JP2013033569A - Substrate for suspension, suspension, suspension with element, hard disk drive, and method for manufacturing substrate for suspension - Google Patents

Abstract

PROBLEM TO BE SOLVED: To mainly provide a substrate for a suspension which can be grounded in a small area.SOLUTION: The substrate for a suspension of the invention has a metal support substrate, a first insulation layer formed on the metal support substrate, a first wiring layer formed on the first insulation layer, a second insulation layer formed on the first wiring layer, and a second wiring layer formed on the second insulation layer. In the substrate for a suspension, a first wiring part for ground and a second wiring part for ground are electrically connected to the metal support substrate through a viahole part penetrating the first insulation layer.

Description

  The present invention relates to a suspension substrate capable of grounding in a small area.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed, and along with this, the capacity of hard disk drives (HDD) incorporated in personal computers has increased. Increasing information transmission speed is required. A suspension substrate (flexure) used in an HDD generally has a basic structure in which a metal support substrate (for example, stainless steel), an insulating layer (for example, polyimide resin), and a wiring layer (for example, copper) are laminated in this order.

  The metal support substrate normally imparts spring properties to the suspension substrate, but it is known to provide a function as a ground of the wiring layer in addition to the function as a spring. For example, Patent Document 1 discloses a magnetic head suspension in which a metal pad and a metal thin plate (metal support substrate) are electrically connected through a conductive portion that penetrates an insulating layer and is made of metal plating.

  On the other hand, as shown in Patent Document 1, a pair of wiring layers in the suspension substrate is usually formed on the same surface of the insulating layer (wiring layers in a planar arrangement). On the other hand, Patent Documents 2 and 3 disclose a structure in which wiring layers are vertically stacked via an insulating layer (wiring layers in a stacked arrangement).

JP 2006-202359 A JP 2009-129490 A JP 2010-146679 A

  As the functionality of HDDs increases, the number of wiring layers required for a suspension board is increasing. The wiring layer in the stacked arrangement has an advantage in that it can easily cope with the increase in the number of wiring layers in comparison with the wiring layer in the planar arrangement. In addition, as the functionality of HDDs increases, the types of elements mounted on suspension boards are also increasing. Conventional suspension boards have mounted only a recording / reproducing element (for example, a magnetic head slider). In addition to this, a thermal assist element (for example, a semiconductor laser diode element), an actuator element (for example, a piezo element), etc. Is assumed to be implemented.

  These elements need to be grounded (earth) in order to prevent characteristic changes and destruction due to static electricity or to prevent malfunctions due to changes in the reference potential. Further, for example, it is necessary to ground the noise shielding wiring layer that suppresses noise between the wiring layers. As described above, the wiring layer in the stacked arrangement has an advantage that it can easily cope with the increase in the number of wiring layers in comparison with the wiring layer in the planar arrangement, but the increasing tendency of the number of wiring layers is remarkable. There is a need for a suspension substrate capable of grounding in a small area even in the case of employing a wiring layer in a stacked arrangement.

  The present invention has been made in view of the above circumstances, and a main object of the present invention is to provide a suspension substrate capable of grounding in a small area.

  In order to solve the above problems, in the present invention, a metal support substrate, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and the above A suspension substrate having a second insulating layer formed on the first wiring layer and a second wiring layer formed on the second insulating layer, and made of the same material as the first wiring layer The first ground wiring portion and the second ground wiring portion formed from the same material as the second wiring layer are formed, and the first ground wiring portion and the second ground wiring portion are formed. However, the present invention provides a suspension substrate, wherein the suspension substrate is electrically connected to the metal support substrate through a via portion penetrating the first insulating layer.

  According to the present invention, since the first ground wiring portion and the second ground wiring portion are electrically connected to the metal support substrate by the common via portion, the suspension capable of grounding in a small area. Substrate.

  In the above invention, the first ground wiring portion and the second ground wiring portion each include a pad portion having an opening, and the opening portion of the first ground wiring portion and the second ground wiring portion. In the opening, the via portion is formed, and the via portion has no material continuity with the pad portion of the first ground wiring portion and the pad portion of the second ground wiring portion. It is preferable that

  In the above invention, the first ground wiring portion includes a pad portion having an opening, the second ground wiring portion includes a pad portion, and the via portion is formed in the opening of the first ground wiring portion. Preferably, the via portion is a via portion having material continuity with the pad portion of the second ground wiring portion.

  In the above invention, the first ground wiring portion and the second ground wiring portion each include a pad portion, and the via portion has material continuity with the pad portion of the first ground wiring portion. It is preferable that the via portion has.

  In the above invention, it is preferable that the pad portion of the second ground wiring portion is directly formed on the pad portion of the first ground wiring portion. This is because the second insulating layer does not exist between the two pad portions, and the thickness of the portion where the via portion is formed can be reduced.

  In the above invention, the pad portion of the second ground wiring portion is formed directly on the pad portion of the first ground wiring portion, and a cover layer is formed inside the opening of the second ground wiring portion. It is preferable that the via portion and the second ground wiring portion are not in contact with each other. This is because the height and shape of the via portion can be easily controlled.

  In the above invention, the first ground wiring portion is a ground wiring layer of a thermal assist element, and the second ground wiring portion is a ground wiring layer of a recording / reproducing element. preferable. This is because it is easy to mount the thermal assist element on the metal support substrate side of the suspension substrate and mount the recording / reproducing element on the second wiring layer side.

  The present invention also provides a suspension comprising the above-described suspension substrate and a load beam provided on the surface of the suspension substrate on the metal support substrate side.

  According to the present invention, a suspension capable of grounding in a small area can be obtained by using the suspension substrate described above.

  The present invention also provides an element-equipped suspension comprising the above-described suspension and a recording / reproducing element disposed on the suspension.

  According to the present invention, by using the above-described suspension, a suspension with an element capable of grounding in a small area can be obtained.

  The present invention also provides a hard disk drive having the above-described suspension with an element.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  In the present invention, the metal support substrate, the first insulating layer formed on the metal support substrate, the first wiring layer formed on the first insulating layer, and the first wiring layer A method for manufacturing a suspension board having a formed second insulating layer and a second wiring layer formed on the second insulating layer, wherein the first wiring layer and the first ground wiring portion are A first wiring layer forming step for simultaneously forming, a second wiring layer forming step for simultaneously forming the second wiring layer and the second ground wiring portion, the first ground wiring portion and the second ground wiring portion. And a via part forming step of forming a via part penetrating the first insulating layer and electrically connecting to the metal supporting board. .

  According to the present invention, a suspension substrate capable of grounding in a small area is formed by forming a via portion that electrically connects the first ground wiring portion and the second ground wiring portion to the metal support substrate. Can be obtained.

  The suspension substrate of the present invention has an effect that a small area can be grounded.

It is a schematic diagram which shows an example of the board | substrate for suspension which has the wiring layer of a lamination | stacking arrangement | sequence. It is a schematic plan view which shows an example of the via | veer part periphery in this invention. It is AA sectional drawing of FIG.2 (b). It is a schematic sectional drawing explaining the board | substrate for suspensions of a 1st embodiment. It is a schematic sectional drawing explaining the board | substrate for suspensions of a 1st embodiment. It is a schematic sectional drawing explaining the board | substrate for suspensions of a 1st embodiment. It is a schematic diagram which shows an example of the board | substrate for suspensions of a 2nd embodiment. It is a schematic sectional drawing explaining the board | substrate for suspensions of a 2nd embodiment. It is a schematic sectional drawing explaining the board | substrate for suspensions of a 2nd embodiment. It is a schematic diagram which shows an example of the board | substrate for suspensions of a 3rd embodiment. It is a schematic sectional drawing explaining the board | substrate for suspensions of a 3rd embodiment. It is a schematic sectional drawing explaining the board | substrate for suspensions of a 3rd embodiment. It is a schematic sectional drawing explaining the board | substrate for suspensions of other embodiment. It is a schematic plan view which shows an example of the suspension of this invention. It is a schematic plan view which shows an example of the suspension with an element of this invention. It is a schematic plan view which shows an example of the hard disk drive of this invention. It is a schematic sectional drawing explaining the manufacturing method of the board | substrate for suspensions of a 1st embodiment. It is a schematic sectional drawing explaining the manufacturing method of the board | substrate for suspensions of a 2nd embodiment. It is a schematic sectional drawing explaining the manufacturing method of the board | substrate for suspensions of a 3rd embodiment.

  Hereinafter, the suspension substrate, suspension, suspension with element, hard disk drive, and manufacturing method of the suspension substrate of the present invention will be described in detail.

A. Suspension Substrate The suspension substrate of the present invention includes a metal support substrate, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and the first A suspension substrate having a second insulating layer formed on a wiring layer and a second wiring layer formed on the second insulating layer, the suspension substrate being made of the same material as the first wiring layer. The first ground wiring portion and the second ground wiring portion made of the same material as the second wiring layer are formed, and the first ground wiring portion and the second ground wiring portion are It is electrically connected to the metal support substrate through a via portion that penetrates the first insulating layer.

  FIG. 1A is a schematic plan view showing an example of a suspension substrate having a wiring layer in a stacked arrangement, and FIG. 1B is a cross-sectional view taken along line AA in FIG. In FIG. 1A, illustration of the insulating layer and the cover layer is omitted for convenience. A suspension substrate 100 shown in FIG. 1A includes a recording / reproducing element mounting region 101 formed at one tip portion, an external circuit board connection region 102 formed at the other tip portion, and a recording / playback device. A wiring layer 103 that electrically connects the element mounting region 101 and the external circuit board connection region 102 is provided. In addition, one of the wiring layers 103 in FIG. 1A is a write wiring layer, and the other is a read wiring layer.

  Further, as shown in FIG. 1B, the suspension substrate 100 is formed on the metal supporting substrate 1, the first insulating layer 2 formed on the metal supporting substrate 1, and the first insulating layer 2. The first wiring layer 3, the second insulating layer 4 formed on the first wiring layer 3, the second wiring layer 5 formed on the second insulating layer 4, and the second wiring layer 5 are covered. And a cover layer 6 formed. A pair of wiring layers is formed by laminating the first wiring layer 3 and the second wiring layer 5 via the second insulating layer 4. In addition, from the viewpoint of improving the high frequency characteristics (signal attenuation), it is preferable that the metal supporting substrate 1 under the first wiring layer 3 and the second wiring layer 5 is removed.

  FIG. 2 is a schematic plan view showing an example of the periphery of the via portion in the present invention. FIG. 2A shows a state before the via portion is formed, and FIG. 2B shows a state after the via portion is formed. In FIGS. 2A and 2B, the description of the insulating layer and the cover layer is omitted for convenience. FIG. 3 is a cross-sectional view taken along the line AA in FIG. As shown in FIGS. 2A, 2B, and 3, the suspension board of the present invention includes a first ground wiring portion 3a made of the same material as the first wiring layer, and a second wiring layer. And a second ground wiring portion 5a made of the same material. In addition, the first ground wiring portion 3 a and the second ground wiring portion 5 a are electrically connected to the metal support substrate 1 through via portions 7 that penetrate the first insulating layer 2.

  According to the present invention, since the first ground wiring portion and the second ground wiring portion are electrically connected to the metal support substrate by the common via portion, the suspension capable of grounding in a small area. Substrate.

In addition, as described in the first to third embodiments described later, when the first ground wiring portion and the second ground wiring portion are connected to the metal support substrate by the same via portion, There are such advantages. First, there is an advantage that the amount of use of the material of the via part (for example, plated metal) can be reduced and the cost can be reduced. Furthermore, there is an advantage that the process is simplified as compared with the case where separate via portions are formed in the two ground wiring layers. Furthermore, there is an advantage that process stability is improved as compared with the case where separate via portions are formed in two ground wiring layers. Here, when separate via portions are formed in the two ground wiring layers, different sizes and shapes may be unavoidable in design, and management of plating conditions and the like may be difficult. On the other hand, when the first ground wiring portion and the second ground wiring portion are connected to the metal support substrate by the same via portion, the management of the plating conditions and the like is facilitated, and the process stability is improved. There is an advantage. Further, since the first ground wiring portion and the second ground wiring portion are connected to the metal support substrate by a single via portion, there is an advantage that the electrical stability of the via portion is high.
Hereinafter, the suspension substrate of the present invention will be described separately for the suspension substrate member and the suspension substrate configuration.

1. First, members of the suspension substrate of the present invention will be described. The suspension substrate of the present invention has at least a metal support substrate, a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer.

  The metal support substrate in the present invention functions as a support for the suspension substrate. The material of the metal support substrate is preferably a metal having a spring property, and specific examples include stainless steel. Moreover, although the thickness of a metal support substrate changes with kinds of the material, it exists in the range of 10 micrometers-20 micrometers, for example.

  The first insulating layer in the present invention is formed on a metal support substrate. The material of the first insulating layer is not particularly limited as long as it has insulating properties, and examples thereof include a resin. Examples of the resin include polyimide resin, polybenzoxazole resin, polybenzimidazole resin, acrylic resin, polyether nitrile resin, polyether sulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, and polyvinyl chloride resin. Of these, polyimide resin is preferred. It is because it is excellent in insulation, heat resistance and chemical resistance. The material of the first insulating layer may be a photosensitive material or a non-photosensitive material. The thickness of the first insulating layer is, for example, preferably in the range of 5 μm to 30 μm, more preferably in the range of 5 μm to 18 μm, and still more preferably in the range of 5 μm to 12 μm.

  The first wiring layer in the present invention is formed on the first insulating layer. The material of the first wiring layer is not particularly limited as long as it has conductivity, but for example, a metal can be used, and among these, copper (Cu) is preferable. The material of the first wiring layer may be rolled copper or electrolytic copper. The thickness of the first wiring layer is preferably in the range of 5 μm to 18 μm, for example, and more preferably in the range of 9 μm to 12 μm. Moreover, it is preferable that the wiring plating part is formed in the one part surface of a 1st wiring layer. This is because the first wiring layer can be prevented from being deteriorated (corrosion or the like) by providing the wiring plating portion. Among them, in the present invention, it is preferable that a wiring plating part is formed in a terminal part for connection with an element or an external circuit board. Although the kind of wiring plating part is not specifically limited, For example, Au plating, Ni plating, Ag plating etc. can be mentioned. Especially, in this invention, it is preferable that Ni plating and Au plating are formed from the surface side of the 1st wiring layer. The thickness of the wiring plating portion is, for example, in the range of 0.1 μm to 4 μm.

  The second insulating layer in the present invention is formed on the first wiring layer. The material of the second insulating layer is not particularly limited as long as it has an insulating property, but for example, the material described as the material of the first insulating layer can be used. Especially, it is preferable that the material of a 2nd insulating layer is a polyimide resin. The material of the second insulating layer may be a photosensitive material or a non-photosensitive material.

  The second wiring layer in the present invention is formed on the second insulating layer. The material of the second wiring layer is not particularly limited as long as it has conductivity. For example, the material described as the material of the first wiring layer can be used. Especially, it is preferable that the material of a 2nd wiring layer is copper (Cu). Moreover, since the preferable range of the dimension of a 2nd wiring layer is the same as the preferable range of the dimension of the 1st wiring layer mentioned above, description here is abbreviate | omitted. It is preferable that the wiring plating part mentioned above is formed in the terminal part of the second wiring layer.

  The suspension substrate of the present invention has a first wiring layer on the first insulating layer and a second wiring layer on the second insulating layer. In the present invention, wiring layers having an arbitrary function can be used as the first wiring layer and the second wiring layer. Specific examples of the first wiring layer and the second wiring layer include a write wiring layer, a read wiring layer, a heat assist wiring layer, an actuator wiring layer, a noise shield wiring layer, a power supply wiring layer, and a flight height control. Wiring layers for sensors, wiring layers for sensors, and the like.

  In the present invention, the cover layer is preferably formed so as to cover the second wiring layer. This is because by providing the cover layer, deterioration (corrosion or the like) of the second wiring layer can be prevented. Examples of the material of the cover layer include those described as the material of the first insulating layer described above, and among them, a polyimide resin is preferable. The material of the cover layer may be a photosensitive material or a non-photosensitive material.

2. Next, the configuration of the suspension substrate of the present invention will be described. The suspension substrate of the present invention includes a first ground wiring portion made of the same material as the first wiring layer, and a second ground wiring portion made of the same material as the second wiring layer. . The first ground wiring portion and the second ground wiring portion are not particularly limited as long as they are electrically connected to the metal support substrate and can function as a ground. Especially, it is preferable that the 1st ground wiring part and the 2nd ground wiring part are each connected with an element. This is because it is possible to prevent changes in characteristics and destruction of the element due to static electricity and to prevent malfunction of the element due to a change in reference potential. Specific examples of such an element include a recording / reproducing element, a thermal assist element, and an actuator element.

  The recording / reproducing element is not particularly limited as long as it can perform recording / reproducing. Among them, the recording / reproducing element in the present invention preferably has a magnetic generating element. Specifically, a magnetic head slider can be mentioned.

  The heat assisting element is not particularly limited as long as it can assist recording by the recording / reproducing element with heat. Among them, the heat assist element in the present invention is preferably an element using light. This is because heat-assisted recording by an optical dominant recording method can be performed. Examples of the heat assist element using light include a semiconductor laser diode element. The semiconductor laser diode element may be a pn-type element, or a pnp-type or npn-type element.

  The actuator element usually corresponds to a microactuator or a milliactuator. Examples of the actuator element include a piezo element. As the piezo element, for example, one made of PZT can be cited. By using the expansion / contraction response of the piezo element, positioning can be performed in submicron units. In addition, the piezoelectric element has advantages such as high energy efficiency, large load resistance, fast response, no wear deterioration, and no magnetic field. In the present invention, a single bipolar piezo element may be used. Two unipolar piezoelectric elements may be used.

  Thus, in the present invention, the combination of the elements connected to the first ground wiring section and the second ground wiring section is selected from the recording / reproducing element, the heat assist element, and the actuator element. It is preferable. In particular, in the present invention, it is preferable that the first ground wiring portion is a ground wiring layer of the thermal assist element, and the second ground wiring portion is a ground wiring layer of the recording / reproducing element. This is because it is easy to mount the thermal assist element on the metal support substrate side of the suspension substrate and mount the recording / reproducing element on the second wiring layer side.

  In the suspension substrate of the present invention, the first ground wiring portion and the second ground wiring portion are electrically connected to the metal support substrate through the via portion penetrating the first insulating layer. Is a major feature. Specific examples of such a suspension substrate will be described separately for the first to third embodiments.

(1) First Embodiment The suspension substrate of the first embodiment includes a pad portion in which each of the first ground wiring portion and the second ground wiring portion has an opening, and the first ground wiring. The via portion is formed in the opening portion of the first portion and the opening portion of the second ground wiring portion, and the via portion includes the pad portion of the first ground wiring portion and the pad portion of the second ground wiring portion. And a via portion having no material continuity.

  2 and 3 described above are schematic views for explaining the suspension substrate of the first embodiment. As shown in FIG. 2A, the first ground wiring portion 3 a includes a pad portion 32 having an opening 31, and the second ground wiring portion 5 a includes a pad portion 52 having an opening 51. Further, as shown in FIG. 3, a via portion 7 penetrating the first insulating layer 2 is formed in the opening portion of the first ground wiring portion 3a and the opening portion of the second ground wiring portion 5a.

  In the first embodiment, one feature is that the via portion is a pad portion of the first ground wiring portion and a pad portion of the second ground wiring portion, and a via portion having no material continuity. To do. “No material continuity” means that the materials themselves are different, that the same material has a different crystal size, or that there is another layer (for example, a sputtered film) at the boundary. When the via portion and the ground wiring layer are formed at the same time as in the second embodiment and the third embodiment to be described later, the material and crystal size of the via portion and the ground wiring layer are the same. It becomes a material continuous state. On the other hand, when the via material and the ground wiring layer material are different, or when the via portion is formed in the opening of the ground wiring layer in the subsequent process even if both materials are the same (for example, copper). Causes discontinuities at the interface between the two due to differences in material properties (material type, crystal size, etc.).

  The first ground wiring portion and the second ground wiring portion each include a pad portion having an opening. The shape of the opening is not particularly limited, and examples thereof include a circle, an ellipse, an arbitrary polygon, a comb, a cross, and a rod. Further, the shape of the pad part is not particularly limited, and examples thereof include a circle, an ellipse, an arbitrary polygon, a comb, a cross, and a bar. The pad portion refers to a region near the via portion in the ground wiring layer. In the first embodiment, normally, the opening of the first ground wiring portion and the opening of the second ground wiring portion are formed so as to overlap in plan view.

  Examples of the material for the via portion include nickel (Ni), silver (Ag), gold (Au), and copper (Cu). Among these, nickel (Ni) is preferable. This is because it is excellent in conductivity and corrosion resistance and is inexpensive. In particular, when the via portion is formed by electrolytic plating using nickel, examples of the electrolytic Ni plating bath used include a watt bath and a sulfamic acid bath. In addition, glossiness and a film | membrane stress can be adjusted by using an additive for these plating baths suitably.

  In the first embodiment, as shown in FIG. 4A, the pad portion of the second ground wiring portion 5a may be directly formed on the pad portion of the first ground wiring portion 3a. As shown in 4 (b), the second insulating layer 4 may exist between the pad portion of the second ground wiring portion 5a and the pad portion of the first ground wiring portion 3a. Of these, the former is preferred. This is because there is no second insulating layer between the two pad portions, and the thickness of the portion where the via is formed can be reduced. This is because by reducing the thickness of the portion where the via portion is formed, it becomes difficult to contact the via portion when the recording / reproducing element is mounted. The term “directly formed” means that there is no second insulating layer between the pad portion of the first ground wiring portion and the pad portion of the second ground wiring portion in the thickness direction. That means. Therefore, for example, even if a seed layer for forming the second ground wiring portion is formed between the two pad portions, the above-mentioned “directly formed” condition is satisfied.

  In FIG. 4A, the second ground wiring portion 5a and the via portion 7 are in contact with each other. On the other hand, in the first embodiment, as shown in FIG. 3, the cover layer 6 is formed inside the opening of the second ground wiring portion 5a, and the via portion 7 and the second ground wiring portion 5a are in contact with each other. Preferably not. This is because the height and shape of the via portion 7 can be easily controlled. Here, when the via portion 7 is formed by an electrolytic plating method using the metal support substrate 1 as a power feeding layer, the via portion 7 grown from the metal support substrate 1 comes into contact with the first ground wiring portion 3a. The second ground wiring portion 5a becomes conductive. Therefore, as shown in FIG. 4A, when the second ground wiring portion 5a is exposed from the cover layer 6, the plating grows on the entire exposed surface, and the height and shape of the via portion are controlled. Becomes difficult. On the other hand, as shown in FIG. 3, when the second ground wiring portion 5a is covered with the cover layer 6, the plating does not grow from the surface of the second ground wiring portion 5a, and the height of the via portion is increased. There is an advantage that the thickness and shape can be easily controlled. In FIG. 3, since the second ground wiring portion 5a is formed on the first ground wiring portion 3a, there is no problem in electrical connection.

In the first embodiment, as shown in FIGS. 3 and 4, it is preferable that the via portion 7 does not protrude from the cover layer 6 in the thickness direction. This is because if the via portion protrudes from the cover layer, the flatness of the element may be hindered. In the suspension substrate of the first embodiment, as shown in FIG. 5A, the second ground wiring portion 5a preferably has a thin portion 53 along the opening. This is because it becomes easy to form a via portion that does not protrude from the cover layer. As shown in FIG. 5 (a), when the thickness of the second ground wiring portion 5a T, the thickness of which is etched to form the thin portion 53 and T _1, the value of T 1 _{/ T} is, For example, it is in the range of 0.3 to 0.8, preferably in the range of 0.4 to 0.7, and more preferably in the range of 0.4 to 0.6. The value of _{T 1} is is different depending on the thickness of the second ground wiring portion 5a, for example in the range of 4Myuemu～10myuemu, preferably in the range of inter alia 5Myuemu～8myuemu. Moreover, as shown to Fig.5 (a), when the width | variety of the thin part 53 is set to W, the value of W exists in the range of 3 micrometers-30 micrometers, for example, and it is preferable that it exists in the range of 4 micrometers-20 micrometers. On the other hand, as shown in FIG. 5B, the suspension substrate of the first embodiment is preferably formed so that the cover layer 6 covers the thin portion 53 in plan view. This is because the protruding portion of the cover layer 6 functions as a lid, and it is easy to form a via portion that does not protrude from the cover layer. Assuming that the width of the protruding portion of the cover layer 6 is Z, the value of Z is, for example, 3 μm or more, and preferably in the range of 4 μm to 8 μm.

Further, as shown in FIG. 6, the size of the opening of the first ground wiring portion 3a and L _31, the size of the pad portion of the first ground wiring portion 3a and L _32, the second ground wiring portion 5a L ₃₁ is preferably in the range of 30 μm to 100 μm, for example, in the range of 50 μm to 70 μm, where L ₅₁ is the opening size and L ₅₂ is the size of the pad portion of the second ground wiring portion 5a. More preferably, it is within. This is because if L ₃₁ is too small, the adhesion between the via portion 7 and the metal support substrate 1 may be lowered, and if L ₃₁ is too large, grounding in a small area may not be possible. L ₃₂ is preferably in the range of 100 μm to 180 μm, for example, and more preferably in the range of 130 μm to 160 μm. L ₅₁ is preferably in the range of 70 μm to 130 μm, for example, and more preferably in the range of 90 μm to 110 μm. This is because if L ₅₁ is too small, the adhesiveness between the via portion 7 and the metal supporting board 1 may be lowered, and if L ₅₁ is too large, there is a possibility that a small area cannot be grounded. L ₅₂ is preferably in the range of 110 μm to 170 μm, for example, and more preferably in the range of 130 μm to 150 μm.

  Further, the via portion in the first embodiment is preferably formed in or near the recording / reproducing element mounting region. This is because the recording / reproducing element mounting area is concentrated with the wiring layers of the recording / reproducing elements and the heat assist elements, and a ground with a small area is particularly effective. The “recording / reproducing element mounting region” refers to a region of the suspension substrate that coincides with a region where the recording / reproducing element is mounted in a plan view. Further, the vicinity of the recording / reproducing element mounting area means an area within 1000 μm from the boundary of the recording / reproducing element mounting area where the element wiring layers are concentrated.

(2) Second Embodiment In the suspension substrate according to the second embodiment, the first ground wiring portion includes a pad portion having an opening, and the second ground wiring portion includes a pad portion. The via portion is formed in the opening of the ground wiring portion, and the via portion is a via portion having material continuity with the pad portion of the second ground wiring portion. is there.

  FIG. 7A is a schematic plan view illustrating the suspension substrate according to the second embodiment, and FIG. 7B is a cross-sectional view taken along line AA of FIG. As shown in FIGS. 7A and 7B, the first ground wiring portion 3a includes a pad portion 32 having an opening, and the first insulating layer is provided in the opening of the first ground wiring portion 3a. 2 is formed. Further, the second embodiment is characterized in that the via portion 7 is a via portion having material continuity with the pad portion of the second ground wiring portion 5a. “Having material continuity” means that material characteristics (material type, crystal size, etc.) are the same.

  In the second embodiment, as shown in FIG. 8A, the pad portion of the second ground wiring portion 5a may be directly formed on the pad portion of the first ground wiring portion 3a. As shown in FIG. 8B, the second insulating layer 4 may exist between the pad portion of the second ground wiring portion 5a and the pad portion of the first ground wiring portion 3a. Of these, the former is preferred. This is because the second insulating layer does not exist between the two pad portions, and the thickness of the portion where the via portion is formed can be reduced. Note that the definition of “directly formed” is the same as the content described in the first embodiment, and therefore the description thereof is omitted here.

Further, as shown in FIG. 6, the size of the opening of the first ground wiring portion 3a and L _31, the size of the pad portion of the first ground wiring portion 3a and L _32, the second ground wiring portion 5a When the size of the pad portion is L ₅₂ , L ₃₁ and L ₃₂ are the same as those described in the first embodiment. On the other hand, L ₅₂ is preferably in the range of 110 μm to 170 μm, for example, and more preferably in the range of 130 μm to 150 μm.

  In addition, since other matters of the suspension substrate of the second embodiment are the same as the contents described in the first embodiment described above, description thereof is omitted here.

(3) Third Embodiment In the suspension substrate of the third embodiment, the first ground wiring portion and the second ground wiring portion each include a pad portion, and the via portion is for the first ground. It is a via part having material continuity with the pad part of the wiring part.

  FIG. 10A is a schematic plan view for explaining the suspension substrate according to the third embodiment, and FIG. 10B is a cross-sectional view taken along line AA of FIG. As shown in FIGS. 10A and 10B, in the third embodiment, the via portion 7 is a via portion having material continuity with the pad portion of the first ground wiring portion 3a. One feature. “Having material continuity” means that material characteristics (material type, crystal size, etc.) are the same.

  In the third embodiment, as shown in FIG. 11A, the pad portion of the second ground wiring portion 5a may be directly formed on the pad portion of the first ground wiring portion 3a. As shown in FIG. 11B, the second insulating layer 4 may exist between the pad portion of the second ground wiring portion 5a and the pad portion of the first ground wiring portion 3a. Of these, the former is preferred. This is because the second insulating layer does not exist between the two pad portions, and the thickness of the portion where the via portion is formed can be reduced. Note that the definition of “directly formed” is the same as the content described in the first embodiment, and therefore the description thereof is omitted here. In FIG. 11B, a via portion penetrating the second insulating layer 4 is formed, and this via portion is a via portion having material continuity with the pad portion of the second ground wiring portion.

Further, as shown in FIG. 6, the size of the opening of the first ground wiring portion 3a and L _31, the size of the pad portion of the first ground wiring portion 3a and L _32, the second ground wiring portion 5a When the size of the pad portion is L ₅₂ , L ₃₁ , L ₃₂ , and L ₅₂ are the same as those described in the second embodiment.

  In addition, since other matters of the suspension substrate of the third embodiment are the same as the contents described in the first embodiment described above, description thereof is omitted here.

(4) Other Embodiments In the first to third embodiments described above, the first ground wiring portion and the second ground wiring portion are electrically connected to the metal support substrate by the same via portion. However, in the present invention, as shown in FIG. 13, the first via portion 7a for electrically connecting the metal support substrate 1 and the first ground wiring portion 3a, the first ground wiring portion 3a and the second ground. The second via portion 7b that electrically connects the wiring portion 5a may be provided separately. Even in this case, the first ground wiring portion and the second ground wiring portion are electrically connected to the metal support substrate by the common via portion (first via portion 7a in FIG. 13). A suspension substrate capable of grounding in area can be obtained. Further, by separating the position of the first via portion 7a to a region where the wiring layer is not concentrated, the ground area can be increased and a highly reliable ground can be performed. The first via portion may be a via portion not having material continuity with the first ground wiring portion, or may be a via portion having material continuity. Similarly, the second via portion may be a via portion not having material continuity with the second ground wiring portion, or may be a via portion having material continuity.

B. Suspension Next, the suspension of the present invention will be described. The suspension according to the present invention includes the suspension substrate described above and a load beam provided on the surface of the suspension substrate on the metal support substrate side.

  FIG. 14 is a schematic plan view showing an example of the suspension of the present invention. A suspension 300 shown in FIG. 14 includes the suspension substrate 100 described above and a load beam 200 provided on the surface of the suspension substrate 100 on the metal support substrate side.

  According to the present invention, a suspension capable of grounding in a small area can be obtained by using the suspension substrate described above.

  The suspension of the present invention has at least a suspension substrate and a load beam. The suspension substrate in the present invention is the same as the content described in the above “A. Suspension substrate”, and therefore description thereof is omitted here. On the other hand, the load beam in the present invention is provided on the surface of the suspension substrate on the metal support substrate side. Although the material of the load beam is not particularly limited, for example, a metal can be used, and stainless steel is preferable.

C. Next, the suspension with an element of the present invention will be described. A suspension with an element of the present invention includes the above-described suspension and a recording / reproducing element disposed on the suspension.

  FIG. 15 is a schematic plan view showing an example of the suspension with an element of the present invention. 15 includes the suspension 300 described above and the recording / reproducing element 301 mounted on the suspension 300 (recording / reproducing element mounting region 101 of the suspension substrate 100).

  According to the present invention, by using the above-described suspension, a suspension with an element capable of grounding in a small area can be obtained.

  The suspension with an element of the present invention includes at least a suspension and a recording / reproducing element. The suspension according to the present invention is the same as the content described in “B. Suspension” above, and thus the description thereof is omitted here. Furthermore, it is preferable that the suspension with an element of the present invention further includes at least one of a thermal assist element and an actuator element.

D. Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention has the above-described suspension with an element.

  FIG. 16 is a schematic plan view showing an example of the hard disk drive of the present invention. A hard disk drive 500 shown in FIG. 16 includes the above-described suspension 400 with an element, a disk 401 on which data is written and read by the suspension 400 with an element, a spindle motor 402 that rotates the disk 401, and an element of the suspension 400 with an element. Arm 403 and voice coil motor 404, and a case 405 for sealing the above members.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  The hard disk drive of the present invention has at least a suspension with an element, and usually further includes a disk, a spindle motor, an arm, and a voice coil motor. Since the suspension with an element is the same as the content described in “C. Suspension with an element”, description thereof is omitted here. As other members, the same members as those used in a general hard disk drive can be used.

E. Next, a method for manufacturing a suspension substrate according to the present invention will be described. The manufacturing method of the suspension substrate of the present invention includes a metal support substrate, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and the first A method for manufacturing a suspension substrate, comprising: a second insulating layer formed on a wiring layer; and a second wiring layer formed on the second insulating layer, wherein the first wiring layer and the first ground A first wiring layer forming step for simultaneously forming the wiring portion for the second wiring, a second wiring layer forming step for simultaneously forming the second wiring layer and the second wiring portion for the ground, the wiring portion for the first ground and the second wiring portion for the second. And a via portion forming step of electrically connecting the ground wiring portion to the metal supporting substrate and forming a via portion penetrating the first insulating layer.

  According to the present invention, a suspension substrate capable of grounding in a small area is formed by forming a via portion that electrically connects the first ground wiring portion and the second ground wiring portion to the metal support substrate. Can be obtained. The method for manufacturing a suspension substrate according to the present invention can be broadly divided into a manufacturing method using a subtractive method and a manufacturing method using an additive method.

  As a manufacturing method using the subtractive method, for example, a laminated member preparing step of preparing a laminated member in which a metal support member, an insulating member, and a conductor member are laminated in this order, etching the conductor member, A first wiring layer forming step for simultaneously forming a first ground wiring portion; a second insulating layer forming step for forming a second insulating layer on the first wiring layer; and a second wiring layer on the second insulating layer. A second wiring layer forming step for simultaneously forming a second ground wiring portion, a cover layer forming step for forming a cover layer so as to cover the second wiring layer, and etching the insulating member, The manufacturing method which has the 1st insulating layer formation process which forms one insulating layer, and the metal support substrate formation process which etches the said metal support member and forms a metal support substrate can be mentioned. In the subtractive method, when a via portion that does not have material continuity with the first ground wiring portion and the second ground wiring portion is formed, a plating step for forming the via portion is usually further performed. On the other hand, in the subtractive method, when the via portion having material continuity with the second ground wiring portion is formed, the via portion is usually formed when the second ground wiring portion is formed.

  On the other hand, as a manufacturing method using the additive method, for example, a metal support member preparing step of preparing a metal support member, a first insulating layer forming step of forming a first insulating layer on the metal support member, and the first A first wiring layer forming step of simultaneously forming a first wiring layer and a first ground wiring portion on the insulating layer; a second insulating layer forming step of forming a second insulating layer on the first wiring layer; A second wiring layer forming step of forming a second wiring layer on the two insulating layers and simultaneously forming a second ground wiring portion; and a cover layer forming step of forming a cover layer so as to cover the second wiring layer; And a metal support substrate forming step of etching the metal support member to form a metal support substrate. In the additive method, when forming a via portion having material continuity with the first ground wiring portion or the second ground wiring portion, usually, the first ground wiring portion or the second ground wiring portion respectively. A via portion is formed during formation. In addition, in the additive method, when forming a via portion that does not have material continuity with the first ground wiring portion and the second ground wiring portion, a plating step for forming the via portion may be further performed.

  In the method for manufacturing a suspension substrate according to the present invention, patterning in each step is performed according to the configuration of the target suspension substrate. Hereinafter, as a specific example of the method for manufacturing the suspension substrate of the present invention, a method for manufacturing the suspension substrate according to the first to third embodiments described in the above-mentioned “A. Suspension substrate” will be described.

1. First Embodiment FIG. 17 is a schematic cross-sectional view showing an example of a method for manufacturing a suspension substrate according to a first embodiment. FIG. 17 is a cross-sectional view corresponding to the AA cross-sectional view of FIG. In FIG. 17, first, a laminated member in which the metal supporting member 1A, the insulating member 2A, and the conductor member 3A are laminated in this order is prepared (FIG. 17A). Next, the conductive member 3A is patterned by wet etching to form a first wiring layer (not shown) and a first ground wiring portion 3a (FIG. 17B). Next, the second insulating layer 4 is formed (FIG. 17C). At this time, the second insulating layer 4 is formed so as to cover the first wiring layer (not shown), but in FIG. 17, the second ground wiring portion is directly formed on the first ground wiring portion 3a as described later. In order to form 5a, the second insulating layer 4 is patterned so that the second insulating layer 4 is not formed on the first ground wiring portion 3a.

  Thereafter, a seed layer 8 is formed on the surface on the second insulating layer 4 side by sputtering (FIG. 17D). Next, a resist pattern composed of a dry film resist is formed on the seed layer 8, and a second ground wiring portion 5 a is formed on the surface of the seed layer 8 exposed from the resist pattern (FIG. 17 ( e)). At this time, a second wiring layer (not shown) is also formed at the same time. Next, the unnecessary seed layer 8 is removed (FIG. 17F), and the cover layer 6 is formed so as to cover the second ground wiring portion 5a (FIG. 17G). Next, the insulating member 2A is patterned by wet etching to form the first insulating layer 2 (FIG. 17H). Next, the via portion 7 is formed by growing the plating by feeding from the metal support member 1A, and the metal support substrate 1 is formed by patterning the metal support member 1A by wet etching (FIG. 17 (i)). ). Thereby, a suspension substrate is obtained.

2. Second Embodiment FIG. 18 is a schematic cross-sectional view showing an example of a method for manufacturing a suspension substrate according to a second embodiment. FIG. 18 is a cross-sectional view corresponding to the AA cross-sectional view of FIG. 7A as in FIG. 7B. In FIG. 18, first, a laminated member in which the metal supporting member 1A, the insulating member 2A, and the conductor member 3A are laminated in this order is prepared (FIG. 18A). Next, the conductive member 3A is patterned by wet etching to form a first wiring layer (not shown) and a first ground wiring portion 3a (FIG. 18B). Next, the second insulating layer 4 is formed (FIG. 18C). At this time, the second insulating layer 4 is formed so as to cover the first wiring layer (not shown). However, in FIG. 18, the second ground wiring portion is directly on the first ground wiring portion 3a as described later. In order to form 5a, the second insulating layer 4 is patterned so that the second insulating layer 4 is not formed on the first ground wiring portion 3a.

  Thereafter, the insulating member 2A is patterned by wet etching to form the first insulating layer 2 (FIG. 18D). Next, the seed layer 8 is formed on the surface on the second insulating layer 4 side by sputtering (FIG. 18E). Next, a resist pattern composed of a dry film resist is formed on the seed layer 8, and the via portion 7 and the second ground wiring portion 5 a are formed on the surface of the seed layer 8 exposed from the resist pattern. (FIG. 18 (f)). At this time, a second wiring layer (not shown) is also formed at the same time. Next, the unnecessary seed layer 8 is removed (FIG. 18G), the cover layer 6 is formed so as to cover the second ground wiring portion 5a, and the metal support member 1A is patterned by wet etching. A metal support substrate 1 is formed (FIG. 18H). Thereby, a suspension substrate is obtained.

3. Third Embodiment FIG. 19 is a schematic cross-sectional view showing an example of a method for manufacturing a suspension substrate according to a third embodiment. Note that FIG. 19 is a cross-sectional view corresponding to the AA cross-sectional view of FIG. 10A in the same manner as FIG. In FIG. 19, first, a metal supporting member 1A is prepared (FIG. 19 (a)). Next, the first insulating layer 2 is formed on the metal support member 1A (FIG. 19B). Next, the seed layer 8 is formed on the surface on the first insulating layer 2 side by sputtering (FIG. 19C). Next, a resist pattern composed of a dry film resist is formed on the seed layer 8, and the via portion 7 and the first ground wiring portion 3a are formed on the surface of the seed layer 8 exposed from the resist pattern. (FIG. 19 (d)). At this time, a first wiring layer (not shown) is also formed at the same time.

  Next, the unnecessary seed layer 8 is removed (FIG. 19E), and the second insulating layer 4 is formed (FIG. 19F). At this time, the second insulating layer 4 is formed so as to cover the first wiring layer (not shown), but in FIG. 19, the second ground wiring portion is directly formed on the first ground wiring portion 3a as described later. In order to form 5a, the second insulating layer 4 is patterned so that the second insulating layer 4 is not formed on the first ground wiring portion 3a. Next, the seed layer 8 is formed on the surface on the second insulating layer 4 side by sputtering (FIG. 19G). Next, a resist pattern composed of a dry film resist is formed on the seed layer 8, and a second ground wiring portion 5 a is formed on the surface of the seed layer 8 exposed from the resist pattern (FIG. 19 ( h)). At this time, a second wiring layer (not shown) is also formed at the same time. Next, the unnecessary seed layer 8 is removed (FIG. 19 (i)), the cover layer 6 is formed so as to cover the second ground wiring portion 5a, and the metal support member 1A is patterned by wet etching. The metal support substrate 1 is formed (FIG. 19 (j)). Thereby, a suspension substrate is obtained.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples.

[Example 1]
First, a laminated member having SUS304 (metal support member) having a thickness of 18 μm, a polyimide resin layer (insulating member) having a thickness of 10 μm, and an electrolytic copper layer (conductor member) having a thickness of 9 μm was prepared (FIG. 17A). . Next, a dry film resist was laminated on both surfaces of the laminated member to form a resist pattern. Next, etching was performed using a ferric chloride solution, and a resist film was removed after the etching. Thus, a first wiring layer (not shown) and a first ground wiring portion were formed from the conductor member (FIG. 17B). A jig hole was formed in the metal support member.

  Thereafter, a polyimide precursor solution was coated on the patterned first wiring layer with a die coater. After drying, resist plate-making is performed, and the polyimide precursor film is etched simultaneously with development, and then cured (imidized) by heating in a nitrogen atmosphere to form a second insulating layer (FIG. 17C). Next, a seed layer made of Cr was formed on the surface of the second insulating layer side by a sputtering method (FIG. 17D). Next, a predetermined resist pattern was formed on the seed layer, and a second wiring layer (not shown) and a second ground wiring portion were formed by electrolytic copper plating on a portion exposed from the resist pattern ( FIG. 17 (e)). Thereafter, an unnecessary seed layer was removed (FIG. 17F).

  Thereafter, a polyimide precursor solution was coated on the patterned second ground wiring portion with a die coater. After drying, resist plate-making was performed, and the polyimide precursor film was etched simultaneously with development, and then cured (imidized) by heating in a nitrogen atmosphere to form a cover layer (FIG. 17G). Next, in order to pattern the insulating member, resist plate-making was performed, and the exposed polyimide resin was removed by wet etching (FIG. 17H). Next, a via part was formed by growing the plating by feeding from a metal support member using a nickel sulfamate plating bath (FIG. 17 (i)). Finally, an unnecessary metal support member was removed by wet etching to obtain a suspension substrate.

[Example 2]
First, a laminated member having SUS304 (metal support member) having a thickness of 18 μm, a polyimide resin layer (insulating member) having a thickness of 10 μm, and an electrolytic copper layer (conductor member) having a thickness of 9 μm was prepared (FIG. 18A). . Next, a dry film resist was laminated on both surfaces of the laminated member to form a resist pattern. Next, etching was performed using a ferric chloride solution, and a resist film was removed after the etching. Thus, a first wiring layer (not shown) and a first ground wiring portion were formed from the conductor member (FIG. 18B). A jig hole was formed in the metal support member.

  Thereafter, a polyimide precursor solution was coated on the patterned first wiring layer with a die coater. After drying, resist engraving was performed and the polyimide precursor film was etched simultaneously with development, and then cured (imidized) by heating in a nitrogen atmosphere to form a second insulating layer (FIG. 18C). Next, in order to pattern the insulating member, resist plate-making was performed, and the exposed polyimide resin was removed by wet etching (FIG. 18D). Next, a seed layer made of Cr was formed on the surface on the second insulating layer side by sputtering (FIG. 18E). Next, a predetermined resist pattern is formed on the seed layer, and a second wiring layer (not shown), a via portion and a second ground wiring portion are formed on the portion exposed from the resist pattern by electrolytic copper plating. It formed (FIG.18 (f)). Thereafter, an unnecessary seed layer was removed (FIG. 18 (g)).

  Thereafter, a polyimide precursor solution was coated on the patterned second ground wiring portion with a die coater. After drying, resist plate-making is performed, and the polyimide precursor film is etched simultaneously with development, and then cured (imidized) by heating in a nitrogen atmosphere to form a cover layer (FIG. 18 (h)). Finally, an unnecessary metal support member was removed by wet etching to obtain a suspension substrate.

[Example 3]
A metal support member made of SUS304 having a thickness of 18 μm was prepared (FIG. 19A). A photosensitive polyimide precursor was applied to a metal support member, dried, and then exposed to a desired pattern shape through a mask using a high-pressure mercury lamp as a light source at an exposure amount of 500 to 2000 mJ / cm ² . Thereafter, heating is performed under such conditions that the maximum temperature reaches 160 ° C. to 190 ° C. and the maximum temperature holding time is within a range of 0.1 minutes to 60 minutes, and development is performed with an alkaline aqueous solution. The pattern image of was formed. Then, it heated in nitrogen atmosphere and formed the 1st insulating layer (FIG.19 (b)).

  Next, a seed layer made of Cr was formed on the surface on the first insulating layer side by a sputtering method (FIG. 19C). Next, a predetermined resist pattern is formed on the seed layer, and a first wiring layer (not shown), a via portion, and a first ground wiring portion are formed on the portion exposed from the resist pattern by electrolytic copper plating. It formed (FIG.19 (d)). Thereafter, an unnecessary seed layer was removed (FIG. 19E).

  Thereafter, a polyimide precursor solution was coated on the patterned first wiring layer with a die coater. After drying, resist plate-making was performed, and the polyimide precursor film was etched simultaneously with development, and then cured (imidized) by heating in a nitrogen atmosphere to form a second insulating layer (FIG. 19F). Next, a seed layer made of Cr was formed on the surface of the second insulating layer side by a sputtering method (FIG. 19G). Next, a predetermined resist pattern was formed on the seed layer, and a second wiring layer (not shown) and a second ground wiring portion were formed by electrolytic copper plating on a portion exposed from the resist pattern ( FIG. 19 (h)). Thereafter, an unnecessary seed layer was removed (FIG. 19 (i)).

  Thereafter, a polyimide precursor solution was coated on the patterned second ground wiring portion with a die coater. After drying, resist engraving was performed and the polyimide precursor film was etched simultaneously with development, and then cured (imidized) by heating in a nitrogen atmosphere to form a cover layer (FIG. 19 (j)). Finally, an unnecessary metal support member was removed by wet etching to obtain a suspension substrate.

  DESCRIPTION OF SYMBOLS 1 ... Metal support board | substrate, 2 ... 1st insulating layer, 3 ... 1st wiring layer, 3a ... 1st ground wiring part, 4 ... 2nd insulating layer, 5 ... 2nd wiring layer, 5a ... 2nd ground wiring , 6 ... cover layer, 7 ... via portion, 8 ... seed layer, 31 ... opening, 32 ... pad portion, 51 ... opening portion, 52 ... pad portion, 53 ... thin wall portion, 100 ... suspension substrate, 101 ... Element mounting area for recording / reproducing, 102 ... External circuit board connection area, 103 ... Wiring layer

Claims (11)

A metal support substrate, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and a second insulating layer formed on the first wiring layer A suspension substrate having a second wiring layer formed on the second insulating layer,
A first ground wiring portion made of the same material as the first wiring layer, and a second ground wiring portion made of the same material as the second wiring layer are formed,
The first ground wiring portion and the second ground wiring portion are electrically connected to the metal support substrate through via portions penetrating the first insulating layer. substrate. The first ground wiring portion and the second ground wiring portion each include a pad portion having an opening,
The via portion is formed in the opening of the first ground wiring portion and the opening of the second ground wiring portion,
The via portion is a via portion having no material continuity with the pad portion of the first ground wiring portion and the pad portion of the second ground wiring portion. Suspension board. The first ground wiring portion includes a pad portion having an opening, and the second ground wiring portion includes a pad portion,
The via portion is formed in the opening of the first ground wiring portion,
The suspension substrate according to claim 1, wherein the via portion is a via portion having material continuity with the pad portion of the second ground wiring portion. The first ground wiring portion and the second ground wiring portion each include a pad portion,
The suspension substrate according to claim 1, wherein the via portion is a via portion having material continuity with the pad portion of the first ground wiring portion.   The pad portion of the second ground wiring portion is formed directly on the pad portion of the first ground wiring portion. 5. Suspension board. The pad portion of the second ground wiring portion is directly formed on the pad portion of the first ground wiring portion,
A cover layer is formed inside the opening of the second ground wiring portion;
The suspension substrate according to claim 2, wherein the via portion and the second ground wiring portion are not in contact with each other. The first ground wiring portion is a ground wiring layer of a thermal assist element,
The suspension substrate according to any one of claims 1 to 6, wherein the second ground wiring portion is a ground wiring layer of a recording / reproducing element.   A suspension comprising the suspension substrate according to any one of claims 1 to 7 and a load beam provided on a surface of the suspension substrate on the metal support substrate side. .   9. A suspension with an element, comprising: the suspension according to claim 8; and a recording / reproducing element disposed on the suspension.   A hard disk drive comprising the suspension with an element according to claim 9. A metal support substrate, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and a second insulating layer formed on the first wiring layer And a second wiring layer formed on the second insulating layer, and a manufacturing method of a suspension substrate,
A first wiring layer forming step of simultaneously forming the first wiring layer and the first ground wiring portion;
A second wiring layer forming step for simultaneously forming the second wiring layer and the second ground wiring portion;
A via portion forming step of electrically connecting the first ground wiring portion and the second ground wiring portion to the metal support substrate and forming a via portion penetrating the first insulating layer;
A method for manufacturing a suspension substrate, comprising:

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