JP4875728B2 - Barrel for plating - Google Patents

Description

  The present invention relates to a plating barrel.

  Usually, in the process of manufacturing a chip component such as a varistor, a chip inductor, a multilayer ceramic capacitor (capacitor) (Multi Layer Ceramic Capacitor, MLCC), an external electrode that has undergone termination processing is immediately applied to the external electrode. It cannot be soldered. Therefore, in order to facilitate soldering, nickel (Ni) and tin (Sn) are sequentially plated to form the outermost electrode. At this time, a plating method using a plating barrel is mainly used. Yes.

The plating method using a barrel for plating is a method of plating a small amount of small parts such as chip parts at a time, and frictionally polishing the small parts with each other by rotating the plating barrel immersed in the plating tank. In this method, the small objects are plated by a cathode bar that comes into contact with the small objects.

  In such a plating barrel, a hole is usually formed in the wall surface, or a part of the wall surface is configured with a mesh so that the plating solution flows into the barrel.

  However, the smaller the chip component, the smaller the size of the hole and mesh, and a water film may be formed in the hole and mesh. As a result, the plating solution did not flow smoothly into the plating barrel, resulting in uneven plating.

  In order to solve such a problem, a method of forcibly circulating the plating solution inside the plating barrel and the plating solution in the plating tank using a pump has been proposed. There was a problem that became complicated.

  In addition, the small chip component may float inside the plating barrel due to surface tension and may not be plated.

  In view of the problems of the prior art, an object of the present invention is to provide a plating barrel that circulates a plating solution without using separate power.

  Another object of the present invention is to provide a plating barrel for sinking chip components floating inside the plating barrel.

In one embodiment of the present invention, a plating barrel that is rotated by being immersed in a plating solution, and includes a case having a partition wall in which an opening is formed, and a liquid collection port through which the plating solution flows by rotation of the plating barrel There is provided a plating barrel including a liquid collecting portion including a communicating portion that communicates with the liquid collecting port and the opening and is coupled to the outside of the partition wall.

  Here, it may further include a discharge part for discharging a part of the plating solution that has flowed in.

  Further, it may further include a mesh that covers the opening and is formed in a mesh shape.

  A vibration member that is interposed between the communication portion and the mesh and vibrates in contact with the mesh, and a housing portion that houses the vibration member and prevents the vibration member from being detached can be further included.

  Here, the vibration member may include a vibration ball.

  The accommodating portion may include a wire coupled to the vibration member and fixed to the mesh or the partition wall.

  In addition, the housing part can include a stopper for preventing separation that prevents the vibration member from separating through the communication part or the discharge part.

  On the other hand, the cross-sectional area of the end of the communication part facing the opening may be smaller than the cross-sectional area of the liquid collection port.

  The discharge part includes a discharge path penetrating the inside of the partition wall, and the discharge path can communicate with the communication part and the opening.

  According to the embodiment of the present invention, it is possible to remove the water film formed in the holes or the mesh and circulate the plating liquid inside the plating barrel, and to settle the floating chip parts and perform uniform plating. Can be made.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

1 is a perspective view showing a plating barrel according to an embodiment of the present invention. It is sectional drawing of the box A of the barrel for plating by one Example of this invention. It is sectional drawing which shows the barrel for plating by one Example of this invention. It is sectional drawing which shows the barrel for plating by the other Example of this invention. FIG. 6 is a cross-sectional view illustrating a plating barrel according to still another embodiment of the present invention. It is an incision view showing a discharge part of a plating barrel according to another embodiment of the present invention.

  The present invention can be modified in various ways and have various embodiments. In this application, specific embodiments are illustrated in the drawings and described in detail. However, this is not to limit the invention to the specific embodiments, and the invention should be understood as including all modifications, equivalents and alternatives that fall within the spirit and scope of the invention. . In describing the present invention, when it is determined that the specific description of the known technology is not clear, the detailed description thereof will be omitted.

  Terms including ordinal numbers such as “first”, “second”, etc. are only used to describe various components, and the components are not limited by these terms. These terms are only used to distinguish one component from another.

  The terms used in the present application are merely used to describe particular embodiments, and are not intended to limit the present invention. A singular expression includes the plural unless specifically stated otherwise in the sentence. In this application, terms such as “comprising” or “having” specify the presence of a feature, number, step, action, component, part, or combination thereof described in the specification, and It should be understood that the existence or additional possibilities of one or more other features or numbers, steps, operations, components, parts, or combinations thereof are not excluded in advance.

  Hereinafter, exemplary embodiments of a plating barrel according to the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, the same or corresponding components are denoted by the same reference numerals, and redundant description thereof will be omitted.

  FIG. 1 is a perspective view showing a plating barrel according to an embodiment of the present invention, FIG. 2 is a sectional view of a box A of the plating barrel according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. It is sectional drawing which shows the barrel for plating by an example.

  1 to 3, a case 10, a partition wall 12, an opening 14, a liquid collection part 20, a liquid collection port 22, a communication part 30, and a discharge part 40 are shown.

A plating barrel according to an embodiment of the present invention is rotated by being immersed in a plating solution, and the plating solution is formed by rotation of the case 10 having a partition wall 12 in which an opening 14 is formed and the plating barrel. A fluid collection part 20 having a fluid collection port 22 that flows in, and a communication part 30 that communicates with the fluid collection port 22 and the opening 14 and is coupled to the outside of the partition wall 12. The plating film can be circulated inside the plating barrel by removing the water film, and the floating chip parts can be allowed to settle so that uniform plating can be performed.

The case 10 forms an internal space where plating is performed. The internal space accommodates an object to be plated such as a chip part and a cathode bar serving as a negative electrode. In addition, an opening 14 into which the plating solution flows is formed in the partition wall 12 forming the case 10. Furthermore, it is connected to a rotating shaft (not shown) so that it can be immersed in the plating solution and rotated. Referring to FIG. 1, the case 10 according to this embodiment has a hexagonal column shape, and an opening 14 is formed on each wall surface. Further, the upper and lower surfaces of the hexagonal column are covered with a lid (not shown) and connected to the rotating shaft.

  The liquid collection unit 20 serves to collect the plating liquid when the plating barrel rotates. For this reason, when the plating barrel rotates, the plating solution can be made to flow by forming the liquid collection port 22 facing the flow direction of the plating solution flowing along the wall surface of the plating barrel.

  Specifically, referring to FIG. 2, the liquid collection unit 20 according to the present embodiment is formed in a form that is horizontally opened from the outside of the box A provided on the opening 14 of the case 10. Therefore, when the plating barrel rotates, a liquid collection port 22 is formed on the surface of the box A facing the flow of the plating solution, and the plating solution flows into the box A through the liquid collection port 22. .

  The communication part 30 serves to send the plating solution flowing in through the liquid collecting part 20 to the opening 14 formed in the case 10. That is, the communication part 30 makes the liquid collection port 22 and the opening 14 communicate. As a result, when the plating barrel rotates, the plating solution flows toward the opening 14 via the liquid collecting portion 20. The communication part 30 according to the present embodiment is formed vertically from the opening 14 in order to connect the liquid collection part 20 opened horizontally and the opening 14.

  The plating barrel according to this embodiment applies a shock to the water film formed in the opening 14 by using the rotation of the plating barrel so that the plating solution flows toward the opening 14. Thereby, the water film formed in the opening 14 is broken, and the plating solution can flow into the plating barrel.

  Further, referring to FIG. 3, the liquid collection part 20 and the communication part 30 are exposed to the outside of the plating liquid by the rotation of the plating barrel. In this case, the plating solution filled in the liquid collection unit 20 and the communication unit 30 flows into the inside of the plating barrel through the opening 14 located on the lower side. As a result, the plating solution is poured onto the chip component floating inside the plating barrel, and the chip component sinks. In this way, it is possible to prevent floating chip components from being plated.

  On the other hand, the plating barrel may further include a discharge portion 40 that flows out a part of the plating solution that has flowed in via the liquid collection portion 20 and the communication portion 30. If only a part of the plating solution discharged from the communication portion 30 toward the opening 14 flows into the opening 14 and the rest remains in the communication portion 30, the flow of the plating solution stagnates. Flow may be weak. In order to prevent this, the discharge part 40 can be provided at a point where the communication part 30 and the opening 14 are in contact with each other, so that the plating solution can continue to flow.

  Referring to FIG. 2, the discharge unit 40 according to the present embodiment is formed on the opposite side of the liquid collection port 22, and the plating solution flowing from the liquid collection port 22 flows toward the opening 14, and then naturally flows through the discharge unit 40. It is provided to be discharged.

  However, the present invention is not limited to this, and the discharge part 40 can also be provided through the inside of the partition wall 12 so as to communicate with the communication part 30 and the opening 14 as shown in FIGS. 4 to 6.

  4 is a sectional view showing a plating barrel according to another embodiment of the present invention, FIG. 5 is a sectional view showing a plating barrel according to still another embodiment of the present invention, and FIG. It is an incision figure which shows the discharge part of the barrel for plating by the Example of.

  4 to 6, the case 10, the partition 12, the opening 14, the liquid collection part 20, the liquid collection port 22, the communication part 30, the discharge part 40, the mesh 50, the vibration member 60, the accommodation part 70, the wire 72, And a stopper 74 for preventing separation is shown.

  According to other and further embodiments of the present invention, a mesh 50 covering the opening 14 is further included. Further, the liquid collection port 22 and the communication part 30 are integrated and formed in a funnel shape in order to increase the efficiency of liquid collection.

  The mesh 50 is a net formed in a mesh shape and covers the opening 14. The smaller the chip component is, the higher the possibility of being caught or detached from the opening 14, so that the opening 14 is covered with a fine mesh 50.

  On the other hand, the liquid collection port 22 and the communication portion 30 are integrated, and the cross-sectional area of the communication portion end 32 facing the opening 14 is formed smaller than the cross-sectional area of the liquid collection port 22 to increase the flow rate of the plating solution toward the opening 14. be able to. This is because the possibility that a water film is formed by covering the opening 14 with the fine mesh 50 increases the flow rate of the plating solution in order to give a large impact to the water film.

  Further, a vibration member 60 that is interposed between the communication portion 30 and the mesh 50 and vibrates in contact with the mesh 50, and a housing portion 70 that houses the vibration member 60 so as to prevent the vibration member 60 from being detached are further provided. Can be included. Thereby, when it becomes difficult to remove the water film by covering the opening 14 with the mesh 50, the impact applied to the water film can be further increased by further including the vibrating member 60 that vibrates the mesh 50. In addition, by providing the accommodation portion 70, it is possible to prevent the vibration member 60 from being detached through the communication portion 30 or the discharge portion 40.

  For this reason, as shown in FIG. 4, in another embodiment of the present invention, a vibrating ball is used as the vibrating member 60 for vibrating the mesh 50. Further, the wire 72 coupled to the vibration ball and fixed to the mesh 50 can be used to prevent the vibration ball from being detached. In this way, when the plating solution flows, the vibrating ball moves and the vibrating ball is in contact with the mesh 50. Therefore, the mesh 50 is vibrated while moving with the plating solution, and the water film of the mesh 50 is destroyed. To do.

  Further, as shown in FIG. 5, in yet another embodiment of the present invention, a space for accommodating the vibrating ball can be formed to prevent the vibrating ball from being detached. For this purpose, it is possible to provide a stopper 74 for preventing the vibration member 60 from separating through the communication part 30 or the discharge part 40. Thereby, the entrance of the communication part 30 or the discharge part 40 is formed smaller than the width of the vibration member 60, and the separation of the vibration member 60 can be prevented.

  On the other hand, as described above, in another embodiment and still another embodiment of the present invention, the discharge portion 40 penetrating the inside of the partition wall 12 is provided so as to communicate with the communication portion 30 and the opening 14. Referring to FIG. 6, the plating solution that has flowed through the discharge portion 40 that penetrates the partition wall 12 flows. At this time, the air 80 that has flowed in when the liquid collection port 22 is immersed in the plating solution from the outside of the plating solution also flows through the discharge portion 40. However, the inflowing air 80 reciprocates between the opening 14 and the discharge portion 40 by the rotation of the plating barrel. This is because when the plating barrel rotates and the position of the opening 14 becomes higher than the position of the discharge portion 40, the air 80 moves toward the opening 14 against the flow of the plating solution by buoyancy. At this time, the air 80 impacts the opening 14, the mesh 50, and the vibration member 60, and plays a role of destroying a water film formed on the opening 14 or the mesh 50.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operation, procedure, step, and process in the apparatus and method shown in the claims, the description, and the drawings is clearly indicated as “before”, “prior”, etc. It should be noted that, unless the output of the previous process is used in the subsequent process, it can be realized in any order. Even if the operation flow in the claims, the description, and the drawings is described using “first,” “next,” etc. for the sake of convenience, it means that it is essential to carry out in this order. It is not a thing.

10 Case 12 Partition 14 Opening 20 Liquid Collecting Portion 22 Liquid Collecting Port 30 Communication Portion 40 Discharge Portion 50 Mesh 60 Vibrating Member 70 Housing Portion 72 Wire 74 Detaching Prevention Stopper 80 Air

Claims (7)

A barrel for plating which is immersed in the plating solution and rotates,
A case with a partition wall in which an opening is formed;
A liquid collection part having a liquid collection port through which the plating solution flows by rotation of the plating barrel;
A communication portion connected to the outside of the partition wall, which communicates the liquid collection port and the opening;
A discharge part for discharging a part of the flowing plating solution,
The discharge part is
A plating barrel comprising a discharge path penetrating through the partition wall, wherein the discharge path communicates with the communication portion and the opening .   The plating barrel according to claim 1, further comprising a mesh formed in a mesh shape covering the opening. A vibration member that is interposed between the communication portion and the mesh and vibrates in contact with the mesh;
An accommodating portion for accommodating the vibration member to prevent the vibration member from being detached;
The plating barrel according to claim 2 , further comprising: The plating barrel according to claim 3 , wherein the vibration member includes a vibration ball. The accommodating portion is
The plating barrel according to claim 3 , further comprising a wire coupled to the vibration member and fixed to the mesh or the partition wall. The accommodating portion is
4. The plating barrel according to claim 3 , further comprising a separation preventing stopper that prevents the vibration member from separating through the communication portion or the discharge portion.   2. The plating barrel according to claim 1, wherein a cross-sectional area of the end of the communication portion facing the opening is smaller than a cross-sectional area of the liquid collection port.

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