JP6583673B2 - Light emitting device and lighting device - Google Patents

Description

  The present invention relates to a light emitting device having a configuration in which a light emitting element is mounted on a substrate, and an illumination device using the same.

  As a light emitting device that emits white light, a light emitting device that employs a method of combining a blue element, which is a blue light emitting element, and a yellow phosphor and a red phosphor is known (see Patent Document 1). In the light emitting device disclosed in Patent Document 1, a blue element is sealed with a sealing resin. In the sealing resin, a yellow phosphor that absorbs blue light emitted from a blue element and emits yellow light or orange light, and a red phosphor that absorbs blue light and emits red light are dispersed. ing. That is, white light is obtained by mixing blue light from a blue element, yellow light or orange light from a yellow phosphor, and red light from a red phosphor.

JP 2007-116117 A

  In recent years, in order to improve color rendering properties, a method has been studied in which a red element, which is a red light-emitting element, is provided in a light-emitting device to increase the luminous efficiency of red light. In this case, it is desirable that the red light emitted from the red element is not absorbed by the sealing resin and is emitted from the sealing resin while maintaining the characteristics emitted from the red element. However, when red light is transmitted through the sealing resin, the red light is absorbed and weakened by the sealing resin, and a desired color rendering property cannot be obtained.

  As described above, when a light-emitting element that is not intended to excite the phosphor is used, the light from the light-emitting element is absorbed and weakened when transmitted through the sealing resin, so that a desired color rendering property is obtained. Not preferable.

  For this reason, the objective of this invention is providing the light-emitting device and illuminating device which can suppress the light emission intensity fall of the light which does not aim at excitation of fluorescent substance.

A light-emitting device according to one embodiment of the present invention includes a substrate, a first light-emitting element mounted on the substrate, a second light-emitting element having an emission peak wavelength larger than the emission peak wavelength of the first light-emitting element, A first sealing member for sealing the light emitting element, the first sealing member including a phosphor that emits fluorescence by light emitted from the first light emitting element, and at least a part of the first sealing member and the first sealing member A second sealing member for sealing the second light emitting element sandwiched between the two light emitting elements, and a dam material provided on the substrate and surrounding the first light emitting element and the second light emitting element , The second sealing member has a smaller absorbance than the first sealing member, and the first sealing member is filled in a region surrounded by the dam material so as to be thicker than the second sealing member. The surface region including the portion of the second sealing member through which the optical axis of the second light emitting element passes is the first sealing member. It is exposed through an opening formed in the member.

  The illuminating device which concerns on the other aspect of this invention is equipped with said light-emitting device.

  ADVANTAGE OF THE INVENTION According to this invention, the light emission intensity fall of the light emitting element which is not aimed at excitation of fluorescent substance can be suppressed.

1 is an external perspective view of a light emitting device according to Embodiment 1. FIG. 3 is a plan view of the light emitting device according to Embodiment 1. FIG. 3 is a plan view showing an internal structure of the light emitting device according to Embodiment 1. FIG. It is sectional drawing of the light-emitting device in the IV-IV line of FIG. 3 is a flowchart of a method for manufacturing the light emitting device according to Embodiment 1. 5 is a cross-sectional view showing one step of the method for manufacturing the light-emitting device according to Embodiment 1. FIG. 5 is a cross-sectional view showing one step of the method for manufacturing the light-emitting device according to Embodiment 1. FIG. 5 is a cross-sectional view showing one step of the method for manufacturing the light-emitting device according to Embodiment 1. FIG. 5 is a cross-sectional view showing one step of the method for manufacturing the light-emitting device according to Embodiment 1. FIG. 5 is a cross-sectional view showing one step of the method for manufacturing the light-emitting device according to Embodiment 1. FIG. It is sectional drawing of schematic structure of the light-emitting device which concerns on a modification. It is sectional drawing of the illuminating device which concerns on Embodiment 2. FIG. It is an external appearance perspective view of the illuminating device which concerns on Embodiment 2, and its peripheral member.

  Hereinafter, a light-emitting device and the like according to embodiments will be described with reference to the drawings. It should be noted that each of the embodiments described below shows a comprehensive or specific example. The numerical values, shapes, materials, constituent elements, arrangement positions and connecting forms of the constituent elements, steps, order of steps, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily shown strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, and the overlapping description may be abbreviate | omitted or simplified.

(Embodiment 1)
[Configuration of light emitting device]
First, the structure of the light-emitting device according to Embodiment 1 will be described with reference to the drawings. FIG. 1 is an external perspective view of the light emitting device according to Embodiment 1. FIG. FIG. 2 is a plan view of the light emitting device according to the first embodiment. FIG. 3 is a plan view showing the internal structure of the light emitting device according to Embodiment 1. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3 is a plan view showing the internal structure of the LED chip 12 and the arrangement of the LED chips 12 and the wiring pattern in which the first sealing member 13 and the dam material 15 are removed from FIG.

  As shown in FIGS. 1 to 4, the light emitting device 10 according to the first embodiment includes a substrate 11, a plurality of LED chips 12, a first sealing member 13, a second sealing member 18, and a buffer layer. 14 and a dam material 15.

  The light emitting device 10 is an LED module having a so-called COB (Chip On Board) structure in which an LED chip 12 is directly mounted on a substrate 11.

  The substrate 11 is a substrate having a wiring region where the wiring 16 is provided. The wiring 16 (and the electrodes 16a and 16b) is a metal wiring for supplying power to the LED chip 12. The substrate 11 is, for example, a metal base substrate or a ceramic substrate. The substrate 11 may be a resin substrate having a resin as a base material.

  As the ceramic substrate, an alumina substrate made of aluminum oxide (alumina), an aluminum nitride substrate made of aluminum nitride, or the like is employed. As the metal base substrate, for example, an aluminum alloy substrate, an iron alloy substrate, a copper alloy substrate, or the like having an insulating film formed on the surface is employed. As the resin substrate, for example, a glass epoxy substrate made of glass fiber and epoxy resin is employed.

  As the substrate 11, for example, a substrate having a high light reflectance (for example, a light reflectance of 90% or more) may be employed. By adopting a substrate having a high light reflectance as the substrate 11, the light emitted from the LED chip 12 can be reflected on the surface of the substrate 11. As a result, the light extraction efficiency of the light emitting device 10 is improved. An example of such a substrate is a white ceramic substrate based on alumina.

  Further, as the substrate 11, a translucent substrate having a high light transmittance may be adopted. Examples of such a substrate include a transparent ceramic substrate made of polycrystalline alumina or aluminum nitride, a transparent glass substrate made of glass, a crystal substrate made of crystal, a sapphire substrate made of sapphire, or a transparent resin substrate made of a transparent resin material. Illustrated.

  In the first embodiment, the substrate 11 is rectangular, but may be other shapes such as a circle.

  As shown in FIG. 3, the plurality of LED chips 12 include a first LED chip 12b and a second LED chip 12r.

  The first LED chip 12b is an example of a first light emitting element, and is a blue LED chip that emits blue light. As the first LED chip 12b, for example, a gallium nitride LED chip having an emission peak wavelength (emission spectrum peak wavelength) of 430 nm or more and 480 nm or less made of an InGaN material is employed.

  The second LED chip 12r is an example of a second light emitting element, and is a red LED chip that emits red light, for example, having a larger emission peak wavelength than the first LED chip 12b. As the second LED chip 12r, for example, a gallium nitride LED chip having an emission peak wavelength of 600 nm or more and 660 nm or less made of an ALGaInP material is employed. The second LED chip 12r is covered with a second sealing member 18 described later.

  On the substrate 11, a plurality of light emitting element arrays including a plurality of LED chips 12 are provided. As shown in FIG. 3, structurally, seven light emitting element rows are provided on the substrate 11 corresponding to the circular shape.

  Electrically, five light-emitting element arrays each including 12 LED chips 12 connected in series are provided on the substrate 11. These five light emitting element rows are connected in parallel and emit light when power is supplied between the electrodes 16a and 16b.

  Here, nine first LED chips 12b and three second LED chips 12r are provided in one light emitting element row electrically. That is, the ratio between the first LED chip 12b and the second LED chip 12r is 3: 1. When viewed from the whole substrate 11, the first LED chip 12b and the second LED chip 12r are arranged so that the first LED chip 12b and the second LED chip 12r are substantially evenly distributed.

  Further, although not shown in detail, the LED chips 12 connected in series are mainly connected to each other by Chip To Chip by bonding wires 17 (some LED chips 12 are connected by wiring 16). . For example, Au (gold), silver (Ag), or copper (Cu) is used as the metal material of the bonding wire 17 and the wiring 16, the electrode 16a, and the electrode 16b.

  As shown in FIGS. 3 and 4, the second sealing member 18 is a member having translucency that individually seals the second LED chip 12 r. The second sealing member 18 transmits and emits the red light from the second LED chip 12r, but it is desirable that the second sealing member 18 emits the red light without reducing the emission intensity as much as possible. For this reason, the second sealing member 18 is formed of a material having a lower absorbance than the first sealing member 13. Specifically, the 2nd sealing member 18 is formed with translucent resin materials, such as transparent resin. It is preferable that the transparent resin does not contain various phosphor particles and does not have a wavelength conversion function. If the absorbance is smaller than that of the first sealing member 13, an additive such as a diffusing agent may be added to the translucent resin material to form the second sealing member 18.

  The second sealing member 18 is formed on the substrate 11 so as to cover the entire second LED chip 12r. Specifically, the 2nd sealing member 18 is formed in the hemispherical shape which becomes convex toward the advancing direction of the light of the 2nd LED chip 12r. The second sealing member 18 is disposed so that the optical axis of the second LED chip 12r passes through the apex portion of the second sealing member 18. Thereby, the red light that has entered the second sealing member 18 from the second LED chip 12 r is emitted from the spherical surface without being totally reflected by the spherical surface of the second sealing member 18.

  In the present embodiment, the case where the second sealing member 18 is hemispherical has been described as an example. However, the second sealing member 18 may be substantially hemispherical even if it is not completely hemispherical. That's fine. Moreover, the 2nd sealing member 18 may be formed in shapes other than a hemispherical shape.

  The first sealing member 13 is a sealing member that is provided on the substrate 11 and seals the plurality of LED chips 12, the bonding wires 17, and the wirings 16. Specifically, the first sealing member 13 directly seals the first LED chip 12 b among the plurality of LED chips 12. On the other hand, the first sealing member 13 covers and seals the entire second sealing member 18, thereby sealing the second LED chip 12 r among the plurality of LED chips 12 via the second sealing member 18. It has stopped. That is, the second sealing member 18 is sandwiched between the first sealing member 13 and the second LED chip 12r.

  Moreover, the surface shape of the 1st sealing member 13 is a plane. When the substrate 11 is viewed in plan, the portion of the first sealing member 13 that overlaps the second sealing member 18 is formed thinner than the portion of the first sealing member 13 that overlaps the first LED chip 12b.

  Note that the surface shape of the first sealing member 13 may not be a flat surface but may be a curved surface.

  The 1st sealing member 13 is comprised with the translucent resin material containing the yellow fluorescent substance particle and the green fluorescent substance particle as a wavelength conversion material. As the translucent resin material, for example, a silicone resin is used, but an epoxy resin or a urea resin may be used. Further, as the green phosphor particles and the yellow phosphor particles, yttrium / aluminum / garnet (YAG) phosphors (phosphor particles) are employed.

  With this configuration, part of the blue light emitted from the first LED chip 12 b is converted into yellow light by the yellow phosphor particles contained in the first sealing member 13. Similarly, part of the blue light emitted from the first LED chip 12 is converted into green by the green phosphor particles contained in the first sealing member 13. On the other hand, the red light emitted from the second LED chip 12 r passes through the second sealing member 18 and enters the first sealing member 13.

  And the blue light which was not absorbed by the yellow phosphor particles and the green phosphor particles, the yellow light wavelength-converted by the yellow phosphor particles, the green light wavelength-converted by the green phosphor particles, and the second LED chip 12r The red light incident from the light is diffused and mixed in the first sealing member 13. As a result, white light with enhanced color rendering is emitted from the first sealing member 13.

  The first sealing member 13 and the second sealing member 18 also have a function of protecting the LED chip 12 and the bonding wire 17 from dust, moisture, external force, and the like.

  The buffer layer 14 is an underlayer for forming the dam material 15 formed on the substrate 11. In the first embodiment, the buffer layer 14 is a glass coat layer formed by glass coating the substrate 11.

  In the first embodiment, the buffer layer 14 is formed across the wiring region and a region other than the wiring region. Therefore, on the substrate 11, there are a portion where the buffer layer 14 is formed so as to cover the wiring region (wiring 16) (shown in FIG. 4) and a portion where the buffer layer 14 is directly formed on the substrate 11. .

  The buffer layer 14 is provided so as to cover the pattern of the substantially annular wiring 16 provided around the plurality of LED chips 12. That is, the buffer layer 14 is formed in an annular shape so as to surround the plurality of LED chips 12 when the substrate 11 is viewed in plan. Note that the buffer layer 14 may be formed in an annular shape having a rectangular outer shape. The thickness of the buffer layer 14 is about 5 μm to 50 μm. Note that, by increasing the thickness of the buffer layer 14, the amount of material used for the dam material 15 can be reduced.

  As shown in FIG. 4, the dam material 15 is a member for damming the first sealing member 13 provided on the upper surface of the buffer layer 14. The dam material 15 has a convex shape whose cross-sectional shape is convex upward.

  For the dam material 15, for example, an insulating thermosetting resin or thermoplastic resin is used. More specifically, the dam material 15 is made of silicone resin, phenol resin, epoxy resin, BT resin, PPA, or the like.

The dam material 15 desirably has light reflectivity in order to increase the light extraction efficiency of the light emitting device 10. Therefore, in the first embodiment, a white resin (so-called white resin) is used for the dam material 15. In order to enhance the light reflectivity of the dam material 15, the dam material 15 may contain particles such as TiO ₂ , Al ₂ O ₃ , ZrO ₂ , and MgO.

  As shown in FIG. 2, in the light emitting device 10, the dam material 15 is formed in an annular shape so as to surround the plurality of LED chips 12 when the substrate 11 is viewed in plan. The first sealing member 13 is filled in a region surrounded by the dam material 15. Thereby, the light extraction efficiency of the light emitting device 10 can be increased. Note that the dam material 15 may be formed in an annular shape having a rectangular outer shape, similar to the buffer layer 14.

[Method for Manufacturing Light Emitting Device]
Next, a method for manufacturing the light emitting device 10 will be described. FIG. 5 is a flowchart of the method for manufacturing the light emitting device 10. 6A to 6E are cross-sectional views illustrating one process of the method for manufacturing the light emitting device 10. 6A to 6E correspond to FIG.

  First, as shown in FIG. 6A, the buffer layer 14 is formed on the substrate 11 on which the wiring 16 has been previously formed (step S11). Here, the buffer layer 14 is specifically formed as follows.

  First, a paste for forming the buffer layer 14 is prepared by adding a solvent to a powdered frit glass (powder glass) and kneading.

  Next, a paste for forming the buffer layer 14 is printed at a predetermined position on the substrate 11 in a predetermined shape. In the first embodiment, printing is performed in an annular shape so as to surround the plurality of LED chips 12. Note that the paste for forming the buffer layer 14 may be applied instead of printing.

  Next, the substrate 11 on which the paste for forming the buffer layer 14 is printed is fired. When the substrate 11 is fired, the glass frit of the paste for forming the buffer layer 14 is softened, and a glass sintered body film is formed as the buffer layer 14 on the substrate 11 or the wiring 16 as shown in FIG. 6B. The

  After the buffer layer 14 is formed, a dam material 15 is formed on the upper surface of the buffer layer 14 as shown in FIG. 6C (step S12). The dam material 15 is formed in an annular shape like the buffer layer 14. A dispenser that discharges white resin is used to form the dam material 15.

  Next, as shown in FIG. 6D, a plurality of LED chips 12 are mounted on the substrate 11 (step S13). The LED chip 12 is mounted by die bonding the LED chip 12 with a die attach agent or the like. At this time, the plurality of LED chips 12 are electrically connected by the bonding wire 17 and the wiring 16.

  Next, as shown in FIG. 6E, the second sealing member 18 is formed on the substrate 11 so as to individually cover the second LED chips 12r among the plurality of LED chips 12 (step S14).

  Then, as shown in FIG. 4, the first sealing member 13 is filled (applied) (step S15). Specifically, a translucent resin material containing yellow phosphor particles and green phosphor particles is injected into a region surrounded by the dam material 15 and cured by heating or light irradiation.

[Effects]
As described above, according to the present embodiment, the second sealing member 18 that seals the second LED chip 12r is interposed between the second LED chip 12r and the first sealing member 13, and is sandwiched. Therefore, the red light emitted from the second LED chip 12 r passes through the first sealing member 13 after passing through the second sealing member 18. That is, the optical path of red light when passing through the first sealing member 13 can be shortened by the second sealing member 18, and the absorption of red light by the first sealing member 13 can be reduced. . Furthermore, since the second sealing member 18 has a smaller absorbance than the first sealing member 13, the emission intensity of the red light transmitted through the second sealing member 18 is compared with the case where the second sealing member 18 transmits through the first sealing member 13. However, it is difficult to weaken. For these reasons, it is possible to suppress a decrease in emission intensity of red light, and to realize a desired color rendering property.

  Moreover, even if it is the light-emitting device 10 which has the so-called dam structure with which the area | region enclosed by the dam material 15 was filled, the light emission intensity fall of red light can be suppressed.

  Further, since the second sealing member 18 is formed in a hemispherical shape, the red light that has entered the second sealing member 18 from the second LED chip 12r is totally reflected by the spherical surface of the second sealing member 18. Rather, it is emitted from the spherical surface. That is, it is possible to further suppress a decrease in emission intensity of red light from the second LED chip 12r.

  Moreover, since the 2nd sealing member 18 is formed with the transparent resin which does not contain fluorescent substance, a light absorbency can be made as small as possible. Therefore, the emission intensity of the red light transmitted through the second sealing member 18 can be further maintained.

  In addition, since the first sealing member 13 seals the second sealing member 18, phosphors (yellow phosphor particles and green phosphor particles) are also present on the second sealing member 18. Become. Therefore, since these phosphors are excited by the blue light passing over the second sealing member 18 to emit white light, it is possible to suppress sparse emission of white light.

[Modification]
In the said Embodiment 1, the case where the 1st sealing member 13 sealed the 2nd sealing member 18 was illustrated. However, a part of the second sealing member 18 may be exposed from the first sealing member 13.

  FIG. 7 is a cross-sectional view illustrating a schematic configuration of a light emitting device 10A according to a modification. Specifically, FIG. 7 corresponds to FIG. In the following description, the same parts as those of the light emitting device 10 of the first embodiment may be denoted by the same reference numerals and the description thereof may be omitted.

  As shown in FIG. 7, the first sealing member 13 a of the light emitting device 10 </ b> A is formed on the substrate 11 as a whole thinner than the thickness of the apex portion of the second sealing member 18. As a result, the apex portion of the second sealing member 18 is exposed from the first sealing member 13 in a state where the entire circumference of the second sealing member 18 in plan view is surrounded by the first sealing member 13. The vertex part exposed from the 1st sealing member 13a is a surface area | region including the part through which the optical axis of the 2nd LED chip 12r in the 2nd sealing member 18 passes.

  As described above, since the apex portion of the second sealing member 18 is exposed from the first sealing member 13a, most of the red light emitted from the second LED chip 12r is transmitted through the first sealing member 13a. Released without. As described above, the absorption of red light by the first sealing member 13 can be significantly reduced, and the decrease in the emission intensity of the red light can be further suppressed. The red light emitted from the second sealing member 18 is mixed with the white light emitted from the first sealing member 13a and the white light that is mixed outside the light emitting device 10A to enhance the color rendering. Become.

  In this modification, the first sealing member 13a is formed thinner than the second sealing member 18 as a whole, so that the apex portion of the second sealing member 18 is exposed. The stop member 13 may be formed thicker than the second sealing member 18. In this case, an opening for exposing the apex portion of the second sealing member 18 may be formed in the first sealing member.

(Embodiment 2)
Next, the illumination device 200 according to Embodiment 2 will be described with reference to FIGS. FIG. 8 is a cross-sectional view of lighting apparatus 200 according to Embodiment 2. FIG. 9 is an external perspective view of lighting device 200 and its peripheral members according to Embodiment 2. FIG.

  As shown in FIGS. 8 and 9, the lighting device 200 according to the second embodiment is a downlight that irradiates light downward (such as a corridor or a wall) by being embedded in a ceiling of a house or the like, for example. And the like.

  The lighting device 200 includes the light emitting device 10. The lighting device 200 further includes a substantially bottomed tubular instrument body configured by coupling the base 210 and the frame body part 220, and a reflector 230 and a translucent panel 240 disposed in the instrument body. Is provided.

  The base 210 is a mounting base to which the light emitting device 10 is attached and a heat sink that dissipates heat generated in the light emitting device 10. Base 210 is formed in a substantially cylindrical shape using a metal material, and is made of aluminum die casting in the second embodiment.

  A plurality of radiating fins 211 projecting upward are provided on the upper portion (ceiling side portion) of the base portion 210 at regular intervals along one direction. Thereby, the heat generated in the light emitting device 10 can be radiated efficiently.

  The frame body part 220 has a substantially cylindrical cone part 221 having a reflection surface on the inner surface, and a frame body part 222 to which the cone part 221 is attached. The cone portion 221 is formed using a metal material, and can be manufactured by drawing or press-molding an aluminum alloy or the like, for example. The frame main body 222 is formed of a hard resin material or a metal material. The frame body part 220 is fixed by attaching the frame body body part 222 to the base part 210.

  The reflection plate 230 is an annular frame-shaped (funnel-shaped) reflection member having an internal reflection function. The reflector 230 can be formed using a metal material such as aluminum. The reflector 230 may be formed of a hard white resin material instead of a metal material.

  The translucent panel 240 is a translucent member having light diffusibility and translucency. The translucent panel 240 is a flat plate disposed between the reflection plate 230 and the frame body portion 220, and is attached to the reflection plate 230. The translucent panel 240 can be formed in a disk shape with a transparent resin material such as acrylic or polycarbonate.

  Note that the lighting device 200 may not include the translucent panel 240. By not providing the translucent panel 240, the luminous flux of light emitted from the lighting device 200 can be improved.

  As shown in FIG. 9, the lighting device 200 is connected to a lighting device 250 that supplies lighting power to the light emitting device 10 and a terminal block 260 that relays AC power from a commercial power source to the lighting device 250. .

  The lighting device 250 and the terminal block 260 are fixed to a mounting plate 270 provided separately from the instrument body. The mounting plate 270 is formed by bending a rectangular plate member made of a metal material. The lighting device 250 is fixed to the lower surface of one end portion in the longitudinal direction, and the terminal block 260 is mounted on the lower surface of the other end portion. Fixed. The mounting plate 270 is connected to a top plate 280 fixed to the upper part of the base 210 of the instrument body.

  The illuminating device 200 includes the light emitting device 10 so that a decrease in emission intensity of red light is suppressed. That is, it can be said that the lighting device 200 is a lighting device that can achieve a desired color rendering property.

  In the second embodiment, the downlight is exemplified as the lighting device, but the present invention may be realized as another lighting device such as a spotlight.

(Other embodiments)
Although the light emitting device 10 and the lighting device 200 according to the embodiment have been described above, the present invention is not limited to the above embodiment.

  Moreover, in the said embodiment, although the buffer layer 14 and the dam material 15 were cyclically formed so that the LED chip 12 might be enclosed, the shape of the buffer layer 14 and the dam material 15 etc. are not specifically limited. . Further, the dam material 15 may be formed directly on the substrate 11 without providing the buffer layer 14.

  Moreover, in the said embodiment, although white light was emitted by the combination of 1st LED chip 12b which emits blue light, yellow fluorescent substance particle, and green fluorescent substance particle, the structure for emitting white light is not restricted to this. . For example, an ultraviolet LED chip that emits ultraviolet light having a shorter wavelength than the first LED chip 12b, and blue phosphor particles that emit blue light, yellow light, and green light when excited mainly by ultraviolet light, yellow The phosphor particles and the green phosphor particles may be combined.

  Moreover, in the said embodiment, 2nd LED chip 12r which emits red light was illustrated and demonstrated as a light emitting element which does not aim at excitation of fluorescent substance. However, if it is not intended to excite the phosphor, it is possible to employ a second LED chip that emits other color light. In this case, it is desirable that the first sealing member 13 does not include the phosphor excited by the other color light. However, even if it is included, the second LED chip is sealed with the second sealing member. It is possible to suppress a decrease in emission intensity.

  Moreover, in the said embodiment, the case where the LED chip 12 mounted in the board | substrate 11 was connected with the other LED chip 12 and the bonding wire 17 by Chip To Chip was illustrated. However, the LED chip 12 may be connected to the wiring 16 (metal film) provided on the substrate 11 by the bonding wire 17 and electrically connected to another LED chip 12 through the wiring 16.

  Moreover, in the said embodiment, LED chip 12 was illustrated as a light emitting element used for the light-emitting device 10. FIG. However, other types of solid-state light-emitting elements such as semiconductor light-emitting elements such as semiconductor lasers or EL elements such as organic EL (Electro Luminescence) or inorganic EL may be employed as the light-emitting elements.

  The configuration of the present disclosure can also be applied to a line module in which light emitting elements are mounted in a line in only one row.

  In addition, it is realized by variously conceiving various modifications conceived by those skilled in the art for each embodiment, or by arbitrarily combining the components and functions in each embodiment without departing from the spirit of the present invention. This form is also included in the present invention.

10, 10A Light emitting device 11 Substrate 12b First LED chip (first light emitting element)
12r Second LED chip (second light emitting element)
13, 13a 1st sealing member 18 2nd sealing member 200 Illuminating device

Claims (5)

A substrate,
A first light emitting device mounted on the substrate;
A second light emitting device having an emission peak wavelength greater than the emission peak wavelength of the first light emitting device;
A first sealing member that seals the first light emitting element, the first sealing member including a phosphor that emits fluorescence by light emitted from the first light emitting element;
A second sealing member that seals the second light emitting element with at least a portion sandwiched between the first sealing member and the second light emitting element;
A dam material provided on the substrate and surrounding the first light emitting element and the second light emitting element;
With
The second sealing member has a smaller absorbance than the first sealing member,
The first sealing member is filled in a region surrounded by the dam material so as to be thicker than the second sealing member,
A surface region including a portion of the second sealing member through which an optical axis of the second light emitting element passes is exposed through an opening formed in the first sealing member. The light emitting device according to claim 1 , wherein the second sealing member is formed in a hemispherical shape. It said second sealing member, the light emitting device according to claim 1 or 2 is formed of a transparent resin containing no said phosphor. The first light emitting element is a blue LED emitting blue light,
The second light emitting element emitting device according to any one of claims 1 to 3, which is a red LED that emits red light. An illuminating device comprising the light emitting device according to any one of claims 1 to 4 .

Images