JP2022015703A - Light-emitting device - Google Patents

Abstract

To suppress the occurrence of a yellow ring in a light-emitting device.SOLUTION: A light-emitting device (1 to 4) includes a substrate (10), a light emitting element (30) mounted on the substrate, a holding material (40 to 43) arranged around the light emitting element, and a sealing material (50 to 53) filled inside the holding material to seal the light emitting element, and the sealing member includes a fluorescent material that emits light emitted from the light emitting element by wavelength conversion, and the holding material includes a pigment that includes both the peak wavelength of light to be emitted from the fluorescent material and the peak wavelength of the light emitted from the light emitting element in an absorption band of the absorption spectrum on the surface in contact with the sealing member.SELECTED DRAWING: Figure 1

Description

The present invention relates to a light emitting device having a plurality of LED (light emitting diode) elements.

The LED element, which is a semiconductor element, has a long life and excellent drive characteristics, and is compact, has good luminous efficiency, and has a vivid emission color. Therefore, it has been widely used for lighting and the like in recent years.

A substrate, a light emitting body mounted on the substrate, and a reflective frame body provided on the substrate so as to surround the light emitting body are provided, and oblique light members are provided on the outer peripheral surface of the reflective frame body and the outer peripheral surface of the substrate. An LED light emitting device is disclosed (see Patent Document 1).

A light emitting element, a light transmitting member into which light emitted from the light emitting element is incident, a first light-reflecting covering member that covers the side surface of the light transmitting member and surrounds the light emitting element, and a first covering member. A light emitting device including a second covering member for covering is disclosed (see Patent Document 2). In this light emitting device, the second covering member contains a light absorbing material and is colored black.

Japanese Unexamined Patent Publication No. 2013-153070 JP-A-2015-26871

10 (a) is a plan view showing an example of the conventional light emitting device 90, and FIG. 10 (b) shows the dotted line region of FIG. 10 (a) in the IB-IB line cross-sectional view of FIG. 10 (a). It is a figure which shows the corresponding part.

The light emitting device 90 includes an LED element 91, a resin frame 92, and a sealing resin 93. The white light obtained by mixing the blue light from the LED element 91, which is a blue LED, with the yellow light obtained by exciting the yellow phosphor contained in the sealing resin 93 with the blue light is a light emitting device. Emit from 90. When a yellow phosphor is used, if the blue light emitted by the LED element 91 passes through the sealing resin 93 for a long time, the probability that the light irradiates the yellow phosphor increases, and the light emitted from the light emitting device 90 becomes more. It turns yellow. The light L1 obliquely emitted from the LED element 91 passes through the sealing resin 93 longer than the light L2 vertically emitted from the upper surface of the LED element 91. When the light L1 obliquely emitted from the LED element 91 is emitted from the vicinity of the resin frame 92 to the outside of the light emitting device 90, yellow ring-shaped light (hereinafter, may be referred to as a yellow ring) is generated around the white light. .. The generation of the yellow ring impairs the color uniformity of the light emitted from the light emitting device 90.

Therefore, an object of the present invention is to provide a light emitting device capable of suppressing the generation of a yellow ring.

A substrate, a light emitting element mounted on the substrate, a holding material arranged around the light emitting element on the substrate, and a sealing material filled inside the holding material to seal the light emitting element. The encapsulant contains a fluorescent material that converts the light emitted from the light emitting element into wavelength and emits the light, and the holding material has a peak wavelength of the light emitted by the fluorescent material on the surface in contact with the encapsulant. And a light emitting device including a pigment that includes the peak wavelength of the light emitted by the light emitting element in the absorption band of the absorption spectrum.

In the above light emitting device, the holding material preferably contains a resin and a pigment, and the pigment is dispersed in the entire holding material.

In the above light emitting device, the holding material preferably includes a first portion containing a resin and a pigment, and a second portion containing no pigment, containing a resin and a reflective material, and arranged inside the first portion. ..

In the above light emitting device, it is preferable that the second portion has a reflecting surface whose height from the substrate gradually decreases from the outside where the first portion is arranged toward the inside where the light emitting element is mounted. ..

In the above light emitting device, the holding material includes a first portion containing a resin and a pigment, and a second portion containing no pigment, containing a resin and a reflective material, and arranged inside and outside the first portion. Is preferable.

In the above light emitting device, it is preferable that the first portion has a flat portion at the upper portion.

In the above light emitting device, it is preferable that the upper surface of the sealing material is located at the same height as the flat portion.

In the above light emitting device, it is preferable that the light emitted from the fluorescent material has a yellow color, the light emitted from the light emitting element has a blue color, and the pigment has a black color.

According to the present invention, it is possible to realize a light emitting device capable of suppressing the generation of a yellow ring.

(A) and (b) are a plan view and a cross-sectional view of a light emitting device 1. (A) and (b) are graphs showing absorption spectra and the like. (A) to (d) are schematic explanatory views of the manufacturing method of a light emitting device 1. (A) and (b) are a plan view and a cross-sectional view of a light emitting device 2. (A) to (e) are schematic explanatory views of the manufacturing method of a light emitting device 2. (A) and (b) are a plan view and a cross-sectional view of a light emitting device 3. (A) to (e) are schematic explanatory views of the manufacturing method of a light emitting device 3. (A) and (b) are a plan view and a cross-sectional view of a light emitting device 4. (A) to (e) are schematic explanatory views of the manufacturing method of a light emitting device 4. (A) and (b) are a plan view and a cross-sectional view of a light emitting device 90.

Hereinafter, the light emitting device will be described with reference to the drawings. However, it should be understood that the invention is not limited to the drawings or embodiments described below.

(First Embodiment)
1 (a) is a plan view of the light emitting device 1 according to the first embodiment viewed upward, and FIG. 1 (b) is a cross-sectional view taken along the line AA'in FIG. 1 (a).

The light emitting device 1 has a mounting board 10, a circuit board 15, a plurality of LED elements 30, a dam material 40, and a sealing material 50 as main components. The light emitting device 1 is used as an LED light source of a light source device such as a floodlight, high ceiling lighting, and stadium lighting / illumination, and emits white light. However, the emission color of the invention device 1 may be other than white.

Note that, in FIG. 1B, only the elements in the cross-sectional portion are shown, and the elements deeper than the cross-sectional portion are omitted in order to make the illustration easier to understand. Further, although the encapsulant 50 containing phosphor particles and having translucency is present in the uppermost layer of the light emitting device 1, it is assumed that the lower layer portion can be observed for convenience, and in FIG. 1A. The lower part is shown by a solid line. The dam material 40 is also opaque, but is shown in FIG. 1 (a) as being translucent.

As shown in FIG. 1, the mounting substrate 10 is a flat aluminum substrate on which a plurality of LED elements 30 are mounted on its upper surface, and has a square shape as an example. The mounting substrate 10 may be a ceramic substrate. Further, a high reflection processing layer (reflection layer) such as a silver layer (not shown) is formed on the upper surface of the mounting substrate 10. The reflective layer may be an antireflection film such as a dielectric multilayer film. Even if through holes for fixing the light emitting device 1 are provided near the two corners on the diagonal line different from the two vertices on the diagonal line where the first terminal electrode 21 and the second terminal electrode 23 are provided. good.

A circuit board 15 having a circular opening 16 is attached to the upper surface of the mounting board 10 by an adhesive. The circuit board 15 is an insulating substrate made of a glass epoxy material. A wiring pattern is formed on the upper surface of the circuit board 15. The wiring pattern is electrically connected to the arc-shaped first electrode 20, the first terminal electrode 21 electrically connected to the first electrode 20, the arc-shaped second electrode 22, and the second electrode 22. The second terminal electrode 23 is included. The wiring pattern is formed, for example, by plating copper with nickel and gold.

The first terminal electrode 21 and the second terminal electrode 23 are formed in the vicinity of two vertices facing each other on the diagonal line of the mounting substrate 10. The first terminal electrode 21 is a cathode (negative) electrode, and the second terminal electrode 23 is an anode (positive) electrode. When a voltage is applied to these electrodes from an external power source, the LED element 30 is energized and emits light. The device 1 emits light. Reference numerals 24 and 25 near the first terminal electrode 21 and the second terminal electrode 23 are patterns indicating the polarities of the first terminal electrode 21 and the second terminal electrode 23, and are not wiring patterns, but are wiring patterns. It is formed of the same gold-plated layer.

The upper surface of the circuit board 15 is used to prevent a short circuit between the first terminal electrode 21 and the second terminal electrode 23, except for the surfaces of the first terminal electrode 21, the second terminal electrode 23, and the polar patterns 24 and 25. , Covered by a solder mask (not shown).

The plurality of LED elements 30 mounted on the mounting substrate 10 are connected to each other by a gold wire bonding wire (hereinafter, simply referred to as a wire) 32, and further connected to the first electrode 20 and the second electrode 22 by a wire. .. In the example of FIG. 1, the LED elements 30 are connected between the first electrode 20 and the second electrode 22 in five rows of five LED elements in parallel, but the number of LED elements in series and the number of rows in parallel are arbitrary. There may be other numbers.

The LED element 30 is an example of a light emitting element, and is, for example, a blue LED that emits blue light having a light emitting wavelength band of about 450 to 460 nm. As described above, in the light emitting device 1, a plurality of (5 × 5 = 25) LED elements 30 are mounted on the mounting substrate 10, and these emit blue light having the same wavelength. However, the LED element 30 is not limited to the blue LED, and may be, for example, a purple LED or a near-ultraviolet LED, and the emission wavelength band thereof may be in the range of about 200 to 460 nm including the ultraviolet region.

The LED element 30 has a pair of element electrodes on the upper surface. As shown in FIG. 1, the element electrodes of the adjacent LED elements 30 are connected in series by wires 32, and the element electrodes of the LED elements 30 at both ends are connected to the first electrode 20 or the second electrode 22 by wires 32. It is connected. The lower surface of the LED element 30 is directly fixed to the upper surface of the mounting substrate 10 inside the opening 16 of the circuit board 15 by, for example, a transparent insulating adhesive (die bond). Since the LED element 30 is directly fixed on the reflective layer formed on the aluminum mounting substrate 10, it has a high heat dissipation effect and can emit high-power light.

The component represented by reference numeral 31 is a Zener diode element that protects the LED element 30 when an overvoltage is applied between the first electrode 20 and the second electrode 22.

The dam material 40 is an example of a holding material, and is an annular (toroidal-shaped, donut-shaped) frame body arranged around the LED element 30 on the mounting substrate 10 and absorbing light. The dam material 40 is formed at a position overlapping the first electrode 20, the second electrode 22, and the Zener diode element 31 on the circuit board 15 so as to cover them and surround the plurality of LED elements 30.

The dam material 40 contains a silicone resin and a predetermined pigment. The predetermined pigment is a pigment that includes both the peak wavelength of the light emitted by the phosphor contained in the encapsulant 50 and the peak wavelength of the light emitted by the LED element 30 in the absorption band of the absorption spectrum. The absorption spectrum is a spectrum of light absorbed by an object with respect to a standard light source, and the absorption band is a portion of the absorption spectrum showing continuous absorption. The absorption band is, for example, a wavelength band having an absorption rate of a predetermined ratio (for example, 80%) or more. That is, this pigment has a color that absorbs the light that is wavelength-converted by the phosphor and emitted from the phosphor and the light emitted by the LED element 30. In the light emitting device 1, the light emitted from the phosphor has a yellow color, the light emitted from the LED element 30 has a blue color, and the pigment has a black color. As such pigments, for example, titanium black, carbon black and the like are used. The pigment may have a color other than black as long as it is a color that absorbs the light emitted from the phosphor after wavelength conversion by the phosphor and the light emitted by the LED element 30.

The pigment is dispersed throughout the dam material 40. The dam material 40 absorbs the blue light emitted laterally from each LED element 30 and the light emitted laterally from each LED element 30 and wavelength-converted by the phosphor contained in the encapsulant 50. .. In the light emitting device 1, the light emitted from each LED element 30 and whose wavelength is converted by the phosphor contained in the sealing material 50 is absorbed by the dam material 40, so that the generation of yellow ring is suppressed and the light emitting device 1 emits light. It is possible to keep the color of the emitted light uniform. Further, in the light emitting device 1, the blue light emitted laterally from each LED element 30 and the light emitted laterally from each LED element 30 and wavelength-converted by the phosphor contained in the encapsulant 50 are emitted. Since it is absorbed by the dam material 40, light leakage from the side of the light emitting device 1 is prevented. As shown in FIG. 1, the dam material 40 is arranged in a circular shape in a plan view, but may be arranged in an elliptical shape. Further, the dam material 40 may be formed of a metal material having the same color as the above pigment or a metal material surface-treated with the above pigment.

The sealing material 50 is injected (filled) into the inside of the dam material 40 arranged on the circuit board 15, that is, the portion surrounded by the dam material 40 and cured in a substantially disk shape, and a plurality of LED elements 30 are integrated. Cover and protect (seal). The upper surface of the sealing material 50 is located at the same height as the top of the dam material 40. That is, at least a part of the dam material 40 is in contact with the sealing material 50, and the dam material 40 contains the above pigment on the surface in contact with the sealing material 50. A silicone resin is used as the sealing material 50, but another resin that is colorless and transparent and has a heat resistance of about 250 ° C. can be used.

A phosphor that converts the wavelength of the emitted light from each LED element 30 is mixed in the sealing material 50. The phosphor is an example of a fluorescent material, and the light emitted from the LED element 30 is wavelength-converted and emitted. The encapsulant 50 contains a yellow phosphor such as YAG (yttrium aluminum garnet) as such a phosphor. The light emitting device 1 emits white light obtained by mixing blue light from the LED element 30 which is a blue LED and yellow light obtained by exciting a yellow phosphor by the blue light.

The yellow fluorescent substance described above is an example, and the encapsulant 50 may contain another fluorescent substance. For example, the encapsulant 50 may contain two types, a green phosphor and a red phosphor. In this case, the light emitting device 1 is white obtained by mixing the blue light from the LED element 30 which is a blue LED with the green light and the red light obtained by exciting the green phosphor and the red phosphor by the blue light. Emit light. As the green phosphor, a particulate phosphor material such as (BaSr) ₂ SiO ₄ : Eu ²⁺ , which absorbs the blue light emitted by the LED element 30 and converts the wavelength into green light, can be used. As the red phosphor, a particulate phosphor material such as CaAlSiN ₃ : Eu ²⁺ , which absorbs the blue light emitted by the LED element 30 and converts the wavelength into red light, can be used.

As the pigment contained in the dam material 40, the pigment having a black color such as titanium black or carbon black described above also includes the peak wavelength of red light and the peak wavelength of green light in the absorption band of the absorption spectrum. Therefore, even when the sealing material 50 contains a green phosphor and a red phosphor, the dam material 40 can be made of a sealing material by containing a pigment having a black color such as titanium black or carbon black in the dam material 40. It absorbs light whose wavelength has been converted by the phosphor contained in 50.

In the light emitting device 1, since the filling rate of the LED element 30 is high, the amount of heat generated per unit area of the light emitting area (inside the dam material 40) is also large. When the distance between the LED elements becomes narrow and the light density increases, the density of the light that hits the phosphor contained in the encapsulant 50 also increases, and the phosphor itself also generates heat. Therefore, in the light emitting device 1, the phosphor in the sealing material 50 is settled and brought close to the mounting substrate 10, so that the heat dissipation property of the phosphor itself is also improved and heat is easily dissipated.

2 (a) and 2 (b) are graphs schematically showing the spectrum of light by the LED element 30 and the phosphor and the absorption spectrum of the dam material.

The horizontal axis of FIGS. 2 (a) and 2 (b) indicates the wavelength (nm), and the wavelength becomes longer toward the right. The vertical axis of FIGS. 2 (a) and 2 (b) shows the relative radiation intensity of light with respect to the spectrum of light by the LED element 30 and the phosphor, and the intensity increases as it goes up. Further, the vertical axis of FIGS. 2 (a) and 2 (b) shows the absorption rate of the absorption spectrum of the dam material, and the absorption rate increases as it goes up.

Graph 201 of FIG. 2A shows the spectrum of light emitted from the LED element 30 and the phosphor. In this spectrum, intensity peaks exist in the vicinity of the peak wavelength λ1 of the blue light emitted by the LED element 30 and the peak wavelength λ2 of the yellow light wavelength-converted by the phosphor. Graph 202 shows the absorption spectrum of the dam material in which titanium black (13MC) was used as a pigment. In this absorption spectrum, the absorption rate at the peak wavelength λ1 of the light emitted by the LED element 30 is about 0.9, and the absorption rate at the peak wavelength λ2 of the light wavelength-converted by the phosphor is about 0.9. .. That is, the peak wavelength λ1 of the light emitted by the LED element 30 and the peak wavelength λ2 of the light wavelength-converted by the phosphor are included in the absorption band of titanium black. Therefore, the light emitted by the LED element 30 and the light wavelength-converted by the phosphor are substantially absorbed by the dam material in which titanium black is used as the pigment.

Graph 211 of FIG. 2B shows a spectrum of light similar to Graph 201 of FIG. 2A. Graph 212 shows the absorption spectrum of the dam material in which carbon black is used as a pigment. In this absorption spectrum, the absorption rate at the peak wavelength λ1 of the light emitted by the LED element 30 is about 1.0, and the absorption rate at the peak wavelength λ2 of the light wavelength-converted by the phosphor is about 0.9. .. That is, the peak wavelength λ1 of the light emitted by the LED element 30 and the peak wavelength λ2 of the light wavelength-converted by the phosphor are included in the absorption band of carbon black. Therefore, the light emitted by the LED element 30 and the light wavelength-converted by the phosphor are substantially absorbed by the dam material in which carbon black is used as the pigment.

In the light emitting device 1, a dam material 40 having a color that is wavelength-converted by the phosphor and absorbs the light emitted from the phosphor is arranged around the LED element 30 and the sealing material 50. As a result, in the light emitting device 1, the light emitted obliquely from the LED element 30 and wavelength-converted by the phosphor is absorbed by the dam material 40, so that the generation of yellow ring is suppressed.

3A to 3D are schematic explanatory views of a manufacturing method of the light emitting device 1. Hereinafter, a method for manufacturing the light emitting device 1 will be described with reference to FIG.

First, the mounting board 10 and the circuit board 15 on which various wiring patterns are formed are prepared, the mounting board 10 and the circuit board 15 are bonded by an adhesive, and the first electrode 20 and the second electrode 22 are attached to the upper surface of the circuit board 15. Is implemented. FIG. 3A is a diagram showing a state in which the mounting board 10 and the circuit board 15 are adhered to each other.

Next, a plurality of LED elements 30 are mounted on the upper surface of the mounting board 10 inside the opening 16 of the circuit board 15, and between the LED elements 30 and between the LED elements 30, the LED element 30, the first electrode 20, and the second electrode 22. The spaces are connected by wires. FIG. 3B is a diagram showing a state in which the LED element 30 is mounted on the upper surface of the mounting board 10 and connected by a wire.

Next, an uncured dam material resin is filled from a predetermined supply nozzle (not shown) and heated so as to draw a circle around the plurality of LED elements 30 and cover the first electrode 20 and the second electrode 22. And the dam material 40 is formed. FIG. 3C is an image of a cross section of the dam material 40 formed on the first electrode 20 and the second electrode 22.

Next, the uncured encapsulant resin is filled inside the dam material 40 from a predetermined supply nozzle (not shown) to the height of the apex of the dam material 40 and heated to form the encapsulant 50. The light emitting device 1 is completed. FIG. 3D is an image of a cross section when the sealing material 50 is formed.

(Second Embodiment)
FIG. 4A is a plan view of the light emitting device 2 according to the second embodiment viewed upward, and FIG. 4B is a cross-sectional view taken along the line AA'in FIG. 4A.

The light emitting device 2 has a mounting board 10, a circuit board 15, a plurality of LED elements 30, a dam material 41, and a sealing material 51 as main components. The configuration of the mounting board 10, the circuit board 15, and the plurality of LED elements 30 is the same as the configuration of the mounting board 10, the circuit board 15, and the plurality of LED elements 30 included in the light emitting device 1.

The dam material 41 is an example of a holding material, and includes a first portion 41a and a second portion 41b. Similar to the dam material 40, the first portion 41a is an annular frame that is arranged around the LED element 30 on the mounting substrate 10 and absorbs light. The second portion 41b is arranged inside the first portion 41a, and the top of the second portion 41b is located below the top of the first portion 41a (mounting board 10).

The first portion 41a contains a silicone resin and a predetermined pigment. This pigment is the same pigment as the pigment contained in the dam material 40. The first portion 41a may be formed of a metal material having the same color as this pigment or a metal material surface-treated with this pigment. On the other hand, the second portion 41b is composed of a reflective white resin that does not contain this pigment and contains a silicone resin and a reflective material such as titanium oxide (or silica).

The second portion 41b emits blue light emitted laterally from each LED element 30 and light emitted laterally from each LED element 30 and wavelength-converted by a phosphor contained in the encapsulant 51. It is reflected above the device 2. On the other hand, the above pigment is dispersed in the entire first portion 41a. The first portion 41a absorbs the blue light emitted laterally from each LED element 30 and the light emitted laterally from each LED element 30 and wavelength-converted by the phosphor contained in the encapsulant 51. do. In the light emitting device 2, the emitted light from the LED element 30 and the phosphor is reflected upward by the second portion 41b, so that the emission efficiency is higher than that in the light emitting device 1. On the other hand, in the light emitting device 2, since the light wavelength-converted by the phosphor is absorbed by the first portion 41a, the generation of yellow ring is suppressed and the color of the light emitted from the light emitting device 2 can be kept uniform. It will be possible. Further, in the light emitting device 2, the blue light emitted laterally from each LED element 30 and the light emitted laterally from each LED element 30 and wavelength-converted by the phosphor contained in the encapsulant 51 are emitted. Since it is absorbed by the first portion 41a, light leakage from the side of the light emitting device 2 is prevented.

Like the sealing material 50, the sealing material 51 is injected (filled) into the inside of the dam material 41 arranged on the circuit board 15, that is, the portion surrounded by the dam material 41, and is cured into a substantially disk shape. , A plurality of LED elements 30 are integrally covered and protected (sealed). The upper surface of the sealing material 51 is located at the same height as the top of the first portion 41a of the dam material 41. That is, at least a part of the first portion 41a of the dam material 41 is in contact with the sealing material 51, and the dam material 41 contains the above pigment on the surface in contact with the sealing material 51. The encapsulant 51 is made of the same material as the encapsulant 50.

5 (a) to 5 (e) are schematic explanatory views of a method of manufacturing the light emitting device 2. Hereinafter, a method for manufacturing the light emitting device 2 will be described with reference to FIG.

The manufacturing procedure shown in FIGS. 5A to 5B is the same as the manufacturing procedure shown in FIGS. 3A to 3B. After the LED element 30 is mounted on the upper surface of the mounting substrate 10, an uncured second portion resin is formed so as to draw a circle around the plurality of LED elements 30 and cover the first electrode 20 and the second electrode 22. It is filled and heated from a predetermined supply nozzle to form a second portion 41b of the dam material 41. FIG. 5C is an image diagram of a cross section when the second portion 41b is formed on the first electrode 20 and the second electrode 22.

Next, the outside of the second portion 41b is filled with an uncured resin for the first portion from a predetermined supply nozzle and heated so as to cover a part of the second portion 41b, and the first portion of the dam material 41 is heated. 41a is formed. FIG. 5D is an image of a cross section when the first portion 41a is formed on the outside of the second portion 41b.

Next, the uncured encapsulant resin is filled inside the dam material 41 from a predetermined supply nozzle to the height of the apex of the first portion 41a and heated to form the encapsulant 51, and the light emitting device 2 is formed. Is completed. FIG. 5 (e) is an image of a cross section when the sealing material 51 is formed.

(Third Embodiment)
FIG. 6A is a plan view of the light emitting device 3 according to the third embodiment viewed upward, and FIG. 6B is a cross-sectional view taken along the line AA'in FIG. 6A.

The light emitting device 3 has a mounting board 10, a circuit board 15, a plurality of LED elements 30, a dam material 42, and a sealing material 52 as main components. The configuration of the mounting board 10, the circuit board 15, and the plurality of LED elements 30 is the same as the configuration of the mounting board 10, the circuit board 15, and the plurality of LED elements 30 included in the light emitting device 1. In FIG. 6A, the elements located in the opening 16 of the circuit board 15 and the elements located below the dam material 42 are omitted for easy understanding.

The dam material 42 is an example of a holding material, and includes a first portion 42a and a second portion 42b. Similar to the dam material 40, the first portion 42a is an annular frame that is arranged around the LED element 30 on the mounting substrate 10 and absorbs light. The second portion 42b is arranged inside and outside the first portion 42a. The first portion 42a is formed so as to have an L-shaped cross section, has a flat portion 42d at the upper portion, and further has a base portion 42d arranged on the circuit board 15 and extending to the outer end portion of the flat portion 42c. is doing. The flat portion 42c formed on the upper portion of the first portion 42a protrudes from the top of the second portion 42b and is located at a position higher than the top of the second portion 42b.

The first portion 42a contains a resin for molding and a predetermined pigment. This pigment is the same pigment as the pigment contained in the dam material 40. The first portion 42a may be formed of a metal material having the same color as this pigment or a metal material surface-treated with this pigment. On the other hand, the second portion 42b is composed of a reflective white resin that does not contain this pigment and contains a silicone resin and a reflective material such as titanium oxide (or silica).

Of the second portion 42b, the portion arranged inside the first portion 43a is the blue light emitted laterally from each LED element 30 and the sealing material emitted laterally from each LED element 30. The light wavelength-converted by the phosphor contained in 53 is reflected above the light emitting device 4. On the other hand, the above pigment is dispersed in the entire first portion 42a. The first portion 42a absorbs the blue light emitted laterally from each LED element 30 and the light emitted laterally from each LED element 30 and wavelength-converted by the phosphor contained in the encapsulant 52. do. In the light emitting device 3, the emitted light from the LED element 30 and the phosphor is reflected upward by the second portion 42b, so that the emission efficiency is higher than that in the light emitting device 1. On the other hand, in the light emitting device 3, since the light wavelength-converted by the phosphor is absorbed by the first portion 42a, the generation of yellow ring is suppressed and the color of the light emitted from the light emitting device 3 can be kept uniform. It will be possible. Further, in the light emitting device 3, the blue light emitted laterally from each LED element 30 and the light emitted laterally from each LED element 30 and wavelength-converted by the phosphor contained in the sealing material 52 are emitted. Since it is absorbed by the first portion 42a, light leakage from the side of the light emitting device 3 is prevented.

Further, in the light emitting device 3, the flat portion 42c is formed on the upper portion of the dam material 42 by the first portion 42a molded to a predetermined size, so that the overall height of the light emitting device 3 can be stabilized. It will be possible.

Like the sealing material 50, the sealing material 52 is injected (filled) into the inside of the dam material 42 arranged on the circuit board 15, that is, the portion surrounded by the dam material 42, and is cured into a substantially disk shape. , A plurality of LED elements 30 are integrally covered and protected (sealed). The upper surface of the sealing material 53 is located at the same height as the flat portion 42c of the first portion 42a of the dam material 42. That is, at least a part of the first portion 42a of the dam material 42 is in contact with the sealing material 52, and the dam material 42 contains the above pigment on the surface in contact with the sealing material 52. The encapsulant 52 is made of the same material as the encapsulant 50.

7 (a) to 7 (e) are schematic explanatory views of a manufacturing method of the light emitting device 3. Hereinafter, a method for manufacturing the light emitting device 3 will be described with reference to FIG. 7.

The manufacturing procedure shown in FIGS. 7 (a) to 7 (b) is the same as the manufacturing procedure shown in FIGS. 3 (a) to 3 (b). After the LED element 30 is mounted on the upper surface of the mounting substrate 10, a circle is drawn around the plurality of LED elements 30 and the first electrode 20 and the second electrode 22 are covered so as to cover the uncured second portion. The resin 42'is filled from a predetermined supply nozzle. FIG. 7C is an image of a cross section of the uncured resin 42'for the second portion formed on the first electrode 20 and the second electrode 22.

Next, the first portion 42a formed in an annular shape and an L shape faces the upper side of the uncured second portion resin 42', and the flat portion 42c faces the upper side (opposite side of the mounting substrate 10). , Arranged along the resin 42'for the second portion. Next, the tip of the base portion 42d is inserted from the upper part of the uncured second portion resin 42'. After that, the resin 42'for the second portion is heated, and the inner and outer portions of the first portion 42a are formed as the second portion 42b. FIG. 7D is an image of a cross section when the second portion 42b is formed with the first portion 42a interposed therebetween.

Next, the uncured encapsulant resin is filled inside the dam material 42 from a predetermined supply nozzle to the height of the flat portion 43c of the first portion 42a and heated to form the encapsulant 52 and emit light. The device 3 is completed. FIG. 7 (e) is an image of a cross section when the sealing material 52 is formed.

(Fourth Embodiment)
FIG. 8 (a) is a plan view of the light emitting device 4 according to the fourth embodiment viewed upward, and FIG. 8 (b) is a cross-sectional view at the position indicated by AA'in FIG. 8 (a).

The light emitting device 4 has a mounting board 10, a circuit board 15, a plurality of LED elements 30, a dam material 43, and a sealing material 53 as main components. The configuration of the mounting board 10, the circuit board 15, and the plurality of LED elements 30 is the same as the configuration of the mounting board 10, the circuit board 15, and the plurality of LED elements 30 included in the light emitting device 1. In FIG. 8A, the elements located in the opening 16 of the circuit board 15 and the elements located below the dam material 43 are omitted for easy understanding.

The dam material 43 is an example of a holding material, and includes a first portion 43a and a second portion 43b. Similar to the dam material 40, the first portion 43a is an annular frame that is arranged around the LED element 30 on the mounting substrate 10 and absorbs light. The first portion 43a is formed so as to have an L-shaped cross section, has a flat portion 43c at the upper portion, and further has a base portion 43d arranged on the circuit board 15 and extending to the outer end portion of the flat portion 43d. is doing. The second portion 43b is arranged inside the first portion 43a, and the height from the mounting substrate 10 gradually increases from the outside where the first portion 43a is arranged toward the inside where the LED element 30 is mounted. It has a low reflective surface. The flat portion 43c formed on the upper part of the first portion 43a is located at a position higher than the top of the second portion 43b.

The first portion 43a contains a resin for molding and a predetermined pigment. This pigment is the same pigment as the pigment contained in the dam material 40. The first portion 43a may be formed of a metal material having the same color as this pigment or a metal material surface-treated with this pigment. On the other hand, the second portion 43b is composed of a reflective white resin that does not contain this pigment and contains a silicone resin and a reflective material such as titanium oxide (or silica).

The second portion 43b emits blue light emitted laterally from each LED element 30 and light emitted laterally from each LED element 30 and wavelength-converted by a phosphor contained in the encapsulant 53. It is reflected above the device 4. On the other hand, the above pigment is dispersed in the entire first portion 43a. The first portion 43a absorbs the blue light emitted laterally from each LED element 30 and the light emitted laterally from each LED element 30 and wavelength-converted by the phosphor contained in the encapsulant 53. do. In the light emitting device 4, the emitted light from the LED element 30 and the phosphor is reflected upward by the second portion 43b, so that the emission efficiency is higher than that in the light emitting device 1. On the other hand, in the light emitting device 4, since the light wavelength-converted by the phosphor is absorbed by the first portion 43a, the generation of yellow ring is suppressed and the color of the light emitted from the light emitting device 4 can be kept uniform. It will be possible. Further, in the light emitting device 4, the blue light emitted laterally from each LED element 30 and the light emitted laterally from each LED element 30 and wavelength-converted by the phosphor contained in the encapsulant 53 are emitted. Since it is absorbed by the first portion 43a, light leakage from the side of the light emitting device 4 is prevented.

Further, in the light emitting device 4, the flat portion 43c is formed on the upper portion of the dam material 43 by the first portion 43a molded to a predetermined size, so that the overall height of the light emitting device 4 can be stabilized. It will be possible. Further, in the light emitting device 4, by providing the first portion 43a molded into a predetermined shape, the second portion 43b can be formed along the first portion 43a, and the second portion 43b can be formed. It becomes easy to form a concave shape.

Like the sealing material 50, the sealing material 53 is injected (filled) into the inside of the dam material 43 arranged on the circuit board 15, that is, the portion surrounded by the dam material 43, and is cured into a substantially disk shape. , A plurality of LED elements 30 are integrally covered and protected (sealed). The upper surface of the sealing material 53 is located at the same height as the flat portion 43c of the first portion 43a of the dam material 43. That is, at least a part of the first portion 43a of the dam material 43 is in contact with the sealing material 53, and the dam material 43 contains the above pigment on the surface in contact with the sealing material 53. The encapsulant 53 is made of the same material as the encapsulant 50.

9 (a) to 9 (e) are schematic explanatory views of a manufacturing method of the light emitting device 4. Hereinafter, a method for manufacturing the light emitting device 4 will be described with reference to FIG. 9.

The manufacturing procedure shown in FIGS. 9 (a) to 9 (b) is the same as the manufacturing procedure shown in FIGS. 3 (a) to 3 (b). After the LED element 30 is mounted on the upper surface of the mounting board 10, the first portion 43a formed in an annular shape and an L shape has a plurality of flat portions 43c facing the upper side (opposite side of the mounting board 10). It is arranged around the LED element 30 of the above, particularly outside the first electrode 20 and the second electrode 22. Next, the tip of the base 43d is adhered to the circuit board 15 with an adhesive. FIG. 9C is an image diagram of a cross section when the first portion 43a is arranged on the circuit board 15.

Next, the uncured second portion resin is filled inside the first portion 43a from a predetermined supply nozzle so as to cover the first electrode 20 and the second electrode 22. As a result, the second portion 43b is formed so that the height gradually decreases from the outside to the inside. FIG. 9D is an image of a cross section when the second portion 43b is formed on the first electrode 20 and the second electrode 22.

Next, the uncured encapsulant resin is filled inside the dam material 43 from a predetermined supply nozzle to the height of the flat portion 43c of the first portion 43a and heated to form the encapsulant 53 and emit light. The device 4 is completed. FIG. 9E is an image of a cross section when the sealing material 53 is formed.

In the above-mentioned light emitting devices 1 to 4, as shown in FIGS. 1, 4, 6, and 8, a substrate having a circuit board 15 having a wiring pattern attached on an aluminum mounting substrate 10 is used. Has been (COB). However, in the light emitting devices 1 to 4, a base material on which the wiring pattern is directly arranged may be used without providing the circuit board 15 on the ceramic mounting substrate 10 (SMD).

1, 2, 3, 4 Light emitting device 10 Mounting board 15 Circuit board 30 LED element 40, 41, 42, 43 Dam material 41a, 42a, 43a First part 41b, 42b, 43b Second part 42c Third part 50, 51 , 52, 53 Encapsulant

Claims (8)

With the board
The light emitting element mounted on the substrate and
On the substrate, the holding material arranged around the light emitting element and
It has a sealing material filled inside the holding material in order to seal the light emitting element.
The encapsulant contains a fluorescent material that wavelength-converts and emits light emitted from the light emitting element.
The holding material contains a pigment whose surface in contact with the sealing material contains both the peak wavelength of the light emitted by the fluorescent material and the peak wavelength of the light emitted by the light emitting element in the absorption band of the absorption spectrum.
A light emitting device characterized by that. The light emitting device according to claim 1, wherein the holding material contains a resin and the pigment, and the pigment is dispersed in the entire holding material. The holding material includes a first portion containing a resin and the pigment, and a second portion containing the resin and a reflective material without the pigment and arranged inside the first portion, according to claim 1. The light emitting device described. According to claim 3, the second portion has a reflective surface whose height from the substrate gradually decreases from the outside where the first portion is arranged toward the inside where the light emitting element is mounted. The light emitting device described. The holding material comprises a first portion containing the resin and the pigment and a second portion not containing the pigment but containing the resin and the reflective material and disposed inside and outside the first portion. The light emitting device according to 1. The light emitting device according to any one of claims 3 to 5, wherein the first portion has a flat portion at an upper portion. The light emitting device according to claim 6, wherein the upper surface of the sealing material is located at the same height as the flat portion. The light emitting device according to any one of claims 1 to 7, wherein the light emitted from the fluorescent material has a yellow color, the light emitted from the light emitting element has a blue color, and the pigment has a black color. ..

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