JP2019121678A - Light-emitting device - Google Patents

Abstract

To provide a light-emitting device in which a mixed color between regions is promoted without separating a plurality of regions with a dub member.SOLUTION: A light-emitting device includes: substrates 10 and 11; a plurality of first light emitting elements 31 mounted in a first region 61 of each substrate; a plurality of second light emitting elements 32 mounted in a second region 62 arranged so as to surround the first region on an outer side of the first region on each substrate; a first sealing resin 41 which contains a first fluorescence substance and is for sealing the plurality of first light emitting elements; a second sealing resin 42 which contains a second particle-like fluorescence substance different from the first fluorescence substance, and is for sealing the plurality of second light emitting elements; and a dam member 20 arranged on the outer side of the second region. The light-emitting device is constructed so that thixotropy before hardening of the first sealing resin is higher than the thixotropy before hardening of the second sealing resin, the second particle fluorescence substance forms a phosphor layer by settling in the circumference of the second light emitting element in the second sealing resin, and a part of a light projected from the first sealing resin is directly ejected to the outer part through an upper part of the phosphor layer in the second sealing resin.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting device.

  There is known a COB (Chip On Board) type light emitting device in which a light emitting element such as an LED (light emitting diode) element is mounted on a general-purpose substrate such as a ceramic substrate or a metal substrate. According to such a light emitting device, for example, by sealing a light emitting element that emits blue light with a resin containing a phosphor, and mixing light obtained by exciting the phosphor with light from the light emitting element It is possible to obtain the corresponding light.

  When the light emitting elements disposed in different regions on the substrate are sealed with different sealing resins, in order to prevent mixing of different sealing resins, a configuration in which a dam material is provided between the regions is adopted. That is, a dam material is formed of a resin other than the sealing resin at the boundary between one region and the other region, and the sealing resin is injected into the region partitioned by the dam material to manufacture the light emitting device.

  Since the resin forming the dam material does not emit light, this configuration has a problem that the light amount per unit area decreases and the light emitting region is not uniform. In order to cope with such a problem, techniques such as Patent Literature 1-2 have been proposed.

  In Patent Document 1, a plurality of LED chips are sealed using a first sealing resin having high thixotropy without using a dam material, and the first sealing resin is used as a dam with thixotropy inside thereof. A light emitting device is described that seals multiple LED chips with a low second sealing resin.

  Patent Document 2 describes a light emitting device in which the inner side of a light reflecting member arranged in a circular shape is divided into two regions concentrically by a circular inner frame covering a second light emitting element without using a dam material. It is done. In addition, a sealing member is injected into the inner region and the outer region of the inner frame to cover the first light emitting element. Thus, in the light emitting device described in Patent Document 2, three regions are formed concentrically.

Unexamined-Japanese-Patent No. 2015-084397 gazette International Publication No. 2013/015058

  In the light emitting device described in Patent Document 1, although the dam material is not used, since the phosphor particles are uniformly dispersed in the second sealing resin, the light emitted from the first sealing resin is And the second sealing resin. Therefore, when all the LED chips sealed with the first and second sealing resins are caused to emit light at one time, the area of the first sealing resin and the area of the second sealing resin are clearly distinguished. It will That is, color mixing of light emitted from the area of the first sealing resin and light emitted from the second sealing resin is less likely to occur.

  Further, even in the light emitting element described in Patent Document 2, the first light emitting element and the second light emitting element are lighted at one time because the light emitted from the inner frame is not configured to be incident into the inner area and the outer area. If this is done, the inner frame, the inner area and the outer area are clearly distinguished. That is, color mixing of light emitted from the inner frame, the inner region, and the outer region is less likely to occur.

  Therefore, an object of the present invention is to provide a light emitting device in which color mixing between regions is promoted without dividing the plurality of regions by a dam material.

  A light emitting device according to the present invention comprises a substrate, a plurality of first light emitting elements mounted in a first region on the substrate, and a first region arranged outside the first region on the substrate so as to surround the first region. A plurality of second light emitting elements mounted in two regions, a first sealing resin for sealing the plurality of first light emitting elements including the first phosphor, and a particle-shaped first different from the first phosphor (2) A second sealing resin for sealing a plurality of second light emitting elements including a phosphor, and a dam member disposed outside the second region, and before curing of the first sealing resin The thixotropy is higher than that before curing of the second sealing resin, and the particulate second phosphor precipitates around the second light emitting element in the second sealing resin to form a phosphor layer, A part of the light emitted from the first sealing resin is directly emitted to the outside through the upper portion of the phosphor layer in the second sealing resin.

  In the light emitting device according to the present invention, since the light emitting element is mounted apart from the substrate in the region sealed with the sealing resin having high thixotropy, the plurality of regions are not partitioned by the dam material, It is possible to provide a light emitting device with improved color mixing between regions.

(A) is a top view of the light emitting device 1 according to the first embodiment of the present invention, (b) is a cross-sectional view taken along the line AA 'in (a), and (c) is a cross-sectional view taken along the line BB' in (a) It is. (A) is a top view at the time of fixing the circuit board 11 which arranged the wiring pattern in the light-emitting device 1 on the mounting board 10, (b) is AA 'sectional drawing of (a), (c) ) Is a BB ′ sectional view of (a). (A) is a top view of the state where the LED element is mounted on the substrate described in FIG. 2 in the light emitting device 1, (b) is a cross-sectional view taken along the line AA 'of (a), (c) ) Is a BB ′ sectional view of (a). (A) is a top view of a state where a resist is applied on the substrate described in FIG. 3 in the light emitting device 1, (b) is an AA ′ sectional view of (a), (c) is It is BB 'sectional drawing of (a). (A) is a top view of a state in which a dam member is formed on the substrate described in FIG. 4 in the light emitting device 1, (b) is an AA ′ sectional view of (a), (c) ) Is a BB ′ sectional view of (a). (A) is a top view of the state in which 1st sealing resin was formed on the board | substrate described in FIG. 5 in the light-emitting device 1, (b) is AA 'sectional drawing of (a). (C) is a BB 'sectional view of (a). (A) is a schematic diagram explaining the radiation | emission of the light in the part P shown by the dotted line in FIG. 1, (b) is a schematic diagram for demonstrating the radiation | emission path of the light in the light-emitting device of a comparative example. . (A) is a top view of the light emitting device 2 according to the second embodiment of the present invention, (b) is a cross-sectional view taken along the line AA 'of (a), (c) is a cross-sectional view taken along the line BB' of (a) It is.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, it should be understood that the technical scope of the present invention is not limited to those embodiments.

  1 (a) is a top view of the light emitting device 1 according to the first embodiment of the present invention, FIG. 1 (b) is a cross-sectional view of the light emitting device 1 taken along line AA ', and FIG. 1 (c) is a light emitting device FIG. 2 is a cross-sectional view taken along line BB ′ of FIG.

  The light emitting device 1 includes the mounting substrate 10, the circuit substrate 11, the resist 12, the electrode pad 15, the dam member 20, the first LED element 31 to the third LED element 33, and the first sealing resin 41 to the third sealing. And a stop resin 43.

  The first sealing resin 41 to the third sealing resin 43 include the first fluorescent substance 44 to the third fluorescent substance 46, respectively. Wiring patterns 51 to 56 are disposed on the circuit board 11. The LED terminals and between the LED terminals and the wiring pattern are electrically connected by bonding wires 90.

  In FIG. 1B, the second phosphor 45 and the third phosphor 46 are omitted in the right half, and the bonding wire 90 is omitted in the left half.

  The mounting substrate 10 is a flat substrate made of aluminum excellent in heat resistance and heat dissipation and having mounting regions of the first LED element 31 to the third LED element 33. The mounting substrate 10 has a substantially rectangular shape, and around the mounting substrate 10, four notches 16 to 19 for attaching the light emitting device 1 to a lighting fixture or the like are provided. The mounting substrate 10 also functions as a heat sink that dissipates the heat generated by the first to third LED elements 31 to 33 and the first to third phosphors 44 to 46. The material of the mounting substrate 10 may be another metal such as copper as long as it is excellent in heat resistance and heat dissipation, and the shape is not limited to rectangular and may be square, polygon or the like. Further, the shape and the number of notches are not limited to those shown in FIG. 1 (a).

  The circuit board 11 is an insulating board such as a glass epoxy board, for example, and has a substantially rectangular shape of the same size as the mounting board 10. The circuit board 11 has its back surface affixed and fixed to the top surface of the mounting substrate 10 by, for example, an adhesive sheet or the like. Hereinafter, the mounting substrate 10 and the circuit substrate 11 fixed to the upper surface of the mounting substrate 10 are collectively referred to as a “substrate”. The circuit board 11 may be another material such as ceramic as long as it is insulating, and the shape may not necessarily be the same as the mounting board 10. Similar to the mounting substrate 10, four notches are provided around the circuit substrate 11.

  The resist 12 is an insulating white paint and is applied to the surface of the circuit board 11. The resist 12 is provided for the purpose of preventing a short circuit between the wiring patterns disposed on the circuit board 11 or a short circuit between the wiring pattern and the bonding wire.

  FIG. 2A is a top view of the light emitting device 1 when the circuit board 11 having a wiring pattern disposed on the mounting board 10 is fixed, and FIG. 2B is an AA 'of FIG. FIG. 2 (c) is a cross-sectional view taken along the line BB 'of FIG. 2 (a).

  Four openings 11a to 11d are formed in the circuit board 11, and the surface of the mounting substrate 10 is exposed from each of the four openings 11a to 11d. The openings 11 a and 11 b are disposed substantially at the center of the circuit board 11 and each have a semicircular shape. The openings 11c and 11d are arranged to surround the semicircular openings 11a and 11b, respectively, and are arch-shaped. Regions 11e and 11f of the circuit board 11 having an arch shape are disposed between the openings 11a and 11c and between the openings 11b and 11d, respectively.

  The wiring patterns 51 to 55 are formed substantially concentrically around the four openings 11 a to 11 d and the regions 11 e to 11 f on the surface of the circuit board 11. The wiring pattern 56 is formed in a straight line in the region between the openings 11 a and 11 b. The wiring patterns 51 to 56 are formed by gold plating, but may be formed of another metal thin film.

  FIG. 3A is a top view of the light emitting device 1 in which the LED element is mounted on the substrate described in FIG. 2 and a resist is disposed, and FIG. FIG. 3 (c) is a cross-sectional view taken along line BB ′ of FIG. 3 (a).

  The first area 61 is an area between the wiring patterns 52 and 53. The first region 61 includes the regions 11 e and 11 f of the circuit board 11. The 130 first LED elements 31 are mounted in the first area 61 on the surface of the circuit board 11. The 26 sets of first LED elements 31 connected in series by five each are electrically connected by bonding wires 90 so as to be in parallel between the wiring patterns 52 and 53.

  The second region 62 is a region between the wiring patterns 54 and 55. The second region 62 includes the openings 11 c and 11 d of the circuit board 11. The 120 second LED elements 32 are mounted in the second region 62 of the mounting substrate 10 exposed from the openings 11 c and 11 d of the circuit substrate 11. The twenty-four sets of the second LED elements 32 connected in series are connected electrically by bonding wires 90 so as to be in parallel between the wiring patterns 54 and 55.

  The third area 63 is an area surrounded by the wiring pattern 51. The third region 63 includes the openings 11 a and 11 b of the circuit board 11. In the third region 63 of the mounting substrate 10 exposed from the openings 11 a and 11 b of the circuit substrate 11, 198 third LED elements 33 are mounted. The nineteen sets of 22 third LED elements 33 connected in series are electrically connected by bonding wires 90 so as to be in parallel between the wiring patterns 51 and 56.

  In the light emitting device 1, all of the first to third LED elements 31 to 33 are blue LED dies of the same type that emit blue light having an emission wavelength band of about 450 to 460 nm. The first to third LED elements 31 to 33 are not limited to the blue LED die but may be, for example, a violet LED die or a near ultraviolet LED die, and the emission wavelength band thereof is in the range of about 200 to 460 nm including the ultraviolet region It may be

  The first LED element 31 is fixed to the side of the circuit board 11 with an insulating adhesive (die bond) with the light emitting surface facing the side opposite to the circuit board 11. Each of the second LED element 32 and the third LED element 33 is fixed to the mounting substrate 10 with an insulating adhesive (die bond) with the light emitting surface facing the opposite side to the mounting substrate 10.

  The total number of LED elements mounted on the substrate, the number of LED elements connected in series, and the number of sets of LED elements connected in parallel shown in FIG. 3 are all examples, and other numbers are also possible. Good. In addition, in AA 'cross section figure of FIG.3 (b) etc., the number of objects of a LED element is lessened for description and it describes typically.

  Eight portions shown by dotted lines in FIG. 3A indicate portions exposed on the surface as the electrode pads 15 after the resist 12 is applied.

  4 (a) is a top view of the light emitting device 1 in a state where a resist is applied on the substrate described in FIG. 3, and FIG. 4 (b) is a cross-sectional view taken along line AA 'of FIG. 4 (a). 4 (c) is a cross-sectional view taken along the line BB 'in FIG. 4 (a).

  The resist 12 is a circuit except the periphery of the four openings 11a to 11d, the regions 11e to 11f where the first LED element 31 is disposed, and the portions exposed on the surface as the electrode pads 15 on the wiring patterns 51 to 56. It is applied so as to cover the substrate 11. In FIG. 4A, for the sake of explanation, the portions to which the resist 12 is applied are indicated by oblique lines.

  Each of the electrode pads 15 is electrically connected to the LED element through one of the wiring patterns 51 to 56. These are appropriately connected to an external power supply, and a predetermined voltage is applied, whereby the first LED element 31 to the third LED element 33 emit light.

  Each of the electrode pads 15 is a pair, one being an anode and the other being a cathode. The electrode pad 15 is formed so as to be able to solder a connector pin connectable to an external power supply. When the electrode pad 15 is connected to the external power supply and a voltage is applied, the first LED element 31 to the third LED element 33 emit light.

  5 (a) is a top view of the light emitting device 1 in a state where a dam member is formed on the substrate described in FIG. 4, and FIG. 5 (b) is a cross-sectional view taken along line AA 'of FIG. 5 (a). 5 (c) is a cross-sectional view taken along the line BB 'in FIG. 5 (a).

  The dam member 20 is a frame for preventing the second sealing resin 42 from flowing out, and is formed on the outer edge side of the openings 11 c to 11 d so as to cover the wiring pattern 55. The dam member is a thermosetting silicone resin mixed with a white paint, and has light reflectivity after curing. For this reason, the light emitted laterally from the second LED elements 32 disposed in the openings 11 c to 11 d is reflected toward the front of the light emitting device 1, so that the light emission intensity at the front of the light emitting device 1 is increased.

  6 (a) is a top view of the light emitting device 1 in which the first sealing resin 41 is disposed on the substrate described in FIG. 5, and FIG. 6 (b) is a top view of FIG. FIG. 6 (c) is a cross-sectional view taken along line BB ′ of FIG. 6 (a).

  The first sealing resin 41 is made of a resin whose thixotropy before curing is higher than the thixotropy of the second sealing resin 42 and the third sealing resin 43 before curing. The first sealing resin 41, the second sealing resin 42, and the third sealing resin 43 are formed of an epoxy resin, an acrylic resin, a polycarbonate resin, a silicone resin, or the like. The first sealing resin 41 is the same kind of resin having a molecular weight larger than that of the second sealing resin 42 and the third sealing resin 43, or the same resin as the second sealing resin 42 and the third sealing resin 43. And thickeners, fillers and the like.

  Thixotropy is a reversible property in which the viscosity decreases when mechanical agitation is applied to the resin body and returns to the original state (viscosity) when left to stand. The resin with high thixotropy decreases in viscosity by stirring, and returns to its original viscosity by leaving it to stand. When the highly viscous resin with reduced viscosity is disposed on the substrate by stirring, the original viscosity is restored, so that the shape when disposed can be maintained.

  In the resin forming the first sealing resin 41, the ratio (thixo ratio) of the viscosity at 30 rpm to the viscosity at 60 rpm of the composition at 25 ° C. before curing is about 1.5 to 4.5. On the other hand, the thixo ratio before curing of the second sealing resin 42 and the third sealing resin 43 is about 1.0 to 1.5. The magnitude of the thixotropy corresponds to the height of the thixotropy. That is, a resin with a large thixo ratio is high in thixotropy, and it is easier to maintain the shape than a resin with a small thixo ratio.

  At this time, if the viscosity of the resin before curing is too high, processing and handling become difficult, and if the viscosity is too low, the shape can not be maintained even if the viscosity returns to the original viscosity. The viscosity of the resin constituting the first sealing resin 41 in the light emitting device 1 at 25 ° C. before curing is about 8 to 100 Pa · s, which is suitable for processing and handling before curing, and the shape before curing. It can be maintained properly.

  As described above, since the first sealing resin 41 has relatively high thixotropy before curing, the first sealing resin 41 can maintain its shape when it is arranged for a predetermined time after being arranged. By heating and curing within a predetermined time, the first sealing resin 41 can be formed in an appropriate shape without partitioning the regions 11 e to 11 f by the dam member.

  At this time, it is preferable that the first sealing resin 41 be formed so as not to cover the connection portion to which the bonding wire 90 is connected in the wiring patterns 52 and 53.

  The second sealing resin 42 before curing is disposed so as to cover the second LED element 32 of the light emitting device 1 in a state in which the first sealing resin 41 is disposed and cured as illustrated in FIG. 6. Further, the third sealing resin 43 before curing is disposed so as to cover the third LED element 33.

  Since the second sealing resin 42 and the third sealing resin 43 have lower thixotropy than the first sealing resin 41, they tend to be deformed after being disposed. However, the area where the second sealing resin 42 is disposed is surrounded by the dam member 20 and the first sealing resin 41, and the area where the third sealing resin 43 is disposed is the first sealing resin 41. Because it is surrounded by, it does not flow out of the area.

  The first sealing resin 41 includes a first phosphor 44. The first phosphor 44 absorbs the blue light from the first LED element 31 and emits 6500 K light. The first phosphors 44 are uniformly distributed inside the first sealing resin 41.

  The second sealing resin 42 includes the second phosphor 45, and the third sealing resin 43 includes the third phosphor 46. The second phosphor 45 and the third phosphor 46 absorb blue light from the second LED element 32 and the third LED element 33 and emit white light of 3000K. The second phosphor 45 and the third phosphor 46 are particle phosphors different from the first phosphor 44.

  Since the first sealing resin 41 including the first phosphor 44 has a relatively high thixotropy and a relatively large viscosity, the inside of the first sealing resin 41 after the first phosphor 44 is disposed on the substrate Hard to flow. The first sealing resin 41 is heated and cured in a state where the first phosphors 44 are uniformly distributed inside.

  The second sealing resin 42 containing the second phosphor 45 and the third sealing resin 43 containing the third phosphor 46 have a relatively low thixotropy and a relatively low viscosity. The third phosphor 46 flows inside the second sealing resin 42 and the third sealing resin after being disposed on the substrate, and settles around the second LED element 32 and the third LED element 33. The second sealing resin 42 and the third sealing resin 43 are heated in a state where the second phosphor 45 and the third phosphor 46 form a phosphor layer around the second LED element 32 and the third LED element 33, Be cured.

  Here, that the second phosphor 45 and the third phosphor 46 precipitate in the second sealing resin 42 and the third sealing resin 43 means that the second sealing resin 42 and the third sealing resin 43 are in the thickness direction. When divided into two, more than 50% of the particles of the phosphor contained in the entire sealing resin are present in the lower layer portion, and the remainder is present in the upper layer portion. More preferably, more than 70% of the phosphor particles contained in the entire sealing resin are present in the lower layer portion and the remainder is present in the upper layer portion. As the phosphors precipitate, the upper layer portion of the second sealing resin 42 and the third sealing resin 44 is in a state in which the ratio of the phosphors is larger than that of the lower layer portion.

  In addition, in FIG. 1 etc., the particle size of fluorescent substance is expanded and described typically for description, and it is not described as corresponding to the particle size of the actual fluorescent substance.

  Since the second phosphor 45 and the third phosphor 46 are precipitated around the second LED element 32 and the third LED element 33 to form a phosphor layer, the first phosphor contained in the first sealing resin 41 The ratio of the second phosphor 45 and the third phosphor 46 is smaller in the upper layer portion of the second sealing resin 42 and the third sealing resin 43 on which the light emission in the lateral direction from 44 is incident as compared with the lower layer portion. Therefore, the light emission in the lateral direction from the first phosphor 44 is not easily inhibited, and color mixing is promoted.

  Further, the second phosphor 45 and the third phosphor 46 are precipitated around the second LED element 32 and the third LED element 33 to form a phosphor layer, whereby the second phosphor 45 and the third phosphor 46 are formed. Since the distance between the second LED element 32 and the third LED element 33 is reduced, the phosphor from the LED elements can be excited more efficiently. In addition, since the phosphor is located near the mounting substrate 10, the heat generated by the excited phosphor can be transferred to the mounting substrate 10 more efficiently.

  FIG. 7 (a) is a schematic view for explaining the light emission path of light in a portion P indicated by a dotted line in FIG. 1, and FIG. 7 (b) illustrates the light emission path in the light emitting device of the comparative example. It is a schematic diagram for doing.

  As shown in FIG. 7A, in the light emitting device 1 according to the present invention, the light emitted from the first LED element 31 to the second sealing resin 42 proceeds in the direction of the arrow X1, and the light from the first LED element 31 to the third The light emitted to the sealing resin 43 side proceeds in the direction of the arrow X2.

  In the light emitting device 1, the second phosphor 45 contained in the second sealing resin 42 and the third phosphor 46 contained in the third sealing resin 43 are around the second LED element 32 and the third LED element 33, that is, mounted It settles on the surface of the substrate 10 to form a phosphor layer. Therefore, in the portion where the arrow X1 passes in the second sealing resin 42 and in the portion where the arrow X2 passes in the third sealing resin 43, the proportion of the phosphor is smaller than the periphery of the LED element.

  Further, in the light emitting device 1, the first LED element 31 is mounted on the surface of the circuit board 11 fixed on the surface of the mounting board 10. That is, since the first LED element 31 is separated from the surface of the mounting substrate 10 where the second LED element 32 and the third LED element 33 form the phosphor layer, the light emitted from the first LED element 31 is the second sealing resin 42 And in the part which passes 3rd sealing resin 43, the ratio of fluorescent substance is smaller than the surface vicinity of the mounted substrate 10. FIG.

  FIG. 7B shows the light emission path in the light emitting device of the comparative example having the second sealing resin 42 'and the third sealing resin 43' in which the phosphors are uniformly distributed. In the light emitting device of the comparative example, the light emitted from the first LED element 31 to the second sealing resin 42 'proceeds in the direction of the arrow X1', and the light emitted from the first LED element 31 to the third sealing resin 43 ' Go in the direction of arrow X2 '.

  In the light emitting device of the comparative example, a portion where the arrow X1 passes in the second sealing resin 42 'and a portion where the arrow X2 passes in the third sealing resin 43' Exists. Therefore, the light emitted from the first LED element 31 is absorbed by the phosphor, and color mixing hardly occurs.

  As described above, in the light emitting device 1, since the second phosphor 45 and the third phosphor 46 are precipitated, color mixing between the regions is promoted.

  When the second sealing resin 42 and the third sealing resin 43 are configured to emit a worm-based white light of 3000 K as in the light emitting device 1 of the present embodiment, the second phosphor 45 and the third phosphor 46 is reddish, it easily absorbs the blue light emitted from the first LED element 31, and the reduction of color mixing tends to be a problem in particular. Therefore, it is important to promote color mixing by the configuration of the present embodiment.

  Here, a method of manufacturing the light emitting device 1 described in FIG. 1 will be described.

  First, the circuit board 11 on which the wiring patterns 51 to 56 are arranged is fixed to the mounting board 10. FIG. 2 corresponds to the state at this time.

  Next, the LED elements 31 to 33 are disposed in the openings 11 a to 11 d and the regions 11 e to 11 f of the circuit board 11. Subsequently, the LED elements 31 to 33 and the wiring patterns 51 to 56 are connected by the bonding wires 90. FIG. 3 corresponds to the state at this time.

  Then, a resist 12 is formed on the surface of the circuit board 11. FIG. 4 corresponds to the state at this time.

  Furthermore, the outer frame 16 is formed outside the openings 11 c to 11 d. FIG. 5 corresponds to the state at this time.

  Then, the first sealing resin 41 is disposed to cover the first LED element 31. FIG. 6 corresponds to the state at this time.

  Finally, the second sealing resin 42 is disposed so as to cover the second LED element 32, and the third sealing resin 43 is disposed so as to cover the third LED element 33. Thus, the light emitting device described in FIG. Ru.

  Although the light emitting device 1 can be manufactured by the process including the above steps, this is an example of the manufacturing method, and the present invention is not limited to this manufacturing method.

  8 (a) is a top view of the light emitting device 2 according to the second embodiment of the present invention, (b) is a cross-sectional view taken along the line AA 'of (a), and (c) is a line BB' of (a). FIG.

  In the description of the light emitting device 2, the same parts as those of the light emitting device 1 are denoted by the same reference numerals, and the detailed description is omitted.

  The light emitting device 2 includes a first LED element 31 mounted in a circular first area 61 near the center of the substrate, a second LED element 32 mounted in an annular second area 62 surrounding the first LED element 31, and a first LED A first sealing resin 41 for sealing the element 31 and a second sealing resin 42 for sealing the second LED element 32 are included.

  The first LED element 31 is mounted on the circuit board 11. The second LED element 32 is mounted on the mounting substrate 10.

  The first phosphors 44 are uniformly distributed inside the first sealing resin 41 having a relatively high thixotropy before curing and a relatively large viscosity. The second phosphor 45 is distributed inside the second sealing resin 42 which has a relatively low thixotropy before curing and a relatively low viscosity, and precipitates around the second LED element 32 to form a phosphor layer.

  The light emitting device 2 configured in this way can promote color mixing between the first area 61 and the second area 62.

  In the present specification, the light emitting device 1 in which the light emitting region is divided into three and the light emitting device 2 in which the light emitting region is divided into two are described as the embodiment of the present invention. Embodiments of the present invention are not limited to these, and, for example, the present invention is similarly applicable to a light emitting device in which a light emitting region is divided into four or more.

DESCRIPTION OF SYMBOLS 1, 2 Light-emitting device 10 Mounting board 11 Circuit board 12 Resist 15 Electrode pad 20 Dam member 31, 32, 33 LED element 41, 42, 43 Seal resin 44, 45, 46 Phosphor 51, 52, 53, 54, 55 , 56 wiring pattern 61 first area 62 second area 63 third area 90 bonding wire

Claims (4)

A substrate,
A plurality of first light emitting elements mounted in a first area on the substrate;
A plurality of second light emitting elements mounted in a second area disposed to surround the first area outside the first area on the substrate;
A first sealing resin for sealing the plurality of first light emitting elements, including a first phosphor;
A second sealing resin for sealing the plurality of second light emitting elements including a particulate second phosphor different from the first phosphor;
And a dam member disposed outside the second area,
The thixotropy of the first sealing resin before curing is higher than the thixotropy of the second sealing resin before curing,
The particulate second phosphor precipitates around the second light emitting element in the second sealing resin to form a phosphor layer,
A part of the light emitted from the first sealing resin is directly emitted to the outside through the upper portion of the phosphor layer in the second sealing resin.
A light emitting device characterized by   The light emitting device according to claim 1, wherein the plurality of first light emitting elements are mounted on a circuit board disposed on the substrate. The light emitting device further includes a plurality of third light emitting elements mounted in a third region arranged to be surrounded by the first region inside the first region on the substrate,
The second sealing resin seals the plurality of third light emitting elements,
The light emitting device according to claim 1, wherein the second sealing resin is divided into two regions by the first sealing resin inside the dam member.   The light emitting device according to claim 3, wherein the first to third light emitting elements emit light of the same wavelength.

Images