JP2013051375A5 - - Google Patents
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- JP2013051375A5 JP2013051375A5 JP2011189814A JP2011189814A JP2013051375A5 JP 2013051375 A5 JP2013051375 A5 JP 2013051375A5 JP 2011189814 A JP2011189814 A JP 2011189814A JP 2011189814 A JP2011189814 A JP 2011189814A JP 2013051375 A5 JP2013051375 A5 JP 2013051375A5
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- light emitting
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- light
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Description
すなわち本発明に係る発光装置は、基板と、前記基板上の実装領域に配列された複数の発光素子と、前記基板上の前記実装領域の周囲に形成された枠体と、前記複数の発光素子を封止する光透過性の封止部材と、を備える。前記発光装置は、前記実装領域が壁体によって2以上の照射領域に区画され、前記封止部材が、前記壁体にまたは前記壁体と前記枠体とに囲まれた内側に充填されて前記照射領域毎に分離されて備えられ、隣り合う2つの前記照射領域の前記封止部材は、いずれか一方のみが蛍光体を含有し、あるいは互いに異なる蛍光体を含有し、前記壁体は当該壁体が設けられた照射領域の前記発光素子の少なくとも一部を被覆し、光透過性の材料からなることを特徴とする。 That light emitting device according to the present invention includes a substrate and a plurality of light emitting elements arranged on the mounting area on the substrate, and prior Symbol frame formed around the mounting area on the substrate, wherein the plurality of light emitting an optically transparent sealing member for sealing the element, Ru comprising a. In the light emitting device , the mounting area is partitioned into two or more irradiation areas by a wall body, and the sealing member is filled in the wall body or inside the wall body and the frame body. wherein provided is separated for each irradiation area, before Kifutome member two of the irradiation region mutually Ri next, only one of them contains a phosphor, or contain different phosphors from each other, said wall It covers the at least a portion of the light emitting element of the irradiated region where the wall is provided, characterized by comprising the optically transparent material.
Claims (1)
前記実装領域は、壁体によって2以上の照射領域に区画され、
前記封止部材は、前記壁体にまたは前記壁体と前記枠体とに囲まれた内側に充填されて、前記照射領域毎に分離されて備えられ、
隣り合う2つの前記照射領域の前記封止部材は、いずれか一方のみが蛍光体を含有し、あるいは互いに異なる蛍光体を含有し、
前記壁体は、当該壁体が設けられた照射領域の前記発光素子の少なくとも一部を被覆し、光透過性の材料からなることを特徴とする発光装置。 Board and a plurality of light emitting elements arranged in the mounting region on the substrate, before Symbol a frame formed around the mounting area on the substrate, the light transmissive sealing the plurality of light emitting elements a sealing member, the light emitting device Ru provided with,
The mounting area is divided into two or more irradiation areas by a wall ,
The sealing member is filled in the wall body or inside surrounded by the wall body and the frame body, and is provided separately for each irradiation region ,
Before Kifutome member two of the irradiation region adjacent Ri each other, only either one contains a phosphor, or contain different phosphors from each other,
The wall at least partially by a coating, a light-emitting device characterized by comprising the optically transparent material of the light emitting element of the irradiated region where the wall is provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011189814A JP5810758B2 (en) | 2011-08-31 | 2011-08-31 | Light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2011189814A JP5810758B2 (en) | 2011-08-31 | 2011-08-31 | Light emitting device |
Publications (3)
Publication Number | Publication Date |
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JP2013051375A JP2013051375A (en) | 2013-03-14 |
JP2013051375A5 true JP2013051375A5 (en) | 2014-09-25 |
JP5810758B2 JP5810758B2 (en) | 2015-11-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011189814A Active JP5810758B2 (en) | 2011-08-31 | 2011-08-31 | Light emitting device |
Country Status (1)
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JP (1) | JP5810758B2 (en) |
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CN106887507B (en) | 2015-10-30 | 2020-09-22 | 日亚化学工业株式会社 | Light emitting device and method for manufacturing the same |
JP6790602B2 (en) * | 2015-10-30 | 2020-11-25 | 日亜化学工業株式会社 | Light emitting device and its manufacturing method |
US10461065B2 (en) | 2015-11-30 | 2019-10-29 | Nichia Corporation | Method of manufacturing light emitting device |
JP6584308B2 (en) * | 2015-12-04 | 2019-10-02 | シチズン電子株式会社 | LED light emitting module |
JP6643910B2 (en) * | 2016-02-08 | 2020-02-12 | シチズン電子株式会社 | Light emitting device |
JP6728869B2 (en) * | 2016-02-25 | 2020-07-22 | 豊田合成株式会社 | Light emitting device |
JP6866580B2 (en) * | 2016-06-29 | 2021-04-28 | 日亜化学工業株式会社 | Light emitting device and light source |
JP2018041843A (en) | 2016-09-07 | 2018-03-15 | パナソニックIpマネジメント株式会社 | Light-emitting device and illuminating device |
JP6807686B2 (en) * | 2016-09-13 | 2021-01-06 | シチズン電子株式会社 | Light emitting device |
JP6458793B2 (en) * | 2016-11-21 | 2019-01-30 | 日亜化学工業株式会社 | Method for manufacturing light emitting device |
JP2018206886A (en) * | 2017-06-01 | 2018-12-27 | パナソニックIpマネジメント株式会社 | Light-emitting device, and luminary device |
JP7063583B2 (en) * | 2017-11-22 | 2022-05-09 | シチズン電子株式会社 | Light emitting device |
JP2019121678A (en) * | 2018-01-04 | 2019-07-22 | シチズン電子株式会社 | Light-emitting device |
JP2019138940A (en) | 2018-02-06 | 2019-08-22 | セイコーエプソン株式会社 | Light source device, illumination device and projector |
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JP5113820B2 (en) * | 2009-10-27 | 2013-01-09 | パナソニック株式会社 | Light emitting device |
DE102010044470B4 (en) * | 2010-09-06 | 2018-06-28 | Heraeus Noblelight Gmbh | Method for coating an on-board opto-electronic module, optoelectronic chip-on-board module and system therewith |
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