JP2013051275A - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
JP2013051275A
JP2013051275A JP2011187578A JP2011187578A JP2013051275A JP 2013051275 A JP2013051275 A JP 2013051275A JP 2011187578 A JP2011187578 A JP 2011187578A JP 2011187578 A JP2011187578 A JP 2011187578A JP 2013051275 A JP2013051275 A JP 2013051275A
Authority
JP
Japan
Prior art keywords
substrate
substrates
processing apparatus
unit
substrate processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011187578A
Other languages
English (en)
Japanese (ja)
Inventor
Yoshinori Takagi
善則 高木
Fumihiko Ikeda
文彦 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Priority to JP2011187578A priority Critical patent/JP2013051275A/ja
Priority to TW101112385A priority patent/TW201310570A/zh
Priority to CN2012102099864A priority patent/CN102969261A/zh
Priority to KR1020120072743A priority patent/KR101442334B1/ko
Publication of JP2013051275A publication Critical patent/JP2013051275A/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Solid Materials (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2011187578A 2011-08-30 2011-08-30 基板処理装置 Withdrawn JP2013051275A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011187578A JP2013051275A (ja) 2011-08-30 2011-08-30 基板処理装置
TW101112385A TW201310570A (zh) 2011-08-30 2012-04-06 基板處理裝置
CN2012102099864A CN102969261A (zh) 2011-08-30 2012-06-20 基板处理装置
KR1020120072743A KR101442334B1 (ko) 2011-08-30 2012-07-04 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011187578A JP2013051275A (ja) 2011-08-30 2011-08-30 基板処理装置

Publications (1)

Publication Number Publication Date
JP2013051275A true JP2013051275A (ja) 2013-03-14

Family

ID=47799318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011187578A Withdrawn JP2013051275A (ja) 2011-08-30 2011-08-30 基板処理装置

Country Status (4)

Country Link
JP (1) JP2013051275A (zh)
KR (1) KR101442334B1 (zh)
CN (1) CN102969261A (zh)
TW (1) TW201310570A (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014216498A (ja) * 2013-04-25 2014-11-17 東レエンジニアリング株式会社 基板熱処理装置
JP2015173183A (ja) * 2014-03-11 2015-10-01 東京応化工業株式会社 塗布装置、基板処理装置、塗布方法及び基板処理方法
JP2016218389A (ja) * 2015-05-26 2016-12-22 ウシオ電機株式会社 光照射装置および光照射方法
JP2018529236A (ja) * 2015-09-22 2018-10-04 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 大面積デュアル基板処理システム
JP2018160586A (ja) * 2017-03-23 2018-10-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび基板処理方法
CN110880461A (zh) * 2018-09-06 2020-03-13 细美事有限公司 基板处理装置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103394437B (zh) * 2013-07-29 2015-08-12 长兴金润大正机械有限公司 一种双液自动点胶机
KR101970780B1 (ko) * 2017-04-13 2019-04-22 삼성디스플레이 주식회사 기판 처리 시스템 및 기판 반송 방법
KR102125677B1 (ko) * 2019-06-27 2020-06-24 세메스 주식회사 기판 처리 방법
KR102473692B1 (ko) * 2021-04-15 2022-12-02 (주)에스티아이 기판 식각 시스템
CN113070184B (zh) * 2021-06-07 2021-09-07 成都拓米电子装备制造有限公司 一种狭缝挤出涂布头的清洁装置及清洁方法
KR102458914B1 (ko) * 2022-05-17 2022-10-26 주식회사 아라(Ara) 태그 분산을 수행하는 글라스 기판 이송 시스템

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4030654B2 (ja) * 1998-06-02 2008-01-09 大日本スクリーン製造株式会社 基板搬送装置
JP3687666B2 (ja) * 2002-11-18 2005-08-24 セイコーエプソン株式会社 乾燥装置及びこれを備えるワーク処理装置
KR200331986Y1 (ko) 2003-07-04 2003-11-03 스피닉스(주) 복수의 기판을 동시에 처리할 수 있는 원 라인을 갖는기판처리장치
KR100567136B1 (ko) 2003-11-13 2006-04-05 주식회사 디엠에스 멀티형 기판이송장치
JP4688637B2 (ja) * 2005-10-28 2011-05-25 東京エレクトロン株式会社 基板処理装置及びバッチ編成装置並びにバッチ編成方法及びバッチ編成プログラム
JP2008212804A (ja) * 2007-03-02 2008-09-18 Tokyo Ohka Kogyo Co Ltd 基板の搬送塗布装置
KR101181560B1 (ko) * 2008-09-12 2012-09-10 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 그것에 사용되는 기판반송장치
KR100994287B1 (ko) * 2008-11-18 2010-11-12 주식회사 케이씨텍 서셉터 및 이를 구비하는 원자층 증착장치
JP5182598B2 (ja) * 2009-06-02 2013-04-17 村田機械株式会社 無限駆動媒体を備えた搬送システムと、そこでの物品の受け渡し方法
KR101170778B1 (ko) * 2009-11-27 2012-08-10 세메스 주식회사 처리액 토출 장치 및 방법

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014216498A (ja) * 2013-04-25 2014-11-17 東レエンジニアリング株式会社 基板熱処理装置
JP2015173183A (ja) * 2014-03-11 2015-10-01 東京応化工業株式会社 塗布装置、基板処理装置、塗布方法及び基板処理方法
JP2016218389A (ja) * 2015-05-26 2016-12-22 ウシオ電機株式会社 光照射装置および光照射方法
JP2018529236A (ja) * 2015-09-22 2018-10-04 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 大面積デュアル基板処理システム
JP2018160586A (ja) * 2017-03-23 2018-10-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理システムおよび基板処理方法
CN110880461A (zh) * 2018-09-06 2020-03-13 细美事有限公司 基板处理装置
KR20200028149A (ko) * 2018-09-06 2020-03-16 세메스 주식회사 기판 처리 장치
KR102222263B1 (ko) * 2018-09-06 2021-03-04 세메스 주식회사 기판 처리 장치

Also Published As

Publication number Publication date
CN102969261A (zh) 2013-03-13
KR20130024738A (ko) 2013-03-08
KR101442334B1 (ko) 2014-09-23
TW201310570A (zh) 2013-03-01

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