problem in that plating is not performed.

The present invention is to provide a plating barrel for circulating the plating liquid without using a separate power.

In addition, the present invention is to provide a plating barrel for sedimenting the chip components floating in the plating barrel.

According to an aspect of the present invention, in the plating barrel that is immersed in the plating liquid to rotate,

A plating barrel including a case including an opening formed partition wall, a collecting part including a collecting port into which a plating liquid flows in accordance with rotation of the plating barrel, a collecting port, and a communicating part connected to an outside of the partition wall are provided.

At this time, it may further include a discharge part for outflowing a part of the introduced plating liquid.

In addition, it may further include a mesh to cover the opening, the body is formed.

At this time, interposed between the communication portion and the mesh, and may further include a vibration member for vibrating in contact with the mesh, the receiving portion for receiving the vibration member to prevent the vibration member from being separated.

At this time, the vibrating member may include a vibrating ball.

In addition, the receiving portion may be coupled to the vibration member and may include a wire fixed to the mesh or the partition wall.

In addition, the accommodation portion may include a separation prevention jaw to prevent the vibration member from being separated into the communication portion or the outlet.

On the other hand, the cross-sectional area of the end portion of the communication portion facing the opening may be characterized by being smaller than the cross-sectional area of the collection port.

On the other hand, the discharge portion may include a discharge path passing through the partition wall, the discharge path may be characterized in that the communication with the communication portion and the opening.

The plating solution can be circulated into the plating barrel by removing the water film formed in the hole or mesh.

In addition, it is possible to settle the floating chip component to achieve a uniform plating.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all transformations, equivalents, and substitutes included in the spirit and scope of the present invention. In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Hereinafter, a preferred embodiment of a plating barrel according to the present invention will be described in detail with reference to the accompanying drawings, in the following description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and duplicated thereto. The description will be omitted.

1 is a perspective view showing a plating barrel according to a first embodiment of the present invention, Figure 2 is a cross-sectional view showing a portion A of the plating barrel according to the first embodiment of the present invention, Figure 3 is a first embodiment of the present invention It is sectional drawing of the plating barrel which concerns on an example.

1 to 3, a case 10, a partition 12, an opening 14, a collection part 20, a collection port 22, a communication part 30, and a discharge part 40 are illustrated. have.

The plating barrel according to an embodiment of the present invention, the case 10 including a partition 12 having the opening 14 is rotated in the plating liquid, the collection port 22 into which the plating liquid flows in accordance with the rotation of the plating barrel. A water film formed in the hole or mesh 50, including a communication part 30, which communicates with the liquid collecting part 20, the liquid collecting port 22, and the opening 14, and is coupled to the outside of the partition wall 12. By removing the plating solution can be circulated into the plating barrel, it is possible to settle the floating chip components to achieve a uniform plating.

The case 10 is a place where an inner space in which plating is formed is formed. In the inner space, a plating material such as a chip component and a cathode rod serving as a negative electrode are accommodated. In addition, an opening 14 is formed in the partition 12 forming the case 10 to allow the inflow of the plating liquid. It is also connected to the rotating shaft so as to be rotatable in the plating liquid. Referring to Figure 1, the case 10 according to the present embodiment has a hexagonal columnar shape, the opening 14 is formed on each wall surface. In addition, the upper and lower surfaces of the hexagonal column is covered with a cover (not shown) and connected to the rotating shaft (not shown).

The collection part 20 collects the plating liquid when the plating barrel is rotated. To this end, when the plating barrel rotates, the plating liquid is introduced by forming a collecting port 22 facing the flow direction of the plating liquid flowing along the wall surface of the plating barrel.

Specifically, referring to FIG. 2, the liquid collecting part 20 according to the present exemplary embodiment is formed in a shape that is horizontally drilled outside of the box A positioned on the opening 14 of the case 10. Then, a collecting port 22 is formed on the surface where the plating liquid collides when the plating barrel rotates, and the plating liquid is transferred into the box through the collecting port 22.

The communication part 30 serves to send the plating liquid introduced through the collection part 20 to the opening 14 formed in the case 10. To this end, the communication portion 30 communicates the reservoir 22 and the opening 14. As a result, the plating liquid flows toward the opening 14 via the liquid collecting portion 20 by rotation in the plating barrel. The communication part 30 according to the present embodiment is formed by drilling a vertical direction in the opening 14 so as to communicate with the collection part 20 and the opening 14 which are horizontally drilled.

In the plating barrel according to the present embodiment, the plating liquid flows toward the opening 14 using the rotation of the plating barrel, thereby impacting the water film formed in the opening 14. Accordingly, the water film formed in the opening 14 may be broken to allow the plating liquid to flow into the plating barrel.

3, as the plating barrel rotates, the collection part 20 and the communication part 30 may be exposed out of the plating solution. At this time, since the plating liquid is filled in the liquid collecting portion 20 and the communicating portion 30, the plating liquid flows into the plating barrel through the opening 14 located below. As a result, the plating liquid is poured onto the chip component floating inside the plating barrel, and the chip component is settled. Therefore, the phenomenon that the floating chip component is not plated can be prevented.

On the other hand, the plating barrel may further include a discharge portion 40 for discharging a portion of the plating liquid introduced through the collection portion 20 and the communication portion 30. When only a part of the plating liquid discharged toward the opening 14 through the communication unit 30 flows into the opening 14 and the remainder remains in the communication unit 30, the flow of the plating liquid is stagnated. As a result, the flow of the plating liquid may be weakened. In order to prevent such a phenomenon, the discharge part 40 may be formed at a point where the communication part 30 and the opening 14 meet to allow the plating liquid to continuously flow.

2, the discharge portion 40 according to the present embodiment is formed in the collection port 22 and the support piece, the plating liquid introduced from the collection port 22 meets the opening 14, and later through the discharge port It is formed to fall naturally.

In addition, the discharge part 40 can be formed through the inside of the partition 12 so that it may communicate with the communication part 30 and the opening 14, as shown to FIG.

4 is a cross-sectional view showing a plating barrel according to a second embodiment of the present invention, Figure 5 is a cross-sectional view showing a plating barrel according to a third embodiment of the present invention, Figure 6 is a second embodiment of the present invention This is a cutaway view showing the outlet of the plating barrel.

4 to 6, the case 10, the partition 12, the opening 14, the collection part 20, the collection port 22, the communication part 30, the discharge part 40, and the mesh ( 50, the vibrating member 60, the receiving portion 70, the wire 72, the departure stop 74 is shown.

The second and third embodiments of the invention further comprise a mesh 50 covering the opening 14 portion. In addition, the collection port 22 and the communication portion 30 is integrated, and is formed in a funnel shape in order to increase the efficiency of the collection.

The mesh 50 covers the opening 14 with a mesh in which the body is formed. The smaller the chip component is, the more likely it is to be caught or disengaged from the opening 14, so that the opening 14 is covered with a mesh 50 having a finer body.

On the other hand, the liquid collection port 22 and the communication portion 30 are integrated, and the cross-sectional area of the communication portion end portion 32 facing the opening 14 is formed smaller than the cross-sectional area of the collection port 22 to face the opening 14. Can increase the flow rate. Covering the opening 14 with a small mesh 50 of the body increases the likelihood of water film generation. Therefore, the flow rate of the plating liquid is improved to apply a large impact to the water film.

In addition, interposed between the communication portion 30 and the mesh 50, the vibration member 60 for vibrating in contact with the mesh 50, and accommodates the vibration member 60 to prevent separation of the vibration member 60 It may further include a receiving portion 70. When the opening 14 is covered with the mesh 50, and it is difficult to break the water film, a further impact may be applied to the water film by further adding a vibration member 60 having the mesh 50. And, by installing the receiving portion 70, it is possible to prevent the vibrating member 60 from being separated through the communication portion 30 or the discharge portion (40).

To this end, as shown in Figure 4, in the second embodiment of the present invention uses a vibrating ball as the vibration member 60 having a mesh (50). In addition, using a wire 72 is coupled to the vibration ball and fixed to the mesh 50, to prevent the separation of the vibration ball. Accordingly, the vibrating ball is moved while the plating liquid flows. At this time, since the vibrating ball is in contact with the mesh 50, the oscillating ball vibrates the mesh 50 while moving by the plating liquid, thereby destroying the water film of the mesh 50.

In addition, as shown in Figure 5, in the third embodiment of the present invention can form a space for accommodating the vibration ball can prevent the separation of the vibration ball. To this end, the vibration preventing member 60 may be provided with a departure preventing jaw 74 to prevent the falling into the communication portion 30 or the discharge portion 40. Accordingly, the inlet of the communication unit 30 or the discharge unit 40 is formed smaller than the width of the vibration member 60, it is possible to prevent the vibration member 60 from being separated.

On the other hand, as described above, in the second and third embodiments of the present invention, the discharge portion 40 is formed through the inside of the partition wall 12 so as to communicate with the communication portion 30 and the opening 14. Form. Referring to FIG. 6, the introduced plating liquid flows along the discharge part 40 penetrating the partition 12. At this time, when the collection port 22 is obtained as the plating liquid from the outside of the plating liquid, the air introduced in the same manner also moves along the discharge portion 40. However, the introduced air reciprocates between the opening 14 and the discharge part 40 in accordance with the rotation of the plating barrel. This is because when the plating barrel is rotated so that the opening 14 is positioned higher than the discharge portion 40, the air flows back to the opening 14 due to the buoyancy due to the flow of the plating liquid. At this time, since the air impacts the opening 14, the mesh 50, and the vibrating member 60, air serves to destroy the water film formed in the opening 14 or the mesh 50.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It will be understood that the invention may be varied and varied without departing from the scope of the invention.

Many embodiments other than the above-described embodiments are within the scope of the claims of the present invention.

1 is a perspective view showing a plating barrel according to a first embodiment of the present invention.

2 is a sectional view showing a portion A of the plating barrel according to the first embodiment of the present invention.

3 is a sectional view showing a plating barrel according to the first embodiment of the present invention.

4 is a cross-sectional view showing a plating barrel according to a second embodiment of the present invention.

5 is a cross-sectional view showing a plating barrel according to a third embodiment of the present invention.

Figure 6 is a cutaway view showing the discharge portion of the plating barrel according to the second embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10: case 12: bulkhead

14: opening 20: liquid collection part

22: collection hole 30: communication unit

40: discharge part 50: mesh

60: vibration member 70: receiving portion

72: wire 74: release bump

80: air

Claims (9)

In the plating barrel which is immersed in the plating liquid and rotates, A case including an inner space in which plating is formed and including a partition wall having an opening opened into the inner space; A mesh covering the opening, the mesh being formed; A liquid collecting part including a liquid collecting port disposed on an outer side of the partition wall so as to face a flow direction of a plating liquid when the plating barrel is rotated and into which the plating liquid is introduced; A communication unit coupled to an outer side of the partition wall and forming a path for communicating the collection port and the opening; A vibration member interposed between the communicating portion and the mesh and vibrating in contact with the mesh; And Plating barrel including a receiving portion for receiving the vibration member to prevent separation of the vibration member. The method of claim 1, Plating barrel further comprises a discharge portion for outflowing a portion of the introduced plating liquid. delete delete The method of claim 1, The vibrating member is plated barrel, characterized in that it comprises a vibrating ball. The method of claim 1, The receiving portion, Plating barrel coupled to the vibration member, comprising a wire fixed to the mesh or the partition. The method of claim 1, The receiving portion, Plating barrel, characterized in that it comprises a separation prevention jaw to prevent the vibration member is separated from the communication portion. The method of claim 1, The cross-sectional area of the end portion of the communication portion facing the opening is smaller than the cross-sectional area of the collection port. The method of claim 2, The discharge portion, And a discharge path passing through the partition wall, wherein the discharge path communicates with the communication part and the opening.

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