JP7193140B2 - Vertical holding type plating machine - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus that can be suitably used for plating one side of an object to be processed, such as a disk-shaped semiconductor substrate (wafer).

Recently, as a plating apparatus, when forming a plating film on one side of a disk-shaped workpiece such as a semiconductor substrate, the flatness, smoothness, film thickness, etc. of the plating film can be maintained with high precision and high quality. Various devices are being developed with the aim of doing so.
Among plating apparatuses of this type, there is one that has a processing tank in which a mounting opening slightly smaller than the plate surface size of an object to be processed is formed through one side wall (see, for example, Patent Document 1, etc.). The mounting opening of the side wall communicates the inside and outside of the tank, and during plating, the outer peripheral portion of the workpiece is pressed against the opening edge of the mounting opening so that the mounting opening can be closed. In addition, since one side of the article to be treated faces the inside of the treatment tank through the mounting port, the treatment liquid is injected into the treatment tank in this state to plate the one side of the article to be treated. It is.

Since such a plating apparatus is of a type in which an object to be processed is held in an upright state so that the plate surface is in the vertical direction, the plating apparatus of this type is referred to in this specification as a "vertical holding type." plating equipment.

Japanese Patent No. 2734269

It is also well known that as the plating process progresses, minute air bubbles and waste products are generated in the treatment bath, and that the amount of generated air bubbles and waste products tends to increase over time. In the conventional vertical holding type plating apparatus, since no countermeasures against air bubbles and wastes were taken, it is presumed that the adhesion of air bubbles and wastes to the workpiece was inevitable. Naturally, it is not suitable to cut out a product (integrated circuit chip, etc.) from a portion to which air bubbles, waste matter, etc. are adhered, so the yield of the product to be processed is reduced accordingly.

In addition, the thickness of the plating formed on the workpiece may be thicker toward the outer circumference and thinner toward the center, or conversely, thinner toward the outer circumference and thicker toward the center. It was difficult to make the film thickness uniform. Such a phenomenon in which the film thickness of the plating becomes uneven has also been a major factor in lowering the yield of processed products.
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances. It is an object of the present invention to provide a vertical holding type plating apparatus capable of increasing the yield of processed products to the utmost limit by making it possible to make the thickness of the plating film uniform.

In order to achieve the above object, the present invention takes the following measures.
That is, the vertical holding type plating apparatus according to the present invention comprises a tank body having a bottom body and a tank wall surrounding the bottom body and capable of storing a processing solution in the tank, and the peripheral wall of the tank body. an attachment/detachment device that presses a plate-shaped article to be treated from outside the tank against an assumed attachment/detachment surface on which the article to be treated is assumed to be attached and detached, and removes the article to be treated that is in the pressed state; The attachment/detachment assumed surface of is provided with a mounting opening that penetrates between the inside and outside of the tank on the inside of the opening edge while forming an opening edge that abuts on the outer peripheral portion of the plate surface of the object to be processed in a ring shape, The attachment/detachment device is characterized by having a rotation mechanism for rotating the article to be processed that is pressed toward the attachment opening of the tank main body.

It is preferable that the tank main body is provided with a rotary support that holds a portion of contact with the article to be treated that is pressed by the attachment/detachment device so as to be rotatable together with the article to be treated.
In the tank main body, a structure is adopted at a portion that rotatably holds the rotary support so as to allow leakage of the processing liquid from the inside of the tank main body to the outside of the tank. It is preferable that a leaked liquid receiver is provided for collecting the processing liquid after it has leaked.

In this case, the object to be processed is placed between the structure part of the tank body that allows the leakage of the processing liquid and the leaked liquid receiver, and the article to be processed is pressed against the opening edge of the mounting port at a position where the processing liquid comes into contact with the cathode. Conductive contacts are preferably provided for

In the vertical holding type plating apparatus according to the present invention, when an object to be processed such as a semiconductor substrate is plated, it is possible to thoroughly prevent the adhesion of air bubbles and waste materials, thereby dramatically improving flatness and smoothness. In addition, by making it possible to uniformize the plating film thickness, it is possible to maximize the yield of processed products.

1 is a side sectional view showing an embodiment of a vertical holding type plating apparatus according to the present invention; FIG. 1 is a plan view showing an embodiment of a vertical holding type plating apparatus according to the present invention; FIG. FIG. 3 is a side cross-sectional view showing a melting case;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described based on the drawings.
1 and 2 show an embodiment of a vertical holding type plating apparatus 1 according to the present invention. This vertical holding type plating apparatus 1 has a bath body 2 and an attachment/detachment device 3 . In this embodiment, the tank main body 2 and the attachment/detachment device 3 are arranged side by side via a base 5 supported by the device frame 4 .

In the following description, the case where the object to be processed is a disk-shaped semiconductor substrate (wafer) will be described.
First, the tank main body 2 will be described.
The tank main body 2 has a bottom body 10 and a rising tank wall 11 surrounding the bottom body 10, and the inside of the tank is used as a space for storing the processing liquid L. As shown in FIG. When the bottom body 10 is square in plan, the tank wall 11 has four walls 11a to 11d (see FIG. 2) arranged on the four sides of the bottom body 10. As shown in FIG. The planar shape of the bottom body 10 is not particularly limited, and therefore the number of walls is not limited.

At least one wall portion 11a of the tank wall 11 of the tank main body 2 is used as an attachment/detachment assumed surface on which the article W to be processed is attached/detached. A mounting opening 15 for the workpiece W to be processed is provided in a state of penetrating between the inside and outside of the tank main body 2 on the assumed attachment/detachment surface. Therefore, the processing liquid L cannot be stored in the tank unless the mounting port 15 is closed. For closing the mounting opening 15, the workpiece W itself is used.

Due to such circumstances, the mounting opening 15 is formed to have an opening size slightly smaller than the plate surface size of the workpiece W to be processed. Therefore, by pressing the workpiece W toward the loading opening 15 so as to form a concentric relationship, the outer peripheral portion of the workpiece W comes into contact with the opening edge of the loading opening 15 in a ring shape, and the workpiece W is removed from the loading opening 15 . Therefore, the processing liquid L can be stored in the tank main body 2 by preventing the processing liquid L from leaking.

In the present embodiment, as described above, the object to be processed W is disk-shaped, so the opening of the mounting opening 15 is also circular.
The wall portion 11a provided with the mounting opening 15 is composed of an inner frame member 17 and an outer frame member 18 which are fixed to each other in a superimposed state, and an overlapping portion between the inner frame member 17 and the outer frame member 18. It is formed with a rotary support 19 that is held in a sandwiched manner. The inner frame body 17 and the outer frame body 18 have their respective frame openings (the opening shape is circular) matched with each other.

On the other hand, the rotary support 19 has a slightly smaller central opening (the shape of the opening is circular) that communicates with the matching inner frame openings between the inner frame 17 and the outer frame 18. ) is formed. In short, an opening communicating between the inner frame 17, the outer frame 18, and the rotary support 19 is provided, and the mounting opening 15 is formed by this communicating opening.

In such a mounting opening 15, the opening edge of the rotary support 19 is provided with a portion having a shape that protrudes radially inward by being formed thinly. The contact portion 15a with the workpiece W is secured. The contact portion 15a is flush along the vertical plane (longitudinal plane) and has a circular ring shape with a uniform width in the circumferential direction. It is designed to make uniform and watertight surface contact.

The rotary support 19 is rotatably held with respect to the inner frame 17 . In order to obtain smooth rotation of the rotary support 19, this embodiment employs a structure in which the bearing balls 20 are sandwiched between the interface portions where the inner frame 17 and the rotary support 19 rub against each other. doing.
Specifically, the bearing balls 20 are fitted into at least one of the surface of the inner frame 17 facing the rotation support 19 and the surface of the rotation support 19 facing the inner frame 17, or both surfaces. A possible recess is formed.

When the recessed portion is provided only on one surface of the inner frame member 17 or the rotary support member 19, it is provided at three or more locations in the circumferential direction, or as an annular circumferential groove 21 along the opening edge of the mounting port 15. just form it. Also, it is possible to form circumferential grooves 21 of the same diameter on both surfaces of the inner frame 17 and the rotary support 19. The depth should be such that the water is submerged.

This embodiment is an example in which circumferential grooves 21 are formed on both surfaces of the inner frame body 17 and the rotation support body 19, and both circumferential grooves are formed so that a large number of bearing balls 20 are connected along the groove direction. It is sandwiched between 21.
By the way, the structural portion where the inner frame 17 rotatably holds the rotary support 19 (the portion where the bearing ball 20 is sandwiched in this embodiment) is originally structured so that the processing liquid L in the tank body 2 does not leak. should be Depending on the situation, it is better to employ a simple structure such as a structure in which the bearing balls 20 are sandwiched in the first place, and a structure having other complicated leakage prevention structure in the rotation support structure itself.

However, the present invention does not adopt a complicated leakage prevention structure. It is devised so that the efficiency of power supply to the processed product W can be improved.
Specifically, the rotary support 19 is made of a conductive material or an insulating material, and the contact portion 15a of the workpiece W to be processed and the outer peripheral surface of the rotary support 19 are appropriately electrically conductive. A structure secured by a conductive material is adopted. Then, using the circumference between the inner peripheral surface of the opening in the frame of the outer frame 18 and the outer peripheral surface of the rotary support 19 facing the inner peripheral surface and facing the outside of the tank, the object to be processed is A conducting contact 25 is provided to hold the W side to the cathode.

Further, a leaked liquid receiver 27 for collecting the leaked processing liquid L is provided on the outside of the tank main body 2 . The leaked liquid receiver 27 is arranged such that the conducting contact 25 is included in the middle of guiding the processing liquid L that has leaked out of the tank body 2 to the leaked liquid receiver 27 .
In other words, the conductive contact 25 is provided at a position where it comes into contact with the processing liquid L between the structural portion of the tank body 2 that allows the processing liquid L to leak and the leaked liquid receiving portion 27 . can say

Specifically, a drain hole 28 passing downward is formed at the lower end position of the outer frame 18 , and a leaked liquid receiver 27 is arranged below the drain hole 28 . The leaked liquid receiver 27 may have a structure for storing the recovered processing liquid L, or may have a structure for sending the processing liquid L to a circulation path (not shown) for returning the processing liquid L to the tank main body 2 .
Therefore, the processing liquid L leaking from the tank of the tank body 2 through the structural part (the part where the bearing balls 20 are sandwiched) that allows the inner frame 17 to rotatably hold the rotary support 19 is partly rotated. It is guided to the outer peripheral surface of the support body 19 facing the outside of the tank, and the effect of moistening the sliding contact portion of the conductive contact 25 (becoming in a liquid power supply state) and increasing the power supply rate can be obtained.

A dissolution case 32 is erected in the tank of the tank main body 2 . In the example shown in the figure, the number of dissolution cases 32 used is three, but the number of dissolution cases 32 used can be increased or decreased according to the capacity of the tank body 2 . Of course, the capacity (inner diameter, height, shape, etc.) of the melting case 32 can also be arbitrarily changed, and depending on the situation, it is possible to provide only one melting case 32 .

The dissolution case 32 has a case body 32a having a case outer wall made of a liquid-permeable material, and a cover 32b surrounding the case outer wall of the case body 32a from the outside.
A case outer wall of the case main body 32a is made of, for example, titanium, and has a net structure, a porous structure, a slit lattice structure, and the like.

The cover 32b is formed of a filter material (for example, a filter cloth with meshes that do not allow wastes to pass) that does not allow wastes generated from the plating-side metal contained in the case body 32a to pass through.
Small pieces 33 of plating-side metals such as nickel, copper, gold, silver, and palladium are placed in the melting case 32, and an anolyte (for example, sulfuric acid) is supplied from the upper end side of the melting case 32, so that each melting case A processing liquid L (such as copper sulfate) can be supplied into the tank of the tank main body 2 from the side surface of 32 .

The treatment liquid L supplied to the tank main body 2 in this way has impurities, wastes, etc. Needless to say, the concentration is adjusted according to plating conditions such as , mass and current density.
The tank wall 11 of the tank main body 2 is provided with an overflow part 35 for limiting the storage amount of the treatment liquid L in a part of the wall (wall part 11c in the drawing). By providing the overflow portion 35, there is also the advantage that contaminated wastes near the surface of the treatment liquid L can be positively discharged from the inside of the tank of the tank main body 2. FIG.

A support table 37 having a supply and discharge function is provided on the bottom body 10 in the tank body 2 , and the melting case 32 is supported on the support table 37 . The support base 37 is formed with a drainage passage 39 directed to the lower end of the dissolving case 32, an ejection passage 40 directly connecting the inside and outside of the tank main body 2, and the leaked liquid receiving portion 27 described above. there is
The drainage passage 39 is designed to communicate the small-diameter drainage hole 42 formed at the lower end of the dissolution case 32 and the outside of the tank body 2 in a unique direct relationship. Wastes generated inside (wastes generated from small pieces 33 of the metal on the plating side) can be discharged out of the tank body 2 without leaking into the tank body 2 at all. there is

In short, it can be said that contamination of the environment inside the tank of the tank body 2 (including, of course, the surface to be plated of the workpiece W to be processed) by the waste generated in the dissolving case 32 can be substantially prevented. can. In particular, when the processing liquid L is removed from the tank body 2 in advance when the workpiece W to be processed is taken out of the tank body 2 after plating, the waste is prevented from being mixed with the processing liquid L to be removed. It has been extremely beneficial.

The ejection passage 40 pushes the catholyte (sulfuric acid, etc. can be used as well as the anode liquid) supplied from outside the tank main body 2 toward the inside of the tank within the mounting port 15 and holds the object to be processed. It can be supplied at a position as close as possible while following W (surface to be plated). A plurality of the ejection passages 40 can be arranged side by side with the diameter of the opening facing the tank main body 2 narrowed down. By doing so, the supply flow of the catholyte can be made into a curtain-like jet with momentum.

In order to bring the catholyte supplied from the jet passage 40 into contact with the article W to be treated more efficiently, a rectifying plate (not shown) is provided so as to separate the dissolution case 32 and the article W to be treated. good too.
Next, the attachment/detachment device 3 will be described.
The attachment/detachment device 3 is for pressing the article W to be treated against the intended attachment/detachment surface of the tank main body 2 (the opening edge of the mounting port 15) and taking out the article W to be treated that is being pressed. It has a holding mechanism 45 for the article W, a moving mechanism 46 for moving the holding mechanism 45 toward and away from the tank body 2 , and a rotating mechanism 47 for rotating the holding mechanism 45 with respect to the moving mechanism 46 . doing.

The holding mechanism 45 has a disk-shaped holding body 50 having substantially the same size as the plate surface of the workpiece W to be processed. The holding member 50 is held sideways so that the center axis of the disk-shaped member is oriented horizontally. At the center of the holder 50 is formed a recess whose diameter is one turn smaller than the size of the plate surface of the object W to be processed. It abuts and can maintain a non-contact state with other front portions.

A plurality of suction holes 51 are formed at predetermined intervals in the circumferential direction on the front side outer peripheral portion of the holding body 50 (the portion that contacts the workpiece W), and each suction hole 51 is positioned at the center of the disk shape. to the rear (the direction opposite to the tank body 2: the right side in FIG. 1), and is connected to an appropriate suction device (not shown). Therefore, by operating this suction device, the article W to be processed can be sucked and held in front of the holder 50 .

A circumferential groove (not shown) may be formed along the outer peripheral portion of the front side of the holding member 50 so as to connect the openings of all the suction holes 51 arranged on the outer peripheral portion of the front side of the holding member 50 . Then, each suction hole 51 should be brought into communication.
A detent piece 53 is provided on the outer peripheral portion of the holder 50 so as to protrude radially outward from at least one location. A mating engagement portion 55 that engages with the detent piece 53 is provided on the rotation support 19 of the tank body 2 .

The rotation mechanism 47 is formed of, for example, a disk motor, and the holding member 50 of the holding mechanism 45 is attached to a rotation driving member 47a that is rotated by a motor body 47a. Of course, the use of the disk motor is not limited, and a general motor can be used if there is enough space.
The rotational speed of the holder 50 (workpiece W) by the rotating mechanism 47 is such that, in the case where the workpiece W is a semiconductor substrate, its outer diameter falls within a predetermined range as a common technical knowledge. From the correlation with the outer diameter, for example, it is preferable to set it to about 2 to 3 rpm.

When the speed is lower than 2 rpm, the effect of preventing air bubbles and wastes from adhering to the workpiece W is poor, and the effect of uniforming the film thickness of the plating is also low. On the other hand, if the speed is higher than 3 rpm, the thickness of the plating may be uneven.
However, since this number of rotations depends on the presence or absence of the catholyte supplied from the jet passage 40 and whether or not the catholyte is supplied as a jet flow, the conditions regarding the supply of the catholyte are different. In some cases, the number of revolutions is not necessarily limited.

The moving mechanism 46 may have a structure in which the moving table 57 is slid along the guide rails 58 by means of, for example, a fluid pressure cylinder, a rodless cylinder, or a mechanism 56 for electrically driving a winding transmission means or the like (Fig. The example uses an air cylinder).
Needless to say, when the holding mechanism 45 and the rotating mechanism 47 are moved by the moving mechanism 46, the center height of the workpiece W held by the holding mechanism 45, the rotation center height of the rotating mechanism 47, etc. , and the center height of the mounting opening 15 and the rotation center height of the rotary support 19.

Therefore, the workpiece W held by the holding mechanism 45 is pressed against the opening edge of the mounting port 15 in the tank main body 2 by the movement of the moving mechanism 46, and rotated by the rotating mechanism 47. It rotates concentrically with the rotation center of 19.
At this time, since the detent pieces 53 provided on the holding member 50 of the holding mechanism 45 are engaged with the engaging portions 55 of the rotary support member 19, the rotational force applied to the holding member 50 by the rotating mechanism 47 is reduced. is directly transmitted to the rotary support 19, and the workpiece W sandwiched and held by the holder 50 and the rotary support 19 rotate together.

That is, when the article W to be treated rotates in this manner, the article W to be treated does not undergo relative rotational rubbing against anything, and there is no risk of scratching or the like.
Next, the operation status of the vertical holding type plating apparatus 1 according to the present invention will be described.
First, the tank main body 2 is set to an empty state in which the processing liquid L is not stored in the tank. Then, the moving mechanism 46 stops the holding mechanism 45 at a position separated from the tank main body 2, and the rotating mechanism 47 stops the holding body 50 of the holding mechanism 45 from rotating.

In this state, the article W to be processed is attracted and held by the holder 50 of the holding mechanism 45 by mechanical operation or manual operation. While the rotating mechanism 47 is kept in a non-rotating state, the moving mechanism 46 advances the holding mechanism 45 and the rotating mechanism 47 toward the tank main body 2 to press the workpiece W against the opening edge of the loading port 15 .
Next, in this state, the anolyte is supplied into the tank of the tank main body 2 (upper end of the dissolution case 32). After the anolyte overflows from the overflow portion 35 of the tank main body 2, the rotation mechanism 47 is driven to impart rotation to the workpiece W to be processed.

At the same time, the catholyte is supplied into the tank of the tank main body 2 through the ejection passage 40, and a current is applied between the anode liquid and the conductive contact 25, so that the article W to be processed is plated.
The catholyte ejected from the ejection passage 40 also has the effect of agitating the processing liquid L stored in the tank of the tank body 2, leading to the advantage that the concentration of the processing liquid L is stabilized at a constant level.
Since the article W to be treated continues to rotate during the plating process, air bubbles and waste matter do not adhere to the article W to be treated. As a matter of course, the waste generated in the dissolution case 32 is managed in such a manner that it does not leak out of the case. Also from this point of view, the amount of waste matter adhering to the article W to be treated is at a level that can be said to be substantially zero. In addition, the rotation of the workpiece W also has the effect of uniforming the film thickness of the deposited plating film.

When the plating is completed, the rotation mechanism 47 is stopped, and the treatment liquid L is completely discharged from the tank main body 2 .
After that, the moving mechanism 46 is operated to move the holding mechanism 45 and the rotating mechanism 47 away from the tank body 2, and then the article W to be treated is taken out from the holding mechanism 45, thereby completing one cycle of the surface treatment process. .

As is clear from the above detailed explanation, the vertical holding type plating apparatus 1 provided with the melting case 32 according to the present invention can thoroughly prevent air bubbles, wastes, etc. from adhering to the workpiece W to be processed. Therefore, the flatness and smoothness of the plating film can be dramatically improved. In addition, since the plating film thickness can be made uniform, the yield of the workpieces W to be processed can be increased to the utmost.
In addition, the workpiece W plated by the vertical holding type plating apparatus 1 according to the present invention has high quality in terms of the flatness and smoothness of the plating film, the plating film thickness, etc., and is widely used in the semiconductor manufacturing industry. It greatly contributes to product stabilization and product development in the field.

In addition, by moistening the sliding contact portion of the conductive contact 25 for using the article W to be processed as the cathode with the processing liquid L to increase the power supply rate (as in a liquid power supply state), there is a gap between the anode and the cathode. The applied current density can be increased (40 to 50 A/dm ² is also possible). As a result, it is possible to improve processing efficiency (time reduction, cost reduction, etc.) and further improve processing quality.

By the way, the present invention is not limited to the above-described embodiment, and can be changed as appropriate according to the embodiment.
For example, the rotation mechanism 47 is not limited to a uniaxial drive system using a disk motor or the like. For example, a structure may be adopted in which a ring gear is provided on the outer peripheral surface of the holding body 50 and rotationally driven by an external motor with or without a speed reducer.

The melting case 32 can also be formed in a box shape or the like.
Providing the dissolution case 32 in the tank body 2 is an extremely effective means for shortening the piping route, making the equipment compact, etc., but is not limited thereto. For example, the plating-side metal is immersed in a dissolution tank provided separately from the tank main body 2 to adjust the concentration of the treatment liquid L, and the treatment liquid L is circulated between the tank main body 2 and the dissolution tank. It should be made to occur. In this case, a filter or the like may be provided at an appropriate location in the circulation path to remove wastes and the like in the treatment liquid L.

In the tank main body 2, the mounting opening 15 is not limited to be provided on one wall portion 11a, and the mounting opening 15 can be provided on two or more wall portions. In this case, a holding hole 45, a rotating mechanism 47, and a moving mechanism 46 may be provided corresponding to each mounting port 15. FIG.
The holding body 50 of the holding mechanism 45 is not limited to be disk-shaped, and other shapes such as a rectangular disk-like shape or a polygonal disk-like shape may be adopted.

The object W to be processed in the present invention is not limited to a semiconductor substrate (wafer) as long as it is plate-shaped and one side is plated in one cycle of plating.
In addition, although the plate-side metal piece 33 is spherical in FIG. 1, it may be plate-shaped, rolled plate-shaped, cylindrical, prismatic, or indeterminate.

1 vertical holding type plating apparatus 2 tank main body 3 attachment/detachment apparatus 4 apparatus frame 5 base 10 bottom 11 tank wall 11a to 11d wall 15 mounting opening 15a contact portion 17 inner frame 18 outer frame 19 rotation support 20 bearing ball 21 Circumferential groove 25 Continuity contact 27 Leaked liquid receiver 28 Drain hole 32 Dissolution case 32a Case main body 32b Cover 33 Small piece 35 Overflow part 37 Support base 39 Drain passage 40 Ejection passage 42 Drain hole 45 Holding mechanism 46 Moving mechanism 47 Rotation Mechanism 47a Motor body 47a Rotating body 50 Holding body 51 Suction hole 53 Anti-rotation piece 55 Engagement part 56 Mechanism 57 Moving table 58 Guide rail L Treatment liquid W Object to be treated

Claims (4)

One wall portion (11a) is used as a detachable surface forming a mounting port (15) closed by mounting the article (W), and the tank main body (2 ) capable of storing the processing liquid (L) inside. ) and a loading/unloading device (3) that holds the workpiece (W) and presses it against the mounting port (15) from the outside of the tank body (2) ,
An inner frame body (17) and an outer frame body (18) fixed in a superimposed state, and these inner frame body (17) and outer frame body (18) are provided on the detachable surface of the tank body (2). A rotary support (19) rotatably held between superpositions is provided, and the rotary support (19) has a central opening serving as a mounting opening (15), and an opening edge of this central opening. (W) forms a contact portion (15a) to be pressed,
The attachment/detachment device (3) includes a holder (50) holding an article (W) at its tip, and moving the holder (50) toward a rotary support (19) to hold the article (W). ) against the contact portion (15a) of the rotary support (19), and a rotating mechanism for rotating the holding body (50) pressed against the rotary support (19) together with the rotary support (19). (47) A vertical holding type plating apparatus characterized by having: The rotating mechanism (47) includes an engaging portion (50) formed on the rotating support (19) and a holding body (50) which engages when pressed against the rotating support (19). 2. The vertically held plating apparatus according to claim 1, further comprising a detent piece (53) that engages with the joint (50) to integrally rotate the rotary support (19) . A bearing ball (20) is sandwiched between the rotating support (19) and the inner frame (17), the rotating support (19) is made of a conductive material, and the outer frame (18) 3. The vertical holding type plating apparatus according to claim 2, further comprising a conductive contact (25) for holding the workpiece (W) on the cathode by sliding contact with the rotating rotary support (19). . The outer frame (18) has a drain hole (28) through which the processing liquid (L) leaking to lubricate the bearing ball (20) and the conductive contact (25) passes downward, and the drain hole ( 4. The vertical holding type plating apparatus according to claim 3, wherein a leakage liquid receiver (27) for recovering the treatment liquid (L) after leakage is provided below 28) .

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