JP2013041989A - Method of delivering substrate to frame for holding substrate, method of receiving substrate on mounting frame for transfer, and substrate mounting frame for transfer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of delivering a large size substrate of 2 m square or more from a mounting frame for transfer to a frame for holding a substrate, or a method of receiving the substrate from the frame for holding a substrate, and to provide a mounting frame for transfer used in these methods.SOLUTION: In the mounting frame for transfer, a plurality of rotary wheels are disposed rotatably at an upper part, all contacts of the rotary wheels and a substrate being mounted are arranged to form the horizontal plane of the mounting frame, lift pins capable of ascending and descending are arranged below the horizontal plane of the mounting frame, and the outer peripheral region of the horizontal plane of the mounting frame is formed so that the mounting frame can pass through the opening of a frame for holding a substrate. A substrate is delivered to the frame for holding a substrate by lifting the frame for holding a substrate from the underside of the mounting frame for transfer while supporting the substrate with the lift pins in a state where the central region is low and both end sides are high. When the substrate is received, the lift pins waits while lowering the central region, and after the substrate is mounted on the lift pins, the lift pins are brought into planar state.

Description

The present invention relates to a technology for placing rectangular substrates one by one on a rectangular substrate holding frame, and stacking the substrate holding frames on which the substrates are placed in multiple stages. The present invention relates to a delivery method to a holding frame, a receiving method to a transfer frame, and a transfer frame.
Since the substrate is flexible, it is slightly curved downward in the substrate holding frame, but it is necessary to prevent a plurality of substrates from contacting each other and to be integrated at a high density. Furthermore, it is necessary to protect the substrate from breakage and cracking during transportation or storage, and to prevent dust contamination and contamination.
Examples of substrates include glass substrates and plastic substrates, and in particular, color filters for liquid crystal display devices and plasma display devices, and color filter substrates including intermediate products in the manufacturing process of those color filters. Can do.

It is important to transport and store glass substrates used for liquid crystal display panels, plasma display panels, and their color filters without damaging or soiling the surface. When transporting such substrates, in order to protect the surfaces of the substrates, it is necessary to store them in parallel at predetermined intervals so that the surfaces do not contact each other.
However, the color filter, the intermediate product, and the like, which are the substrates, are enlarged because the display device itself is enlarged, and even a small size product is manufactured in a multi-faceted state.
Incidentally, the glass substrate of the sixth generation (G6) generally has a thickness of 0.7 mm, a size of 1500 mm × 1850 mm, and the weight of one sheet is 5 kg. In addition to this, the thickness of the sixth generation (G6) glass substrate includes a thin plate such as 0.4 mmt and 0.5 mmt and a thick plate of 1.1 mm and 1.6 mmt. There is also 1500 mm × 1800 mm in the outer size. Further, the substrate referred to as the eighth generation has a size of 2200 mm × 2500 mm, and the ninth generation has a size of 2400 mm × 2800 mm.
It is necessary to store and handle such a substrate safely at a high density due to problems of storage space and handling equipment.

There is Patent Document 2 in which one substrate is curved and stored in a frame, and the frames are stacked and conveyed in multiple stages. However, the document does not describe a method for storing a substrate in a frame, a method for taking out a substrate stored in a frame, and an apparatus for performing those methods.
In addition, it is essential to use the cushioning material 7 and the contact material 6 for the frame body, and the upper and lower frame bodies are aligned with each other by the engaging convex portion 9a and the engaging concave portion 9b. It is considered that there is a problem in cleaning this part.

Patent Document 2 and Patent Document 3 describe a substrate transport method, a transport device, and the like.
Patent Document 2 discloses a method of taking out and receiving a substrate (plate-like object) held in a tray in a bent state using a plurality of pins. However, the thing of the literature does not describe the relationship with the transfer platform.

  Moreover, in patent document 3, the board | substrate (plate-shaped object) hold | maintained in the bent state is received using a plurality of pins, and the substrate (plate-shaped object) is bent using a plurality of pins. There are provided a delivery process for holding the tray in a state in which it is not received, and a transfer device for performing the above-described reception process and delivery process. However, the document of the same document does not describe the relationship with the transfer platform.

JP 2006-168749 A JP 2008-81269 A JP 2008-81270 A

  In recent years, especially in liquid crystal display devices, there has been a demand for the manufacture of larger color filter substrates with the increase in the size of display devices and the increase in the number of manufacturing methods, and transport and storage of color filters and their intermediate process substrates. On the other hand, there is a demand for further reduction in transportation cost by improving transportation efficiency, saving storage space, and safe handling of intermediate products.

A glass material with a certain rigidity is used for the color filter substrate, but because it is thin, it is easily damaged by impact, and when it is enlarged, a considerable amount of bending occurs at the center of the substrate. It is. By the way, when the size is about 1 meter square, even if a glass substrate with a thickness of 0.7 mm supports two or four sides facing each other, the middle part is curved downward (gravity direction) by nearly 100 mm. Inevitable.
When large size glass is stored in a flat state and vibrations are applied during transportation, the substrate undulates and jumps up and down about several hundred mm, and contact damage occurs between the substrates unless the storage interval is very large. Alternatively, the glass itself jumps up and down by several hundred mm due to vibration and breaks down while it is deformed.
Accumulating and transporting and storing such glass substrates at a high density not only saves storage space, but also prevents the handling equipment and transport equipment from becoming large, thus saving resources. This will contribute to the reduction of manufacturing costs.
Conventionally, in the substrate holding frame that has been used, there has been a problem that the alignment portion between the frames is likely to be deformed during stacking and taking-out operations, and the glass substrate is easily damaged due to impact during stacking or transportation. . In addition, generation of dust from the device itself or mixing from the outside causes an increase in defective products, and thus strict measures are required.
In addition, in order to increase production efficiency and transport efficiency, a space-saving substrate storage device and transport device for storing and transporting such a large glass substrate in large quantities are required. On the other hand, if even one large glass substrate breaks during transportation or handling, glass fragments adhere to other glass substrates, or other glass breaks due to the glass substrate with glass fragments adhering to the equipment. Damage to the device, damage to expensive masks and jigs used in the process, and secondary loss occur. In order to prevent secondary damage due to the glass substrate breakage, production must be interrupted and thorough cleaning of equipment, jigs, etc. is necessary, and the loss due to breakage of one piece of glass becomes enormous.
Even if the glass substrate is not completely damaged, damage may occur due to stress on the glass substrate such as contact in the subsequent process or heat treatment even if the glass substrate is damaged. When handling glass substrates, it is important that even one sheet does not break.
The present invention has been completed through intensive research to solve such problems.

  The first of the gist of the present invention to solve the above problems is a method of transferring a rectangular substrate from a transfer platform to a substrate holding frame, wherein a plurality of rotating wheels are connected to all the rotating wheels. The substrate is placed and moved horizontally on the gantry horizontal surface of the transfer gantry arranged so that the contact point with the substrate to be placed forms a gantry horizontal surface, and the dimensions of the outer periphery of the substrate are four dimensions. In the pedestal horizontal plane, a plurality of lift pins that are positioned and placed below the pedestal horizontal plane and positioned so that the outer peripheral four sides of the substrate extend outward from the outer shape of the pedestal horizontal plane, Protruding beyond the horizontal plane of the pedestal, contacting the lower surface of the substrate, and then moving the lift pin vertically upward to a height corresponding to each position, formed at the apex of all the lift pins The flat surface accommodates the substrate in the substrate holding frame. By supporting the substrate so as to have a flat surface shape, and then raising the substrate holding frame body, which has an opening on the inner side provided below the transfer stand, in a horizontal state An opening of the substrate holding frame passes through an outer peripheral region of the transfer platform, and an inner peripheral side of the substrate holding frame extends to a peripheral portion of the substrate that extends outward from the outer shape of the mount horizontal surface. The substrate holding member provided on the substrate holding member is brought into contact with the upper surface, and the substrate is transferred to the substrate holding frame continuously.

  A second aspect of the present invention for solving the above-described problems is a method of receiving a rectangular substrate from a substrate holding frame to a transfer platform, wherein a plurality of rotating wheels are mounted on all the rotating wheels. In the transfer platform arranged so that the contact point with the substrate to be placed forms a pedestal horizontal plane, a plurality of lift pins waiting below the pedestal horizontal plane are raised to protrude beyond the pedestal horizontal plane, The surfaces formed by the apexes of all the lift pins are adjusted so as to have a curved shape when the substrate is housed in the substrate holding frame, and then the substrate holding frame is placed above the transfer platform. The substrate holding frame is brought into contact with the apex of the lift pin, the substrate is supported by the lift pin, by being lowered in a horizontal state from the substrate. Only the transfer Continuously passing the outer periphery of the pedestal and moving it downward, and then lowering the lift pins below the pedestal horizontal plane to place the substrate in a planar state and receiving it on the pedestal horizontal plane And a method of receiving the substrate onto the transfer platform.

  The third of the gist of the present invention to solve the above problems is that the substrate is stored in a curved state from the planar state to the substrate holding frame and delivered, or is stored in the substrate holding frame and curved. A transfer platform for receiving in a flat state, wherein a plurality of rotating shafts each having a plurality of rotating wheels are rotatably arranged in parallel with each other on the upper part in the vertical direction of the transfer platform, and all the above The rotating wheel has the rotating wheel arranged so that a contact point between the rotating wheel and the substrate to be placed forms a horizontal frame horizontal plane, and the outer shape of the frame horizontal plane is smaller than the size of the opening of the substrate holding frame. The transfer frame is formed so that the opening of the substrate holding frame can pass vertically upward or downward through the outer peripheral area of the transfer frame including the horizontal plane of the transfer frame. At the bottom of the vertical direction of the It has a plurality of lift pins arranged below, and the lift pins can move vertically up and down and protrude upward beyond the gantry horizontal plane, and the top of each lift pin can be adjusted to an arbitrary height The substrate transfer platform is characterized by being arranged as described above.

According to the method for transferring a substrate to a substrate holding frame of the present invention, the substrate holding frame placed on the lower side of the transfer platform on which the substrate is placed is pulled up, and the opening is used for transfer. By raising the substrate so that it passes through the outer peripheral area of the gantry and picking up the substrate and transferring it to the substrate holding frame, the substrate holding frame can be approached from below the substrate at the time of transfer. The fall of dust and foreign matter can be reduced.
Further, according to the method for delivering a substrate to the substrate holding frame of the present invention, the substrate is preliminarily formed into a surface shape along the shape of the substrate holding frame with a plurality of lift pins, and then the substrate holding frame is formed. As a result of mounting, the substrate and the substrate are generated by changing the surface shape in a state in which the substrate is in contact with the substrate holding frame as compared with the case where the substrate is directly transferred to the substrate holding frame in a flat state. Generation of friction between the holding member and distortion, cracking, dirt, etc. of the substrate itself can be prevented.

Then, according to the method of receiving the substrate to the transfer platform of the present invention, the substrate placed on the substrate holding frame is received on the mount horizontal surface of the transfer platform via a plurality of lift pins, The substrate holding frame is lowered so that the opening passes through the outer peripheral area of the transfer platform and moved downward, so that the substrate holding frame is moved below the substrate when receiving. Further, it is possible to reduce the fall of dust and foreign matters from above the substrate.
Further, according to the method for receiving the substrate on the transfer platform of the present invention, the surface formed by the vertices of the plurality of lift pins is formed in the curved shape of the substrate holding frame, and the substrate is then apex of the plurality of lift pins. The substrate is placed in a curved state on the substrate holding frame so that the substrate is placed in a flat state by lowering the lift pins and receiving the substrate in a flat state. Compared to the case, prevent the occurrence of friction between the substrate and the substrate holding member, distortion of the substrate itself, cracks, dirt, etc., caused by the surface shape changing while the substrate is in contact with the substrate holding frame. Can do.

According to the substrate transfer platform of the present invention, when the substrate is transferred to the substrate holding frame, the substrate holding frame can be approached from below the substrate, and the substrate is received. Has a structure in which the opening of the substrate holding frame passes through the outer peripheral area of the transfer platform so that the substrate holding frame is moved below the substrate. The fall of dust and foreign matter can be reduced.
Further, according to the substrate transfer platform of the present invention, when the substrate is transferred to the substrate holding frame, the substrate is preliminarily formed into a surface shape along the shape of the substrate holding frame by a plurality of lift pins. Then, when the substrate is transferred to the transfer frame, the surface formed by the apexes of the plurality of lift pins is formed into the curved shape of the substrate holding frame. Then, after the substrate is brought into contact with and supported by the apexes of the plurality of lift pins, the lift pins are lowered to place the substrate in a flat state so that the plurality of lift pins are disposed below the mount horizontal plane. As compared with the case where transfer is performed between the gantry and the substrate holding frame without using a lift pin, the surface shape changes with the substrate in contact with the substrate holding frame. A substrate and a substrate holding member formed from It is possible to prevent the occurrence of distortion and cracking or contamination of the friction and the substrate itself between.

It is the top view which looked at the frame for substrate maintenance from the upper surface. It is sectional drawing of the frame part and fitting part of the left side which laminated | stacked the board | substrate holding frame in 3 steps | paragraphs, and a board | substrate support part. FIG. 3 is a cross-sectional view of a state in which a substrate holding member is mounted on the substrate support portion of FIG. 2 and a substrate is placed thereon, and then substrate holding frames are stacked in three stages. It is a figure explaining the outline of the apparatus which transfers a board | substrate to the frame for board | substrate holding | maintenance. It is an external appearance perspective view explaining the position correction apparatus of the mount frame for a board | substrate transfer. It is a figure explaining the height position when a lift pin protrudes. It is a figure which shows the state at the time of the transfer of a board | substrate (at the time of delivery). It is a figure which shows the state at the time of the transfer of a board | substrate (at the time of reception). It is a figure which shows the relationship of each magnitude | size of the opening of a board | substrate holding frame, a board | substrate, and the mount for transfer. It is a figure explaining the various of a lift pin. It is a perspective view which shows the external appearance of the frame for board | substrate holding | maintenance. It is an external appearance perspective view of the state which mounts a board | substrate on the frame for board | substrate holding | maintenance. It is a perspective view which shows the state which puts a board | substrate on the board | substrate holding | maintenance frame, puts an upper cover in the state which piled up the board | substrate holding | maintenance frame in multiple steps, and applies an inner pallet and a vibration isolating pallet to the lower side. It is a perspective view which shows the state which packed the board | substrate holding frame and the inner pallet with the binding material.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, in order to facilitate understanding, a method for delivering a substrate of the present invention to a substrate holding frame, a method for receiving a substrate for transfer, and a substrate Before describing the transfer platform in detail, the transport and storage of the substrate using the substrate holding frame according to the present invention will be described in its entirety.

FIG. 11 is a perspective view showing the appearance of the substrate holding frame. The substrate holding frame 10 is a rectangular frame in plan view, but in the perspective view, the substrate is a frame whose center is curved downward (in the direction of gravity). On four sides, there are frame-like frame portions 11 (consisting of 11a, 11b, 11c, and 11d). The frame 11 is a structural member that supports the total weight of the substrate holding frame 10 and the substrate stacked in multiple stages.
The left and right sides 11a and 11b of the frame portion 11 have a flat linear shape, but the front and rear sides 11c and 11d are curved downward. Here, the front and rear and the left and right sides of the frame body may originally be either the front or rear or the left and right sides, but in this specification, the two sides on which the long side of the rectangular substrate is placed are easy to distinguish. The left and right sides.

A substrate support portion 13 having a constant width is formed to extend on the inner peripheral side of the upper surface of the frame portion 11. Further, although not shown in FIG. 11, a fitting portion is formed along the inner periphery of the lower surface (see FIGS. 1 and 2 described later). The substrate support part 13 and the fitting part are made of the same material as the frame part 11.
A resin substrate holding member 14 is attached to the substrate support portion 13 so as to cover the metal surface at regular intervals. In some cases, the substrate holding member 14 is provided with notches in the substrate support portion 13 at regular intervals, and in this case, the substrate support portion 13 including the substrate holding member 14 has a constant width. It will extend to the inner circumference. However, the substrate holding member 14 may be continuously attached in a band shape without a constant interval.
A central region K surrounded by the substrate support 3 and the substrate holding member 14 is an empty opening (space region).

FIG. 12 is an external perspective view of a state where the substrate is placed on the substrate holding frame.
FIG. 12A shows a state in which the substrate holding frame 10 is prepared in the lower part of the drawing and the substrate A is prepared in the upper part of the drawing. FIG. 12B shows the substrate A placed on the substrate holding frame 10. It is the state that was put. The substrate A is placed so that the peripheral edge of the substrate A is in contact with the upper surface of the substrate holding member 14.
As a method of bringing the substrate A close to the substrate holding frame 10, a method of placing the substrate A so as to scoop up on the substrate holding frame 10 raised from below the stationary substrate A is used. In this method, the apparatus does not operate above the substrate A as compared with the case where the substrate A is lowered and mounted on the substrate holding frame 10 in a stationary state. There is an advantage of reducing the amount of dust and foreign matter falling on the surface of the substrate A.

FIG. 13 is a perspective view showing a state in which the substrate is placed on the substrate holding frame, the substrate holding frames are stacked in multiple stages, the upper lid is covered, and the inner pallet and the vibration isolating pallet are applied to the lower side.
By sequentially stacking the substrate holding frame 10 on the other substrate holding frame 10 on which the substrate A has already been placed, the multistage stack 100 of the substrate holding frame 10 can be obtained. The upper and lower substrate holding frames 10 are stacked on the upper surface of the fitting portion near the frame portion 11 of the substrate supporting portion 13 of the lower substrate holding frame 10 and the fitting portion of the upper substrate holding frame 10. By being engaged with the lower surface, they are fitted together and the alignment is performed reliably.

  The inner pallet 30 has a surface plate 31 made of metal or resin that is shaped to match the curved surface of the substrate so as not to contact the substrate A placed on the lowermost stage. Further, the total weight of the substrate holding frame 10 and the substrate A stacked in multiple stages is received by the four sides of the pallet. As with the substrate holding frame 10, consideration is given not to generate dust or the like. In order to obtain a sealing structure, the lower part of the board holding frame 10 has a fitting part of the pallet itself that is fitted to the lower surface fitting part.

The anti-vibration pallet 40 is for suppressing vibrations and the like that are exerted on the substrate during conveyance. In general, vibration-proof rubber is used to cushion vibrations and shocks during transportation and cargo handling. A commercially available product may be used as long as it does not generate dust or foreign matter.
As the upper lid 20, one having a surface plate 21 curved downward in accordance with the curved shape of the substrate A is used. For this purpose, it is preferable to use a strong metal or resin material so as to withstand impacts from above. Further, in order to achieve a substantially sealed state, the upper lid 20 itself has a fitting portion so as to be fitted to the upper surface of the uppermost substrate holding frame 10. More preferably, a binding mechanism 22 and a binding belt 23 are provided.

  FIG. 14 is a perspective view showing a state in which the substrate holding frame and the inner pallet are packed with a binding material. A multi-stage stacked body 100 of the substrate holding frame 10 is sandwiched between the upper lid 20 and the inner pallet 30 and is bound using a binding mechanism 22 and a binding belt 23. A package is completed by covering an outer cover (not shown). It can be stored in this state, and can also be transported as cargo or air mail.

  Since the present application relates to the method of transferring the substrate to the substrate holding frame and the method of receiving the transfer frame, and the substrate transfer frame in the overall description of the substrate transfer / storage device described above, Hereinafter, the substrate holding frame 10 and its usage will be described in detail.

FIG. 1 is a plan view of the substrate holding frame as viewed from above.
As shown in FIG. 1, the substrate holding frame 10 has a rectangular shape whose shape when the substrate A is observed in a planar state is a shape obtained by enlarging the substrate A in proportion to the shape. However, in the frame portion 11, the left and right frame portions 11a and 11b are formed in parallel with each other in a linear shape, and the front and rear frame portions 11c and 11d are formed in a curved shape.
A handle 15 is formed outside the left and right frame portions 11a and 11b. The handle portion 15 is a portion that is gripped by a robot arm or the like, and does not have to be provided along the entire length of the side, and may have a partial length.

The substrate holding frame 10 uses a metal material having structural strength for the frame portion 11. This is because it is necessary to withstand the total load of the substrate holding frame 10 itself and the substrate A. For example, in the case of the sixth generation (1500 mm × 1850 mm, 0.7 mmt), one glass substrate is 5 kg, and the substrate holding frame is 5.5 kg. It becomes. As described above in paragraph [0009], the glass that is said to be the sixth generation has slightly different sizes and thicknesses. As a matter of course, the weight of the glass substrate and the weight of the substrate holding frame 10 are also included. Slightly different, total weight will also change.
A substrate support portion 13 having a certain width extends from the upper surface of the frame portion 11 toward the inner peripheral side. A portion along the frame portion 11 of the substrate support portion 13 serves as a first fitting portion 12n, and has an inclined surface that can be fitted into the lower second fitting portion. A second fitting portion 12d is formed on the lower surface of the frame portion 11 along the inclined surface, but is not shown in FIG. 1 (see FIG. 2 or FIG. 3).
The fitting portions 12n and 12d are preferably provided on all four sides or at least three sides. This is because the front, rear, left and right of the frame 10 are aligned.

A resin substrate holding member 14 is attached to the substrate support portion 13 so as to cover the metal surface of the substrate support portion 13 at regular intervals. This is because a substrate represented by glass is unlikely to be damaged when subjected to an impact if the substrate is in contact with a resin material whose surface is softer than the metal surface.
About 5 to 20 substrate holding members 14 are mounted on one side, depending on their dimensions. In the case of FIG. 1, 8 pieces are mounted on the left and right sides, and 6 pieces are mounted on the front and rear sides. Accordingly, the single substrate holding member 14 has a width of about 5 to 10 cm and a length of about 10 to 25 cm. However, as described above, the substrate holding member 14 may not be mounted at intervals.
The opening K surrounded by the substrate support portion 13 and the substrate holding member 14 is an empty space area.

FIG. 2 is a cross-sectional view of a frame portion and a fitting portion on the left side in which the substrate holding frame bodies are stacked in three stages, and the substrate support portion. The three stages are examples, and the number of stages is actually increased.
A material such as aluminum or aluminum alloy is used for the frame portion 11 for the purpose of weight reduction. As shown in the figure, the cross section is rectangular or square, and a hollow structure can be suitably employed.
A handle portion 15 serving as a grip portion of a robot arm or the like extends outward with a constant width as a smooth surface parallel to the upper surface of the frame portion 11. The reason for the smooth surface is to prevent dust generation, facilitate cleaning, and sealability. However, it does not require perfect airtightness.

In the case of FIG. 2, the substrate support portion 13 extends from the upper surface of the frame portion 11, but may extend from the lower surface side as the substrate support portion 13. A portion along the frame portion 11 of the substrate support portion 13 is a first fitting portion 12n. The second fitting portion 12 d is provided as a protruding piece that extends short from the lower surface of the frame portion 11. When the substrate support portion 13 is on the lower side, the protruding piece protrudes from the upper surface side. In the first embodiment of the substrate holding frame, the substrate supporting portion 13 extends from the upper side, and in the second embodiment of the substrate holding frame, the substrate supporting portion 13 extends from the lower side. The only difference is that the protrusions for fitting are in the opposite positions. In either case, the effect is not changed so much, but it is considered that the falling of dust onto the substrate can be reduced when the substrate support portion 13 is the upper surface.

The substrate support portion 13 is provided with a constant width H1. H1 is about 6 to 15 cm. The substrate support portions 13a and 13b provided on the left and right frame portions 11a and 11b are bent downward at an angle α. In the case of a 6th generation glass substrate (1500 mm × 1850 mm, 0.7 mmt), the short side of the substrate is curved, and the most curved central portion of the substrate is perpendicular to the plane including two opposing long sides. The distance is preferably about 100 mm to 120 mm, but in this case, the angle α is in the range of about 5 degrees to 25 degrees. Substrate support portions 13c and 13d are also provided on the front and rear frame portions 11c and 11d. Since the frame portions 11c and 11d are curved, the length direction follows the curved shape, but slightly below the inner peripheral side. Just bend.

In the case of FIG. 2, the second fitting portion 12 d is formed by being inclined and bent from the lower side of the frame portion 11. As described above, the fitting portion 12d is formed not on the frame portion 11 itself but on the inner peripheral portion of the frame portion 11 that does not directly receive the substrate holding frame itself or the substrate load. By doing in this way, a deformation | transformation of a fitting part can be prevented.
A first fitting portion 12 n is formed at a portion along the frame portion 11. This portion is similarly inclined downward so as to match the shape of the second fitting portion 12d. By the fitting of the lower surface of the second fitting part 12d and the upper surface of the first fitting part 12n, the upper and lower substrate holding frames 10 are aligned with each other. Thus, it is preferable to form the fitting parts 12n and 12d in the inner peripheral part which does not receive the load of frame part 11 itself, when a frame body is stacked in multiple stages.

An angle β of the inclined surface of the fitting portion with respect to the horizontal surface of the frame portion 11 is about 5 degrees to 45 degrees, more preferably 10 degrees to 20 degrees. Further, the width h of the hypotenuse is about 5 mm to 20 mm. By providing an appropriate inclination, even if a slight misalignment occurs, a function of fitting with the load and adjusting the position (self-alignment) occurs.
The upper and lower surfaces of the frame portion 11 have a smooth surface finish, and the upper and lower surfaces of the fitting portions 12n and 12d and the upper and lower surfaces of the substrate support portion along the frame portion 11 are correctly aligned and stacked. Can be kept constant and the inside can be substantially sealed.

FIG. 3 is a left-end cross-sectional view of a state in which the substrate holding member is mounted on the substrate support portion of FIG. 2 and the substrate is placed, and then the substrate holding frames are stacked in three stages.
A substrate holding member 14 is mounted on the surface of the substrate support portion 13. It is preferable that at least the front end side (the side looking into the opening K) of the substrate holding member 14 is formed thin. This is because if it is thick, the gap between the upper and lower substrate holding frames is narrowed. However, it is preferable that the rear end 14a of the substrate holding member 14 is made as thick as close to the gap width between the substrate support portions so as to perform the function of suppressing the displacement due to the swinging of the substrate A in the front-rear and left-right directions.

  Various methods can be used for mounting the substrate holding member 14 to the substrate support portion 13. The structure is such that the vicinity of the front end (side facing the opening K) of the substrate holding member 14 can be opened and closed in a hinge-like manner, and at the rear end (frame side), the front and back pieces are passed through several small holes provided in the substrate support portion. They may be fitted together. Alternatively, as described above, the substrate support portion 13 is provided with notches and punched holes having a shape smaller and proportional to the substrate holding member 14, and the slide grooves formed on the rear end and the left and right side surfaces of the thin substrate holding member 14 It can also be inserted into a notch or punch hole. In any case, it is necessary to have a structure that does not easily fall off and does not generate dust or the like.

In the case of FIG. 3, the substrate holding member 14 is fitted and fixed to the substrate support portion 13 by a complicated structure, but the detailed structure is not shown in the drawing. Further, the substrate holding member 14 has a thickness of the rearmost end portion 14f to provide a stopper function for stopping the substrate A from swinging. Such a structure of the substrate holding member 14 can suppress the swing of the substrate A within a certain range. In FIG. 3, the upper substrate A1 is in contact with the rearmost end portion 14f, and the lower substrate A2 is on the right side.
When the swing range of the substrate A is ± 5 mm, the distance between the left and right stoppers 14f along the curved shape can be the width of the substrate A + 10 mm.

As shown in FIG. 1, the four corners of the frame portion 11 can be connected by fitting a corner piece 16 made of resin or the like into the end portion, but may be joined by welding or the like if possible. In the case of a corner piece, care is taken so that the connecting portion with the frame portion 11 is connected smoothly.
The frame portion 11 inserted into the corner piece 16 is cut or pressed to be thinned so that no step is generated between the surface of the corner piece 16 and the surface of the frame portion 11.
It is preferable to form front and back fitting grooves in the corner piece 16 itself. The frame 11 and the corner piece 16 are firmly fixed with bolts and nuts so that the angles of the two sides are maintained at right angles.
The substrate is typically a glass substrate or a plastic substrate, and in particular, a color filter substrate, that is, a color filter for a liquid crystal display device or a plasma display device, or an intermediate in the process of manufacturing these color filters. Products are eligible.

  As described above, the substrate holding frame is used for a purpose of carrying or storing a single rectangular substrate and transporting or storing the substrate holding frames in a stacked state. Frame portion, a first fitting portion inclined from the upper surface of the frame portion to the inner peripheral lower side, a substrate support portion formed to extend further forward, and an inner periphery from the lower surface of the frame portion A second holding portion provided on the lower side, and a substrate holding frame in a state where the substrate is placed on the substrate support portion, by fitting the first fitting portion and the second fitting portion, It is preferable that the upper and lower frame portions are aligned and can be stacked in multiple stages.

(Embodiments related to materials and manufacturing method)
As a material used for the frame portion 11, a metal material that is lightweight and does not cause corrosion can be used. Specifically, aluminum alloys such as pure aluminum, duralumin, and aluminum-manganese can be used. These materials can be hollow extruded to produce a frame shape.
The substrate holding member 14 includes a polyolefin resin material such as polyethylene and polypropylene, a polyamide resin such as ultra high molecular weight polyethylene (UHMW-PE), nylon 66 and nylon 610, polyethylene terephthalate (PET), polyimide, polyetheretherketone ( Materials such as PEEK) can be used. These materials can be manufactured by injection molding using a mold.
The corner piece 16 can be manufactured by processing the same material as the substrate holding member 14 in the same manner.

  Next, referring to FIG. 4 to FIG. 9, a transfer platform on which the substrate A is transferred to the substrate holding frame 10 or the substrate A is transferred from the substrate holding frame 10 and the operation thereof. I will explain.

4A and 4B are diagrams for explaining the outline of an apparatus for transferring a substrate to a substrate holding frame. FIG. 4A is a plan view, FIG. 4B is a front view, and FIG. FIG.
As shown in FIG. 4A, when the substrate A is transferred to the substrate holding frame 10 (delivery) and when the substrate A is transferred from the substrate holding frame 10 (reception), the transfer is performed. A robot arm (not shown) is used for the mounting platform 50 and FIG.
The transfer platform 50 is a platform having a size in which the substrate A can be placed and having a substantially rectangular shape in plan view. The substantially rectangular shape means that a plurality of rotating shafts W (W1, W2, W3,... Wn) for transporting the substrate A, rotating wheels sw attached thereto, and a number of lift pins P ( P1, P2, P3,... Pn) and their drive mechanisms, etc., and does not have a clear outer shape like a table.
A plurality of rotating wheels sw are attached to each rotating shaft W that transports the substrate A, and each rotating shaft W is supported by a bearing J.
The rotating wheels are arranged so as to horizontally form one surface on which the apex (uppermost surface) of each rotating wheel sw exists. In other words, the rotating wheels are arranged such that the contact points between the rotating wheels and the substrate A form a horizontal horizontal plane.

  The outer shape of the transfer platform 50 needs to be smaller than an opening K (indicated by a broken line in FIG. 4) formed by being surrounded by the substrate support portion 13 of the substrate holding frame 10. It is necessary to prepare the substrate holding frame 10 on which the substrate is not placed on the outer periphery below the mount horizontal plane through the mount horizontal plane of the transfer mount 50, and when transferring the substrate A, This is because it is necessary to pass the gantry 50 through the opening K of the substrate holding frame 10.

A plurality of rotation axes W are arranged orthogonal to the transport direction of the substrate A. The substrate A (shown by a one-dot chain line in FIG. 4) that has been processed by the manufacturing apparatus 90 in the previous process is placed on the rotating wheel sw of the rotating shaft W and is smoothly discharged onto the gantry horizontal plane. Accordingly, the rotating wheel sw rotates at a constant speed and carries the substrate in the arrow Y direction. The surface of the rotating wheel sw that contacts the substrate A is made of a material such as ultra high molecular weight polyethylene that is less damaged by the substrate and less worn by the substrate.
In the gantry horizontal plane of the transfer gantry 50, the substrate A must stop at a position where each of the left and right and front and rear sides protrudes outward from the gantry horizontal plane. This is because when the substrate holding frame 10 on the lower side of the substrate A is raised, the substrate A needs to be struck by the substrate support portion 13 of the substrate holding frame 10. Therefore, the transfer platform 50 may be provided with a position inspection device and a position correction device for the substrate A.
Since the connecting portion between the manufacturing apparatus 90 and the transfer platform 50 in the previous process allows the rear side 11d of the substrate holding frame 10 to pass during transfer, the rotation axis W is spaced at a predetermined width so that the substrate holding frame When 10 passes, it is structured to be retractable.

The transfer platform 50 is further provided with lift pins P (P1, P2,... Pn), which can be curved when the substrate A is transferred, aligned vertically and horizontally. It has been. The lift pins P are in a standby state so that the substrate A does not protrude from the gantry horizontal plane when the substrate A is moving on the rotating wheel sw (see FIG. 4B).
In FIG. 4, six lift pins are arranged in one row (in the left-right direction), but the number of pins can be freely set as long as necessary. However, a total of three, one at the lowest center and two on the left and right, is necessary, and can be increased to about ten. At the time of transfer, the substrate A is raised at the left side edge and the right side edge so that the center part is bent downward (vertically in the vertical direction) and bent, so that the lower side in the first row (FIG. 4A) The side P3 and P4 pins are at the lowest position, and the lift pins at P1 and P6 are raised to the highest position. Even if the lift pins P are not used, the transfer to the substrate holding frame 10 can be performed, but if the substrate A in a flat state is suddenly bent, a sudden stress change is likely to occur and cracks and the like are likely to occur. Because. The pin height will be described in detail later.

Since the lift pins of P3 and P4 are at the lowest position, it is not necessary to project so much from the gantry horizontal plane at the time of transfer, and may be the same as or slightly projecting from the gantry horizontal plane.
As the pins P3 and P4, pins having hemispherical tips are used, but pins that are attracted by negative pressure may be used. Since the pins near the left and right ends are easily scratched on the back surface when the substrate A is bent, it is preferable to use pins that lift and hold the substrate in a non-contact manner by pressurized air. However, it is possible to use a lift pin loaded with a rotatable sphere at the tip of the pin without using air pressure.

If air pressure is not used, the lift pin P may be a simple straight rod with a small diameter (about 5 mm to 50 mm) made of metal or resin with a hemispherical tip, but if air pressure is used, it is connected to the pump. Piping is necessary. In either case, the lift pins P at the left and right symmetrical positions with respect to the center line of the substrate are paired and adjusted to the same rising height.
In FIG. 4B, each pipe or rod connected to the lift pin P is connected to a drive mechanism such as a servo cylinder. In the figure, the piping and the like are schematically shown, and do not show the actual structure.
In FIG. 4C, the positional relationship between the rotating wheel sw and the lift pin P is clarified.

FIG. 5 is an external perspective view illustrating the substrate position correcting apparatus.
As shown in FIG. 5, the substrate A is placed on the gantry horizontal surface of the transfer gantry 50 (in FIG. 5, the outer shape is indicated by a broken line). A plurality of position correction members (S1, S2, S3, S4, S5, S6) arranged so as to abut at right angles to the outer peripheral end surface of the substrate A correspond to at least two sides of the three sides of the substrate A. Spaced apart. This board | substrate A was conveyed in the arrow Y direction from the previous process, and was mounted in the mount horizontal surface, In the state which all of the outer periphery 4 sides of the board | substrate A stopped in the position which protruded outside the outer periphery of the mount horizontal plane. is there.
Here, the position correction apparatus includes the position correction members (S1 to S6) and a control unit (not shown) that controls these operations.
As shown in FIG. 5, the position correction members S3 and S4 are arranged so as to abut at right angles to the end surface of the substrate A, which is the leading portion in the transport direction, and to correct the position of the substrate at a preset position. Has been. Further, the position correction members S1 and S2 and the position correction members S5 and S6 facing them are brought into contact with the end surfaces of both sides of the substrate A along the transport direction, and the position of the substrate is set to a preset position. It is to correct. By this position correction, the peripheral edge of the substrate A is accurately placed on the substrate holding member 14 of the substrate holding frame 10 as shown in FIGS. 12 (A) and 12 (B).
In addition, each of these position correction members (S1, S2, S3, S4, S5, S6) has a tip portion (a cylindrical portion having a smaller diameter of the two-stage cylindrical position correction member in FIG. 5). It moves in a direction away from the end face of the substrate A and is pulled into a cylindrical portion having a large diameter, and the substrate holding frame 10 is lifted by placing the outer periphery of the substrate A below the transfer platform 50. It can be made to pass. Examples of the position correction member that can be adapted include a cylindrical cylinder.

FIG. 6 is a diagram for explaining the height position when the lift pin protrudes.
As described above, the lift pins of P3 and P4 are brought to the lowest position, and the pins of P1 and P6 are raised to the highest position.
Of course, following the first row of pins, the subsequent pin rows are also adjusted to substantially the same height in principle. The surface formed by the apexes of the lift pins P <b> 1 to P <b> 6 has a shape that roughly matches the curved shape of the substrate A when the substrate A is supported by the substrate holding frame 10. At the time of transfer, control is performed so that each pin protrudes to a preset height position. At this time, the lift pins that are symmetrical with respect to the left and right center line of the substrate A are controlled to have the same height.
However, the above description is a case where the substrate is in a curved state in which the center line region parallel to the long side is low and both the left and right long side regions are raised higher, and other curved states are set. You can also. For example, when the front and rear sides of the substrate holding frame 10 are flat four-sided frames with no curvature, the substrate has a shape in which only the central region is bent downward. It is preferable that the surface formed by the apexes of all adjacent lift pins substantially matches the curved shape of the substrate when protruding above the gantry horizontal plane.

FIG. 7 is a diagram showing a state when the substrate is transferred (during delivery).
The substrate transported in a planar state to the gantry horizontal surface of the transfer gantry 50 is placed on the gantry horizontal surface of the transfer gantry arranged in the horizontal direction and moved horizontally, and the outer periphery 4 is more than the substrate. A plurality of lift pins, which are positioned on the horizontal surface of the gantry horizontal plane with the side dimensions reduced so that the four outer sides of the substrate extend outward from the external shape of the gantry horizontal plane, It protrudes beyond the said mount horizontal surface, and is made to contact the lower surface of the said board | substrate. Next, the lift pin is moved vertically upward to a height corresponding to each position, and the surface formed by the vertices of all the lift pins is the surface shape when the substrate is housed in the substrate holding frame. The substrate is supported so as to become (FIG. 7A).
Next, by raising the substrate holding frame body 10 which is provided below the transfer platform 50 and has an opening on the inside in a horizontal state, the opening of the substrate holding frame body 10 is made to be the same as that of the transfer frame. Passing through the outer peripheral area, the upper surface of the substrate holding member provided on the inner peripheral side of the substrate holding frame contacting the peripheral edge of the substrate A extending outward from the outer shape of the gantry horizontal plane, the substrate A The substrate A is transferred to the substrate holding frame (FIG. 7B) continuously, and then the substrate A is transported to a predetermined place. Each lift pin P sinks below the gantry horizontal plane of the transfer gantry 50, and the next substrate A is carried to the gantry horizontal plane by the rotating wheel sw (FIG. 7C).

FIG. 8 is a diagram illustrating a state when the substrate is transferred (received).
At the time of receipt, the substrate A that is housed in a curved state in the substrate holding frame 10 is carried, contrary to the time of delivery. A plurality of lift pins P waiting below the gantry horizontal plane are raised and protruded beyond the gantry horizontal plane, and the surface formed by the vertices of all the lift pins P is curved when the substrate is placed in the substrate holding frame. It adjusts so that it may become a shape (FIG. 8 (A)). Next, the substrate holding frame 10 is lowered in a horizontal state from above the transfer platform so that the lower surface of the substrate A placed on the substrate holding frame 10 is brought into contact with the apex of the lift pins. The substrate A is supported by P (FIG. 8B), and only the substrate holding frame passes through the outer peripheral area of the transfer platform and is moved downward. Next, the lift pin that has received the substrate A is lowered below the gantry horizontal plane to receive the substrate A on the gantry horizontal plane in a flat state (FIG. 8C). The board | substrate A mounted on the rotating wheel sw surface is conveyed to the manufacturing apparatus of the next process.
The empty substrate holding frame 10 is stacked as it is below the transfer platform 50 or is transported to other necessary locations.

FIG. 9 is a diagram illustrating a relationship in size between the opening of the substrate holding frame, the substrate, and the transfer platform.
As is clear from the above description, the relationship among the sizes (planar outlines) of the opening K of the substrate holding frame 10, the substrate A, and the transfer platform 50 is as shown in FIG. That is, the planar outer shape of the substrate A is the maximum, the next is the size of the opening K, and the transfer platform 50 must be the minimum. However, the outer shape of the substrate holding frame 10 is naturally larger than that of the substrate A. The substrate holding frame 10 placed on the transfer stand 50 is placed around the transfer stand 50 and around it, not below the stand horizontal plane.

FIG. 10 is a diagram for explaining various types of lift pins.
FIG. 10A shows a simple straight rod-like shape having a small diameter made of metal or resin having a hemispherical tip 2. The sectional diameter of the lift pin P is preferably about 5 mm to 50 mm. The material is preferably stainless steel, fluororesin, ultra high molecular weight polyethylene or the like, and in particular, the material at the tip is selected so as not to damage the substrate.
FIG. 10B shows a pin configuration having a minute rotating sphere 3 at the tip. The rotating body 3 rotated by the ball bearing is fixed by a fixing portion 31 and connected to a shaft body 32. A material such as polyether ether ketone (PEEK) is used as the material of the rotating sphere 3.

FIG. 10C is a pin that uses air pressure, and has a purpose of adsorption and a purpose of non-contact support. Both have a small opening 4 at the tip. In the case of the suction purpose, it is used for the purpose of fixing the substrate A at the time of transfer, and the pipe piping is connected to a vacuum pump.
In the case of non-contact support, the purpose is to blow out air from the tip and support the substrate A at a close distance from the opening 4, and the pipe piping is connected to a pressure pump. The non-contact support state is continued until the substrate A is accommodated in the frame.
As shown in FIG. 10D, since the substrate A tends to slip near the left and right ends of the substrate A, it has a rotating sphere 3 and the tip of the pin is bent inward so as to support the substrate A at a right angle. It is also preferable to use those prepared.

Next, the movement of the substrate holding frame 10 will be described.
First, the substrate holding frames 10 stacked in advance are transported in units of several to tens of steps, and stacked so as to be positioned below the surface of the substrate holding frame 10 through the transfer frame 50 through the opening K. do. The substrate holding frame 10 is carried in a horizontal state, and can be moved in batches by holding the lowermost handle 15 in units of several steps.
A robot arm is used to move the substrate holding frame.
The robot arm has a structure capable of gripping the handle 15 (see FIGS. 1 and 2) of the substrate holding frame 10. The robot arm can be expanded and contracted, moved up and down, and rotated.
Further, the robot arm grips and lowers the substrate holding frame 10, and after the substrate A is transferred onto the lift pins and is made flat on the gantry horizontal surface, the gripping portion of the robot arm passes the outer periphery of the substrate A. It has a structure that does not prevent you from doing it.
Further, when the substrate is transferred, the robot arm can adjust the positional relationship between the substrate holding frame and the transfer platform. For example, when the substrate is received, the lower surface of the substrate A placed on the substrate holding frame 10 is lowered by the lift pins by lowering the substrate holding frame 10 in a horizontal state from above the transfer platform by the robot arm. The substrate A is transferred to the substrate holding frame so that the substrate A can be supported by the lift pins P while being in contact with the apex, and only the substrate holding frame can be moved downward through the outer peripheral area of the transfer platform. The positional relationship with the gantry can be set.

A substrate holding frame 10 having a size of 1500 mm × 1850 mm was manufactured using an aluminum alloy material. First, the frame portion having the cross-sectional shape shown in FIG. 2 was manufactured by hollow extrusion.
The left and right frame portions 11a and 11b were used as they were, but the front and rear frame portions 11c and 11d were subjected to bending after being extruded. The radius of curvature was set to 3000 mm. The thickness (step pitch) d of the frame part 11 was 10 mm, the frame part width W1 was 30 mm, and the width W2 of the second fitting part 12d was 20 mm. The thickness of each part was changed from 3 mm to 5 mm.

  A transfer test of the substrate A (thickness 0.7 mm, 1500 mm × 1850 mm glass substrate) was performed using the completed substrate holding frame 10 and the transfer platform 50 (the size of the opening K in FIG. 9). 1410 mm × 1760 mm, and the size of the transfer platform is 1360 mm × 1710 mm). It was confirmed that the substrate can be transferred and received smoothly.

DESCRIPTION OF SYMBOLS 10 Board | substrate holding frame 11 Frame part 12n 1st fitting part 12d 2nd fitting part 13 Board | substrate support part 14 Board | substrate holding member 15 Handle part 16 Corner piece 20 Top cover 21 Surface plate 22 Bundling mechanism 23 Bundling belt 30 Inner pallet 40 Anti-vibration pallet 50 Transfer platform 90 Manufacturing apparatus 100 in the previous process A multi-stage stack A of frames A Substrate W Rotating shaft J Bearing sw Rotating wheel

Claims (12)

A method of transferring a rectangular substrate from a transfer platform to a substrate holding frame,
A plurality of rotating wheels are placed horizontally on the gantry horizontal surface of the gantry for transfer arranged such that the contacts of all the rotating wheels and the substrate to be placed form a gantry horizontal surface. Move
Positioned such that the outer peripheral four sides of the substrate extend outward from the outer shape of the gantry horizontal plane on the gantry horizontal plane in which the dimensions of the outer peripheral four sides are smaller than the substrate,
A plurality of lift pins that are arranged and waited below the gantry horizontal plane, project beyond the gantry horizontal plane, and contact the lower surface of the substrate,
Next, the lift pin is moved vertically upward to a height corresponding to each position, and the surface formed by the vertices of all the lift pins is the surface shape when the substrate is housed in the substrate holding frame. Supporting the substrate so that
Next, the substrate holding frame body, which has an opening on the inner side provided below the transfer frame, is raised in a horizontal state, so that the opening of the substrate holding frame becomes the transfer frame. The substrate holding member provided on the inner peripheral side of the substrate holding frame is in contact with the peripheral edge of the substrate extending outward from the outer shape of the gantry horizontal plane, the substrate Is continuously transferred to the substrate holding frame. A method of transferring to the substrate holding frame.   The shape when the substrate is stored in the substrate holding frame has a short side and a long side, and an area that is equidistant from the long side to the center toward the center is the lowest in the vertical direction. 2. The method for transferring a substrate to a substrate holding frame according to claim 1, wherein the substrate has a curved shape that is gradually raised upward in the vertical direction toward both long sides.   3. The method for delivering a substrate to a substrate holding frame according to claim 1, wherein the substrate is a color filter substrate. A method of receiving a rectangular substrate from a substrate holding frame to a transfer platform,
A plurality of rotating wheels are lifted by lifting a plurality of lift pins that are placed below the mounting horizontal plane in the mounting rack in which contact points between all the rotating wheels and the substrate to be placed form a mounting horizontal plane. Let it protrude beyond the pedestal horizontal plane, and the surface formed by the apexes of all the lift pins is adjusted to have a curved shape when the substrate is housed in the substrate holding frame,
Next, the lower surface of the substrate placed on the substrate holding frame is brought into contact with the apex of the lift pins by lowering the substrate holding frame in a horizontal state from above the transfer platform. Continuously supporting the substrate by the lift pins, moving only the substrate holding frame through the outer peripheral area of the transfer platform and moving downward,
Next, by lowering the lift pins downward from the gantry horizontal plane, the substrate is placed in a flat state and received by the gantry horizontal plane. A method for receiving a substrate on a transfer gantry. 5. The method for receiving a substrate to a transfer stand according to claim 4, wherein the substrate holding frame is moved below the transfer stand, and then the substrate holding frame is moved to the transfer stand. Placed at the bottom,
Repeating the method of receiving the substrate to the transfer platform, stacking a plurality of the substrate holding frames on which the substrate is not mounted on the lower portion of the transfer platform,
Next, a method of receiving a substrate on a transfer platform, wherein the plurality of stacked substrate holding frames are moved together.   The shape when the substrate is housed in the substrate holding frame has a short side and a long side, and a central region that is equidistant from the long side to the center toward the center is the lowest in the vertical direction, 6. The method for receiving a substrate on a transfer platform according to claim 4 or 5, wherein the substrate has a curved shape that gradually increases upward in the vertical direction toward both opposing long sides.   7. The method for receiving a substrate on a transfer platform according to claim 4, wherein the substrate is a color filter substrate. This is a transfer platform for receiving a substrate from a flat state in a curved state in a substrate holding frame and delivering it, or receiving a curved state in a substrate holding frame. And
A horizontal surface of the gantry in which a plurality of rotating shafts to which a plurality of rotating wheels are attached are rotatably arranged in parallel with each other and a contact point between all the rotating wheels and the substrate to be placed is horizontal at an upper portion in the vertical direction of the transfer platform. Having the rotating wheel arranged to form
The outer shape of the gantry horizontal plane is made smaller than the size of the opening of the substrate holding frame, and the outer periphery of the transfer gantry including the gantry horizontal surface is positioned above or below the vertical direction of the opening of the substrate holding frame. Is formed so that it can pass through,
At the lower part in the vertical direction of the transfer platform, there are a plurality of lift pins arranged below the mount horizontal plane,
The lift pins are vertically movable up and down, protrude upwardly beyond the horizontal plane of the gantry, and are arranged so that the apex of each lift pin can be adjusted to an arbitrary height. Substrate for transferring substrates. The substrate transfer platform according to claim 8,
A plurality of position adjusting members disposed so as to contact the outer peripheral end surface of the substrate placed on the horizontal surface of the gantry;
The position adjusting member is provided corresponding to at least three sides of the substrate,
The front end of the position adjusting member has a gap between the outer peripheral end surfaces of the substrate, and waits at a position where it can pass through the substrate holding frame vertically upward and downward. A substrate transfer platform characterized by projecting at the time of the step and abutting the end surface of the substrate to adjust the position.   The shape when the substrate is housed in the substrate holding frame has a short side and a long side, and a central region that is equidistant from the long side to the center toward the center is the lowest in the vertical direction, 10. The substrate transfer platform according to claim 8 or 9, which has a curved shape that gradually increases upward in the vertical direction toward both opposing long sides.   11. The substrate transfer platform according to claim 8, wherein the lift pins include a pin for adsorbing the substrate or a pin for supporting the substrate in a non-contact manner by air pressure.   The substrate transfer platform according to any one of claims 8 to 11, wherein the substrate is a color filter substrate.

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