JP2017143104A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device enhanced in the mixed color property of emission light from a plurality of light-emitting parts which can be driven independently.SOLUTION: A light-emitting device comprises: a substrate having, on its upper face side, a central region and an outer peripheral region which surrounds the central region and is lower than the central region in height; pluralities of first and second light-emitting elements which are mounted on the central region and the outer peripheral region respectively; first and second sets of electrode terminals electrically connected with the pluralities of first and second light-emitting elements respectively; a translucent first sealing frame disposed on an edge part of the central region, and surrounding the central region; a first sealing resin charged into a space over the central region surrounded by the first sealing frame, and integrally sealing the plurality of first light-emitting elements; a second sealing frame having reflectivity, disposed on an edge part of the outer peripheral region so as to surround the central region and the outer peripheral region, and having an upper end lower than that of the first sealing frame; and a second sealing resin charged into a space over the outer peripheral region surrounded by the first and second sealing frames, and integrally sealing the plurality of second light-emitting elements.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting device.

  2. Description of the Related Art A COB (Chip On Board) light emitting device in which a light emitting element such as an LED (light emitting diode) element is mounted on a general-purpose substrate such as a ceramic substrate or a metal substrate is known. In such a light-emitting device, for example, an LED element that emits blue light is sealed with a resin containing a phosphor, and light obtained by exciting the phosphor with light from the LED element is mixed, depending on the application. White light is obtained.

  Patent Document 1 describes a planar light emitting device having a COB structure that emits light arranged in two or more colors and emits light effectively by arranging light emitting elements at a boundary between the two colors without any interval. ing. The light emitting device includes a substrate, light emitting elements arranged in a mounting region on the substrate, a frame formed around the mounting region on the substrate, and a light emitting device that is filled inside the frame to seal the light emitting element. And a sealing member that transmits light emitted from the light emitting element, and the irradiation area surrounded by the frame body in plan view is divided into a first irradiation area at the center and a second irradiation area surrounding the irradiation area. Irradiate with luminescent color. The light-emitting device further includes a light-transmitting wall that is separated from the second irradiation region in order to separate the second sealing member of the second irradiation region containing the phosphor in the first irradiation region. Since the light-transmitting wall transmits light emitted by the embedded light-emitting element, light is evenly irradiated even in the vicinity of the boundary with the second irradiation region.

JP 2013-051375 A

  In the light emitting device of Patent Document 1, a part of the light emitting elements is also disposed under the light transmitting wall that divides the first irradiation region and the second irradiation region. For this reason, if the phosphor is not mixed not only in the sealing member for sealing the light emitting element but also in the light transmitting wall, only the light emitting element arranged under the light transmitting wall is not covered with the phosphor, and direct light is emitted. Therefore, color unevenness may occur in the translucent wall portion. Further, in the light emitting device of Patent Document 1, the irradiation area is doubled, but since all the light emitting elements are turned on at the same time, color matching cannot be performed.

  In order to realize a toned light-emitting device, it is conceivable that a plurality of light-emitting portions that can be driven independently and have different emission colors are provided in one light-emitting device. Then, by adjusting the drive current of each light emitting unit and mixing the emitted light from each light emitting unit, it is possible to obtain an intermediate color between them. However, in such a light-emitting device, the color mixing property of the light emitted from each light-emitting unit is not necessarily sufficient, or color unevenness may occur due to the conspicuous boundary line between the light-emitting units.

  In view of the above, an object of the present invention is to provide a light emitting device that improves the color mixing property of light emitted from a plurality of light emitting units that can be driven independently.

  A substrate having a central region and an outer peripheral region lower in height than the central region and surrounding the central region on the upper surface side, a plurality of first light emitting elements mounted on the central region of the substrate, and a plurality of first light emitting elements A first set of electrode terminals electrically connected to each other, a translucent first sealing frame disposed along the edge of the central region and surrounding the central region, and a first sealing frame A first sealing resin that fills a space on the enclosed central region and integrally seals the plurality of first light emitting elements; and a plurality of second light emitting elements mounted on the outer peripheral region of the substrate; A second set of electrode terminals electrically connected to the plurality of second light emitting elements, and a first sealing frame disposed along an edge of the outer peripheral region so as to surround the central region and the outer peripheral region A reflective second sealing frame whose upper end position is lower than that of the first sealing frame and the second sealing frame. Emitting device is provided, characterized in that it comprises a second sealing resin for sealing integrally filled in the space on the outer peripheral region a plurality of second light emitting elements.

  In the light emitting device, the first sealing resin contains a phosphor that is excited by light from the plurality of first light emitting elements, and the second sealing resin is formed from the plurality of second light emitting elements. It is preferable that the phosphor that is excited by the light of the same has the same thickness as the first sealing resin.

The light emitting device is disposed along the edge of the central region so as to contact the outer peripheral side of the first sealing frame and surround the first sealing frame, and the height of the upper end is the second sealing It is preferable to further have a reflective third sealing frame that is the same as the frame.
In the above light-emitting device, it is preferable that the inner peripheral side of the third sealing frame is embedded in the first sealing frame.

In the above light emitting device, the substrate is composed of a metal mounting substrate and an insulating circuit substrate having an outer peripheral opening surrounding the central portion and fixed to the upper surface of the mounting substrate. The outer peripheral region is preferably the upper surface of the mounting substrate exposed in the outer peripheral opening.
Alternatively, in the above light emitting device, the substrate is a metal mounting substrate having a step whose central portion is one step higher, the central region is the upper surface of the mounting substrate above the step, and the outer peripheral region is a stepped portion. The upper surface of the mounting substrate on the lower side is preferable.

  In the above light emitting device, the plurality of first light emitting elements emit light, whereby the first white light is emitted through the first sealing resin, and the plurality of second light emitting elements emit light, whereby the second light emitting elements emit light. It is preferable that second white light having a color temperature different from that of the first white light is emitted through the sealing resin.

  According to the above light emitting device, the color mixing property of the emitted light from the plurality of light emitting units that can be driven independently is improved.

It is the perspective view and sectional drawing of the light-emitting device. 2 is a perspective view and an end view of the mounting board 10 and the circuit board 20. FIG. It is the top view and sectional drawing which show the example of arrangement | positioning of LED element 31,32. FIG. 4 is a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 1. FIG. 4 is a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 1. FIG. 4 is a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 1. It is the perspective view and sectional drawing of another light-emitting device 2. FIG. 6 is a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 2. FIG. 6 is a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 2. FIG. 6 is a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 2. It is the perspective view and sectional drawing of another light-emitting device 3. FIG. FIG. 6 is a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 3. FIG. 6 is a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 3. FIG. 6 is a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 3. 6 is a cross-sectional view of yet another light emitting device 4. FIG. It is sectional drawing of another light-emitting device 5. FIG.

  Hereinafter, the light emitting device will be described with reference to the drawings. However, it should be understood that the present invention is not limited to the drawings or the embodiments described below.

  FIG. 1A and FIG. 1B are a perspective view and a cross-sectional view of the light emitting device 1. 1A is a perspective view of the light-emitting device 1 as a finished product, and FIG. 1B is a cross-sectional view of the light-emitting device 1 taken along line IB-IB in FIG. 1A. The light emitting device 1 includes an LED element as a light emitting element, and is used as an LED light source device such as a projector, a high ceiling illumination, a studio illumination, and an illumination. The light emitting device 1 includes a mounting substrate 10, a circuit substrate 20, LED elements 31 and 32, a central sealing frame 41, an outer peripheral sealing frame 42, and sealing resins 51 and 52 as main components.

  In the light emitting device 1, the portion covered with the sealing resins 51 and 52 corresponds to the light emitting portion, and the light emitting portion is divided into two, a circular shape and a donut shape, by the central sealing frame 41. Electrode terminals 220 and 230 are provided corresponding to the central light emitting part, and electrode terminals 270 and 280 are provided corresponding to the light emitting part on the outer peripheral side, and the two divided light emitting parts (two light emitting parts) are mutually connected. Can be lit independently. In addition, these two light emitting units emit white light having different color temperatures, for example, the central light emitting unit emits 5000 K white light and the outer light emitting unit emits 3000 K white light. Designed to. In the light emitting device 1, light of 5000K, 3000K and their intermediate colors can be obtained by adjusting the currents flowing through the electrode terminals 220 and 230 and the electrode terminals 270 and 280. That is, the light-emitting device 1 is a COB light-emitting device that realizes a white light toning function by integrating two LED light-emitting modules into one unit and providing two sets of electrode terminals.

  2A to 2C are a perspective view and an end view of the mounting board 10 and the circuit board 20, respectively. 2A is an exploded perspective view of the mounting board 10 and the circuit board 20, and FIG. 2B is a perspective view of the mounting board 10 and the circuit board 20 attached to each other. FIG. FIG. 3 is an end view of the mounting board 10 and the circuit board 20 taken along the line IIC-IIC in FIG. The substrate of the light emitting device 1 includes a mounting substrate 10 and a circuit substrate 20.

  The mounting substrate 10 has a square shape as an example, and is a metal substrate on which the LED elements 32 are mounted. Since the mounting substrate 10 also functions as a heat dissipation substrate that dissipates heat generated by the LED elements 31 and 32 and phosphor particles described later, the mounting substrate 10 is made of, for example, aluminum having excellent heat resistance and heat dissipation. However, as long as the material of the mounting substrate 10 is excellent in heat resistance and heat dissipation, another metal such as copper may be used.

  The circuit board 20 is an insulating board such as a glass epoxy board, and has a square shape as large as the mounting board 10 as an example. The circuit board 20 has four outer peripheral openings 26 </ b> A to 26 </ b> D formed so that a circular central region 21 is formed on the upper surface of the central portion. The outer peripheral openings 26 </ b> A to 26 </ b> D have a substantially annular shape surrounding the central region 21 as a whole. The lower surface of the circuit board 20 is fixed to the upper surface of the mounting substrate 10 by an adhesive sheet, for example.

  The upper surfaces of the mounting substrate 10 exposed in the outer peripheral openings 26A to 26D are hereinafter referred to as “outer peripheral regions 16A to 16D”, respectively. The outer peripheral regions 16 </ b> A to 16 </ b> D are lower than the central region 21 by the thickness of the circuit board 20 (height of the wall portion 29), and are arranged so as to surround the central region 21.

  The LED element 31 is an example of a first light emitting element, and is mounted on the central region 21 of the circuit board 20. The LED element 32 is an example of a second light emitting element, and is mounted on the outer peripheral regions 16A to 16D of the mounting substrate 10 exposed in the outer peripheral openings 26A to 26D. In the light emitting device 1, a plurality of LED elements 32 are mounted on each of the outer peripheral openings 26A to 26D. Each of the LED elements 31 and 32 is a blue LED that emits blue light having an emission wavelength band of about 450 to 460 nm, for example. The lower surfaces of the LED elements 31 and 32 are directly fixed to the upper surface of the mounting substrate 10 or the circuit substrate 20 with, for example, a transparent insulating adhesive.

  On the upper surface of the circuit board 20, wiring patterns 22, 23, electrode terminals 220, 230, wiring patterns 27, 28, and electrode terminals 270, 280 are formed. The electrode terminal 220 and the electrode terminal 270 are arranged near one corner of the circuit board 20. On the other hand, the electrode terminal 230 and the electrode terminal 280 are disposed in the vicinity of a corner located diagonally to the corner where the electrode terminal 220 and the electrode terminal 270 are disposed.

  The wiring pattern 22 passes through the edge of the central region 21 so as to surround the central region 21, passes over the connection region 221 that is a wall portion between the outer peripheral opening 26 </ b> A and the outer peripheral opening 26 </ b> D, It is connected to the terminal 220. The wiring pattern 23 has a point-symmetric shape with respect to the wiring pattern 22, and passes through the edge of the central region 21 across the half circumference on the opposite side of the wiring pattern 22 across the center of the central region 21. The electrode terminal 230 is connected through the connection region 231 which is a wall portion between the outer peripheral opening 26C.

  The wiring pattern 27 extends along the outer peripheral edge of the outer peripheral openings 26A and 26B and the connection region 271 that is a wall portion between the outer peripheral opening 26A and the outer peripheral opening 26B, and is connected to the electrode terminal 270. ing. The wiring pattern 28 has a point-symmetric shape with respect to the wiring pattern 27, and is an edge on the outer peripheral side of the outer peripheral openings 26C and 26D and a connection between the outer peripheral opening 26C and the outer peripheral opening 26D. It extends along the region 281 and is connected to the electrode terminal 280.

  The electrode terminals 220 and 230 are an example of a first set of electrode terminals, and are electrically connected to the LED element 31 via the wiring patterns 22 and 23, respectively. One of the electrode terminals 220 and 230 is an anode electrode and the other is a cathode electrode. When these are connected to an external power source and a voltage is applied, the LED element 31 emits light. The electrode terminals 270 and 280 are an example of a second set of electrode terminals, and are electrically connected to the LED element 32 via the wiring patterns 27 and 28, respectively. One of the electrode terminals 270 and 280 is an anode electrode and the other is a cathode electrode. When these are connected to an external power source and a voltage is applied, the LED element 32 emits light.

  FIGS. 3A and 3B are a plan view and a cross-sectional view showing an arrangement example of the LED elements 31 and 32, respectively. 3A is a plan view of the light-emitting device 1 from which the central sealing frame 41, the outer peripheral sealing frame 42, and the sealing resins 51 and 52 are removed, and FIG. 3B is a plan view of FIG. It is an expanded sectional view of the part shown by code | symbol IIIB.

  The number of the LED elements 31 and 32 included in the light emitting device 1 may be any number and is appropriately determined according to the application. In FIG. 1B and FIG. 4A, which will be described later, only a small number of LED elements 31 and 32 are shown for the sake of simplicity, but actually, as shown in FIG. The number of elements may be larger.

  The LED elements 31 and 32 have a pair of element electrodes on the upper surface, and the element electrodes of the adjacent LED elements 31 and 32 are bonding wires (hereinafter simply referred to as wires) 33 and 34 as shown in FIG. Are electrically connected to each other. More specifically, 15 LED elements 31 arranged in the central region 21 are connected in series by 15 wires 33, and the 15 LED elements 31 constitute one group. The wires 33 coming out of the LED elements 31 at both ends of each group are connected to the wiring pattern 22 or the wiring pattern 23, and in the light emitting device 1, eleven groups of LED elements 31 are connected to the wiring pattern 22 and the wiring pattern 23. Are connected in parallel. When the forward voltage of the LED elements 31 is set to Vfw1, all LED elements 31 are lit by applying a voltage of 15 × Vfw1 or more between the electrode terminal 220 and the electrode terminal 230.

  Twenty-four LED elements 32 arranged in the outer peripheral openings 26A to 26D are connected in series by wires 34, and the 24 LED elements 32 constitute one group. The wires 34 coming out of the LED elements 32 at both ends of each group are connected to the wiring pattern 27 or the wiring pattern 28 on the connection region 271 or the connection region 281. In the light emitting device 1, 16 groups of LED elements are connected. 32 is connected in parallel between the wiring pattern 27 and the wiring pattern 28. When the forward voltage of the LED elements 32 is Vfw2, all LED elements 32 are lit by applying a voltage of 24 × Vfw1 or more between the electrode terminal 270 and the electrode terminal 280.

  The LED element 32 disposed in the outer peripheral opening 26A and the LED element 32 disposed in the outer peripheral opening 26D are connected to each other across the connection region 221. As shown in FIG. 3B, in this portion, the wire 34 has a substantially trapezoidal shape excluding the bottom and straddles the connection region 221 and the wiring pattern 22 thereon. Further, in the connection region 221, a resist resin 60 is applied on the wiring pattern 22 so as not to cause a short circuit between the wiring pattern 22 and the wire 34. The sealing resin 52 is filled so as to cover the LED element 32, the wire 34, and the resist resin 60.

  The LED element 32 disposed in the outer peripheral opening 26B and the LED element 32 disposed in the outer peripheral opening 26C are connected to each other across the connection region 231. The cross section of this portion is the same as that shown in FIG.

  The center sealing frame 41 is an example of a first sealing frame and is a dam material for preventing the sealing resin 51 from flowing out. The central sealing frame 41 is a circular frame formed in accordance with the size of the central region 21, and is disposed along the edge of the central region 21 so as to surround the central region 21. The central sealing frame 41 is fixed at a position overlapping the wiring patterns 22 and 23 on the upper surface of the circuit board 20. Further, the central sealing frame 41 is made of, for example, a transparent silicone resin and has translucency so that the color mixing property of the light emitted from the LED element 31 and the light emitted from the LED element 32 is enhanced. The central sealing frame 41 may be mixed with a scattering material.

  The outer peripheral sealing frame 42 is an example of a second sealing frame and is a dam material for preventing the sealing resin 52 from flowing out. The outer peripheral sealing frame 42 is a circular frame formed in accordance with the size of the outer circumference of the outer peripheral openings 26A to 26D, and the outer peripheral region so as to surround the central region 21 and the outer peripheral regions 16A to 16D. It arrange | positions along the edge of 16A-16D. The outer peripheral sealing frame 42 is fixed to a position overlapping the wiring patterns 27 and 28 on the upper surface of the circuit board 20. The outer peripheral sealing frame 42 is made of an opaque silicone resin mixed with white particles, for example, and has reflectivity. Thereby, the outer periphery sealing frame 42 directs the light emitted from the LED elements 31 and 32 to the upper side of the light emitting device 1 on the side opposite to the mounting substrate 10 when viewed from the LED elements 31 and 32. Reflect.

  The central sealing frame 41 and the outer peripheral sealing frame 42 are both arranged concentrically on the upper surface of the circuit board 20. The heights of the lower ends of the central sealing frame 41 and the outer peripheral sealing frame 42 are the same, but the central sealing frame 41 is taller than the outer peripheral sealing frame 42. In other words, the outer peripheral sealing frame 42 has a lower upper end position (height) than the central sealing frame 41.

  The sealing resin 51 is an example of a first sealing resin, is filled in a space on the central region 21 surrounded by the central sealing frame 41, and integrally seals (protects) the plurality of LED elements 31. To do. For example, the sealing resin 51 is a colorless and transparent resin such as an epoxy resin or a silicone resin. In the example shown in FIG. 1A, the sealing resin 51 is hardened in a disk shape and fixed by, for example, the central sealing frame 41.

  The sealing resin 52 is an example of a second sealing resin, and is a space on the outer peripheral regions 16A to 16D and the connection regions 221, 231, 271, 281 surrounded by the central sealing frame 41 and the outer peripheral sealing frame 42. The plurality of LED elements 32 are integrally sealed (protected). For example, the sealing resin 52 is a colorless and transparent resin such as an epoxy resin or a silicone resin. The material of the sealing resin 52 may be the same as the sealing resin 51 or may be different from the sealing resin 51. In the example shown in FIG. 1A, the sealing resin 52 is cured in an annular shape and fixed by, for example, the central sealing frame 41 and the outer peripheral sealing frame 42. The height of the upper surface of the sealing resin 52 is lower than that of the sealing resin 51, but the sealing resin 52 has the same thickness as the sealing resin 51.

The sealing resin 51 contains a phosphor that is excited by light from the LED element 31, and the sealing resin 52 contains a phosphor that is excited by light from the LED element 32. For example, each of the sealing resins 51 and 52 may contain a yellow phosphor such as YAG (Yttrium Aluminum Garnet), or may contain a plurality of types of phosphors. Plural kinds of phosphors, for _{example, (BaSr) 2 SiO 4:} Eu and a green phosphor such as ^2+, CaAlSiN _3: may be the combination of the red phosphor such as ^{Eu 2+,} or green and red phosphors Further, a yellow phosphor may be combined. In this case, the blue light from the LED element 31 or the LED element 32 that is a blue LED and light (yellow light, green light, red light) obtained by exciting the phosphor through the sealing resins 51 and 52, respectively. White light obtained by mixing the light and the like.

  In the light emitting device 1, the type of phosphor, the blending ratio, or both may be changed between the sealing resin 51 and the sealing resin 52. For example, the phosphor of the sealing resin 51 is selected so that white light having a color temperature of 5000K can be obtained by mixing light from the LED element 31 and light obtained by exciting the phosphor with the light. . The phosphor of the sealing resin 52 is selected so that white light having a color temperature of 3000 K can be obtained by mixing light from the LED element 32 and light obtained by exciting the phosphor with the light. . In this case, in the light emitting device 1, when the LED element 31 emits light, 5000K white light is emitted as the first white light, and when the LED element 32 emits light, the first white light has a color temperature. 3000K white light is emitted as the different second white light.

  Unlike the light emitting device 1, the upper surface of the sealing resin 51, which is the central light emitting surface, and the upper surface of the sealing resin 52, which is the outer peripheral light emitting surface, are leveled and covered with the sealing resin 51. It is also conceivable to emit white light having different color temperatures from the central light emitting part and the light emitting part on the outer peripheral side covered with the sealing resin 52. However, if the light emitting surfaces on the center and the outer peripheral side are made the same height, a part of the light beam emitted from the LED element 31 to the side is transmitted through the central sealing frame 41 and then the central axis in the outer peripheral sealing frame 42. Since the light is reflected in the direction (the axis extending through the center of the sealing resin 51 and perpendicular to the circuit board 20), the irradiation angle of the light emitting portion at the center is reduced. As a result, the color mixing between the light flux of the central light emitting portion and the light flux of the outer peripheral light emitting portion is reduced.

  On the other hand, in the light emitting device 1, since the central region 21 is higher than the outer peripheral regions 16 </ b> A to 16 </ b> D by the thickness of the circuit board 20, the central LED element 31 is higher than the peripheral LED element 32. Is mounted at a high position. Further, since the upper end of the central sealing frame 41 is higher than the upper end of the outer peripheral sealing frame 42, the upper surface of the sealing resin 51 is higher than the upper surface of the sealing resin 52. When the central light emitting unit is raised as described above, the irradiation angle of white light from the central light emitting unit becomes wider than when the bottom light is not raised. Therefore, 5000K white light emitted from the central light emitting unit is It becomes easy to mix with 3000K white light emitted from the light emitting unit. Therefore, in the light emitting device 1, the color mixing property between the central light emitting unit and the light emitting unit on the outer peripheral side is improved as compared with the case where the central light emitting unit is not raised.

  In the light emitting device 1, the sealing resin 51 and the sealing resin 52 have the same thickness. Thus, if the resin thickness of both is made the same, for example, when the same phosphor-containing resin is used for the sealing resins 51 and 52, the same light emission characteristic is obtained in the central light emitting portion and the outer peripheral light emitting portion. Therefore, there is an advantage that the designed color can be easily obtained.

  4A to 6B are a perspective view and an end view for explaining an example of a manufacturing process of the light-emitting device 1. 4 (B), FIG. 5 (B) and FIG. 6 (B) are respectively the IVB-IVB line in FIG. 4 (A), the VB-VB line in FIG. 5 (A) and the VIB in FIG. 6 (A). -Shows the end face along the VIB line. With reference to FIGS. 2A to 3B and FIGS. 4A to 6B, a manufacturing process of the light-emitting device 1 will be described.

  When the light emitting device 1 is manufactured, first, as shown in FIGS. 2A to 2C, the circuit board 20 having the outer peripheral openings 26A to 26D and the mounting board 10 are overlapped and bonded together. 4A and 4B, a plurality of LED elements 31 are mounted on the central region 21 of the circuit board 20, and are exposed in the outer peripheral openings 26A to 26D. A plurality of LED elements 32 are mounted on the ten outer peripheral regions 16A to 16D. Subsequently, as shown in FIGS. 3A and 3B, each LED element 31 is electrically connected to the electrode terminals 220 and 230 via the wire 33, and each LED element 32 is connected to the wire 34. Are electrically connected to the electrode terminals 270 and 280.

  Next, as shown in FIGS. 5A and 5B, the outer peripheral sealing frame 42 is fixed on the circuit board 20 along the edges of the outer peripheral regions 16A to 16D. Further, as shown in FIGS. 6A and 6B, the central sealing frame 41 is fixed on the circuit board 20 along the edge of the central region 21. Further, the space on the central region 21 surrounded by the central sealing frame 41 is filled with the sealing resin 51, and the spaces on the outer peripheral regions 16A to 16D surrounded by the central sealing frame 41 and the outer peripheral sealing frame 42 are sealed. Resin 52 is filled. Thereby, the light emitting device 1 shown in FIGS. 1A and 1B is completed.

  FIGS. 7A and 7B are a perspective view and a cross-sectional view of another light emitting device 2. 7A is a perspective view of the light-emitting device 2 as a finished product, and FIG. 7B is a cross-sectional view of the light-emitting device 2 taken along line VIIB-VIIB in FIG. 7A. The light emitting device 2 is different from the light emitting device 1 in that the light emitting device 2 includes a central sealing frame 43 that is not included in the light emitting device 1. Since components other than the central sealing frame 43 of the light emitting device 2 are the same as those of the light emitting device 1, the same reference numerals as those of the light emitting device 1 are used for portions overlapping with the light emitting device 1, and details thereof are used. The detailed explanation is omitted.

  The center sealing frame 43 is an example of a third sealing frame, and is a circular frame formed in accordance with the size of the circumference inside the outer peripheral openings 26A to 26D. The central sealing frame 43 is disposed along the edge of the central region 21 so as to contact the outer peripheral side of the central sealing frame 41 and surround the central sealing frame 41. As with the outer peripheral sealing frame 42, the central sealing frame 43 is made of, for example, an opaque silicone resin mixed with white particles and has reflectivity.

  The central sealing frame 43 is disposed concentrically with the central sealing frame 41 and the outer peripheral sealing frame 42 on the upper surface of the circuit board 20. The height of the central sealing frame 43 is the same as that of the outer peripheral sealing frame 42. That is, the lower end position (height) of the central sealing frame 43 is the same as the central sealing frame 41 and the outer peripheral sealing frame 42, but the upper end position (height) of the central sealing frame 43 is the same as the central sealing frame 43. It is lower than the stop frame 41 and is the same as the outer peripheral sealing frame 42. Thereby, in the light emitting device 2, the sealing resin 52 is filled up to the height of the upper ends of the outer peripheral sealing frame 42 and the central sealing frame 43.

  Also in the light emitting device 2, the central light emitting part is raised from the outer peripheral side light emitting part, and the central sealing frame 41 is made of a transparent resin. In the light emitting device 2, there is a white resin central sealing frame 43 between the central light emitting part and the outer peripheral light emitting part, but the central sealing frame 41 is taller than the central sealing frame 43. On the upper side of the central sealing frame 43, white light mixes between the central light emitting part and the outer peripheral light emitting part. For this reason, also in the light-emitting device 2, as in the light-emitting device 1, compared with the case where the central light-emitting portion is not raised, the color mixing property between the central light-emitting portion and the outer peripheral light-emitting portion is improved.

  Further, in the light emitting device 2, since there is a central sealing frame 43 whose upper end height is the same as that of the outer peripheral sealing frame 42, the sealing resin 52 is filled according to the upper ends of the outer peripheral sealing frame 42 and the central sealing frame 43. By doing so, it becomes easy to make the height of the sealing resin 52 on the outer peripheral side constant.

  In the light emitting device 2, since the central sealing frame 43 is made of white resin and has reflectivity, for example, light emitted laterally from the LED elements 31 in the central region 21 passes through the central sealing frame 41. Then, the light is reflected upward of the light emitting device 1 by the central sealing frame 43. Thereby, in the light-emitting device 2, the brightness | luminance in the front of an apparatus improves rather than the light-emitting device 1. FIG.

  FIG. 8A to FIG. 10B are a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 2. 8B, FIG. 9B, and FIG. 10B are respectively the VIIIB-VIIIB line of FIG. 8A, the IXB-IXB line of FIG. 9A, and the XB of FIG. 10A. -Indicates an end face along line XB. With reference to FIGS. 2A to 3B and FIGS. 8A to 10B, a manufacturing process of the light-emitting device 2 will be described.

  As in the manufacturing of the light emitting device 1, first, as shown in FIGS. 8A and 8B, the plurality of LED elements 31 are formed on the central region 21 of the circuit board 20 bonded to the mounting board 10. The plurality of LED elements 32 are mounted on the outer peripheral regions 16 </ b> A to 16 </ b> D of the mounting substrate 10. Subsequently, as shown in FIGS. 3A and 3B, each LED element 31 is electrically connected to the electrode terminals 220 and 230 via the wire 33, and each LED element 32 is connected to the wire 34. Are electrically connected to the electrode terminals 270 and 280.

  Next, as shown in FIG. 8A and FIG. 8B, the outer peripheral sealing frame 42 is fixed along the edge of the outer peripheral regions 16 </ b> A to 16 </ b> D on the circuit board 20, and the edge of the central region 21. The central sealing frame 43 is fixed along the part. Further, as shown in FIGS. 9A and 9B, the central sealing frame 41 is fixed on the central region 21 so as to contact the inner peripheral side of the central sealing frame 43. Further, as shown in FIGS. 10A and 10B, the sealing resin 52 is filled in the spaces on the outer peripheral regions 16 </ b> A to 16 </ b> D surrounded by the outer peripheral sealing frame 42 and the central sealing frame 43. . Further, a sealing resin 51 is filled in a space on the central region 21 surrounded by the central sealing frame 41. Thereby, the light-emitting device 2 shown in FIGS. 7A and 7B is completed.

  FIG. 11A and FIG. 11B are a perspective view and a cross-sectional view of yet another light-emitting device 3. 11A is a perspective view of the light-emitting device 3 as a finished product, and FIG. 11B is a cross-sectional view of the light-emitting device 3 taken along line XIB-XIB in FIG. 11A. The light emitting device 3 is different from the light emitting device 1 in that the light emitting device 3 has a central sealing frame 41 ′ instead of the central sealing frame 41 of the light emitting device 1 and has the same central sealing frame 43 as the light emitting device 2. Since components other than the central sealing frames 41 ′ and 43 of the light emitting device 3 are the same as those of the light emitting device 1, the same reference numerals as those of the light emitting device 1 are used for portions overlapping the light emitting device 1. Detailed description thereof will be omitted.

  In the light emitting device 2, the central sealing frame 41 and the central sealing frame 43 are in contact with each other, but are separate sealing frames. On the other hand, in the light emitting device 3, the central sealing frame 43 is embedded in the central sealing frame 41 'and integrated with the central sealing frame 41'. More specifically, as shown in FIG. 11 (B), in the light emitting device 3, about half of the inner peripheral side of the central sealing frame 43 has a central sealing frame at the lower part on the outer peripheral side of the central sealing frame 41 ′. It is embedded in 41 '. The central sealing frame 41 ′ is a circular frame formed of, for example, a transparent silicone resin in accordance with the size of the central region 21 in the same manner as the central sealing frame 41. In contrast, the lower part on the outer peripheral side has a recess into which the central sealing frame 43 is fitted over the entire periphery. The central sealing frame 41 'is also an example of the first sealing frame.

  The height relationship and materials of the central sealing frame 41 ′, the outer peripheral sealing frame 42, and the central sealing frame 43 of the light emitting device 3 are the same as those of the light emitting devices 1 and 2, respectively. Also in the light emitting device 3, the sealing resin 52 is filled up to the height of the upper ends of the outer peripheral sealing frame 42 and the central sealing frame 43. For this reason, also in the light-emitting device 3, as with the light-emitting devices 1 and 2, the color mixing property between the central light-emitting portion and the light-emitting portion on the outer peripheral side is improved, and the height of the sealing resin 52 on the outer peripheral side is made uniform. It becomes easy. Further, in the light emitting device 3, about half of the inner peripheral side of the central sealing frame 43 overlaps with the central sealing frame 41 ′, so that the area of the upper surface of the sealing resin 52 is larger than that of the light emitting device 2. As a result, the light emitting part on the outer peripheral side becomes wider.

  FIGS. 12A to 14B are a perspective view and an end view for explaining an example of a manufacturing process of the light emitting device 3. FIGS. 12B, 13B, and 14B are respectively the XIIB-XIIB line of FIG. 12A, the XIIIB-XIIIB line of FIG. 13A, and the XIVB of FIG. 14A. -Shows the end face along the line XIVB. With reference to FIGS. 2A to 3B and FIGS. 12A to 14B, a manufacturing process of the light-emitting device 3 will be described.

  As in the manufacturing of the light emitting devices 1 and 2, first, as shown in FIGS. 12A and 12B, a plurality of LED elements are formed on the central region 21 of the circuit board 20 bonded to the mounting board 10. 31 is mounted, and a plurality of LED elements 32 are mounted on the outer peripheral regions 16 </ b> A to 16 </ b> D of the mounting substrate 10. Subsequently, as shown in FIGS. 3A and 3B, each LED element 31 is electrically connected to the electrode terminals 220 and 230 via the wire 33, and each LED element 32 is connected to the wire 34. Are electrically connected to the electrode terminals 270 and 280.

  Next, as shown in FIGS. 12A and 12B, the outer peripheral sealing frame 42 is fixed along the edge of the outer peripheral regions 16 </ b> A to 16 </ b> D on the circuit board 20, and the edge of the central region 21. A central sealing frame 43 is fixed along the portion. Further, as shown in FIGS. 13A and 13B, the sealing resin 52 is filled in the spaces on the outer peripheral regions 16 </ b> A to 16 </ b> D surrounded by the outer peripheral sealing frame 42 and the central sealing frame 43. . Furthermore, a central sealing frame 41 ′ having a depression that matches the curved surface of the central sealing frame 43 over the entire circumference at the lower part on the outer peripheral side is formed as shown in FIGS. 14 (A) and 14 (B). It is fixed on the central region 21 so as to mesh with the frame 43. Further, a sealing resin 51 is filled in a space on the central region 21 surrounded by the central sealing frame 41 ′. Thus, the light emitting device 3 shown in FIGS. 11A and 11B is completed.

  Unlike the above description, the central sealing frames 41 ′ and 43 may be formed as one sealing frame from the beginning, arranged on the central region 21, and filled with the sealing resin 51.

  In the light emitting devices 1 to 3 described so far, the LED element 31 is mounted on the central region 21 of the circuit board 20, and the LED element 32 is mounted on the mounting board 10 in the outer peripheral openings 26 </ b> A to 26 </ b> D of the circuit board 20. By doing so, the central light emitting part is raised with respect to the light emitting part on the outer peripheral side. However, as will be described below, the central light emitting unit may be raised with respect to the light emitting unit on the outer peripheral side by providing a step on the mounting substrate itself.

  15 and 16 are cross-sectional views of further light emitting devices 4 and 5, respectively. The perspective views of the light emitting devices 4 and 5 are the same as those in FIG. 1A, and FIGS. 15 and 16 show the same cross sections as the light emitting devices 4 and 5 in FIG. The light emitting devices 4 and 5 differ from the light emitting device 1 only in the shape of the mounting substrate and the circuit board, and have the same configuration as the light emitting device 1 in other points. The same reference numerals are used, and detailed descriptions thereof are omitted.

  As shown in FIG. 15, the mounting substrate 10 ′ of the light emitting device 4 has a step whose upper surface side of the central portion is raised by, for example, a disk shape and has a recess 12 on the lower surface side of the central portion. The mounting substrate 10 ′ is formed by denting a central portion of a metal substrate such as aluminum from the lower surface side. The circuit board 20 ′ of the light emitting device 4 is an insulating substrate having a circular central opening 21 ′ in addition to the outer peripheral openings similar to the outer peripheral openings 26 </ b> A to 26 </ b> D of the circuit board 20. Reference numeral 29 is a part of the circuit board 20 ′ and indicates a wall portion that separates the central opening 21 ′ from the outer peripheral opening.

  As shown in FIG. 16, the mounting substrate 10 ″ of the light emitting device 5 also has a step where the upper surface side of the central portion is raised by one step, for example, in the shape of a disk, like the mounting substrate 10 ′ of the light emitting device 4. The lower surface side of the substrate 10 '' is a flat surface. For example, the mounting substrate 10 ″ is configured by bonding two metal substrates such as aluminum having different sizes. The circuit board 20 ′ of the light emitting device 5 is the same as that of the light emitting device 4.

  In the light emitting devices 4 and 5, the stepped portions of the mounting substrates 10 ′ and 10 ″ are fitted in the central opening 21 ′ of the circuit board 20 ′, and on the upper surfaces of the mounting substrates 10 ′ and 10 ″ above the steps. A certain central region 11 'is exposed in the central opening 21'. Further, an outer peripheral region 16 ′ which is the upper surface of the mounting substrate 10 ′, 10 ″ below the step is exposed in the outer peripheral opening. The LED elements 31 and 32 are mounted on the central region 11 ′ and the outer peripheral region 16 ′, which are the upper surfaces of the mounting substrates 10 ′ and 10 ″, respectively.

  Also in the light emitting devices 4 and 5, the central light emitting portion is raised from the outer peripheral side light emitting portion, and the central sealing frame 41 is made of a transparent resin. Compared with the case where the bottom is not raised, the color mixing property of the light emitting part at the center and the light emitting part on the outer peripheral side is improved. Further, in the light emitting devices 4 and 5, not only the LED element 32 but also the LED element 31 is directly mounted on the upper surfaces of the mounting substrates 10 'and 10' '. For this reason, in the light emitting devices 4 and 5, heat generated by the LED element 31 can also be efficiently released to the mounting substrates 10 ′ and 10 ″, so that heat dissipation is improved as compared with the light emitting device 1.

  One or both of the LED elements 31 and 32 may be a blue LED and a green LED, or a plurality of types of LED elements such as a blue LED, a green LED, and a red LED. For example, one type of blue LED may be used as the LED element 31, and three types of blue LED, green LED, and red LED may be used as the LED element 32. In this case, a transparent resin containing a yellow phosphor may be used for the sealing resin 51, and a transparent resin not containing a phosphor may be used for the sealing resin 52. When a blue LED, a green LED, and a red LED are used as the LED element 31 or the LED element 32, white light is obtained by the blue light, the green light, and the red light from the LED elements, and therefore the sealing resin is fluorescent. It does not have to contain a body. Further, for example, when a plurality of types of LED elements are used as the LED element 31 or the LED element 32, a plurality of sets of electrode terminals 220, 230 or electrode terminals 270, 280 may be provided, and the LED elements may be connected for each type. .

1, 2, 3, 4, 5 Light-emitting device 10, 10 ′, 10 ″ Mounting substrate 11 ′, 21 Central region 16A, 16B, 16C, 16D, 16 ′ Outer peripheral region 20, 20 ′ Circuit substrate 220, 230, 270 , 280 Electrode terminal 26A, 26B, 26C, 26D Peripheral opening 31, 32 LED element 41, 41 ', 43 Central sealing frame 42 Peripheral sealing frame 51, 52 Sealing resin

Claims (7)

A substrate having a central region and an outer peripheral region lower in height than the central region and surrounding the central region on the upper surface side;
A plurality of first light emitting elements mounted on the central region of the substrate;
A first set of electrode terminals electrically connected to the plurality of first light emitting elements;
A translucent first sealing frame disposed along an edge of the central region and surrounding the central region;
A first sealing resin that fills a space on the central region surrounded by the first sealing frame and integrally seals the plurality of first light emitting elements;
A plurality of second light emitting elements mounted on the outer peripheral region of the substrate;
A second set of electrode terminals electrically connected to the plurality of second light emitting elements;
A reflective second sealing frame disposed along an edge of the outer peripheral region so as to surround the central region and the outer peripheral region, and having a lower upper end position than the first sealing frame;
A second sealing resin that fills a space on the outer peripheral region surrounded by the first sealing frame and the second sealing frame and integrally seals the plurality of second light emitting elements; ,
A light emitting device comprising: The first sealing resin contains a phosphor that is excited by light from the plurality of first light emitting elements,
The said 2nd sealing resin contains the fluorescent substance excited by the light from these 2nd light emitting elements, and has the same thickness as the said 1st sealing resin. Light emitting device.   It is arranged along the edge of the central region so as to contact the outer peripheral side of the first sealing frame and surround the first sealing frame, and the height of the upper end is the same as that of the second sealing frame. The light emitting device according to claim 2, further comprising a reflective third sealing frame that is the same.   The light emitting device according to claim 3, wherein an inner peripheral side of the third sealing frame is embedded in the first sealing frame. The board is composed of a metal mounting board and an insulating circuit board fixed to the upper surface of the mounting board having an outer peripheral opening that surrounds a central portion;
The central region is an upper surface of the central portion of the circuit board;
The light emitting device according to claim 1, wherein the outer peripheral region is an upper surface of the mounting substrate exposed in the outer peripheral opening. The substrate is a metal mounting substrate having a step whose central portion is one step higher,
The central region is the upper surface of the mounting substrate above the step,
The light emitting device according to claim 1, wherein the outer peripheral region is an upper surface of the mounting substrate below the step. When the plurality of first light emitting elements emit light, first white light is emitted through the first sealing resin,
The second white light having a color temperature different from that of the first white light is emitted through the second sealing resin when the plurality of second light emitting elements emit light. The light-emitting device as described in any one.

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