JP2013042133A - ロゴスキーコイルアセンブリ及びこれを提供するための方法 - Google Patents
ロゴスキーコイルアセンブリ及びこれを提供するための方法 Download PDFInfo
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- JP2013042133A JP2013042133A JP2012177634A JP2012177634A JP2013042133A JP 2013042133 A JP2013042133 A JP 2013042133A JP 2012177634 A JP2012177634 A JP 2012177634A JP 2012177634 A JP2012177634 A JP 2012177634A JP 2013042133 A JP2013042133 A JP 2013042133A
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- JP
- Japan
- Prior art keywords
- rogowski coil
- circuit board
- printed circuit
- coil assembly
- rogowski
- Prior art date
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/18—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers
- G01R15/181—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers using coils without a magnetic core, e.g. Rogowski coils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Transformers For Measuring Instruments (AREA)
- Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
【解決手段】ロゴスキーコイルアセンブリ(110、115、120、125)及びロゴスキーコイルアセンブリ(110、115、120、125)を提供または形成するための方法(200)を提供する。ロゴスキーコイルアセンブリ(110、115、120、125)は、プリント回路基板(105)と、該プリント回路基板(105)の外部表面に対して1つまたは複数の対応する回路トレース(140a〜f)によって装着された複数のロゴスキーコイルセクション(130a〜f)と、を含むことがある。この回路トレース(140a〜f)は複数のロゴスキーコイルセクション(130a〜f)を保持かつ接続することがある。
【選択図】図1
Description
105 プリント回路基板
110 ロゴスキーコイルアセンブリ
115 ロゴスキーコイルアセンブリ
120 ロゴスキーコイルアセンブリ
125 ロゴスキーコイルアセンブリ
130a〜130f ロゴスキーコイルセクション
135 開口部
140a〜140f 回路トレース
145 帰還経路
147 回路トレース
150 計測値処理回路
155 計測値処理回路
160 コネクタ
165 コネクタ
170 ギャップまたはスロット
175 ギャップまたはスロット
180 容量性シールド
200 方法
205 ブロック
210 ブロック
215 ブロック
220 ブロック
225 ブロック
230 ブロック
Claims (10)
- プリント回路基板(105)と;
前記プリント回路基板(105)の外部表面に対して1つまたは複数の対応する回路トレース(140a〜f)によって装着された複数のロゴスキーコイルセクション(130a〜f)と;を備えるロゴスキーコイルアセンブリ(110)であって、
前記回路トレース(140a〜f)により複数のロゴスキーコイルセクション(130a〜f)を保持かつ接続しているロゴスキーコイルアセンブリ(110)。 - 前記プリント回路基板(105)は、複数のロゴスキーコイルセクション(130a〜f)による監視を受ける少なくとも1つの導体を受け容れるように構成された開口部(135)を備える、請求項1に記載のロゴスキーコイルアセンブリ(110)。
- 前記複数のロゴスキーコイルセクション(130a〜f)の各々は開口部(135)から概ね等しい距離に位置決めされている、請求項2に記載のロゴスキーコイルアセンブリ(110)。
- 前記複数のロゴスキーコイルセクション(130a〜f)は開口部(135)の周囲に位置決めされている、請求項2に記載のロゴスキーコイルアセンブリ(110)。
- 前記プリント回路基板(105)と少なくとも1つの導体の間で開口部(135)の内部に位置決めされた容量性シールド(180)をさらに備える請求項2に記載のロゴスキーコイルアセンブリ(110)。
- 前記プリント回路基板(105)内で開口部(135)とプリント回路基板(105)のエッジとの間にあるスロット(170)をさらに備える請求項2に記載のロゴスキーコイルアセンブリ(110)。
- 前記プリント回路基板(105)に取り付けられると共に、複数のロゴスキーコイルセクション(130a〜f)が収集した計測値データを外部の計測値処理回路に提供するように構成された少なくとも1つのコネクタ(160)をさらに備える請求項1に記載のロゴスキーコイルアセンブリ(110)。
- 前記プリント回路基板(105)に取り付けられると共に、複数のロゴスキーコイルセクション(130a〜f)が収集した計測値データを受け取りかつ該受け取った計測値データを処理するように構成された計測値処理回路(150)をさらに備える請求項1に記載のロゴスキーコイルアセンブリ(110)。
- 前記複数のロゴスキーコイルセクション(130a〜f)は概ね3個から概ね12個のロゴスキーコイルセクション(130a〜f)を含む、請求項1に記載のロゴスキーコイルアセンブリ(110)。
- 前記複数のロゴスキーコイルセクション(130a〜f)用の帰還電流経路(145)は、(i)プリント回路基板上の回路トレース、または(ii)複数のロゴスキーコイルセクション(130a〜f)を通過する導体のうちの一方を含む、請求項1に記載のロゴスキーコイルアセンブリ(110)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/212,818 | 2011-08-18 | ||
US13/212,818 US8872611B2 (en) | 2011-08-18 | 2011-08-18 | Rogowski coil assemblies and methods for providing the same |
Publications (3)
Publication Number | Publication Date |
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JP2013042133A true JP2013042133A (ja) | 2013-02-28 |
JP2013042133A5 JP2013042133A5 (ja) | 2015-09-17 |
JP6231265B2 JP6231265B2 (ja) | 2017-11-15 |
Family
ID=47048949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012177634A Active JP6231265B2 (ja) | 2011-08-18 | 2012-08-10 | ロゴスキーコイルアセンブリ及びこれを提供するための方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8872611B2 (ja) |
EP (1) | EP2560013B1 (ja) |
JP (1) | JP6231265B2 (ja) |
AU (1) | AU2012216261B2 (ja) |
BR (1) | BR102012020701B1 (ja) |
CA (1) | CA2785396C (ja) |
ES (1) | ES2912087T3 (ja) |
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US9520710B2 (en) * | 2014-06-24 | 2016-12-13 | Eaton Corporation | Thermal trip assembly and circuit interrupter including the same |
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US9958480B2 (en) * | 2015-02-10 | 2018-05-01 | Qualcomm Incorporated | Apparatus and method for a current sensor |
DE102015104838B4 (de) | 2015-03-30 | 2018-07-19 | Harting Electric Gmbh & Co. Kg | Sensormodul eines modularen Steckverbinders |
US10365241B2 (en) | 2015-05-13 | 2019-07-30 | Veris Industries, Llc | Sensing system for a humidity sensor |
US10274521B2 (en) | 2015-09-02 | 2019-04-30 | Veris Industries, Llc | Multiple sensor based Rogowski coil |
US10295573B2 (en) | 2015-09-02 | 2019-05-21 | Veris Industries, Llc | Compensated rogowski coil |
US10670633B2 (en) | 2015-09-02 | 2020-06-02 | Veris Industries, Llc | Rogowski coil based alarm system |
US10545177B2 (en) | 2015-09-02 | 2020-01-28 | Veris Industries, Llc | Non-contact sensor based Rogowski coil |
US10901005B2 (en) | 2015-09-02 | 2021-01-26 | Veris Industries, Llc | Low power based Rogowski coil |
US10274522B2 (en) | 2015-09-02 | 2019-04-30 | Veris Industries, Llc | Mobile device coupled Rogowski coil |
KR101937209B1 (ko) * | 2017-06-09 | 2019-01-10 | 엘에스산전 주식회사 | 전류 감지 장치 |
KR101939569B1 (ko) | 2018-05-09 | 2019-01-17 | (주)인피니어 | 차폐 구조를 가지는 로고스키 코일 전류 센서 |
CN109100558B (zh) * | 2018-06-06 | 2021-11-16 | 中国电力科学研究院有限公司 | 一种罗氏线圈及电流测量装置 |
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2011
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2012
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- 2012-08-10 JP JP2012177634A patent/JP6231265B2/ja active Active
- 2012-08-13 EP EP12180314.2A patent/EP2560013B1/en active Active
- 2012-08-13 ES ES12180314T patent/ES2912087T3/es active Active
- 2012-08-16 AU AU2012216261A patent/AU2012216261B2/en not_active Ceased
- 2012-08-17 BR BR102012020701-0A patent/BR102012020701B1/pt active IP Right Grant
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Also Published As
Publication number | Publication date |
---|---|
AU2012216261B2 (en) | 2016-08-11 |
US8872611B2 (en) | 2014-10-28 |
ES2912087T3 (es) | 2022-05-24 |
AU2012216261A1 (en) | 2013-03-07 |
BR102012020701A8 (pt) | 2017-02-21 |
BR102012020701B1 (pt) | 2020-12-29 |
CA2785396C (en) | 2017-07-04 |
BR102012020701A2 (pt) | 2014-02-25 |
US20130043967A1 (en) | 2013-02-21 |
EP2560013A1 (en) | 2013-02-20 |
CA2785396A1 (en) | 2013-02-18 |
JP6231265B2 (ja) | 2017-11-15 |
EP2560013B1 (en) | 2022-01-05 |
NZ601886A (en) | 2014-02-28 |
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