JP6584308B2 - LED light emitting module - Google Patents

Description

  The present invention relates to a chip on board (COB) type LED light emitting module, and more particularly, to an LED light emitting module capable of emitting light with high luminance at a low voltage and having good color characteristics.

  In recent years, LED elements, which are semiconductor elements, have long life and excellent driving characteristics, and are widely used for illumination and the like because they are small in size, have high luminous efficiency, and have bright emission colors.

  Furthermore, it is desired to realize a high-intensity light source device such as a projector, high ceiling lighting, and lighting / illumination of a stadium using an LED element. In order to realize a high-intensity light source device, it is required to mount LED elements at high density in an LED light emitting module.

  In order to mount LED elements at high density, for example, anode (positive) and cathode (negative) electrodes and a plurality of LED elements are arranged on a board, and a plurality of LED elements are electrically connected by wire bonding between the electrodes. Generally, they are connected in series. The LED element row is not limited to one row, and a plurality of LED element rows are connected in parallel between the electrodes. Since the electrode reduces the mounting density, it is desirable to reduce the area of the electrode in the region where the LED element is disposed.

  When a large number of LED elements are arranged densely, the number of LED elements connected between the electrodes increases, that is, the number of LED elements connected in series increases. Since the voltage generated in one LED element is constant, the voltage applied between the electrodes increases as the number of LED elements in a line increases. Therefore, the voltage supplied to the LED light emitting module sometimes exceeds the voltage of a usable DC power source. In such a case, in order to use the LED light emitting module, a larger power source having a higher voltage is required.

  Therefore, an electrode is arranged between the arranged LED elements to reduce the number of LED elements connected in series in each LED element row. In this case, one system of electrodes (anode or cathode) has a plurality of electrodes, and in order to insulate and electrically connect the plurality of electrodes from the other, it is common to perform multilayer wiring. In some cases, the bonding wire connecting the LED elements straddles the electrode wiring. Thus, in order to reduce the number of LED elements connected in a row, there is known an LED light emitting module in which one system of electrodes is formed by a plurality of electrodes, but the wiring of electrodes and bonding wires is complicated. There was a problem.

  Moreover, it is desirable that the LED light emitting module used for a projector or the like has a circular light emitting portion and has a rotationally symmetric luminance distribution.

  Furthermore, it is desired that the LED light emitting module has a desired color characteristic by mixing emitted light. In order to exhibit desired color characteristics, there are a method of mounting a plurality of LED elements having different emission wavelengths, a method of covering the LED element with a phosphor that converts to a different color, and a method of performing both, but easy manufacture In view of the characteristics, it is desirable to use LED elements having the same emission wavelength and combine the phosphors.

  Patent Document 1 has an electrode pattern that provides a plurality of stages of voltage, divides an area where a plurality of LED elements are arranged into a plurality of areas with a dam material, and arranges different phosphors in the enclosed areas Thus, a light-emitting device that obtains desired color characteristics is described.

  Patent Document 2 describes a substrate of a light emitting module having one wiring pattern whose connection can be switched.

JP 2011-108744 A JP 2009-164209 A

  An object of the present invention is to provide an LED light-emitting module that uses a plurality of LED elements having the same emission wavelength and can obtain light having a desired color characteristic with a simple electrode structure.

  An LED light emitting module according to the present invention includes a substrate, a first electrode and a second electrode formed on the substrate, a plurality of LED elements of the same emission color connected between the first electrode and the second electrode, and a plurality of LED elements The area where the LED elements are arranged is divided into a plurality of areas, and the dam material formed so as to surround each of the divided areas, and the plurality of areas surrounded by the dam material so as to protect the LED elements The resin material disposed in at least two of the plurality of regions includes a phosphor that converts light output from the LED element into light of a different color, The resin material arranged in one of the regions includes a first phosphor that converts light of the first color, and the resin material arranged in the other of the two regions emits second light different from the first color. It contains the 2nd fluorescent substance to convert.

  The first electrode has an arc-shaped first outer electrode and first inner electrode smaller than 180 degrees, and a first connection electrode connecting the first outer electrode and the first inner electrode, and the second electrode is , Smaller than 180 degrees, arc-shaped second outer electrode and second inner electrode having the same radius as the first outer electrode and first inner electrode, and a second connection electrode for connecting the second outer electrode and the second inner electrode The first outer electrode is disposed to face the second inner electrode, the second outer electrode is disposed to face the first inner electrode, and the plurality of LED elements are arranged in M rows of LED elements. Each LED element row has N LED elements connected in series between the first electrode and the second electrode.

  The LED element array disposed in the central region between the first inner electrode and the second inner electrode is connected to the first inner electrode and the second inner electrode, and between the first outer electrode and the second inner electrode and The LED element array disposed in the peripheral region between the second outer electrode and the first inner electrode is connected to the first outer electrode and the second inner electrode or the first inner electrode and the second outer electrode.

  The plurality of LED elements arranged in the peripheral region may be arranged radially with respect to the center.

  The LED elements in the same order in each LED element array arranged radially in the peripheral region may be arranged concentrically.

  The dam material includes an annular outer ring portion disposed at a radial position corresponding to the first outer electrode and the second outer electrode, and a circle disposed at a radial position corresponding to the first inner electrode and the second inner electrode. An annular inner ring portion, and an inner radiation portion that extends radially from the center to the inner ring portion in four directions at equal angles and extends in two directions are the same as the directions of the first connection electrode and the second connection electrode. A resin frame having an outer radiating portion extending from the inner annular portion to the outer annular portion in the same four directions as the inner radiating portion is formed.

  The outer annular portion, the inner annular portion, the outer radiating portion, and the inner radiating portion are formed of white resin. The plurality of LED elements may include an LED element on which a dam material is disposed.

  The outer ring part, the inner ring part, and the outer radiation part may be formed of a white resin, and the inner radiation part may be formed of a transparent resin containing a diffusing agent.

  The substrate may be made of ceramic. The substrate has a mounting substrate and a circuit substrate disposed on the mounting substrate, the first electrode and the second electrode are disposed on the circuit substrate, the circuit substrate has an opening, and a plurality of The LED element may be mounted on a mounting substrate corresponding to the opening.

  ADVANTAGE OF THE INVENTION According to this invention, the LED light emitting module which uses the some LED element of the same light emission wavelength, and can obtain the light of a desired color characteristic with a simple electrode structure is implement | achieved.

It is the top view and sectional drawing of the LED light emitting module which concern on 1st Embodiment of this invention. It is a top view of the mounting board in a 1st embodiment. It is a top view of the mounting board | substrate which has arrange | positioned the LED element. It is a top view of the mounting board | substrate which connected the arrange | positioned LED element by wire bonding. It is a top view of the mounting substrate which formed the resin frame with the dam material. It is a top view of the mounting board | substrate sealed with sealing resin containing a fluorescent substance. It is a graph which shows the color characteristic of the emitted light at the time of mounting the sample LED element with the LED light emitting module which concerns on 1st Embodiment. It is the upper side figure and sectional drawing of the LED light emitting module concerning 2nd Embodiment of this invention. In 2nd Embodiment, it is a top view of the state which has arrange | positioned the LED element.

  Hereinafter, an LED light emitting module and a manufacturing method thereof will be described with reference to the drawings. However, it should be understood that the present invention is not limited to the drawings or the embodiments described below.

FIG. 1 is two cross-sectional views at positions indicated by IA and IB in the top view and the top view of the LED light emitting module 1 according to the first embodiment of the present invention. In the cross-sectional view, only elements in the cross-sectional portion are shown, and elements that are visible from the cross-sectional portion to the back are omitted for easy understanding. In addition, there is a sealing resin containing a phosphor in the uppermost layer. However, in the top view, the sealing resin is absent or transparent for easy understanding of the illustration, and the lower layer portion can be observed. The lower layer is indicated by a solid line.
The LED light emitting module 1 includes a mounting substrate 10, an LED element 30, a resin frame 40A-40D formed of a dam material, and a sealing resin 50A-50C as main components.

  2 to 6 show the mounting substrate 10, the mounting substrate 10 in a state where the LED elements 30 are arranged, the mounting substrate 10 in a state where the LED elements 30 are connected by wire bonding 31, and the resin frame with the dam materials 40A to 40D. The mounting board | substrate 10 of the formed state and the mounting board | substrate of the state sealed with sealing resin 50A-50C are shown. 2 to 6 correspond to diagrams sequentially illustrating manufacturing steps of the LED light emitting module 1.

  As shown in FIG. 2, the mounting substrate 10 is a substrate having a planar region on which the LED element 30 is mounted on the upper surface, and here, an example made of ceramic is shown. The mounting substrate 10 has a square shape as an example.

  A wiring pattern is formed on the upper surface of the mounting substrate 10. The wiring patterns include the first terminal electrode 24A and the second terminal electrode 24B, the first outer electrode 25A and the second outer electrode 25B, the first inner electrode 26A and the second inner electrode 26B, the first connection electrode 27A and the first electrode. 2 connection electrodes 27B. The wiring pattern is, for example, a gold plating layer. A portion other than the wiring pattern on the upper surface of the mounting substrate 10 is formed with a high reflection processing layer such as a silver plating layer. The highly reflective treatment layer may be a reflection enhancing film such as a dielectric multilayer film.

  The first terminal electrode 24A and the second terminal electrode 24B are formed in the vicinity of two apexes facing each other diagonally. The first terminal electrode 24A is an anode (positive) electrode, the second terminal electrode 24B is a cathode (negative) electrode, and the LED light emitting module 1 emits light when a voltage is applied thereto from an external power source. The patterns indicated by reference numerals 24AA and 24BB near the first terminal electrode 24A and the second terminal electrode 24B are patterns indicating the polarities of the first terminal electrode 24A and the second terminal electrode 24B, and are not wiring patterns. It is formed in the same process as the wiring pattern.

  The first outer electrode 25 </ b> A and the second outer electrode 25 </ b> B are arc-shaped patterns arranged from the center of the LED light emitting module 1 to the first radius so as not to overlap each other. The first outer electrode 25A and the second outer electrode 25B are preferably as long as possible while satisfying the condition that they do not overlap with each other, and are each less than 180 degrees with respect to the center, but in a range as close to 180 degrees as possible. Have In practice, in consideration of pattern formation errors, mutual insulation, and the like, for example, it is formed to have a length that forms an angle of 170 degrees with respect to the center.

  The first inner electrode 26 </ b> A and the second inner electrode 26 </ b> B are arc-shaped patterns arranged at a second radius smaller than the first radius from the center of the LED light emitting module 1, and do not overlap each other like the outer electrode. Formed as follows.

  As shown in FIG. 2, the first outer electrode 25A and the second inner electrode 26B are disposed on the same side (upper side in the drawing) with respect to the center, and the second outer electrode 25B and the first inner electrode 26A are with respect to the center. Arranged on the same side (lower side in the figure). The first radius and the second radius are, for example, the radial distance between the first outer electrode 25A and the second inner electrode 26B, and the radial distance between the second inner electrode 26B and the first inner electrode 26A. Are selected to be approximately equal.

  The first connection electrode 27A is a linear pattern that connects the end of the first outer electrode 25A and the end of the first inner electrode 26A, and the second connection electrode 27B is the end of the second outer electrode 25B. And a linear pattern connecting the end of the second inner electrode 26B. The first connection electrode 27A and the second connection electrode 27B are disposed on the opposite sides with respect to the center.

  As shown in FIG. 2, the first terminal electrode 24A, the first outer electrode 25A, the first connection electrode 27A, and the first inner electrode 26A are connected to each other to form a first electrode. When a voltage is applied from the external power source to the first terminal electrode 24A, the electrodes forming the first electrode have the same voltage. The second terminal electrode 24B, the second outer electrode 25B, the second connection electrode 27B, and the second inner electrode 26B are connected to each other to form a second electrode. When a voltage is applied from the external power source to the second terminal electrode 24B, the electrodes forming the second electrode have the same voltage.

  Although not shown, the mounting substrate 10 has fixing through holes in the vicinity of two vertices on the diagonal different from the two vertices on the diagonal on which the first terminal electrode 24A and the second terminal electrode 24B are provided. May be provided.

  The LED element 30 is an example of a light emitting element, and is, for example, a blue LED element that emits blue light having an emission wavelength band of about 450 to 460 nm. As shown in FIG. 3, in the LED light emitting module 1, a plurality (42) of LED elements 30 are mounted on the mounting substrate 10. The lower surface of the LED element 30 is fixed to the upper surface of the mounting substrate 10 with, for example, a transparent insulating adhesive. Since the LED element 30 is directly fixed on the ceramic mounting substrate 10 or the silver plating layer, the LED element 30 has a high heat dissipation effect on the LED element 30 and can emit light with high output.

  In the central region where the first inner electrode 26A and the second inner electrode 26B face each other, the six LED elements 30 are arranged at the same radial position from the center. In the upper peripheral area where the first outer electrode 25A and the second inner electrode 26B face each other and in the lower peripheral area where the second outer electrode 25B and the first inner electrode 26A face each other, three pieces arranged in a straight line. Twelve rows of LED elements 30 composed of the LED elements are arranged radially with respect to the center, and the LED elements 30 in the same order in each row are arranged concentrically. For example, the LED element 30 angular spacing is about 50 degrees for only two spacings and about 25 degrees for the other.

  The component indicated by reference numeral 32 is a Zener diode element that protects the LED element 30 when an overvoltage is applied between the first electrode and the second electrode.

  The LED element 30 has a pair of element electrodes on its upper surface. As shown in FIG. 4, the element electrodes of three adjacent LED elements 30 are connected in series by bonding wires 31, and the element electrodes of the LED elements 30 at both ends are bonded to the first electrode and the second electrode by bonding wires. 31 is connected.

  For example, in the central region, the six LED elements 30 are divided into two rows extending in the vertical direction in the figure, and the element electrodes of the three LED elements 30 in each row are connected in series by bonding wires 31. The element electrodes of the LED elements 30 at both ends of the column are connected to the first inner electrode 26A and the second inner electrode 26B by bonding wires 31. In other words, the three LED elements 30 in each row are connected in series by the bonding wire 31 between the first inner electrode 26A and the second inner electrode 26B.

  Furthermore, in the upper peripheral region, the 18 LED elements 30 are divided into 6 LED element arrays, with the three LED elements 30 arranged radially with respect to the center as one line. The three LED elements 30 in each row are connected in series by a bonding wire 31 between the first outer electrode 25A and the second inner electrode 26B. Similarly, in the lower peripheral region, the three LED elements 30 in each of the six LED element arrays are connected in series by the bonding wires 31 between the first inner electrode 26A and the second outer electrode 25B. The In the LED light emitting module 1, the first electrode and the second electrode are gold plating layers, and the wire bonding is good, so that the connection reliability can be improved.

  Further, in the peripheral region, 12 rows of LED elements 30 are arranged radially with respect to the center, and the LED elements 30 in the same order in each row are arranged concentrically, so that the circular luminance distribution is rotationally symmetric. A light emitting module is formed.

  The dam material is a highly reflective white resin, and as shown in FIG. 5, an outer annular portion 40A formed at a position overlapping the first outer electrode 25A and the second outer electrode 25B on the upper surface of the mounting substrate 10, An inner annular portion 40B formed at a position overlapping with the first inner electrode 26A and the second inner electrode 26B, an inner radiation portion 40D extending radially from the center to the inner annular portion 40B in four directions at equal angles, and inner radiation A dam (resin frame) having an outer radiation portion 40C extending from the inner annular portion 40B to the outer annular portion 40A in the same four directions as the portion 40D is formed. A portion extending in the opposite two directions of the inner radiation portion 40D is formed at a position overlapping the first connection electrode 27A and the second connection electrode 27B, and the remaining portion extending in the two directions extends in a direction different by 90 degrees. Therefore, the region where the LED element 30 is mounted is divided into four outer regions and four inner regions by the dam material. In each of the four outer regions, three rows of LED elements, a total of nine LED elements, are arranged. One LED element is disposed in each of the four inner regions. The inner two LED elements have a dam material disposed on the top.

  As shown in FIG. 6, the sealing resin is injected into a portion surrounded by the dam material (resin frame) 40 on the mounting substrate 10 to cover and protect (seal) the LED element 30. For example, as the sealing resin 50, a colorless and transparent resin such as an epoxy resin or a silicone resin, particularly a resin having a heat resistance of about 250 ° C. may be used. The sealing resin 50 is cured for each divided region as shown.

Further, the phosphor is dispersed and mixed in the sealing resin. In the present embodiment, the phosphors dispersed and mixed are different for each region. Specifically, the sealing resin is excited by the red sealing resin 50A in which a red phosphor that emits red light that is excited by the blue light from the LED element 30 is dispersed, and is excited by the blue light from the LED element 30. The green sealing resin 50B in which the green phosphor that emits green light is dispersed and mixed, and the transparent sealing resin 50C that does not include the phosphor and allows the blue light from the LED element 30 to pass through as it is. The sealing resin 50 </ b> C may be a blue sealing resin in which a blue phosphor that is excited by blue light from the LED element 30 and emits blue having a wider wavelength range than that emitted from the LED element is dispersed. As shown in FIG. 6, the red sealing resin 50 </ b> A is used for sealing the three outer regions to seal nine rows of 27 LED elements 30, and the green sealing resin 50 </ b> B is the outer one. Used to seal one region and two inner regions to seal three rows of 9 + 2 LED elements 30, and a transparent sealing resin 50C is used to seal two inner regions. Two LED elements 30 are sealed. The green phosphor is a particulate phosphor material such as (BaSr) ₂ SiO ₄ : Eu ²⁺ that absorbs blue light emitted from the LED element 30 and converts the wavelength into green light. The red phosphor is a particulate phosphor material such as CaAlSiN ₃ : Eu ²⁺ that absorbs blue light emitted from the LED element 30 and converts the wavelength into red light. The phosphor mixed in the sealing resin 50 is not limited to the green phosphor and the red phosphor, but is selected according to the color characteristics of the emitted light.

  Next, the layer structure of the phosphor in the sealing resin will be described. In the LED light emitting module 1, the amount of heat generated per unit area of the light emitting area is increased by increasing the filling factor of the LED elements 30. In particular, when the interval between the LED elements is narrowed and the light density is increased, the density of light hitting the phosphor contained in the sealing resin is also increased, and the phosphor itself generates heat. Therefore, in the LED light emitting module 1, the phosphor in the sealing resin is allowed to settle and approach the mounting substrate 10, thereby improving the heat dissipation of the phosphor itself and facilitating heat dissipation.

  For example, the thermal conductivity of the silicone resin is about 0.1 to 0.4 W / mK, while the thermal conductivity of the phosphor is about 9 to 14 W / mK, which is significantly higher than that. Even with the same phosphor, the green phosphor has a higher thermal conductivity than the red phosphor. Therefore, when the phosphor layer is formed on the side closer to the mounting substrate 10, in the sealing resin, the thermal conductivity becomes higher as the mounting substrate 10 is approached. For this reason, in the LED light emitting module 1, heat can be more efficiently transmitted to the mounting substrate 10 from the entire region of the sealing resin. Since the material of the mounting substrate 10 is made of ceramic having excellent heat dissipation, the LED light emitting module 1 can sufficiently dissipate heat even if the filling rate of the LED elements 30 is increased.

  The manufacturing process of the LED light emitting module 1 is performed corresponding to the states shown in FIGS. First, the mounting substrate 10 shown in FIG. 2 is prepared, the LED elements 30 are mounted as shown in FIGS. 3 and 4, connected by wire bonding, and a dam (resin frame) is formed as shown in FIG. And it seals with sealing resin as shown in FIG.

  As described above, in the LED light emitting module 1 of the first embodiment, the central region, the upper peripheral region, and the lower peripheral region are circular regions sandwiched between the arc-shaped first outer electrode 25A and the second outer electrode 25B. It is. In the circular region, the first inner electrode 26A, the second inner electrode 26B, the first connection electrode 27A and the second connection electrode 27B are arranged, but the proportion of the electrodes is relatively small, and a large number of LED elements 30 are disposed. Can be arranged. In other words, the filling factor (density) of the LED elements 30 can be increased.

  Further, the first electrode and the second electrode are arranged opposite to each other on the center region, the upper peripheral region, and the lower peripheral region, and the distance between the opposing electrodes is such that three LED elements 30 are connected in series. This is the distance that can be placed. Therefore, if the three LED elements 30 are arranged in series between the first electrode and the second electrode, the operation of the bonding wire 31 for connecting them can be easily performed. Furthermore, it is possible to supply a relatively small voltage between the first electrode and the second electrode, that is, a voltage necessary for causing the three LED elements 30 connected in series to emit light, thereby causing the LED element 30 to emit light. Yes, if a voltage is applied to the terminals 24A and 24B, all the LED elements 30 are turned on simultaneously.

  In the first embodiment, the red sealing resin 50A is disposed on the top of the 27 LED elements 30, and the green sealing resin 50B is disposed on the top of the 11 LED elements 30, and is transparent or blue sealed. The resin 50C is disposed on the upper part of the two LED elements 30, and the light emitting area is wide in red, next in green, and finally in blue in order, so that the balance during color mixing can be improved.

  Further, in the first embodiment, the two LED elements in the inner region are disposed under the dam material (resin frame), and are disposed under the dam material when the dam material does not transmit light. Light emitted from the two LED elements is hardly emitted to the outside. In contrast, by making the dam material transparent resin containing a diffusing agent or white that is close to transparency, the blue color output from the LED element will be emitted to the outside, so adjust the material of the dam material By adjusting the emission intensity, the color balance can be adjusted.

  FIG. 7 shows the LED light emitting module according to the first embodiment. The LED element 30 to be mounted is selected from a plurality of samples having different characteristics, and the LED light emitting module is driven under the driving conditions corresponding to each. It is a figure which shows the color (spectral) characteristic of an emitted light, and also shows the drive conditions and the value of an optical characteristic of each sample as a table. For reference, the characteristics of the LED light emitting module used as a standard RGB light source are also indicated as “RGB”.

  FIG. 7 shows an example of four samples in which the rounded average color rendering property Ra and color temperature K are Ra80 / 3000K, Ra80 / 5000K, Ra70 / 5000K, and Ra80 / 4000K. It can be seen from FIG. 7 that all samples are more efficient than standard RGB light sources. Furthermore, it can be seen that any color temperature between 3000K and 5000K can be set.

  FIG. 8 is two cross-sectional views at positions indicated by IA and IB in the top view and the top view of the LED light emitting module 2 according to the second embodiment of the present invention. In the cross-sectional view of FIG. 8, only elements in the cross-sectional portion are shown, and elements that are visible from the cross-sectional portion are partly indicated by broken lines, but the other portions are omitted for easy understanding of the illustration. ing.

The LED light emitting module 2 of the second embodiment is different from the LED light emitting module 1 of the first embodiment in the configuration of the substrate, the number of connected LED elements, and the mounting configuration of the LED elements on the substrate, and other parts are the same. The same parts as those in the first embodiment are denoted by the same reference numerals, description thereof will be omitted, and different parts will be described. Further, as in FIG. 1, the lower layer portion is indicated by a solid line in the top view.
FIG. 9 is a top view of the circuit board of the LED light emitting module 2 of the second embodiment.

  As shown in FIG. 8, the mounting substrate 11 is a metal substrate formed of, for example, an aluminum base excellent in heat resistance and heat dissipation, and has a square shape as an example. The mounting substrate 11 has a planar area on which the LED element 30 is mounted. Although not shown, a fixing through hole may be provided near the two apexes facing each other on the diagonal line.

  In the LED light emitting module 2, a metal plate in which a highly reflective layer is formed on a metal plate such as an aluminum plate is used as the mounting substrate 11, and the LED element 30 is directly mounted and fixed on the reflective layer of the metal plate. The heat dissipation effect for the element 30 is high, and high-output light emission can be performed. Further, in the LED light emitting module 2, a dam material 40 is provided around the element mounting region. Further, in the LED light emitting module 2, the element mounting region is surrounded by the reflective layer and the dam material 40, so that the light emitted from the LED element 30 is emitted from the first and second terminal electrodes 24 </ b> A and 24 </ b> B of the circuit board 20. It is not absorbed by the (gold) plating layer of the outer electrodes 25A, 25B. Therefore, in the LED light emitting module 2, since most of the light emitted from the LED element 30 is reflected by the reflective layer and the dam material 40 (very high reflection efficiency), high emission efficiency can be obtained.

  In the LED light emitting module 2, since the gold plating layer is formed on the first and second outer electrodes 25A and 25B, the wire bonding property of the LED element 30 can be improved and the connection reliability can be improved. Therefore, in the LED light emitting module 2, it is possible to improve both the emission efficiency and the connection reliability.

  As a highly reflective treatment layer formed as a reflective layer in the element mounting region, for example, an increased reflection film such as a dielectric multilayer film is preferable. However, when the metal plate 11 is a material having a high reflectance such as aluminum or silver. It is not always necessary to use an increased reflection film, and a transparent insulating film for insulation may be used.

  As an example, the circuit board 20 is an insulating board such as a glass epoxy board having a square shape the same size as the mounting board 11. As shown in FIG. 9, on the surface of the circuit board 20, the first electrodes described in the first embodiment (first terminal electrode 24A, first outer electrode 25A, first inner electrode 26A and first connection electrode 27A) are provided. And second electrodes (second terminal electrode 24B, second outer electrode 25B, second inner electrode 26B, and second connection electrode 27B) are formed. In the circuit board 20, three openings 29 </ b> A, 29 </ b> B, and 29 </ b> C for directly mounting the LED element 30 on the mounting board 11 are formed. Although not shown, when the mounting substrate 11 is provided with fixing through holes, the circuit substrate 20 is also provided with fixing through holes at corresponding positions. The lower surface of the circuit board 20 is fixed to the mounting board 11 by, for example, an adhesive sheet so that the position of the fixing through hole matches the fixing through hole of the mounting board 11.

  As shown in FIG. 9, the opening 29A has a shape corresponding to a central region where the first inner electrode 26A and the second inner electrode 26B face each other. The opening 29B has a shape corresponding to the upper peripheral region where the first outer electrode 25A and the second inner electrode 26B face each other. The opening 29C has a shape corresponding to the lower peripheral region where the first inner electrode 26A and the second outer electrode 25B are opposed to each other.

  Also in the LED light emitting module 2, the LED element 30 is a blue LED element, and as shown in FIG. 8, 51 LED elements 30 are mounted. The lower surface of the LED element 30 is fixed to the upper surface of the mounting substrate 11 corresponding to the openings 29A, 29B, and 29C by, for example, a transparent insulating adhesive.

  As is clear from comparison between FIG. 4 and FIG. 9, in the second embodiment, in addition to the 14 rows of LED elements of the first embodiment, 3 rows of LED elements are mounted. Each column has three LED elements 30 connected in series. The added three rows of LED elements are arranged so as to be positioned below two outer radiation portions and one inner radiation portion in the vertical direction in FIG. In other words, in FIG. 4, it arrange | positions in the part of the up-down direction where the space | interval of the LED element row | line | column which adjoins is wide. The three LED elements 30 in each row are provided between the first outer electrode 25A and the second inner electrode 26B, between the second inner electrode 26B and the first inner electrode 26A, and between the first inner electrode 26A and the second outer electrode. 25B are connected in series by a bonding wire 31. Therefore, the added three rows of LED elements are electrically connected between the electrodes in the same manner as the other rows of LED elements, and when a voltage is applied to the terminals 24A and 24B, a voltage similar to that of the other rows of LED elements is generated. Applied.

  In the second embodiment, the dam material (resin material) forming the outer annular portion 40A, the inner annular portion 40B, and the outer radiating portion 40C is a highly reflective white resin as in the first embodiment. Since the two dam members of the outer radiation portion 40C are respectively formed on top of one row (three pieces) of LED elements, most of the light emitted from the two rows (six pieces) of LED elements is absorbed by the dam member. And is hardly emitted to the outside.

  In the first embodiment, the dam material of the inner radiating portion 40D disposed inside the inner annular portion 40B is a white resin, whereas in the second embodiment, the dam material of the inner radiating portion 40D is transparent. It is a resin material that transmits most of the light emitted from the five LED elements 30 disposed under the inner radiation portion 40D and emits the light to the outside. In addition, you may make it diffuse light by putting a diffusing agent in the transparent resin material of inner side radiation | emission part 40D. Thereby, much of the light emitted from the five LED elements 30 is emitted to the outside.

  Also in the second embodiment, the sealing resin 50 is injected into eight portions surrounded by white and transparent dam material (resin material) in the same manner as the first embodiment, that is, divided into three color portions.

  In the second embodiment, the same effect as that of the first embodiment is obtained, and the dam material (resin material) and the inner radiating portion 40D that form the outer annular portion 40A, the inner annular portion 40B, and the outer radiating portion 40C are further provided. By adjusting the transparency of the dam material (resin material) to be formed, the amount of the diffusing agent, and the like, it is possible to adjust the emission intensity and the color balance over a wider range.

  As mentioned above, although embodiment of this invention was described, it cannot be overemphasized that various modifications are possible. For example, various modifications of the arrangement and connection of the LED elements are possible. Furthermore, in the above-described embodiment, an example in which the first and second electrodes each have an outer electrode and an inner electrode, that is, an example in which the arc-shaped electrode is double, has been described. . Further, the LED element is not limited to the blue LED.

1, 2 LED light emitting module 10, 11 Mounting board 20 Circuit board 24A First terminal electrode 24B Second terminal electrode 25A First outer electrode 25B Second outer electrode 26A First inner electrode 26B Second inner electrode 27A First connection electrode 27B Second connection electrode 30 LED element 31 Bonding wire 40A-40D, 40CA, 40CB Dam material (resin frame)
50A-50C sealing resin

Claims (11)

A substrate,
A first electrode and a second electrode formed on the substrate;
A plurality of LED elements of the same emission color connected between the first electrode and the second electrode;
The area where the plurality of LED elements are arranged is divided into a plurality of regions, and a dam material formed so as to surround each divided region;
A resin material arranged to protect the LED element in the plurality of regions surrounded by the dam material;
The resin material disposed in at least two of the plurality of regions includes a phosphor that converts light output from the LED element into light of a different color, and is disposed in one of the two regions. The resin material includes a first phosphor that converts light of a first color, and a resin material disposed in the other of the two regions has a second light that converts to a second light different from the first color. Including phosphor ,
The first electrode has an arc-shaped first outer electrode and a first inner electrode smaller than 180 degrees, and a first connection electrode that connects the first outer electrode and the first inner electrode,
The second electrode is smaller than 180 degrees and has an arc-shaped second outer electrode and second inner electrode having the same radius as the first outer electrode and the first inner electrode, and the second outer electrode and the second inner electrode. A second connection electrode for connecting the electrode,
The LED light emitting module , wherein the first outer electrode is disposed to face the second inner electrode, and the second outer electrode is disposed to face the first inner electrode . The plurality of LED elements include M LED element arrays, and each LED element array includes N LED elements connected in series between the first electrode and the second electrode. Item 2. The LED light emitting module according to Item 1. The LED element array disposed in a central region between the first inner electrode and the second inner electrode is connected to the first inner electrode and the second inner electrode,
The LED element arrays arranged in the peripheral region between the first outer electrode and the second inner electrode and between the second outer electrode and the first inner electrode include the first outer electrode and the second outer electrode. The LED light emitting module according to claim 2, wherein the LED light emitting module is connected to an inner electrode or the first inner electrode and the second outer electrode.   The LED light emitting module according to claim 3, wherein the plurality of LED elements arranged in the peripheral region are arranged radially with respect to the center.   The LED light emitting module according to claim 4, wherein the LED elements in the same order in each LED element array arranged radially in the peripheral region are arranged concentrically. The dam material is
An annular outer annular portion disposed at a radial position corresponding to the first outer electrode and the second outer electrode;
An annular inner annular portion disposed at a radial position corresponding to the first inner electrode and the second inner electrode;
An inner radiation portion that extends radially from the center to the inner annular portion in four directions at equal angles, and that extends in two directions is the same as the direction of the first connection electrode and the second connection electrode;
6. The LED light emitting module according to claim 2, wherein a resin frame having an outer radiating portion extending from the inner annular portion to the outer annular portion in the same four directions as the inner radiating portion is formed. .   The light emitting device according to claim 6, wherein the outer annular portion, the inner annular portion, the outer radiating portion, and the inner radiating portion are formed of a white resin.   The light emitting device according to claim 7, wherein the plurality of LED elements include an LED element on which the dam material is disposed. The outer ring part, the inner ring part and the outer radiation part are formed of a white resin,
The light emitting device according to claim 6, wherein the inner radiation portion is formed of a transparent resin containing a diffusing agent.   The LED light emitting module according to claim 1, wherein the substrate is made of ceramic. The board includes a mounting board and a circuit board disposed on the mounting board,
The first electrode and the second electrode are disposed on the circuit board;
The circuit board has an opening,
The LED light emitting module according to claim 1, wherein the plurality of LED elements are mounted on the mounting substrate corresponding to the opening.

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