JP6735072B2 - LED light source device and projector - Google Patents

Description

The present invention relates to an LED light source device and a projector, for example, an LED light source device for a projector having excellent luminous flux distribution and directivity, and a total luminous flux value from three light sources being 2000 lumens (lm) or more (preferably 3000 lm or more). And a projector including the light source device.

In recent years, many lighting fixtures have been proposed in which the light emitting unit is replaced with an LED (Light Emitting Diode), and an LED light source that replaces an ultra-high pressure mercury lamp has also been proposed for a projector.
For example, Patent Document 1 proposes a projector having an optical configuration shown in FIG. Reference numeral 10R is an LED for red light, reference numeral 10G is an LED for green light, reference numeral 10B is an LED for blue light, and the light from each LED is collimated by the collimator lens 12, The light enters each liquid crystal light valve 100, is modulated, and then enters the dichroic prism 14. The light combined by the dichroic prism 14 is projected on a screen from a projection lens 16 having a zoom ring 17.

However, it is not possible to provide a bright projector equivalent to a mercury lamp by emitting light from a single LED. Therefore, in Patent Document 2, a light guide body having an area in which the light incident end surface and the light exit end surface facing each other are relatively larger than the area of the display region in the irradiated body, and the light incident end surface of the light guide body. A light source having a light emitting area substantially equal to the area of the light incident end surface, and the light emitting end surface of the light guide has an area substantially equal to the area of the display region of the irradiated body. No. 1 opening is formed, and a light exit side reflection member is provided in a region other than the first opening, and the light exit side reflection member is provided on the light entrance side of the light guide in the optical axis direction from the light source. An illuminating device is proposed in which a light-incident-side reflecting member facing the member is provided.

However, with the optical structure of Patent Document 2, the size of the projector main body must be enormous. On the other hand, if the integration degree of the LED elements is increased, there is a problem that a donut phenomenon occurs in which the light amount at the emission center portion where the heat dissipation is deteriorated is particularly reduced. Therefore, in Patent Document 3, the applicants apply a liquid material containing SiO ₂ particles having an average particle diameter of several nanometers to several hundred nanometers and a white inorganic pigment to the surface of a substrate having at least a metal surface in Patent Document 3 and calcining. As a result, a semiconductor device that can solve the donut phenomenon by forming a laminated structure of a white insulating layer and a metal layer was proposed.

JP2012-155049A JP, 2014-187026, A Patent No. 5456209

The present invention relates to an LED light source device having a light distribution angle of 30 degrees or less (preferably 26 degrees or less, more preferably 20 degrees or less) and excellent in light flux distribution and directivity, and a desktop projector including the light source device. The purpose is to provide. Another object of the present invention is to provide an LED light source device having a total luminous flux value of 2000 lumens (lm) or more, and a table-top projector including the LED light source device.

A first aspect of the present invention is a mounting substrate having at least a metal surface, a first insulating layer formed on the surface of the mounting substrate, a wiring layer formed as an upper layer of the first insulating layer, and a mounting substrate. An LED light source device comprising a plurality of LED chips having the same specifications, which are surface-mounted in a matrix in the above, and a reflector block having the same number of micro-reflectors as the LED chips is provided, and the micro-reflector has a bottom portion. It has an opening and an upper opening having a diameter larger than that of the bottom opening, and the first insulating layer applies a liquid material containing nano-particled SiO ₂ and a white inorganic pigment, and heats it at 160 to 250° C. The wiring layer is composed of a porous inorganic white insulating layer formed by applying a metal paste containing a resin and a metal powder soaked and hardened into the porous inorganic white insulating layer and heated. a first conductive layer formed, provided no wiring pattern by printing on the upper surface of the first conductive layer, a thickness and a low resistance material than the first conductive layer formed by heating the It is an LED light source device characterized by comprising two conductive layers.
A second invention is characterized in that, in the first invention, the second insulating layer functioning as a reflection layer as an upper layer of the wiring layer is formed so as to leave an exposed portion for exposing the wiring layer. To do.
The third invention is the second invention, the second conductive layer, a silver paste was printed, to be formed by heating, the second insulating layer, SiO ₂ and is nanoparticulate It is characterized in that it is composed of a porous inorganic white insulating layer formed by applying a liquid material containing a white inorganic pigment and heating it at 160 to 250°C.
4th invention is a 2nd or 3rd invention, The upper opening of the said micro reflector is expanded by 70-85 degrees with respect to a bottom opening, and the distance between a bottom opening and an upper opening is 4-8 mm. It is characterized by
According to a fifth invention, in the fourth invention, the micro-reflector is characterized in that it is staggered.
A sixth invention is characterized in that, in any of the second to fifth inventions, a light distribution angle is 30 degrees or less, a total luminous flux value is 500 lumens or more, and the projector is used.

A seventh invention is characterized in that, in the sixth invention, the LED chip has a substantially square top view shape and a maximum rated current of 300 mA or more.
An eighth invention is characterized in that, in the seventh invention, the reflector block is made of a resin material integrally molded, and a reflective layer made of a metal material is formed on an inner peripheral surface of the micro reflector. To do.
In a ninth aspect based on the seventh aspect, a metal is integrally formed on a core material of the reflector block and a resin is formed on an outer peripheral portion of the reflector block, and a reflective layer made of a metal material is formed on an inner peripheral surface of the micro reflector. Is characterized by.
In a tenth aspect based on any one of the sixth to ninth aspects, the micro-reflector includes a top opening, a bottom opening in which the LED chip is disposed in the vicinity, and a reflecting surface, and the reflecting surface comprises: A first inner peripheral surface positioned on the bottom opening side and acting to collect irradiation light from the LED chip on the central axis side; and a central axis positioned on the upper opening side with respect to the first inner peripheral surface. A second inner peripheral surface having a narrow angle with respect to the second inner peripheral surface, and a third inner peripheral surface located closer to the upper opening than the second inner peripheral surface and having a narrow angle with respect to the central axis. To do.
An eleventh invention is characterized in that, in the tenth invention, a cross-sectional shape of each of the inner peripheral surfaces is linear.
A twelfth invention is an LED light source device for red light, a transmissive liquid crystal panel for red light for modulating light emitted from the LED light source device for red light, an LED light source device for green light, and the green light. Transmissive liquid crystal panel for green light that modulates light emitted from the LED light source device, LED light source device for blue light, and transmissive liquid crystal panel for red light that modulates light emitted from the red light LED light source device. And a dichroic prism that combines red light, green light, and blue light, and a projection optical system that projects combined light from the dichroic prism, wherein the LED light source device for red light and the LED for green light are provided. The projector is characterized in that the light source device and the LED light source device for blue light are constituted by the LED light source device according to any one of the second to eleventh inventions.
According to a thirteenth invention, in the twelfth invention, the total light flux value of the LED light source device for red light, the LED light source device for green light, and the LED light source device for blue light is 2000 lumens or more. To do.
A fourteenth invention is characterized in that, in the twelfth or thirteenth invention, an irradiation surface formed by the micro-reflector is slightly larger than each of the liquid crystal panels.
A fifteenth invention is characterized in that, in the first to fifth inventions, the plurality of LED chips emit ultraviolet light.
A sixteenth invention is characterized in that, in the fifteenth invention, the white inorganic pigment is alumina.
A seventeenth invention is a UV ink curing device having a light source formed by connecting a plurality of LED light source devices according to the fifteenth or sixteenth invention.
An eighteenth invention is a UV sterilization apparatus having a light source in which a plurality of LED light source devices according to the fifteenth or sixteenth invention are arranged in series.
A nineteenth invention is characterized in that, in the first to sixth inventions, the plurality of LED chips emit infrared light.

ADVANTAGE OF THE INVENTION According to this invention, the light distribution angle is 30 degrees or less, the luminous flux distribution and the directivity, and the total luminous flux value is 2000 lumen (lm) or more LED light source device and the tabletop projector provided with the same light source device. It becomes possible to provide.

It is a block diagram of the projector which concerns on 1st embodiment. It is a structure side view of the LED light source device which concerns on 1st embodiment. (A) A plan view of a reflector block according to the first embodiment, and (b) a schematic view of a micro-reflector. It is a schematic diagram which shows the magnitude relationship between a micro reflector and a liquid crystal light valve. It is a top view and a side view of a modification of a reflector block. FIG. 6 is a perspective view of an LED light source device including the reflector block of FIG. 5. It is a simulation result of the light distribution angle of the reflector block according to the first embodiment. (A) shows a case without a reflector, (b) shows a case with a reflector (without a lens), and (b) shows a case with a reflector (with a lens). (A1) is an enlarged view of a main part of (a), and (b1) is an enlarged view of a main part of (b). It is a side surface schematic diagram which shows the shape of the micro reflector which concerns on 2nd embodiment. It is a side surface schematic diagram for demonstrating the optical characteristic of the micro reflector which concerns on 2nd embodiment. (A) A plan view of a reflector block according to a second embodiment and (b) a plan view of an LED light source device according to a third embodiment. It is a side surface schematic diagram which shows the shape of the micro reflector which concerns on 4th embodiment, (a) is the micro reflector 91a, (b) is the micro reflector 91b, (c) is the micro reflector 91c. It is a side view for demonstrating the inner peripheral surface shape of the micro reflector 91a which concerns on 4th embodiment. (A1) is a schematic side view showing the shape of the micro-reflector 91a according to the fourth embodiment, (b1) is a schematic side view showing the shape of the micro-reflector 92 according to Comparative Example 1, and (a2) is the fourth embodiment ( The directivity simulation result of the LED light source device according to the micro reflector 91a) is shown, and (b2) is the directivity simulation result of the LED light source device according to the first comparative example. It is a top view of the LED light source device which concerns on 5th embodiment. It is a side surface schematic diagram which shows the shape of the micro reflector which concerns on 5th embodiment. It is a structure side view of the comparative example 2 which is a well-known LED light source device. It is a simulation result of the light distribution angle of an LED light source device, (a) is the LED light source device according to the fifth embodiment, (b) is the LED light source device according to Comparative Example 2, and (c) is the LED according to Comparative Example 3. The result of the light source device is shown. It is the simulation result of the luminous flux quantity and luminous flux distribution of the LED light source device, (a) the LED light source device which relates to 5th execution form, (b) the LED light source device which relates to relative example 2, (c) 4th execution form. The result of the LED light source device concerning (micro-reflector 91b) is shown. It is a directivity simulation result of an LED light source device, (a) is the LED light source device according to the fifth embodiment, (b) is the LED light source device according to Comparative Example 2, and (c) is the fourth embodiment (micro reflector). 91b) shows the results of the LED light source device. It is a block diagram of the conventional projector. It is a structure side view of the LED light source device which concerns on 6th embodiment. It is a schematic diagram which shows the cross-section of a wiring layer. It is a structure side view of the LED light source device which concerns on 7th embodiment. FIG. 4A is a plan view of a reflector block in which 5×5 micro-reflectors are arranged in a staggered pattern, and FIG. FIG. 7A is a plan view and FIG. 8B is a range of microreflectors in a reflector block in which microreflectors are arranged in a 7×6 staggered pattern. It is a structure side view of the LED light source device which concerns on 8th embodiment. It is a top view of the mounting board concerning a ninth embodiment. It is a top view of the module board concerning a 9th embodiment. It is a simulation result of the ultraviolet distribution of the LED light source device which concerns on 7th embodiment, (a) the distance of a light-receiving surface is 40 mm, (b) the distance of a light-receiving surface is 60 mm, (c) the distance of a light-receiving surface is 85 mm. The result in is shown.

Hereinafter, the present invention will be described based on examples.
<<First embodiment>>
<Structure>
FIG. 1 is a configuration diagram of a projector 1 according to the first embodiment.
The LED light source device according to the present embodiment includes three LED light source devices 21, three collimator lenses 22, three liquid crystal light valves 23, a dichroic prism 31, and a projection optical system 32.

The LED light source device 21, the collimator lens 22, and the liquid crystal light valve 23 are for emitting R (red), G (green), and B (blue) light to the dichroic prism 31.
The red light (R light) from the LED light source device 21R is collimated by the collimator lens 22R and optically modulated by the liquid crystal light valve 23R. The liquid crystal light valve 23R is a transmissive liquid crystal panel (HTPS liquid crystal panel) arranged in a matrix, and is a known light modulator that modulates R light for each pixel according to a video signal. The same applies to the green light (G light) from the LED light source device 21G and the blue light (B light) from the LED light source device 21B, which are collimated by the collimator lenses 22G and 22B, and the known liquid crystal light valves 23G and 23B. Light modulated.

The dichroic prism 31 has two dichroic films arranged so as to be orthogonal to each other, and one of the dichroic films 14 reflects R light, but transmits G light and B light other than R light and transmits the other dichroic film. The dichroic film 14 reflects B light but transmits R light and G light other than B light. The projection optical system 32 includes a plurality of projection lenses into which the light combined by the dichroic prism 31 enters and a projection lens housing that houses the plurality of projection lenses, and emits the projection light L to display a color image on the screen. Enlarge and project.

The configuration of the LED light source device 21 will be described in detail with reference to FIG. Note that FIG. 2 is a schematic diagram for explaining the structure, and does not accurately show the arrangement of the LED chips 46 in the present embodiment.
The LED light source device 21 includes a mounting substrate 41, an inorganic white insulating layer 42 applied on the upper surface of the mounting substrate 41, a wiring layer 43 applied on the upper surface of the inorganic white insulating layer 42, and an insulating layer 44. The mounting portion 45, the LED chip 46, the translucent resin layer 47, and the reflector block 50 are provided.

The mounting board 41 is a plate material having a metal surface having excellent thermal conductivity and electrical characteristics, and for example, a water-cooled heat spreader having a surface made of copper (a laminated structure including three types of copper plates: an upper plate, a middle plate, and a lower plate). Body) and a copper plate (for example, 0.5 to 1.00 mm thick). A material having low thermal conductivity such as a glass epoxy resin cannot be adopted because it causes a donut phenomenon in which the light amount at the emission center portion, which particularly deteriorates the heat dissipation, is particularly reduced.

On the surface of the mounting substrate 41, an inorganic white insulating layer 42 that also plays a role as a reflecting material is provided. The inorganic white insulating layer 42 preferably has an average reflectance of 70% or more, more preferably 80% or more in the visible light wavelength range. The inorganic white insulating layer 42 contains white inorganic powder (white inorganic pigment) and silicon dioxide (SiO ₂ ) as main components, and is an ink obtained by mixing these with a solvent of diethylene glycol monobutyl ether containing organic phosphoric acid (hereinafter, referred to as “white It is formed by applying and baking (for example, heating at 160 to 250° C.) an inorganic ink).

The thickness of the inorganic white insulating layer 42 is preferably thin from the viewpoint of heat dissipation characteristics, but a certain thickness is required from the viewpoint of withstand voltage and tear strength. Depending on the blending ratio of white inorganic powder and silicon dioxide, the withstand voltage of the insulating film required for mounting the LED is generally 1.5 to 5 kV, and the white inorganic insulator is about 1 KV/10 μm. It is preferable that the thickness is 15 μm or more. On the other hand, in order to prevent the heat dissipation performance from being deteriorated by the inorganic white insulating layer 42, it is preferable that the inorganic white insulating layer 42 has a certain thickness or less. That is, the thickness of the inorganic white insulating layer 42 is set, for example, in the range of 10 to 80 μm, preferably 25 to 50 μm.

As the white inorganic pigment, for example, any one of titanium oxide (TiO ₂ ), zinc oxide, alumina, or a combination thereof is used. The content of the white inorganic pigment in the formed white insulating layer is appropriately adjusted depending on the required reflectance and the like, but is preferably 40 to 70% by weight, and more preferably 50 to 65% by weight. This is because when the amount is 40% by weight or more, a sufficient reflection effect can be obtained, and when the amount is 70% by weight or less, the fluidity of the ink necessary for forming a uniform film can be secured.

The white inorganic powder preferably has an average particle size of 100 μm or less, more preferably 50 μm or less. The white inorganic powder having such a particle size is suitable for coating by screen printing, an inkjet method, a dispenser method, or a spray coating method.
At this time, in order to improve the heat dissipation performance of the white insulating layer, the liquid material (white inorganic ink) described above has a high thermal conductive filler made of an inorganic material (for example, silicon carbide (SiC) coated with a nm-sized alumina film). May be mixed.

By coating the white inorganic ink made of such an insulating material on a metal plate and heating it at 160 to 250° C., for example, the nano-sized insulating particles dispersed in the solvent are arranged according to the irregularities on the surface of the base material. At the same time, the solvent evaporates to form a dense white insulating layer (film). That is, the mixed powder of nano-sized ceramics is heated at atmospheric pressure while being in direct contact with the metal surface, sintered in situ, and bonded to the metal surface at the bonding interface by utilizing the diffusion state due to the nano-size effect. At least a part of the system white insulating layer forms a laminated structure with the metal layer.

The inorganic white insulating layer 42 has a high heat dissipation performance because it has an excellent thermal conductivity of about one digit as compared with glass epoxy, for example, and has a heat dissipation performance that is 2 to 5 times higher than that of a PLCC (Plastic leaded chip carrier) having a similar configuration. Estimated to have. Furthermore, the sulfuration phenomenon can be suppressed by covering the metal surface on the substrate with the inorganic white insulating layer 42.

The wiring layer 43 is drawn and formed at a necessary position on the inorganic white insulating layer 42. The wiring layer 43 is formed by applying a conductive metal ink (for example, silver ink or a hybrid ink in which silver and copper are mixed) by drawing by screen printing, an inkjet method, a dispenser method, or the like, and then baking and metallizing. .. The wiring layer 43 may be formed by drawing after the primer treatment.

The insulating layer 44 may have the same composition as the inorganic white insulating layer 42, or may be selected from organic resins (for example, polyimide resins, olefin resins, polyester resins, and mixtures or modified products thereof). One or more types of resin) may be used. The thickness of the insulating layer 44 is determined by the balance between the insulating property and the thermal conductivity, and is, for example, 10 to 60 μm, preferably 10 to 30 μm.

Examples of the polyimide resin include polyimide having an imide ring structure, polyamide imide, and polyester imide. Examples of the olefin resin include polyethylene, polypropylene, polyisobutylene, polybutadiene, polyisoprene, cycloolefin resin, and copolymers of these resins. Examples of the polyester resin include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and liquid crystal polyester.

The mounting portion 45 is made of the same material as the wiring material or a member having excellent thermal conductivity, and may be formed by applying and firing a metal paste material such as copper paste, silver paste, or solder paste. good. The mounting portion 45 may not be provided, and the upper surface of the inorganic white insulating layer 42 or the mounting substrate 41 may be exposed.

The LED chip 46 is, for example, gallium nitride-based (GaN, AlGaN, InGaN), gallium phosphide-based (GaP, GaAsP), gallium arsenide-based (GaAs, AlGaAs, AlGaInP), or zinc oxide-based (ZnO). The surface-mounted LED bare chip is selected according to A large number of LED chips 3 are arranged in a matrix in n rows×m columns (for example, 6 series×7 parallels, 4 series×4 parallels) in a reflector block, and what is called COB (Chip On Board) mounting. In order to realize high brightness, the LED chip 46 uses, for example, an LED chip having a maximum rated current of 300 mA or more, preferably a maximum rated current of 400 mA or more, and more preferably a maximum rated current of 500 mA or more. The size of the LED chip 46 is 3 to 4 mm square or less (preferably 1.5 mm square or less), and all have the same specifications for each emission color unit. In the first embodiment, an LED chip with a 1.0×1.0×0.15 mm and a light distribution angle of 150 degrees was used.

Table 1 below shows an example of the arrangement of LED chips for realizing 3000 lm, 4000 lm and 5000 lm. The outer size in Table 1 refers to the size of the mounting board on which the LED chip is mounted (or the mounting area on which the LED chip is mounted).
[Table 1]

The translucent resin layer 47 is a transparent resin layer made of, for example, an epoxy-based or silicone-based resin, but in order to emit desired R light, G light, and B light, red, green, and/or blue light is emitted. The phosphor may be mixed in.
On the upper surface of the translucent resin layer 47, a convex lens (microlens) formed of a transparent resin (for example, epoxy resin or silicone resin) and having a spherical surface (bow shape in side view) for focusing the light emitted from the LED chip 46 is formed. It may be provided. By providing this convex lens, it is possible to easily realize that the light distribution angle is within the target value (for example, 10 to 30 degrees).

The configuration of the reflector block 50 will be described in detail with reference to FIG.
The reflector block 50 includes 20 micro reflectors 51 and a reflection layer (reflection surface) 52 formed on the inner peripheral surface of the micro reflector 51. The plate-shaped reflector block 50 is integrally molded, and in the first embodiment, it is manufactured by injection molding an organic resin. As long as a highly accurate surface can be formed, the reflector block 50 is not limited to being manufactured by injection molding, but may be manufactured by cutting resin or metal. Although it is difficult with the technical level at the time of application, it is thought that it will be possible to manufacture with a 3D printer in the future.
Further, the reflector block 50 may have a structure in which a metal (for example, 42 alloy or copper) is used for the core material, the outer peripheral portion is covered with an organic resin, and the surface is treated with a reflective material.

As shown in FIG. 3A, the 20 micro-reflectors 51 are arranged in 5 rows×4 columns at a pitch of 3 mm in the vertical direction and a pitch of 3 mm in the horizontal direction. The micro-reflector 51 is a frustoconical space whose diameter is expanded from the bottom to the upper end (emission side) (see FIG. 3B). The bottom has a diameter of 2 mm, the upper end has a diameter of 3.05 mm, and the height is high. The thickness is 4 mm, the diameter expansion angle is 7.5°, and the linearly inclined reflection layer (inner peripheral surface) 52 is provided. On the inner peripheral surface of the micro-reflector 51, a reflective layer 52 is formed by electrolytic polishing of aluminum or vapor deposition of aluminum.
The bottom portion of the micro-reflector 51 for a projector has a diameter of 1.5 to 3 times (preferably 1.5 to 2 times) the LED chip side ratio and a diameter of 3 mm or less, and the height is 2 to 10 the LED chip side ratio. The height is doubled (preferably 2 to 5 times), and the upper end portion has a diameter which is 3 to 6 times (preferably 4 to 5 times) the LED chip side ratio. The arrangement pitch of the micro reflectors 51 is preferably 6 mm or less in both length and width, and more preferably 5 mm or less. From another aspect, LED chip, so that it can position the LED chips with one or more density per 12.25mm ² (preferably one or more density per 9 mm ^2), determines the arrangement pitch of the micro reflectors 51 .. However, in order to obtain a desired luminous flux distribution, it is preferable that the micro-reflectors 51 are provided so as not to overlap each other (having independent upper openings).

An LED chip 46 is arranged at the center of the bottom of each micro reflector 51. The LED chips 46 arranged on the five micro-reflectors 51 arranged on four straight lines extending vertically in FIG. 3 are connected in series, and the five LED chip groups connected in series are connected in parallel. (5 series x 4 parallel). The light distribution angle formed by the 20 LED chips 46 arranged in a matrix is preferably 30 degrees or less, more preferably 5 to 20 degrees or 10 to 15 degrees.
Although FIG. 3 illustrates a mode in which 20 microreflectors 51 are provided, the number of microreflectors 51 is not limited to this. For example, 8 to 100 (preferably 12 to 100, It may be preferably 16 to 50.
As shown in FIG. 4, the reflector block 50 is one size larger than the liquid crystal light valve 23 (for example, the area ratio is 1.21 times or more, preferably 1.44 times or more, more preferably 1.69 times or more). It is preferable that the irradiation surface has a size that constitutes the irradiation surface. From another viewpoint, irradiation is performed so that the liquid crystal light valves 23 are completely surrounded by the respective micro reflectors 51 forming the outer edge of the irradiation surface (the liquid crystal light valves 23 do not overlap the outermost micro reflectors 51). It is preferable to configure the surface. With such a configuration, irradiation light with high output and excellent uniformity can be incident on the dichroic prism 31. In order to make such an irradiation surface compact, it is preferable to arrange the micro-reflectors 51 in a staggered arrangement or a honeycomb arrangement as in a modification described later.

<Modification>
FIG. 5 is a plan view and a side view of a modified example of the reflector 50 having 42 micro-reflectors 51. The reflector block 50 includes a pair of left and right outer frame portions 53, and three partition frames 54 provided on the upper side in the figure and two on the lower side in the figure. Similar to FIG. 3, the inner surface of the micro-reflector 51 is provided with a reflective layer 52 formed by electrolytic polishing of aluminum or vapor deposition of aluminum.
The outer dimensions of the reflector block 50 of FIG. 5 are 24 mm×24 mm, the LED chips 46 are arranged at a 2.6 mm pitch in the horizontal direction and at a 3.0 mm pitch in the vertical direction, and each row corresponds to a half pitch in the vertical direction. , Are staggered alternately. In the reflector block 50 of FIG. 5, the micro-reflectors 51 are arranged in a staggered arrangement or a honeycomb arrangement to narrow the pitch between the centers of the micro-reflectors and increase the integration degree. That is, the centers of the upper openings of the three micro-reflectors 51 in contact with each other are arranged so as to form the vertices of an equilateral triangle. The top view shape of the micro-reflector 51 is not limited to the illustrated circle, and may be, for example, a regular polygon having a hexagonal shape or more. In this case, the bottom opening and the top opening are preferably similar and concentric.
FIG. 6 shows a perspective view of an LED light source device 21 including the reflector block 50 of FIG. The inorganic white layer 42 is exposed on the micro-reflector 51 of the reflector 50, the cutout portion surrounded by the partition frame, and the outer portion of the outer frame portion 53.

The LED light source device 21 described above is provided with three of the same specifications, and is used as a light source for emitting red light (R light), green light (G light) and blue light (B light). ..

<Simulation>
<A. Maximum illuminance and received light flux>
In order to verify the performance of the reflector block 50 of the first embodiment, a simulation was carried out under the following conditions. The reflector block 50A used here is a micro-reflector 51 having the same shape as that of FIG. 3B (that is, the diameter of the bottom portion is 2 mm, the diameter of the upper end portion is 3.05 mm, the height is 4 mm, and the diverging angle is 7.5°). It has and has no lens.
(1) As shown in FIG. 3A, 20 LED chips were arranged in 5 rows×4 columns with a vertical pitch of 3 mm and a horizontal pitch of 3 mm. No microlenses are placed.
(2) It is assumed that one LED chip has 10,000 light rays, and 20 LED chips have 200,000 light rays.
(3) It is assumed that the luminous flux is 1 lumen per LED chip, and the total luminous flux of 20 LED chips is 20 lumens.
(4) The following detector is set as the light receiving surface.
100mm ahead 25mm square detector (200×200 division)

When the difference between the maximum illuminance and the received light flux was examined with and without the reflector block 50, the results are shown in Table 2 below.
[Table 2]

From the simulation results (Table 2), it can be seen that when the reflector block 50 having the linearly inclined reflecting layer 52 shown in FIG. 6 is arranged, the luminous flux is improved by 4.82 times as compared with the case without the reflector.

<B. Light distribution angle>
FIG. 7 is a diagram showing an example of a light distribution angle simulation analysis result different from that in Table 2.
In FIG. 7, (a) shows a case without a reflector, (b) shows a case where a reflector block 50A (without a lens) is used, and (c) shows a case where a reflector block 50B (with a lens) is used. (A1) is an enlarged view of a main part of (a), and (b1) is an enlarged view of a main part of (b). FRED (Photon Engineering LLC) was used as the analysis software.
As a result of the analysis, when the light receiving area is 25 mm square and the distance is 100 mm, the illuminance is 524,922 (lx) and the spread angle is 75° in (a), and the illuminance is 1,552,104 (lx) and the spread angle is (b) in FIG. It becomes less than 30° (10° at the light condensing part (dark part of the line)), the illuminance is 2,734,062 (lx) and the spread angle is 30° at (c) (compared to (b) at the light condensing part). It became less).

<<Second and third embodiments>>
FIG. 8 is a schematic side view showing the shape of the micro reflector 61 of the second embodiment. The micro-reflector 61 includes a bottom opening 62 in which the LED chip 46 is arranged in the center, a small diameter barrel 63, reflecting surfaces (64, 65, 66, 67), and an upper opening 68. The diameter of the bottom opening 62 is 1.8 mm, the diameter of the upper opening 68 is 4.0 mm, and the distance (height) from the bottom opening 62 to the upper opening 68 is 5.0 mm. The lower end of the cylindrical small-diameter cylinder 63 constitutes the bottom opening 62, and the upper end thereof is continuous with the reflecting surface (first inner peripheral surface 64).

The reflecting surface is composed of the first to fourth inner peripheral surfaces (64, 65, 66, 67), and has a structure in which the diameter is increased upward while gradually narrowing the angle with respect to the central axis. .. That is, the first inner peripheral surface 64 is expanded by 60°, the second inner peripheral surface 65 is expanded by 65°, the third inner peripheral surface 66 is expanded by 70°, and the fourth inner peripheral surface 67 is expanded by 85°. The angle with respect to the central axis gradually decreases from 62 toward the upper opening 68. Each of the first to fourth inner peripheral surfaces (64, 65, 66, 67) acts so as to collect the irradiation light from the LED chip 46 on the central axis side of the micro reflector 61. Unlike the present embodiment, the reflecting surface may be composed of three or five inner peripheral surfaces having different angles, and in this case also, the angle with respect to the central axis is narrowed stepwise in the range of 60° to 85°, for example. However, the structure is such that the diameter is increased upward.

FIG. 9 is a micro-reflector 61, which illustrates the reflector effect when light is emitted from the left end (a), the center (b) and the right end (c) of the LED chip. As can be seen from FIG. 9B, the light rays emitted from the center of the LED chip are reflected by the inner peripheral surface of the reflector 61, and most of the light rays are parallel rays.

FIG. 10A is a plan view of the reflector block 60 according to the second embodiment.
The rectangular reflector block 60 includes 20 reflectors 61 arranged in 4 series and 5 parallel at a pitch of 4 mm in each length and width. The structure of the reflector block 60 is similar to that of the first embodiment.

FIG. 10B is a plan view of the LED light source device 70 according to the third embodiment.
The circular reflector block 71 is provided with 16 reflectors 72 arranged in 4 series and 4 parallel at a pitch of 4 mm in each length and width. The structure of the reflector block 71 is similar to that of the first and second embodiments. The LED light source device 70 includes an external reflector 73 having a height of 30 mm. The outer reflector 73 has a reflection structure on the inner peripheral surface surrounding the reflector block 71, and has a shape whose diameter is expanded upward.

In order to verify the performance of the reflector block 60 according to the second embodiment, a simulation is performed on a light source unit in which 20 LED chips are arranged in each opening of the reflector block 60 and a light source unit in which the reflector block 60 is removed from the light source unit. Was carried out. Further, the simulation was also performed on the LED light source device 70 according to the third embodiment including the external reflector 73. These simulations were performed under the condition that the 25 mm square detector 80 was placed at a distance of 30 mm. Table 3 shows the simulation results.

[Table 3]

From the results shown in Table 3, the luminous flux on the light-receiving surface is only 13.4% when the reflector is not provided, but is improved to 70.5% (5.26 times) when the reflector is provided (inside). I understand.
As described above, it was confirmed that the reflector block of the second embodiment can obtain a light collecting effect of 5 times or more without using a lens. Further, it was confirmed that the LED light source device 70 including the external reflector 73 according to the third embodiment can further obtain the light condensing effect.

<<Fourth Embodiment>>
FIG. 11 is a schematic side view showing the shapes of the micro reflectors 91a to 91c of the fourth embodiment. The micro reflectors 91a to 91c of the fourth embodiment are the same as those of the first to third embodiments, and 20 micro reflectors 91a to 91c are arranged in an array on the reflector block (see FIG. 10A).

In order to verify the performance of the micro-reflectors 91a to 91c, a simulation was performed on a light source section in which the micro-reflectors 91a to 91c are arranged and a light source section in which the micro-reflectors 91a to 91c are removed from the light source section. These simulations were performed under the condition that a 25 mm square detector was placed at a distance of 30 mm. Table 4 shows the specifications of the light source, which is a prerequisite for the simulation, and Table 5 shows the results of the simulation.

In addition, in the fourth embodiment, the output of the LED chip is set to 1 lm for convenience, but an LED chip having an output of 250 to 2600 lm with the same size is commercially available. By mounting this LED chip, three light sources are provided. It is possible to make the total luminous flux value from 2000 lm or 3000 lm or more.

[Table 4]

[Table 5]

From the results shown in Table 5, it was confirmed that the luminous flux (lm) of 5 times or more can be obtained with and without the reflector.
FIG. 12 is a side view for explaining the inner peripheral surface shape of the micro reflector 91a according to the fourth embodiment. The points indicated by points in the figure are bending points, and the points sandwiched between the two points (inner peripheral surface) are linear. That is, the reflecting surface of the micro-reflector 91a is composed of seven inner peripheral surfaces having different angles.
As described above, by forming the reflective layer from a large number of inner peripheral surfaces having a straight cross section, it is possible to secure a certain area in the central portion where the light beam density is highest. In other words, in the light source for a projector, it is not preferable to increase the light density of only the central portion (that is, the area of the high light density portion becomes too small). In this respect, if the reflecting layer of the reflector is formed by a smooth peripheral surface (smooth curved surface), the area of a portion having a high light density tends to be too small.

FIG. 13(a1) is a schematic side view showing the shape of the micro-reflector 91a according to the fourth embodiment, (b1) is a schematic side view showing the shape of the micro-reflector 92 according to Comparative Example 1, and (a2) is the fourth embodiment. The directivity simulation result of the LED light source device according to the mode (micro reflector 91a) is shown, and (b2) is the directivity simulation result of the LED light source device according to Comparative Example 1.
In the micro-reflector 91a having a large number of inner peripheral surfaces having straight sections with different angles, as shown in (a2), the tip of the directivity data is crushed, and it is possible to secure a certain area for a portion having a high light density. I understand.
In Comparative Example 1 having a reflecting surface composed of a smooth curved surface, as shown in (b2), the tip of the directivity data is sharp, and it is easy to concentrate light on the center, but a certain area is secured for a portion with high light density. I find it difficult to do.
From the above, it can be said that the micro-reflector having a large number of inner peripheral surfaces having straight cross sections with different angles is superior in terms of uniform distribution of light rays to the reflector having a reflecting surface formed of a smooth curved surface.
With respect to the micro-reflector 91b, a simulation of the luminous flux amount, luminous flux distribution and directivity is carried out, and the results will be described later in the fifth embodiment.

<<Fifth Embodiment>>
The fifth embodiment discloses an LED light source device 100 including one LED chip and one reflector.
FIG. 14 is a plan view of the LED light source device 100 according to the fifth embodiment. The LED light source device 100 of the present embodiment includes a reflector block 101, a reflector 102, and an LED chip 103.
The rectangular reflector block 101 has the same basic structure as that of the first to third embodiments, except that one reflector 102 is provided at the center. The LED chip 103 has a size of 3.0×3.0×0.45 mm, an output of 20 lm, and an orientation angle of 150 degrees.
In the fifth embodiment, as in the fourth embodiment, the output is set to 20 lm for convenience, but the total luminous flux value from the three light sources is set to 2000 lm or 3000 lm or more by changing the LED chip to a high output one. It is possible.

FIG. 15 is a schematic side view showing the shape of the reflector 102. Each dimension of the reflector 102 is three times the corresponding dimension of the micro reflector 91b according to the fourth embodiment. The inner peripheral surface of the reflector 102 is treated with the same reflector as in the first to third embodiments.

In order to verify the performance of the LED light source device 100 according to the fifth embodiment, light rays and light fluxes were analyzed by simulation. This simulation was performed under the condition that the 25 mm square detector 80 was placed at a distance of 30 mm.
When performing the performance simulation of the fifth embodiment, the simulation of the following comparative example was also performed at the same time.

[Comparative example 2]
Comparative example 2 is a known LED light source device 110 including two condenser lenses 111 and 112 as shown in FIG. The LED light source device 110 includes condenser lenses 111 and 112 and a mounting substrate 114 on which an LED chip 113 is mounted.
The condenser lens 111 is a biconvex lens, and has a convex lens 111a on the side opposite to the LED chip 113 (on the liquid crystal light valve side), 111c on the side of the LED chip 113, and a disk-shaped body 111b sandwiched between 111a and 111c. Composed of and. The convex lens 111a has a diameter of 27 mm, a thickness of 7.5 mm, and a curvature of 0.0555. The body portion 111b has a diameter of 27 mm and a height of 2.5 mm. The convex lens 111c has a diameter of 27 mm, a thickness of 0.5 mm, and a curvature of 0.188. The transmittance of the condenser lens 111 is 90%.

The condenser lens 112 is a plano-convex lens, and is composed of a convex lens 112a on the side opposite to the LED chip 113 (on the liquid crystal light valve side) and a body portion 112b on the LED chip 113 side. The convex lens 112a has a diameter of 16 mm, a thickness of 5 mm, and a curvature of 0.1. The cylindrical portion 112b has a diameter of 16 mm and a height of 4.2 mm. The transmittance of the condenser lens 112 is 90%.
A 3.5 mm×2.8 m square LED chip 113 is arranged below the center of the condenser lens 112. The LED chip 113 is electrically connected to the wiring pattern provided on the mounting substrate 114.

[Comparative Example 3]
Comparative Example 3 is a light source device in which the reflector block 101 is removed from the LED light source device 100 of the fifth embodiment (see FIG. 17(c)). In other words, the LED chip of Comparative Example 3 has the same output (20 lm) because it is the same as that of the fifth embodiment, but differs in the divergence angle and the constraint because it does not include the reflector block 101.

[simulation result]
Below, the result of the simulation about each LED light source device is shown. FIG. 17 compares the fifth embodiment, Comparative Example 2 and Comparative Example 3, and FIG. 18 compares the fifth embodiment, Comparative Example 2 and the fourth embodiment (micro reflector 91b). For comparison by simulation, the total luminous flux of each LED light source device was set to 20 lm.

<Optical alignment>
FIG. 17 shows the results of orientation angle simulations performed for the LED light source devices of the fifth embodiment, Comparative Example 2 and Comparative Example 3. In FIG. 17, (a) shows the results of the LED light source device 100 according to the fifth embodiment, (b) shows the results of the LED light source device 110 according to Comparative Example 2, and (c) shows the results of the LED light source device according to Comparative Example 3. There is. In the figure, the number of light rays is reduced to 100 in order to make the light rays easy to see.
From FIG. 17A, it can be seen that the orientation angle of the irradiation light of the LED light source device 100 according to the fifth embodiment is small and the light density of the central portion is the highest in the drawing.
From FIG. 17B, the orientation angle of the irradiation light of the LED light source device 110 according to Comparative Example 2 is smaller than that in FIG. 17C, and the light density is evenly distributed as compared to FIG. 17A. I understand.
From FIG. 17C, it can be seen that in Comparative Example 3 in which the reflector is not provided, the light rays spread randomly.

<Light flux amount and light flux distribution>
The amount of light flux that has reached the 25 mm square detector 80 is (a) 19.17 lm in the fifth embodiment, (b) 7.76 lm in Comparative Example 2, and (c) 15 in the fourth embodiment (microreflector 91b). It was 0.26 lm.
FIG. 18 shows the result of simulation of the luminous flux amount and luminous flux distribution performed for each of the LED light source devices of the fifth embodiment, the comparative example 2 and the fourth embodiment (micro reflector 91b). In FIG. 18, (a) is the LED light source device 100 according to the fifth embodiment, (b) is the LED light source device 110 according to Comparative Example 2, and (c) is the LED light source according to the fourth embodiment (micro reflector 91b). The results of the device are shown.
From FIG. 18(a), the LED light source device 100 according to the fifth embodiment has the highest (brightest) light beam density in the central part, but from another perspective, the light flux is in the central part of the 25 mm square detector 80. It can be seen that, when gathered, the peripheral portion of the 25 mm square detector 80 becomes dark and uneven brightness occurs.
From FIG. 18B, in the LED light source device 110 according to the second comparative example, the orientation angle of the irradiation light is wide, and the luminous flux is distributed over a wider area than in FIGS. 18A and 18C. I understand.
From FIG. 18(c), the LED light source device according to the fourth embodiment (micro reflector 91b) is inferior to that in FIG. 18(a) in the light density of the central portion, but is excellent in the uniform distribution of light rays. I know that In particular, it is superior to the fifth embodiment and the comparative example 2 in that a certain area is secured in the central portion where the light ray density is highest.
FIG. 19 shows the results of directivity simulations performed for the LED light source devices of the fifth embodiment, comparative example 2 and fourth embodiment (micro reflector 91b). 19(a) and 19(c), it can be seen that the tip is flat and the uniformity is good.

As described above, from the result of the simulation, it was found that the LED light source device 100 according to the fifth embodiment has a characteristic that the orientation angle is small and the light beam density is high. As a result of comparison with the fifth embodiment, it has been confirmed that the LED light source device according to the fourth embodiment (micro reflector 91b) has the highest evaluation as the projector light source.

<<6th embodiment>>
The LED light source device 121 of the sixth embodiment differs from the LED light source device 21 of the first embodiment mainly in that the wiring layer 143 is composed of two layers and that the inorganic white insulating layer 144 is provided. Below, it demonstrates centering around difference, and abbreviate|omits description about a common structure.
The configuration of the LED light source device 121 will be described in detail with reference to FIG. Note that FIG. 21 is a schematic diagram for explaining the structure and does not accurately show the arrangement of the LED chips 146 in the present embodiment.
The LED light source device 121 includes a mounting substrate 141, an inorganic white insulating layer 142 coated on the upper surface of the mounting substrate 141, a wiring layer 143 coated on the upper surface of the inorganic white insulating layer 142, and an inorganic white insulating layer. The layer 144, the wiring exposed portion 145, the LED chip 146, the translucent resin layer 147, and the reflector block 150 are provided.

The mounting board 141 is the same as the mounting board 41 of the first embodiment.
The composition of the inorganic white insulating layer 142 is the same as that of the first embodiment except for the white inorganic pigment, but titanium oxide (TiO ₂ ) is used as the white inorganic pigment in order to improve the reflection efficiency.

As shown in FIG. 22, the wiring layer 143 includes a first wiring layer 1431 formed on the mounting substrate side and a second wiring layer 1432 formed on the first wiring layer 1431.
The first wiring layer 1431 is a wiring layer made of a material (for example, a conductive resin composition) having good adhesion to the inorganic white insulating layer 142. More specifically, the first wiring layer 1431 forms a wiring pattern on the inorganic white insulating layer 142 by, for example, printing a gold paste or a metal paste containing metal particles functioning as a conductive filler and a binder resin. It is formed by providing and heating. As the metal particles contained in this metal paste, the materials used for ordinary printed circuits and conductive films are used, but the most common one is silver (Ag) particles. The metal particles may be prepared by mixing nano-sized metal particles and micron-sized metal particles and filling the spaces between the micron-sized metal particles with the nano-sized particles to reduce the resistance value. As the binder resin contained in this metal paste, for example, a dicyclopentadiene type epoxy resin is disclosed. The binder resin forming the first wiring layer 1431 soaks into the porous inorganic white insulating layer 142 and is cured, so that an anchor effect is achieved.

The second wiring layer 1432 is a wiring layer made of a material having a resistance lower than that of the first wiring layer 1431, and is the same on the first wiring layer 1431 by printing silver paste containing nano-sized silver particles, for example. It is formed by providing a wiring pattern and heating. The second wiring layer 1432 may be formed of a plurality of layers.

The inorganic white insulating layer 144 is formed on the wiring layer 143 and functions as a reflective layer that reflects light emitted from the LED chip 146. Like the inorganic white insulating layer 142, the inorganic white insulating layer 144 is formed by applying a white inorganic ink using titanium oxide (TiO ₂ ) as a white inorganic pigment on the second wiring layer 1432 and firing it. It The inorganic white insulating layer 144 which also functions as a solder resist layer is applied so as to expose the wiring exposed portion 145. The wiring exposed portion 145 is a mount portion of the LED chip 146 and a wire bond region.

The LED chip 146 is an LED bare chip similar to that of the first embodiment, but is different in that it has a structure in which one electrode is provided on the back surface. Similar to the first embodiment, each LED chip 146 is arranged so as to fit within the range of each micro-reflector 151, but since there is one wire bonding area, there are two wire bonding areas. It is possible to make the bottom opening (and the top opening) of the micro-reflector 151 smaller than the above. That is, in the sixth embodiment, the integration degree of the LED chips 146 can be increased as compared with the first embodiment. A mode in which both electrodes are flip-chip bonded to increase the integration degree of the LED chip will be described later in the eighth embodiment.

The translucent resin layer 147 is the same as in the first embodiment and is a resin layer in which transparent or phosphor is mixed.

According to the LED light source device 121 of the sixth embodiment described above, it is possible to increase the integration degree of the LED chips 146 and to make the bottom opening and the top opening of the micro-reflector 151 smaller than those of the first embodiment. Is. When the integration degree of the LED chips 146 is increased, the heat dissipation of the insulating layer becomes a problem, but as described in the first embodiment, since the inorganic white insulating layer 142 can be made thin, it becomes a donut. The problem of the phenomenon does not occur. In addition, in order to improve the heat dissipation performance of the inorganic white insulating layer 142, the above-mentioned liquid material (white inorganic ink) is coated with a high thermal conductive filler (for example, silicon carbide (SiC) with an alumina film of nm size. Stuff) may be mixed.

Further, according to the LED light source device 121 of the sixth embodiment, the two-layer wiring structure of the wiring layer 143 improves the adhesiveness with the porous inorganic white insulating layer 144, and the high temperature due to the heat generation of the LED chip 146. It is possible to ensure durability for a long period of time even in an environment. Furthermore, since the inorganic white insulating layer 144 is also provided on the wiring layer 143, the reflectance of the light emitted from the LED chip 146 is increased, and the light amount can be increased.

<<Seventh Embodiment>>
The LED light source device 221 of the seventh embodiment is different from the LED light source device 121 of the sixth embodiment in that the reflector block 250 is arranged on the translucent resin layer 247. Below, it demonstrates centering around difference, and abbreviate|omits description about a common structure.
The configuration of the LED light source device 221 will be described in detail with reference to FIG. Note that FIG. 23 is a schematic diagram for explaining the structure, and does not accurately show the arrangement of the LED chips 246 in the present embodiment.
The LED light source device 221 includes a mounting substrate 241, an inorganic white insulating layer 242 applied on the upper surface of the mounting substrate 241, a wiring layer 243 applied on the upper surface of the inorganic white insulating layer 242, and an inorganic white insulating layer. The layer 244, the LED chip 246, the translucent resin layer 247, the dam material 248, and the reflector block 250 are provided.

The mounting board 241 is the same as the mounting board 141 of the sixth embodiment.
The inorganic white insulating layer 242 is the same as the inorganic white insulating layer 142 of the sixth embodiment, and the inorganic white insulating layer 244 is the same as the inorganic white insulating layer 144 of the sixth embodiment.

The wiring layer 243 is composed of a first wiring layer formed on the mounting substrate side and a second wiring layer formed on the first wiring layer, as in the sixth embodiment.

The LED chip 246 is an LED bare chip similar to that of the sixth embodiment, but has a structure in which one electrode is provided on the back surface. Since there is one wire bonding region, the bottom opening (and top opening) of the micro-reflector 151 can be made smaller in diameter than in the first embodiment in which there are two wire bonding regions.

The dam material 248 is formed so as to surround the outer periphery of the mounting region of the LED chip 246, and is made of, for example, a white filler-containing resin. The surface of the dam material 248 is provided with light reflectivity and reflects the light emitted from the LED chip 246.

The reflector block 250 is arranged such that the center of the bottom opening of the micro-reflector 251 is directly above the center of the LED chip 246. In FIG. 23, the reflector block 250 is arranged so as to cover the dam material 248 and the transparent resin layer 247. However, even if the reflector block 250 is arranged above the transparent resin layer 247. Good.

In the seventh embodiment, since the micro-reflector 251 is arranged above the translucent resin layer 247, the flexibility of wiring of the LED chip 246 is high and the integration degree of the LED chip 246 can be increased. That is, since the wire bonding region can be set within the range of the circle having the pitch diameter of the micro reflector 251 (hereinafter, may be referred to as “wiring possible region”), the integration degree of the LED chips 246 can be increased.

The larger the distance between the upper openings of the micro reflectors 251, the larger the diameter of the wirable region. In the example of FIG. 23, the wirable region is a range of two vertical lines AA′ passing through the center of the micro reflector wall 251a.

24A and 25A are examples of the configuration of the microblock 250.
In the microblock 250 of FIG. 24A, 25 microreflectors 251 are provided in a staggered pattern of 5×5 at a pitch of 3.5 mm in the vertical direction and 3.05 mm in the horizontal direction, and the external size is 22. It is ×26×t4.8 mm.
In the microblock 250 of FIG. 25A, 42 microreflectors 251 are provided in a staggered 7×6 pattern with a pitch of 3.5 mm in the vertical direction and 3.05 mm in the horizontal direction, and the external size is 22. It is ×26×t4.8 mm.
Each micro-reflector 251 is the same in both FIG. 24A and FIG. 25A, and has a circular bottom opening with a diameter of 1.48 mm and a circular top opening with a diameter of 3.1 mm, respectively.

In the case of the microblock 250 of FIG. 24A, the sum of the wirable areas is the hatched area in FIG. 24B, which is wider than the sum of the upper openings of the micro reflector 251. The same applies to the microblock 250 shown in FIG. In this way, when the micro-reflectors having the same shape are arranged at equal pitches, the wirable areas are circles of the same size that circumscribe each other.

The electrical connection between the LED chip 246 and the wiring layer 243 can be made by wire bond connection within the wirable area. Here, if the wire exceeds the range of the upper opening of the micro-reflector and is electrically connected below the wall of the micro-reflector, the wire may block the light of the adjacent LED chip 246. Preference is given to working within the upper opening of the micro-reflector. In other words, the LED chip 246 and the wiring layer 243 are preferably connected within the range of the upper opening of the micro-reflector 251 in which the LED chip 246 is arranged, and the bottom of the micro-reflector 251 in which the LED chip 246 is arranged. It is more preferable that the wires are connected within the range of the opening. In the example of FIG. 23, the range of the two vertical lines BB′ is within the range of the bottom opening of the micro reflector 251.

According to the LED light source device 221 of the seventh embodiment, the reflector block 250 is attached after the translucent resin layer 247 is formed, which facilitates manufacturing. Further, since the wirable area is wide, the micro reflector 251 can be downsized and the density can be increased, and the reflector block 250 can be downsized.

<<Eighth Embodiment>>
The LED light source device 321 of the eighth embodiment differs from the LED light source device 121 of the sixth embodiment in that the LED chip 346 is flip-chip bonded to the wiring layer 343. Below, it demonstrates centering around difference, and abbreviate|omits description about a common structure.
The configuration of the LED light source device 321 will be described in detail with reference to FIG. Note that FIG. 26 is a schematic diagram for explaining the structure, and does not accurately show the arrangement of the LED chips 346 in this embodiment.

The LED chip 346 and the wiring layer 343 are flip-chip bonded by, for example, bumps 349 containing gold or silver as a main component, or are connected by using an anisotropic conductive film (common name: ACF). As a result, the area for wire bonding is not required, so that the LED chips 346 can be mounted at high density. The flip chip bonding is performed, for example, by forming bumps 349 on the LED chips 346 by plating, mounting the bumps 349 on the wiring layer 343, and then thermocompression bonding the LED chips 346 from the back surface 346B side.

Since the upper surface of the LED chip 346 is a light emitting surface, an underfill material such as an epoxy material may be used around the bumps 349 to reinforce the bumps 349 used for flip chip bonding. When the above-mentioned ACF is used, the ACF itself plays the role of an underfill material, so that underfilling is unnecessary.

According to the LED light source device 321 of the eighth embodiment, the area for wire bonding is unnecessary, so that the micro-reflector 351 can be miniaturized and densified, and consequently the reflector block 350 can be miniaturized. It will be possible.

<<Ninth Embodiment>>
The LED light source device of the ninth embodiment relates to an LED light source device that emits ultraviolet light for curing UV curable ink and UV sterilization. The LED light source device of the ninth embodiment is configured by arranging a plurality of COBs in a line.
In the LED light source device of the ninth embodiment, an LED chip, a reflector block, etc. are mounted on a mounting substrate 441 shown in FIG. 27 to form one unit light source 421, and as shown in FIG. 28, ten unit light sources are arranged on a module substrate 460. 421a-j are arranged side by side. Note that, in FIG. 28, the LED chips, the reflector blocks, and the like mounted on the ten unit light sources 421a to 421j are omitted, and only the mounting substrate and the module substrate 460 are illustrated.

The unit light source 421 used in the LED light source device of the ninth embodiment has the same configuration as the LED light source device 121 of the sixth embodiment except for the white inorganic pigment and the transparent resin layer used in the LED chip and the inorganic white insulating layer. Is playing. Below, it demonstrates centering around difference, and abbreviate|omits description about a common structure.

The configuration of the unit light source 421 of the ninth embodiment will be described in detail. The configuration of the unit light source 421 is the same as that of FIG. 26, and includes a mounting substrate 441, an inorganic white insulating layer applied on the upper surface of the mounting substrate 441, and a wiring layer applied on the upper surface of the inorganic white insulating layer. It includes an inorganic white insulating layer formed on the wiring layer, an LED chip, and a reflector block. Although a dam material or an adhesive frame for sealing quartz glass is not shown, a white inorganic pigment of alumina used as a reflecting material may be used as these materials. Further, unlike the sixth embodiment, the transparent resin layer may not be provided in the ninth embodiment, but it is preferable that the entire module is collectively covered with quartz glass or the like to protect the chip. The size of the unit light source is 50×30 mm, and the size when 10 long sides of the unit light sources 421a to 421a are arranged adjacent to each other on the module substrate 460 is 50×300 mm.

The mounting board 441 is the same as the mounting board 141 of the sixth embodiment.
The composition of the inorganic white insulating layer is the same as that of the first embodiment except for the white inorganic pigment, but alumina is used as the white inorganic pigment because of its high reflectance against ultraviolet rays.
Similar to the wiring layer 143 of the sixth embodiment, the wiring layer includes a first wiring layer formed on the mounting substrate side and a second wiring layer formed on the first wiring layer.
The inorganic white insulating layer on the wiring layer is applied to the region excluding the power electrode 4431 and the wiring exposed portions 4432 and 4433 shown in FIG. 27, and the insulation of the wiring layer and the LED chip from the LED chip are performed as in the sixth embodiment. It functions as a reflective layer that reflects emitted light.
The power supply electrode 4431 is connected to an external power supply device and supplies power to the unit light source.
An LED chip is mounted on the wiring exposed portion 4432. It is also possible to electrically connect the LED chip and the wiring layer by providing an electrode on the back surface (wiring layer side) of the LED chip and performing flip-chip bonding as in the sixth embodiment.
The wiring opening 4433 is a portion where the wiring layer is wire-bonded to the LED chip.

Similar to the sixth embodiment, the LED chip is an LED bare chip of a type that uses wire bonding and back wiring, for example, a gallium nitride-based LED chip, and has an emission wavelength in the UV region. As a detailed emission wavelength region, a UV-A region is disclosed for curing a UV curable ink, and a UV-C region is disclosed for UV sterilization. As specific wavelengths, for example, a wavelength of 365 nm for UV curable ink curing and a wavelength of 260 nm for UV sterilization are disclosed. The output angle of the LED chip is, for example, an orientation of 150° Lambertian.

100 LED chips are mounted on one unit light source 421. The 100 LED chips are mounted in a staggered arrangement of 10×10 at a pitch of 3.8 mm long and 3 mm wide at the position of the wiring opening 4432 shown in FIG. The size of the LED chip is 1.05×1.05×0.11 mm. In the case of a UV light source, in order to achieve a desired ultraviolet intensity, the vertical pitch is preferably 5 mm and the horizontal pitch is 5 mm or less, more preferably the vertical pitch is 4.25 mm and the horizontal pitch is 3.7 mm or less. From the viewpoint of ultraviolet intensity, the narrower the pitch, the more preferable. However, finally, the optimum pitch is determined in the range of satisfying the pitch of 5 mm or less in the vertical and horizontal directions in consideration of the ease of manufacturing the reflector block.
Since the LED light source device of the ninth embodiment is composed of 10 unit light sources 421a to 421j, the total number of LED chips used is 1000.

The reflector block has the same configuration as the reflector block 150 of the sixth embodiment, and the array of the micro reflectors is obtained by expanding the 5×5 staggered array of FIG. 24(a) to a 10×10 staggered array. Has become. The size of the micro-reflector is such that the top opening is 3.9 mm, the bottom opening is 1.5 mm, and the height is 3.7 mm.

The translucent resin layer is not usually provided on the reflector block, but when encapsulating with the translucent resin layer, a phosphor suitable for the wavelength in the UV region is appropriately selected.

In order to verify the performance of the LED light source device of the ninth embodiment, a simulation for obtaining the distribution of ultraviolet light on the light receiving surface with or without the reflector block was performed.
The number of rays to be analyzed was 100,000 per LED chip (100 million in total), and the size of the light receiving surface was 250×500 mm.

By the way, there is a need for an LED light source device for ultraviolet ray irradiation to maintain the ultraviolet ray intensity even if the distance from the light receiving surface is large, for the following reasons.
(1) When the printing paper, which is a target for curing the UV curable ink, is large in size, it is likely to be bent, and it is necessary to irradiate the light receiving surface with the light receiving surface separated.
(2) For UV sterilization, it is necessary to separate the light-receiving surfaces for irradiation in order to make the object versatile.
Therefore, the simulation was performed under the condition that the distance of the light receiving surface was changed within the range of 40 to 85 mm to verify the ultraviolet intensity.

FIG. 29 shows the results of the simulation of the ultraviolet intensity distribution when the light receiving surface distances are (a) 40 mm, (b) 60 mm, and (c) 85 mm. In each of the tables (a), (b), and (c), the middle column shows the result of the model in which the reflector block is removed from the LED light source device of the ninth embodiment (in the table, described as "no reflector") on the right side. The column of shows the result of the model of the LED light source device of the ninth embodiment (described as "with reflector" in the table). The items of the result are the ultraviolet intensity distribution on the light receiving surface (indicated as "area distribution" in the table), the plot of ultraviolet intensity along the center line of the light receiving surface (indicated as "cross section" in the table), and Illuminance (indicated as "illuminance" in the table).

As you can see from the lines of “Area distribution” and “Cross section” in (a), when there is a reflector block, ultraviolet rays are concentrated at the center of the light receiving surface, and the distribution of ultraviolet rays becomes narrower than when there is no reflector block. It can be seen that is about double.
In the cases where the reflector block was provided, the tendency that the ultraviolet rays were concentrated at the center of the light receiving surface and the distribution of the ultraviolet rays was narrower was the same in the cases (b) and (c) as compared with the case without the reflector block.
The peak ratios in the case where the reflector block was provided to the case where the reflector block was not provided were about 2.2 times in (b) and about 2.5 times in (c).

From the simulation results of (a) to (c), it was confirmed that in the case where the reflector block was provided, the distribution of ultraviolet rays became narrower and a peak intensity of 2 to 2.5 times was obtained as compared with the case where the reflector block was not provided. Was done. It was also confirmed that the longer the distance of the light receiving surface, the larger the ratio of the peak intensity in the case where the reflector block is present to the case where the reflector block is not present.

According to the LED light source device of the ninth embodiment, since the reflector block is used, the UV intensity can be maintained even if the distance between the light source and the light receiving surface is large, and UV curing or UV that is used away from the light source can be used. It can be said that it is suitable for sterilization applications.

While some embodiments have been described in detail in the present disclosure as merely examples, many modifications of the embodiments are possible without substantially departing from the novel teachings and advantageous effects of the invention. Is possible.

INDUSTRIAL APPLICABILITY The LED light source device of the present invention is suitable for infrared illumination (for infrared cameras, for example), a UV printing/UV curing/UV exposure light source, and a headlamp, for which output can be effectively used to a long distance. Especially, the effect is great in the application of infrared illumination or UV curing (effect work such as UV curing type sheet etc.) where it is desired to give more output to a distant object. (For these module configurations, refer to the ninth embodiment. ).
Furthermore, if this module is applied to infrared lighting, it will be possible to achieve high output and downsizing (handy) that could not be realized until now, and security devices for personal use (for example, easy attachment to mobile phones, surrounding in the dark). It is also possible to use it for on-vehicle installation.

21 LED Light Source Device 22 Collimator Lens 23 Liquid Crystal Light Valve 31 Dichroic Prism 32 Projection Optical System 41 Mounting Substrate 42 Inorganic White Insulating Layer (Substrate Reflecting Layer)
43 wiring layer 44 insulating layer 45 mounting portion 46 LED chip 47 translucent resin layer 48 microlens 50 reflector block 51 microreflector 52 reflection layer (reflection surface)
53 Outer Frame 54 Partition Frame 60 Reflector Block 61 Micro Reflector 62 Bottom Opening 63 Small Diameter Body 64 First Inner Surface 65 Second Inner Surface 66 Third Inner Surface 67 Fourth Inner Surface 68 Upper Opening 71 LED Light Source Device 72 Reflector block 73 Micro reflector 74 External reflector 80 25 mm square detector 91 Micro reflector (fourth embodiment)
92 Micro Reflector (Comparative Example 1)
100 reflector 110 publicly known LED light source device 111 condensing lens 111a convex lens 111b barrel 111c convex lens 112 condensing lens 112a convex lens 112b barrel 113 LED chip 114 mounting substrate 121 LED light source device 141 mounting substrate 142 inorganic white insulating layer (substrate reflection) layer)
143 wiring layer 1431 first wiring layer 1432 second wiring layer 144 insulating layer 146 LED chip 147 translucent resin layer 150 reflector block 151 micro reflector 221 LED light source device 241 mounting substrate 242 inorganic white insulating layer (substrate reflecting layer) )
243 Wiring layer 244 Insulating layer 246 LED chip 247 Translucent resin layer 248 Dam material 250 Reflector block 251 Micro reflector 251a Micro reflector wall 321 LED light source device 341 Mounting substrate 342 Inorganic white insulating layer (substrate reflecting layer)
343 Wiring layer 344 Insulating layer 346 LED chip 346A Front surface 346B Back surface 347 Translucent resin layer 349 Bump 350 Reflector block 351 Micro reflector 441 Mounting board 421 Unit light source 421a-j Unit light source 460 Module board L Projected light

Claims (19)

A mounting board whose surface is at least a metal;
A first insulating layer formed on the surface of the mounting substrate,
A wiring layer formed as an upper layer of the first insulating layer,
An LED light source device comprising a plurality of LED chips of the same specifications, which are surface-mounted in a matrix on a mounting substrate,
A reflector block having the same number of micro-reflectors as the LED chips,
The micro-reflector has a bottom opening and an upper opening having a diameter larger than that of the bottom opening,
The first insulating layer is composed of a porous inorganic white insulating layer formed by applying a liquid material containing nanoparticulate SiO ₂ and a white inorganic pigment and heating the same.
The wiring layer, a first conductive layer formed by applying a metal paste containing a resin and a metal powder that is impregnated and cured into the porous inorganic white insulating layer and heated, and a first conductive layer A wiring pattern is formed on the upper surface by printing, and a second conductive layer made of a material having a thickness and a resistance lower than that of the first conductive layer formed by heating is provided. LED light source device. The LED light source device according to claim 1, wherein a second insulating layer that functions as a reflection layer as an upper layer of the wiring layer is formed so as to leave an exposed portion that exposes the wiring layer. The second conductive layer is formed by printing a silver paste and heating it.
The second insulating layer is composed of a porous inorganic white insulating layer formed by applying a liquid material containing nano-sized SiO ₂ and a white inorganic pigment and heating the liquid material. 2. The LED light source device according to item 2. The upper opening of the micro-reflector is expanded by 70 to 85° with respect to the bottom opening, and the distance between the bottom opening and the top opening is 4 to 8 mm. LED light source device. LED light source device according to claim 4, wherein said micro-reflectors are arranged in a zigzag manner. Light distribution angle is 30 degrees, and the total flux value of 500 lumens or more, and, LED light source device according to any one of claims 2 to 5, characterized in that a projector. The LED light source device according to claim 6 , wherein the LED chip has a substantially square top view shape and a maximum rated current of 300 mA or more. The reflector block is made of an integrally molded resin material,
The LED light source device according to claim 7 , wherein a reflective layer made of a metal material is formed on an inner peripheral surface of the micro reflector. 8. The LED light source according to claim 7 , wherein the core material of the reflector block is integrally formed of metal and the outer peripheral portion of the resin is integrally molded, and the reflective layer made of a metal material is formed on the inner peripheral surface of the micro reflector. apparatus. The micro-reflector includes a top opening, a bottom opening in which the LED chip is disposed in the vicinity, and a reflecting surface,
The reflection surface is located on the bottom opening side, and is located on the upper opening side with respect to the first inner peripheral surface that acts to collect the irradiation light from the LED chip on the central axis side. A second inner peripheral surface that is located and has a narrow angle to the central axis; and a third inner peripheral surface that is located closer to the upper opening than the second inner peripheral surface and that has a narrow angle to the central axis. 6 claims, characterized in Rukoto to LED light source device according to any one of 9. The LED light source device according to claim 10 , wherein the cross-sectional shape of each inner peripheral surface is linear. An LED light source device for red light; a transmissive liquid crystal panel for red light for modulating light emitted from the LED light source device for red light;
An LED light source device for green light; a transmissive liquid crystal panel for green light for modulating light emitted from the LED light source device for green light;
An LED light source device for blue light; a transmissive liquid crystal panel for red light for modulating light emitted from the LED light source device for red light;
A dichroic prism that combines red light, green light, and blue light,
In a projector equipped with a projection optical system for projecting combined light from a dichroic prism,
A projector comprising the LED light source device for red light, the LED light source device for green light, and the LED light source device for blue light configured by the LED light source device according to any one of claims 2 to 11 . 13. The projector according to claim 12 , wherein a total luminous flux value of the LED light source device for red light, the LED light source device for green light, and the LED light source device for blue light is 2000 lumens or more. The irradiation surface micro reflectors constitute the projector according to claim 12 or 13, characterized in that said is larger configured slightly compared to the respective liquid crystal panels. It said plurality of LED chips, LED light source device according to any one of 5 claims 1, characterized in that emit ultraviolet light. The LED light source device according to claim 15, wherein the white inorganic pigment is alumina. A UV ink curing device having a light source comprising a plurality of the LED light source devices according to claim 15 or 16. An apparatus for UV sterilization, comprising a light source comprising a plurality of LED light source devices according to claim 15 or 16. 7. The LED light source device according to claim 1, wherein the plurality of LED chips emit infrared light.