JP2013084332A - Suspension substrate, suspension, suspension with element, hard disk drive, and method for manufacturing suspension substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a suspension substrate capable of preventing adverse effect caused by protrusion of a via from a wiring layer and reducing the diameter of the via.SOLUTION: The suspension substrate according to the present invention comprises a metal support substrate being a stainless steel, an insulating layer, and a wiring layer superposed in this order. In an opening part of the insulating layer, an adhesion layer, a via layer, and the wiring layer are formed on the surface of the metal support substrate in this order. The adhesion layer is formed on the surface of the metal support substrate, and comprises a first adhesion layer including Ni or Cu, and a second adhesion layer formed on the surface of the first adhesion layer and including metal and is formed not to protrude from the insulating layer. The wiring layer is formed to cover the via layer, and the via layer is prevented from protruding from the wiring layer.

Description

  The present invention relates to a suspension substrate that can prevent adverse effects due to protrusion of a via from a wiring layer and can reduce the diameter of the via.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed, and along with this, the capacity of hard disk drives (HDD) incorporated in personal computers has increased. Increasing information transmission speed is required. A suspension substrate (flexure) used in an HDD generally has a basic structure in which a metal support substrate (for example, stainless steel), an insulating layer (for example, polyimide resin), and a wiring layer (for example, copper) are laminated in this order.

  The metal support substrate normally imparts spring properties to the suspension substrate, but it is known to provide a function as a ground of the wiring layer in addition to the function as a spring. For example, in Patent Document 1, a magnetic head in which a metal pad (wiring layer) and a thin metal plate (metal support substrate) are electrically connected through a conductive portion (via) made of metal plating through an insulating layer. A suspension is disclosed. Patent Document 2 discloses a printed circuit board having a conductor pattern (wiring layer) extending so as to be in contact with a conductive substrate (metal supporting board) in a through hole. Furthermore, Patent Document 3 discloses a method for manufacturing a suspension board with circuit, which includes a step of forming a metal filling layer (via) in a base opening so that a ground wiring and a metal support substrate are conductive.

JP 2006-202359 A JP 2007-115864 A JP 2007-58967 A

  For example, as shown in FIG. 2 of Patent Document 1, if the conductive portion 9 (via) is formed so as to protrude from the metal layer 7 (wiring layer), there are the following problems. For example, when the position of the via overlaps with a region where an element such as a magnetic head slider is mounted in plan view, the protruding via may possibly hinder the flatness of the element. In addition, when the via protrudes from the wiring layer, it may be difficult to control the shape of the portion spread on the plane due to the protrusion, which may adversely affect the wiring layer or the like existing in the vicinity. These adverse effects can also occur when the metal filling layer 7 (via) protrudes from the ground wiring 14 as shown in FIG. Therefore, it is necessary to prevent adverse effects caused by the protrusion of the via. On the other hand, the number of wiring layers required for the suspension board is increasing with the higher functionality of the HDD, and it is necessary to reduce the diameter of the via.

  The present invention has been made in view of the above circumstances, and it is a main object of the present invention to provide a suspension substrate that can prevent adverse effects due to protrusion of a via from a wiring layer and can reduce the diameter of the via. And

  In order to solve the above problems, in the present invention, a suspension comprising a metal support substrate made of stainless steel, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer. An adhesion layer, a via layer, and the wiring layer are formed in this order on the surface of the metal support substrate in the opening of the insulating layer, and the adhesion layer is formed on the surface of the metal support substrate. Formed of a first adhesion layer containing Ni or Cu and a second adhesion layer formed on the surface of the first adhesion layer and containing a metal so as not to protrude from the insulating layer The wiring layer is formed so as to cover the via layer, and the via layer does not protrude from the wiring layer.

  According to the present invention, since the via layer does not protrude from the wiring layer, adverse effects due to the protrusion of the via layer can be prevented. Furthermore, according to the present invention, since the specific adhesion layer is provided between the via layer and the metal support substrate, the adhesion can be improved and the via layer can be reduced in diameter. As described above, the suspension substrate of the present invention can prevent the adverse effects caused by the protrusion of the via layer and can reduce the diameter of the via layer.

  In the said invention, it is preferable that said 1st contact | adherence layer is a strike plating layer. The strike plating layer can form a first adhesion layer by removing the passivation film on the surface of the metal support substrate that has been pre-processed for plating formation, for example, and has an adhesion to the metal support substrate (stainless steel). It is because it becomes favorable.

  In the said invention, it is preferable that said 2nd contact | adherence layer contains Ni or Cu. It is because it can be set as the 2nd contact | adherence layer with favorable adhesiveness with a 1st contact | adherence layer.

  In the above invention, the via layer is preferably a plating layer or a metal fine particle-containing layer. This is because a via layer having good electrical characteristics can be obtained and can be manufactured by a method with high productivity.

  In the above invention, the second adhesion layer and the via layer are preferably the same layer. This is because the manufacturing process can be simplified.

  In the above invention, the via layer and the wiring layer are preferably the same layer. This is because the manufacturing process can be simplified.

  Further, in the present invention, a suspension substrate having a metal support substrate made of stainless steel, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer, On the surface of the metal support substrate in the opening of the insulating layer, the first adhesion layer and the wiring layer are formed in this order, the first adhesion layer is a strike plating layer containing Ni or Cu, The suspension substrate is characterized in that the wiring layer in the opening does not protrude from the wiring layer around the opening.

  According to the present invention, since the wiring layer in the opening does not protrude from the surrounding wiring layer, it is possible to prevent the adverse effect caused by the protrusion of the via portion (wiring layer formed in the opening of the insulating layer). Furthermore, according to the present invention, since the specific adhesion layer is provided between the wiring layer and the metal support substrate, the adhesion can be improved and the diameter of the via portion can be reduced.

  In the present invention, a metal support substrate made of stainless steel, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and the first A suspension substrate having a second insulating layer formed on the wiring layer and a second wiring layer formed on the second insulating layer, wherein the metal support in the opening of the first insulating layer An adhesion layer, a via layer, and the second wiring layer are formed in this order on the surface of the substrate, and the adhesion layer is formed on the surface of the metal support substrate and contains a first adhesion layer containing Ni or Cu. And a second adhesion layer that is formed on the surface of the first adhesion layer and contains a metal, and is formed so as not to protrude from the second insulating layer. The via layer is formed so as to cover the via layer, and the via layer is formed on the second wiring. Providing suspension substrate, characterized in that does not protrude from.

  According to the present invention, since the via layer does not protrude from the second wiring layer, it is possible to prevent an adverse effect caused by the protrusion of the via layer. Furthermore, according to the present invention, since the specific adhesion layer is provided between the via layer and the metal support substrate, the adhesion can be improved and the via layer can be reduced in diameter.

  In the present invention, a metal support substrate made of stainless steel, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and the first A suspension substrate having a second insulating layer formed on the wiring layer and a second wiring layer formed on the second insulating layer, wherein the metal support in the opening of the first insulating layer A first adhesion layer and the second wiring layer are formed in this order on the surface of the substrate, and the first adhesion layer is a strike plating layer containing Ni or Cu, and the second wiring in the opening The layer provides a suspension substrate, wherein the layer does not protrude from the second wiring layer around the opening.

  According to the present invention, since the second wiring layer in the opening does not protrude from the surrounding second wiring layer, the via portion (the second wiring layer formed in the opening of the first insulating layer and the second insulating layer) ) Can be avoided. Furthermore, according to the present invention, since the specific adhesion layer is provided between the second wiring layer and the metal support substrate, the adhesion can be improved and the diameter of the via portion can be reduced.

  The present invention also provides a suspension comprising the above-described suspension substrate and a load beam provided on the surface of the suspension substrate on the metal support substrate side.

  According to the present invention, by using the suspension substrate described above, it is possible to provide a suspension that can prevent the adverse effects caused by the protrusion of the via and can reduce the diameter of the via.

  The present invention also provides an element-equipped suspension comprising the above-described suspension and a recording / reproducing element disposed on the suspension.

  According to the present invention, by using the above-described suspension, it is possible to provide a suspension with an element that can prevent adverse effects due to the protrusion of the via and can reduce the diameter of the via.

  The present invention also provides a hard disk drive having the above-described suspension with an element.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  According to the present invention, there is provided a method for manufacturing a suspension substrate having a metal support substrate made of stainless steel, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer. An insulating layer forming step for forming the insulating layer having an opening, a first adhesive layer containing Ni or Cu in the opening of the insulating layer, and formed on the surface of the first adhesive layer An adhesive layer forming step of forming an adhesive layer that does not protrude from the insulating layer, and a via layer forming step of forming a via layer on the adhesive layer; And a wiring layer forming step of forming a wiring layer covering the via layer, and the method of manufacturing a suspension substrate, characterized in that the via layer does not protrude from the wiring layer.

  According to the present invention, since the via layer does not protrude from the wiring layer, adverse effects due to the protrusion of the via layer can be prevented. Furthermore, according to the present invention, since the specific adhesion layer is formed between the via layer and the metal support substrate, the adhesion is improved and the diameter of the via layer can be reduced. In this manner, a suspension substrate can be obtained in which the adverse effects due to the protrusion of the via layer can be prevented and the diameter of the via layer can be reduced.

  In the said invention, it is preferable to form said 1st contact | adherence layer by strike plating method. This is because by using the strike plating method, it is possible to obtain a first adhesion layer having good adhesion to the metal support substrate.

  In the said invention, it is preferable to form said 2nd contact | adherence layer by the plating method. This is because a second adhesion layer having good adhesion to the first adhesion layer can be obtained.

  In the above invention, the via layer is preferably formed by a plating method or a printing method. This is because a via layer having good electrical characteristics can be manufactured by a method with high productivity.

  According to the present invention, there is provided a method for manufacturing a suspension substrate having a metal support substrate made of stainless steel, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer. An insulating layer forming step for forming the insulating layer having an opening, and an adhesion layer forming step for forming a first adhesive layer that is a strike plating layer containing Ni or Cu in the opening of the insulating layer. And a wiring layer forming step of forming the wiring layer on the first adhesion layer, wherein the wiring layer in the opening is not protruded from the wiring layer around the opening. A method for manufacturing a suspension substrate is provided.

  According to the present invention, since the wiring layer in the opening does not protrude from the surrounding wiring layer, it is possible to prevent the adverse effect caused by the protrusion of the via portion (wiring layer formed in the opening of the insulating layer). Furthermore, according to the present invention, since the specific adhesion layer is formed between the wiring layer and the metal support substrate, the adhesion is improved and the diameter of the via portion can be reduced.

  In the present invention, a metal support substrate made of stainless steel, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and the first A method for manufacturing a suspension substrate, comprising: a second insulating layer formed on a wiring layer; and a second wiring layer formed on the second insulating layer, wherein the first insulating layer has an opening. Forming a first insulating layer, forming a first adhesive layer containing Ni or Cu in the opening of the first insulating layer, and forming a metal on the surface of the first adhesive layer. An adhesion layer forming step of forming an adhesion layer that is configured of a second adhesion layer and does not protrude from the second insulating layer; a via layer formation step of forming a via layer on the adhesion layer; and the via layer Forming a second wiring layer covering the second wiring layer forming step, and The A layer to provide a method for manufacturing a suspension substrate, characterized in that does not project from the second wiring layer.

  According to the present invention, since the via layer does not protrude from the second wiring layer, it is possible to prevent an adverse effect caused by the protrusion of the via layer. Furthermore, according to the present invention, since the specific adhesion layer is formed between the via layer and the metal support substrate, the adhesion is improved and the diameter of the via layer can be reduced.

  In the present invention, a metal support substrate made of stainless steel, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, and the first A suspension substrate having a second insulating layer formed on a wiring layer and a second wiring layer formed on the second insulating layer, wherein the first insulating layer having an opening is formed. A first insulating layer forming step, an adhesive layer forming step of forming a first adhesive layer, which is a strike plating layer containing Ni or Cu, in the opening of the first insulating layer; and on the first adhesive layer A second wiring layer forming step of forming the second wiring layer, wherein the second wiring layer in the opening is not protruded from the second wiring layer around the opening. A method for manufacturing a suspension substrate is provided.

  According to the present invention, since the second wiring layer in the opening does not protrude from the surrounding second wiring layer, the via portion (the second wiring layer formed in the opening of the first insulating layer and the second insulating layer) ) Can be avoided. Furthermore, according to the present invention, since the specific adhesion layer is formed between the second wiring layer and the metal support substrate, the adhesion can be improved and the diameter of the via portion can be reduced.

  The suspension substrate according to the present invention can prevent the adverse effects caused by the protrusion of the via and can reduce the diameter of the via.

It is a schematic diagram which shows an example of the board | substrate for suspensions of this invention. It is the enlarged view to which the element mounting area | region for recording / reproducing in Fig.1 (a) was expanded. It is AA sectional drawing of FIG. It is a schematic sectional drawing explaining the conventional via | veer. It is a schematic sectional drawing explaining the via layer etc. in this invention. It is a schematic sectional drawing explaining the via layer etc. in this invention. It is a schematic sectional drawing explaining the via layer etc. in this invention. It is a schematic sectional drawing explaining the via layer etc. in this invention. It is a schematic diagram explaining the wiring layer of an interleave structure. It is a schematic sectional drawing which shows the other example of the board | substrate for suspensions of this invention. It is a schematic sectional drawing which shows the other example of the board | substrate for suspensions of this invention. It is a schematic sectional drawing explaining the via layer etc. in this invention. It is a schematic sectional drawing explaining the via layer etc. in this invention. It is a schematic sectional drawing explaining the via layer etc. in this invention. It is a schematic sectional drawing explaining the via layer etc. in this invention. It is a schematic sectional drawing which shows the other example of the board | substrate for suspensions of this invention. It is a schematic plan view which shows an example of the suspension of this invention. It is a schematic plan view which shows an example of the suspension with an element of this invention. It is a schematic plan view which shows an example of the hard disk drive of this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the board | substrate for suspensions of this invention. It is a schematic sectional drawing which shows the other example of the manufacturing method of the board | substrate for suspensions of this invention. It is a schematic sectional drawing which shows the other example of the manufacturing method of the board | substrate for suspensions of this invention. It is a schematic sectional drawing which shows the other example of the manufacturing method of the board | substrate for suspensions of this invention.

  Hereinafter, the suspension substrate, suspension, suspension with element, hard disk drive, and manufacturing method of the suspension substrate of the present invention will be described in detail.

A. Suspension Substrate The suspension substrate of the present invention can be roughly divided into four embodiments. The suspension substrate of the present invention will be described by dividing it into a first embodiment to a fourth embodiment.

1. First Embodiment A suspension substrate according to a first embodiment includes a metal support substrate made of stainless steel, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer. A suspension substrate, wherein an adhesion layer, a via layer, and the wiring layer are formed in this order on the surface of the metal support substrate in the opening of the insulating layer, and the adhesion layer is formed on the surface of the metal support substrate. Formed on the surface of the first adhesion layer, formed on the surface of the first adhesion layer, and formed of a second adhesion layer containing metal, and does not protrude from the insulating layer. The wiring layer is formed so as to cover the via layer, and the via layer does not protrude from the wiring layer.

  FIG. 1 is a schematic diagram showing an example of a suspension substrate according to the first embodiment. FIG. 1A is a schematic plan view of a suspension substrate, and FIG. 1B is a cross-sectional view taken along line AA in FIG. In FIG. 1A, for convenience, the description of the cover layer and the insulating layer is omitted. A suspension substrate 100 shown in FIG. 1A includes a recording / reproducing element mounting region 101 formed at one tip portion, an external circuit board connection region 102 formed at the other tip portion, and a recording / playback device. A plurality of wiring layers 103a to 103d for electrically connecting the element mounting region 101 and the external circuit board connection region 102 are provided. The wiring layer 103a and the wiring layer 103b are a pair of wiring layers. Similarly, the wiring layer 103c and the wiring layer 103d are also a pair of wiring layers. One of these two wiring layers is a wiring layer for writing (for recording and writing), and the other is a wiring layer for reading (for reproduction and reading). On the other hand, as shown in FIG. 1B, the suspension substrate 100 includes a metal support substrate 1, an insulating layer 2 formed on the metal support substrate 1, and a wiring layer 3 formed on the insulating layer 2. And a cover layer 4 formed on the wiring layer 3.

FIG. 2 is an enlarged view of the recording / reproducing element mounting area in FIG. In FIG. 2, four wiring layers 103a to 103d are arranged up to the vicinity of the recording / reproducing element mounting region 101 and are electrically connected to a recording / reproducing element (not shown). In FIG. 2, a ground wiring layer 103e is provided for the purpose of grounding the recording / reproducing element. FIG. 3 is a cross-sectional view taken along the line AA of FIG. As shown in FIG. 3, in the first embodiment, the adhesion layer 5, the via layer 6, and the wiring layer 3 are formed in this order on the surface of the metal support substrate 1 in the opening of the insulating layer 2. The adhesion layer 5 is formed on the surface of the metal support substrate 1, and is formed on the surface of the first adhesion layer 5a containing Ni or Cu, and the second adhesion layer 5b formed on the surface of the first adhesion layer 5a and containing metal. And is formed so as not to protrude from the insulating layer 2. Furthermore, the wiring layer 3 is formed so as to cover the via layer 6. In the first embodiment, the via layer 6 does not protrude from the wiring layer 3, that is, the top portion T ₆ of the via layer 6 does not protrude from the top portion T ₃ of the wiring layer 3 (cover in the thickness direction). One feature is that it does not protrude toward the layer 4 side.

  According to the first embodiment, since the via layer does not protrude from the wiring layer, it is possible to prevent an adverse effect due to the protrusion of the via layer. Therefore, for example, there is an advantage that the flatness of the mounted element (recording / reproducing element such as a magnetic head slider) is not hindered. Further, for example, when the via layer does not protrude from the insulating layer, there is an advantage that the shape control of the via layer becomes easy and the wiring layer existing in the vicinity of the via layer is not adversely affected. Conventionally, as shown in FIG. 4, the via 11 protrudes from the wiring layer 3 and the cover layer 4 and does not have these advantages. Further, as shown in FIG. 4, conventionally, it is necessary to provide a land portion having an opening in the wiring layer. However, according to the first embodiment, the wiring layer is provided so as to cover the via layer. There is an advantage that the size can be reduced. The suspension substrate of the first embodiment usually has a shape in which the wiring layer in the opening does not protrude from the wiring layer around the opening.

Furthermore, according to the first embodiment, since the specific adhesion layer is provided between the via layer and the metal supporting substrate, the adhesion is improved and the diameter of the via layer can be reduced. The reason why the adhesion is improved is that there is nothing that inhibits the adhesion of a passive film or the like between the metal support substrate (stainless steel) and the first adhesion layer (layer containing Ni or Cu). it is conceivable that. As described above, the suspension substrate according to the first embodiment can prevent the adverse effect caused by the protrusion of the via layer and can reduce the diameter of the via layer. In addition, as described later, the via layer in the first embodiment is preferably in a state (blind via layer) completely covered with the wiring layer in plan view.
Hereinafter, the suspension substrate according to the first embodiment will be described separately for the suspension substrate member and the suspension substrate configuration.

(1) Suspension Board Member First, the suspension board member of the first embodiment will be described. The suspension substrate according to the first embodiment has at least a metal support substrate, an insulating layer, and a wiring layer. The adhesion layer and via layer in the first embodiment will be described in “(2) Configuration of Suspension Substrate”.

  The metal support substrate in the first embodiment functions as a support for the suspension substrate. Moreover, the metal supporting board in the first embodiment is stainless steel. The thickness of the metal support substrate varies depending on the type of the material, but is, for example, in the range of 10 to 20 μm.

  The insulating layer in the first embodiment is formed on the metal support substrate. The material of the insulating layer is not particularly limited as long as it has insulating properties, and examples thereof include a resin. Examples of the resin include polyimide resin, polybenzoxazole resin, polybenzimidazole resin, acrylic resin, polyether nitrile resin, polyether sulfone resin, polyethylene terephthalate resin, polyethylene naphthalate resin, and polyvinyl chloride resin. Of these, polyimide resin is preferred. It is because it is excellent in insulation, heat resistance and chemical resistance. In addition, the material of the insulating layer may be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer is, for example, preferably in the range of 5 μm to 30 μm, more preferably in the range of 5 μm to 18 μm, and still more preferably in the range of 5 μm to 12 μm.

  The wiring layer in the first embodiment is formed on the insulating layer. The material of the wiring layer is not particularly limited as long as it has conductivity, but for example, a metal can be cited, and copper (Cu) is particularly preferable. Moreover, the material of the wiring layer may be rolled copper or electrolytic copper. The thickness of the wiring layer is preferably in the range of 5 μm to 18 μm, for example, and more preferably in the range of 9 μm to 12 μm. Moreover, it is preferable that the protective plating part is formed in the one part surface of a wiring layer. This is because by providing the protective plating portion, the deterioration (corrosion and the like) of the wiring layer can be prevented. Among these, in the first embodiment, it is preferable that a protective plating portion is formed on a terminal portion that is connected to an element or an external circuit board. Although the kind of protective plating part is not specifically limited, For example, Au plating, Ni plating, Ag plating etc. can be mentioned. Among these, in the first embodiment, it is preferable that Ni plating and Au plating are formed from the wiring layer side. The thickness of the protective plating portion is, for example, in the range of 0.1 μm to 4 μm.

  Examples of the wiring layer in the first embodiment include a write wiring layer, a read wiring layer, a heat assist wiring layer, an actuator wiring layer, a ground wiring layer, a noise shield wiring layer, a power supply wiring layer, and a flight. A height control wiring layer, a sensor wiring layer, and the like can be given.

  In the first embodiment, the cover layer is preferably formed so as to cover the wiring layer. This is because providing the cover layer can prevent the deterioration (corrosion or the like) of the wiring layer. Examples of the material for the cover layer include those described above as the material for the insulating layer, and among them, a polyimide resin is preferable. The material of the cover layer may be a photosensitive material or a non-photosensitive material.

(2) Configuration of Suspension Substrate Next, the configuration of the suspension substrate of the first embodiment will be described. One feature of the suspension substrate of the first embodiment is that it has an adhesion layer, a via layer, and a wiring layer in this order on the surface of the metal support substrate in the opening of the insulating layer. The shape of the opening of the insulating layer is not particularly limited, and examples thereof include a circle, an ellipse, an arbitrary polygon, a comb, a cross, and a rod.

  The adhesion layer in the first embodiment is composed of a first adhesion layer and a second adhesion layer. The first adhesion layer is a layer formed on the surface of the metal support substrate and containing at least Ni or Cu. Examples of the material for the first adhesion layer include Ni, Cu, Ni alloy, Cu alloy, and the like. In addition, when a 1st contact | adherence layer contains Cu, in addition to the advantage that adhesiveness is high, there exists an advantage that an electrical resistance is low. In particular, the first adhesion layer in the first embodiment is preferably a strike plating layer. The strike plating layer can directly form the first adhesion layer by removing the passivation film on the surface of the metal support substrate that has been pretreated for plating formation, for example, and the adhesion to the metal support substrate (stainless steel). It is because it becomes favorable. Moreover, since the strike plating layer has an uneven shape, it has an advantage that adhesion is easily improved by an anchor effect. Moreover, it is preferable not to have a stainless steel passive film between the first adhesion layer and the metal support substrate in the first embodiment. The thickness of the first adhesion layer is preferably in the range of 50 nm to 500 nm, for example, and more preferably in the range of 100 nm to 400 nm.

  The second adhesion layer in the first embodiment is a layer formed on the surface of the first adhesion layer and containing a metal. The second adhesion layer is preferably not a strike plating layer as described above, but has a thickness that is a continuous film. The material of the second adhesion layer is not particularly limited as long as it is a metal, and examples thereof include Ni, Cu, and alloys containing at least one of these elements. For example, the thickness of the second adhesion layer is preferably 1/2 or less of the thickness of the insulating layer, and more preferably 1/3 or less of the thickness of the insulating layer. The thickness of the second adhesion layer is preferably in the range of 100 nm to 5 μm, for example, and more preferably in the range of 500 nm to 3 μm.

  The via layer in the first embodiment is formed on the adhesion layer. The material of the via layer is not particularly limited, and examples thereof include Cu, Ni, Ag, Sn, and alloys containing at least one of these elements. The via layer in the first embodiment is preferably a plating layer or a metal fine particle-containing layer. The plating layer can be formed by, for example, a plating method (preferably an electrolytic plating method), and the metal fine particle-containing layer can be formed by, for example, a printing method using a paste containing metal fine particles. The average particle diameter of the metal fine particles used for the paste is in the range of 10 nm to 5 μm, for example. For example, the thickness of the via layer is preferably equal to or less than the thickness of the insulating layer, and more preferably equal to or less than 2/3 of the thickness of the insulating layer. Further, the thickness of the via layer is, for example, preferably 0.5 μm or more, and more preferably 2 μm or more.

  The wiring layer in the first embodiment is usually formed so as to cover the via layer. The first embodiment is characterized in that the via layer does not protrude from the wiring layer. The conventional wiring layer has an opening for forming the via 11 as shown in FIG. On the other hand, since the wiring layer in the first embodiment is formed so as to cover the via layer, it usually does not have an opening. In addition, the wiring layer in the first embodiment may cover at least a part of the via layer in a plan view, but it preferably covers a larger part and preferably covers the via layer completely. . That is, it is preferable that the via layer is covered with the wiring layer and completely hidden (blind via layer) in plan view. This is because the protrusion of the via layer can be prevented and the diameter of the via layer can be reduced.

  The wiring layer in the first embodiment preferably has a seed layer on the contact surface with the insulating layer. Depending on the manufacturing process, the seed layer may be formed not only on the contact surface with the insulating layer but also on the contact surface with the via layer or the like in the opening of the insulating layer. When the seed layer is a sputtering film, examples of the material for the seed layer include Cr, Cr—Ni alloy, and Cu. On the other hand, when the seed layer is an electroless plating film, examples of the material for the seed layer include Ni. In this case, it is preferable that the catalyst is first adsorbed on the seed layer forming surface by a wet process and electroless plating is performed.

As shown in FIG. 5, the size of the via layer 6 (the size of the opening of the insulating layer 2) and L _6, the size of the wiring layer 3 to cover the via layer 6 and L _3. L ₆ is not particularly limited, for example, is preferably in the range of 5Myuemu～150myuemu, and more preferably in a range of 15Myuemu～80myuemu. This is because, within the above range, sufficient adhesion to the metal support substrate is ensured and a via layer having a small diameter can be obtained. L ₃ is not particularly limited, for example, is preferably in the range of 15Myuemu～200myuemu, and more preferably in a range of 20Myuemu～150myuemu.

Further, as shown in FIG. 6, the difference between the position T ₅ of the top of the contact layer 5 and the position T ₂ of the top of the insulating layer 2 and t _1, the position T ₂ and the via layer 6 on top of the insulating layer 2 Let t ₂ be the difference from the top position T ₆ . In the first embodiment, since the adhesion layer 5 is usually formed so as not to protrude from the insulating layer 2, t ₁ is usually 0 or more. In particular, as shown in FIG. 6, the via layer 6 is usually formed on the adhesion layer 5. Therefore, _{t 1} is, for example, 2μm or more, preferably in the range of 4Myuemu～12myuemu. In the first embodiment, the via layer and the insulating layer preferably have the same top position in the thickness direction (ie, are flush with each other). This is because the flatness of the wiring layer is ensured. “The positions of the tops in the thickness direction are equal” means that t ₂ is within ± 2 μm. As shown in FIG. 6, t ₂ when the insulating layer 2 protrudes from the via layer 6 is positive, and conversely, t ₂ when the via layer 6 protrudes from the insulating layer ₂ is negative. . Further, it is preferable that the via layer does not protrude more than the insulating layer. “The via layer does not protrude more than the insulating layer” refers to a state where t ₂ is larger than the value when flush.

  In the first embodiment, as shown in FIG. 7A, the second adhesion layer 5b and the via layer 6 may be the same layer. Since both layers are the same layer, the manufacturing process can be simplified. Here, “the second adhesion layer and the via layer are the same layer” means that both layers have material continuity. For example, when the second adhesion layer and the via layer are continuously formed by electrolytic plating, the materials and crystal sizes of the second adhesion layer and the via layer are the same, and both are in a material continuous state. . On the other hand, the second adhesion layer and the via layer in the first embodiment may be different layers. For example, when the materials of the second adhesion layer and the via layer are different, or when the via layer is formed as a separate process after the second adhesion layer is formed even if both materials are the same (for example, copper) , Discontinuities due to differences in material properties (material type, crystal size, etc.) occur at the interface between the two. This state can be said to be a state in which both layers do not have material continuity.

  Further, in the first embodiment, as shown in FIG. 7B, the via layer 6 and the wiring layer 3 may be the same layer. Since both layers are the same layer, the manufacturing process can be simplified. Since the definition of “same layer” is the same as the above-described content, description thereof is omitted here. Further, the via layer and the wiring layer in the first embodiment may be different layers.

  The use of the via layer in the first embodiment is not particularly limited as long as it electrically connects the wiring layer and the metal supporting board. The via layer in the first embodiment is preferably used for grounding applications, for example. Here, FIG. 8A shows an example of the ground wiring layer. The terminal portion 3a of the ground wiring layer is covered with the protective plating portion 7 and is the ground via the via layer 6 and the like. The metal support substrate 1 is connected. Other ground applications include the ground of a noise shielding wiring layer that suppresses noise between wiring layers.

  In addition, the via layer in the first embodiment may be used to connect the wiring layer and the metal support substrate that is the terminal portion. The terminal portion of the metal support substrate has higher mechanical strength than the terminal portion of the wiring layer, and can suppress deformation. Here, FIG. 8B shows an example of a metal supporting board as a terminal portion, and the wiring layer 3 is electrically connected to the terminal portion 1a through the via layer 6 and the like. This terminal part 1a can be used for connection with elements, such as a thermal assist element and an actuator element, for example.

In addition, the via layer in the first embodiment may be used to connect the wiring layer having the interleave structure and the metal support substrate that is the jumper portion. By adopting a wiring layer having an interleave structure, the impedance can be reduced. Here, a wiring layer having an interleave structure will be described with reference to FIG. FIG. 9A is a schematic plan view showing an example of a wiring layer having an interleave structure, and FIG. 9B is a schematic plan view of FIG. 9A observed from the metal support substrate side. ) Is an AA cross-sectional view of FIG. As shown in FIGS. 9A to 9C, the write wiring layer W _1a has a branch wiring layer W _1b , and W _1a and W _1b each have a via layer 6 that penetrates the insulating layer 2. The two via layers 6 are electrically connected by a jumper portion 1 b that is a part of the metal support substrate 1. Similarly, the write wiring layer W _2a also has a branch wiring layer W _2b , each of W _2a and W _2b has a via layer 6 penetrating the insulating layer 2, and the two via layers 6 are formed of a metal support substrate. 1 is electrically connected by a jumper portion 1b, which is a part of 1. As shown in FIG. 9A, the wiring layers (W _1a , W _1b ) belonging to the write wiring layer W ₁ and the wiring layers (W _2a , W _2b ) belonging to the write wiring layer W ₂ are Are alternately arranged.

  In the suspension substrate of the first embodiment, the wiring layer may be laminated via an insulating layer. This is because the suspension substrate can cope with an increase in the wiring layer. As such a suspension substrate, for example, as shown in FIG. 10A, a metal support substrate 1, a first insulating layer 2x, a first wiring layer 3x, a second insulating layer 2y, a second wiring layer 3y, and a cover. An example in which the layer 4 is laminated in this order can be mentioned. The first wiring layer 3x and the second wiring layer 3y are stacked via the second insulating layer 2y. In FIG. 10A, the first wiring layer 3x is formed on the via layer 6, and the via layer 6 does not protrude from the first wiring layer 3x. Therefore, the first wiring layer 3x is flat on the first wiring layer 3x. It is easy to form the second insulating layer 2y. Therefore, the second wiring layer 3y formed on the second insulating layer 2y can be formed in a stable shape, and thus the second wiring layer 3y can be formed on the via layer 6, so that the suspension substrate The degree of design freedom can be made high. Further, as shown in FIG. 10B, the second wiring layer 3y may be formed on the first wiring layer 3x which is the ground wiring layer.

2. Second Embodiment Next, a second embodiment of the suspension substrate of the present invention will be described. The suspension substrate of the second embodiment is a suspension substrate having a metal support substrate made of stainless steel, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer. The first adhesion layer and the wiring layer are formed in this order on the surface of the metal support substrate in the opening of the insulating layer, and the first adhesion layer is a strike plating layer containing Ni or Cu. The wiring layer in the opening does not protrude from the wiring layer around the opening.

FIG. 11 is a schematic cross-sectional view showing an example of the suspension substrate according to the second embodiment, and is a cross-sectional view taken along the line AA of FIG. As shown in FIG. 11, in the second embodiment, the first adhesion layer 5 a and the wiring layer 3 are formed in this order on the surface of the metal support substrate 1 in the opening of the insulating layer 2. The first adhesion layer 5a is a strike plating layer containing Ni or Cu. Furthermore, the wiring layer 3 is formed so as to cover the opening of the insulating layer 2. In the second embodiment, the wiring layer 3 in the opening does not protrude from the wiring layer 3 around the opening, that is, the top T _3A of the wiring layer 3 in the opening is the wiring layer 3 around the opening. not protrude from the top T _3B a (not overhang the cover layer 4 side in the thickness direction) as one of the features of. Note that the top T _3A of the wiring layer 3 in the opening refers to a portion of the wiring layer 3 that protrudes most toward the cover layer 4 in the opening of the insulating layer 2. Similarly, the top portion T _3B of the wiring layer 3 around the opening refers to the portion of the wiring layer 3 that protrudes most toward the cover layer 4 around the opening of the insulating layer 2. The periphery of the opening of the insulating layer 2 refers to a region from the end of the opening of the insulating layer 2 to the end when the opening size of the insulating layer 2 is doubled.

  According to the second embodiment, since the wiring layer in the opening does not protrude from the surrounding wiring layer, it is possible to prevent the adverse effect caused by the protrusion of the via portion (wiring layer formed in the opening of the insulating layer). Therefore, for example, there is an advantage that the flatness of the mounted element (recording / reproducing element such as a magnetic head slider) is not hindered. In addition, as shown in FIG. 4, conventionally, it is necessary to provide a land portion having an opening in the wiring layer. There is an advantage that the size of the land portion can be reduced.

  Furthermore, according to the second embodiment, since the specific first adhesion layer is provided between the wiring layer and the metal support substrate, the adhesion can be improved and the diameter of the via portion can be reduced. The reason why the adhesion is improved is that there is nothing that inhibits the adhesion of a passive film or the like between the metal support substrate (stainless steel) and the first adhesion layer (layer containing Ni or Cu). it is conceivable that. As described above, the suspension substrate according to the second embodiment can prevent the adverse effect caused by the protrusion of the via portion, and can reduce the diameter of the via portion.

  In addition, since the member and structure of the board | substrate for suspensions of a 2nd embodiment are the same as the content described in the 1st embodiment mentioned above, description here is abbreviate | omitted. In addition, at least one of the second adhesion layer and the via layer may be formed between the first adhesion layer and the wiring layer.

3. Third Embodiment Next, a third embodiment of the suspension substrate of the present invention will be described. The suspension substrate of the third embodiment includes a metal support substrate made of stainless steel, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, A suspension substrate having a second insulating layer formed on the first wiring layer and a second wiring layer formed on the second insulating layer, wherein the suspension substrate has an opening in the opening of the first insulating layer. An adhesion layer, a via layer, and the second wiring layer are formed in this order on the surface of the metal support substrate, and the adhesion layer is formed on the surface of the metal support substrate and contains Ni or Cu. The second wiring layer is formed of one adhesion layer and a second adhesion layer formed on the surface of the first adhesion layer and containing a metal and does not protrude from the second insulating layer. Is formed so as to cover the via layer, and the via layer is Is characterized in that no projecting from said second wiring layer.

FIG. 12 is a schematic cross-sectional view showing an example of the suspension substrate of the third embodiment. As shown in FIG. 12A, in the third embodiment, the adhesion layer 5, the via layer 6 and the second wiring layer 3y are formed on the surface of the metal support substrate 1 in the opening of the first insulating layer 2x. It is formed in order. The adhesion layer 5 is formed on the surface of the metal support substrate 1, and is formed on the surface of the first adhesion layer 5a containing Ni or Cu, and the second adhesion layer 5b formed on the surface of the first adhesion layer 5a and containing metal. And is formed so as not to protrude from the second insulating layer 2y. Furthermore, the second wiring layer 3 y is formed so as to cover the via layer 6. Further, in the third embodiment, the via layer 6 does not protrude from the second wiring layer 3y, i.e., the top T ₆ via layer 6, not to protrude from the top T _3y of the second wiring layer 3y (thickness One feature is that it does not protrude toward the cover layer 4 in the vertical direction. In FIG. 12A, the second wiring layer 3y is electrically connected to the metal support substrate 1. However, as shown in FIG. 12B, the second wiring layer 3y is the first wiring layer 3x. In addition, the metal support board 1 may be electrically connected.

  According to the third embodiment, since the via layer does not protrude from the second wiring layer, it is possible to prevent an adverse effect due to the protrusion of the via layer. Therefore, for example, there is an advantage that the flatness of the mounted element (recording / reproducing element such as a magnetic head slider) is not hindered. Further, for example, when the via layer does not protrude from the second insulating layer, there is an advantage that the shape of the via layer can be easily controlled and the second wiring layer existing in the vicinity of the via layer is not adversely affected. The suspension substrate of the third embodiment usually has a shape in which the second wiring layer in the opening does not protrude from the second wiring layer around the opening.

Furthermore, according to the third embodiment, since the specific adhesion layer is provided between the via layer and the metal support substrate, the adhesion is improved and the diameter of the via layer can be reduced. The reason why the adhesion is improved is that there is nothing that inhibits the adhesion of a passive film or the like between the metal support substrate (stainless steel) and the first adhesion layer (layer containing Ni or Cu). it is conceivable that. As described above, the suspension substrate according to the third embodiment can prevent the adverse effect caused by the protrusion of the via layer and can reduce the diameter of the via layer. In addition, as described later, the via layer in the third embodiment is preferably in a state of being completely hidden (blind via layer) covered with the second wiring layer in plan view.
Hereinafter, the suspension substrate according to the third embodiment will be described separately for the suspension substrate member and the configuration of the suspension substrate.

(1) Suspension Substrate Member First, the suspension substrate member of the third embodiment will be described. The suspension substrate of the third embodiment has at least a metal support substrate, a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer. The first insulating layer and the second insulating layer are the same as the insulating layer in the first embodiment described above, and the first wiring layer and the second wiring layer are the same as the wiring layer in the first embodiment described above. Explanation here is omitted.

(2) Configuration of Suspension Substrate Next, the configuration of the suspension substrate of the third embodiment will be described. One feature of the suspension substrate of the third embodiment is that it has an adhesion layer, a via layer, and a second wiring layer in this order on the surface of the metal support substrate in the opening of the first insulating layer. The shape of the opening of the first insulating layer is not particularly limited, and examples thereof include a circle, an ellipse, an arbitrary polygon, a comb, a cross, and a rod.

  The adhesion layer and via layer in the third embodiment are the same as the adhesion layer and via layer in the first embodiment described above.

  The second wiring layer in the third embodiment is usually formed so as to cover the via layer. In the third embodiment, one feature is that the via layer does not protrude from the second wiring layer. Since the second wiring layer in the third embodiment is formed so as to cover the via layer, it usually does not have an opening. In addition, the second wiring layer in the third embodiment may cover at least a part of the via layer in plan view, but it preferably covers a larger part and completely covers the via layer. Is preferred. That is, the via layer is preferably in a state (blind via layer) completely covered with the second wiring layer in plan view. This is because the protrusion of the via layer can be prevented and the diameter of the via layer can be reduced.

  Moreover, it is preferable that the 2nd wiring layer in a 3rd embodiment has a seed layer in a contact surface with a 2nd insulating layer. Depending on the manufacturing process, the seed layer may be formed not only on the contact surface with the second insulating layer but also on the contact surface with the via layer or the like in the opening of the first insulating layer. The seed layer is the same as that described in the first embodiment.

Further, as shown in FIG. 13, the difference between the position T ₅ of the top of the contact layer 5 and the position T _2y of the top of the second insulating layer 2y and t _3, the position T _2y of the top of the second insulating layer 2y The difference from the top position T ₆ of the via layer 6 is defined as t ₄ . In a third embodiment, normally, since the adhesion layer 5 is formed so as not to protrude from the second insulating layer 2y, t ₃ will normally be zero or more. In particular, as shown in FIG. 13, the via layer 6 is usually formed on the adhesion layer 5. Therefore, _{t 3} is, for example, 2μm or more, preferably in the range of 4Myuemu～20myuemu. In the third embodiment, the via layer and the second insulating layer preferably have the same top position in the thickness direction (that is, they are flush). This is because the flatness of the second wiring layer is ensured. “The positions of the tops in the thickness direction are equal” means that t ₄ is within ± 2 μm. Incidentally, as shown in FIG. 13, when the t ₄ when the second insulating layer 2y is protruded than the via layer 6 is positive, the via layer 6 in the opposite protrudes from the second insulating layer 2y t ₄ Is negative. Further, it is preferable that the via layer does not protrude from the second insulating layer. “The via layer does not protrude more than the second insulating layer” refers to a state where t ₄ is larger than the value when flush.

  In the third embodiment, as shown in FIG. 14A, the second adhesion layer 5b and the via layer 6 may be the same layer. Since both layers are the same layer, the manufacturing process can be simplified. Here, “the second adhesion layer and the via layer are the same layer” is the same as that described in the first embodiment.

  In the third embodiment, as shown in FIG. 14B, the via layer 6 and the second wiring layer 3y may be the same layer. Since both layers are the same layer, the manufacturing process can be simplified. Since the definition of “same layer” is the same as the above-described content, description thereof is omitted here. Further, the via layer and the second wiring layer in the third embodiment may be different layers.

  In the third embodiment, as shown in FIG. 15, the via layer 6 that connects the first wiring layer 3x and the metal support substrate 1 may be made of the same material as the second wiring layer. This is because the via layer 6 can be formed simultaneously with the formation of the second wiring layer, and the manufacturing process can be simplified.

In the third embodiment, as shown in FIG. 12A, the opening end of the first insulating layer 2x is in the horizontal direction (the direction perpendicular to the thickness direction) of the second insulating layer 2y. It is preferable to protrude from the opening end. That is, in plan view, the opening of the second insulating layer 2y is preferably formed so as to include the opening of the first insulating layer 2x. This is because the step structure can alleviate stress concentration and suppress deterioration during long-term use. Here, the open end of the first insulating layer 2x, the difference between the open end of the second insulating layer 2y and W _1. W ₁ is preferably 5 μm or more, for example, and preferably in the range of 8 μm to 30 μm.

Further, in the third embodiment, as shown in FIG. 12B, the opening end of the first insulating layer 2x is in the horizontal direction (direction perpendicular to the thickness direction) of the first wiring layer 3x. It is preferable to protrude from the opening end. Similarly, it is preferable that the opening end portion of the first wiring layer 3x protrudes more than the opening end portion of the second insulating layer 2y in the horizontal direction. That is, in plan view, the opening of the first wiring layer 3x is preferably formed so as to include the opening of the first insulating layer 2x. Similarly, it is preferable that the opening of the second insulating layer 2y protrudes so as to include the opening of the first wiring layer 3x. This is because the step structure can alleviate stress concentration and suppress deterioration during long-term use. Here, the open end of the first insulating layer 2x, the difference between the open end of the first wiring layer 3x and W _2, open end of the open end of the first wiring layer 3x and the second insulating layer 2y The difference from is W ₃ . W ₂ is preferably in the range of ₂ μm to 10 μm, for example. W ₃ is preferably 5 μm or more, for example, and preferably in the range of 8 μm to ₃₀ μm. As shown in FIG. 12C, the opening end of the first insulating layer 2x may be the same as the opening end of the first wiring layer 3x in the horizontal direction. “Same” means that the difference between both opening ends in the horizontal direction is less than 2 μm. Furthermore, as shown in FIG. 12D, the opening end of the first wiring layer 3x may protrude from the opening end of the first insulating layer 2x in the horizontal direction. Here, the open end of the first wiring layer 3x, the difference between the open end of the first insulating layer 2x and W _4. W ₄ is preferably in the range of 2 μm to 5 μm, for example.

  The use of the via layer and other matters in the third embodiment are the same as the matters described in the first embodiment and the second embodiment described above, and thus the description thereof is omitted here.

4). Fourth Embodiment Next, a fourth embodiment of the suspension substrate of the present invention will be described. The suspension substrate of the fourth embodiment includes a metal support substrate made of stainless steel, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, A suspension substrate having a second insulating layer formed on the first wiring layer and a second wiring layer formed on the second insulating layer, wherein the suspension substrate has an opening in the opening of the first insulating layer. A first adhesion layer and the second wiring layer are formed in this order on the surface of the metal support substrate, and the first adhesion layer is a strike plating layer containing Ni or Cu, and the opening in the opening The second wiring layer does not protrude from the second wiring layer around the opening.

FIG. 16 is a schematic cross-sectional view illustrating the suspension substrate of the fourth embodiment. As shown in FIG. 16A, in the fourth embodiment, the first adhesion layer 5a and the second wiring layer 3y are arranged in this order on the surface of the metal supporting board 1 in the opening of the first insulating layer 2x. Is formed. The first adhesion layer 5a is a strike plating layer containing Ni or Cu. Furthermore, the second wiring layer 3y is formed so as to cover the opening of the first insulating layer 2x. In the fourth embodiment, the second wiring layer 3y at the opening does not protrude from the second wiring layer 3y at the periphery of the opening, i.e., top T _3C of the second wiring layer 3y in opening opening One feature is that it does not protrude from the top portion T _3D of the second wiring layer 3y in the vicinity of (not to protrude toward the cover layer 4 in the thickness direction). In FIG. 16A, the second wiring layer 3y is electrically connected to the metal support substrate 1. However, as shown in FIG. 16B, the second wiring layer 3y is the first wiring layer 3x. In addition, the metal support board 1 may be electrically connected. Further, the top T _3C of the second wiring layer 3y in the opening refers to a portion of the second wiring layer 3y that protrudes most to the cover layer 4 side in the opening of the first insulating layer 2x. Similarly, the top portion T _3D of the second wiring layer 3y around the opening, around the aperture in the first insulating layer 2x, refers to a portion of the second wiring layer 3y protruding most cover layer 4 side. The periphery of the opening of the first insulating layer 2x refers to a region from the end of the opening of the first insulating layer 2x to the end when the opening size of the first insulating layer 2x is doubled.

  According to the fourth embodiment, since the second wiring layer in the opening does not protrude from the surrounding second wiring layer, the via portion (the second insulating layer formed in the opening of the first insulating layer and the second insulating layer) It is possible to prevent adverse effects caused by the protrusion of the wiring layer. Therefore, for example, there is an advantage that the flatness of the mounted element (recording / reproducing element such as a magnetic head slider) is not hindered. Further, as shown in FIG. 4, conventionally, it is necessary to provide a land portion having an opening in the wiring layer. According to the fourth embodiment, the second wiring layer is formed so as to cover the opening portion of the first insulating layer. Therefore, there is an advantage that the size of the land portion can be reduced.

  Furthermore, according to the fourth embodiment, since the specific first adhesion layer is provided between the second wiring layer and the metal support substrate, the adhesion is improved and the diameter of the via portion can be reduced. The reason why the adhesion is improved is that there is nothing that inhibits the adhesion of a passive film or the like between the metal support substrate (stainless steel) and the first adhesion layer (layer containing Ni or Cu). it is conceivable that. As described above, the suspension substrate of the fourth embodiment can prevent the adverse effects caused by the protrusion of the via portion and can reduce the diameter of the via portion.

  In addition, since the member and structure of the board | substrate for suspensions of a 4th embodiment are the same as the content described in the 3rd embodiment mentioned above, description here is abbreviate | omitted. Further, at least one of the second adhesion layer and the via layer may be formed between the first adhesion layer and the second wiring layer.

B. Suspension Next, the suspension of the present invention will be described. The suspension according to the present invention includes the suspension substrate described above and a load beam provided on the surface of the suspension substrate on the metal support substrate side.

  FIG. 17 is a schematic plan view showing an example of the suspension of the present invention. A suspension 300 shown in FIG. 17 includes the suspension substrate 100 described above and a load beam 200 provided on the surface of the suspension substrate 100 on the metal support substrate side.

  According to the present invention, by using the suspension substrate described above, it is possible to provide a suspension that can prevent the adverse effects caused by the protrusion of the via and can reduce the diameter of the via.

  The suspension of the present invention has at least a suspension substrate and a load beam. The suspension substrate in the present invention is the same as the content described in the above “A. Suspension substrate”, and therefore description thereof is omitted here. On the other hand, the load beam in the present invention is provided on the surface of the suspension substrate on the metal support substrate side. Although the material of the load beam is not particularly limited, for example, a metal can be used, and stainless steel is preferable.

C. Next, the suspension with an element of the present invention will be described. A suspension with an element of the present invention includes the above-described suspension and a recording / reproducing element disposed on the suspension.

  FIG. 18 is a schematic plan view showing an example of the suspension with an element of the present invention. 18 includes the above-described suspension 300 and the recording / reproducing element 301 mounted on the suspension 300 (recording / reproducing element mounting region 101 of the suspension substrate 100).

  According to the present invention, by using the above-described suspension, it is possible to provide a suspension with an element that can prevent adverse effects due to the protrusion of the via and can reduce the diameter of the via.

  The suspension with an element of the present invention includes at least a suspension and a recording / reproducing element. The suspension according to the present invention is the same as the content described in “B. Suspension” above, and thus the description thereof is omitted here. The recording / reproducing element is not particularly limited, but preferably has a magnetic generating element. Specifically, a magnetic head slider can be mentioned. Furthermore, it is preferable that the suspension with an element of the present invention further includes at least one of a thermal assist element and an actuator element.

  The heat assisting element is not particularly limited as long as it can assist recording by the recording / reproducing element with heat. Among them, the heat assist element in the present invention is preferably an element using light. This is because heat-assisted recording by an optical dominant recording method can be performed. Examples of the heat assist element using light include a semiconductor laser diode element. The semiconductor laser diode element may be a pn-type element, or a pnp-type or npn-type element.

  The actuator element usually corresponds to a microactuator or a milliactuator. Examples of the actuator element include a piezo element. As the piezo element, for example, one made of PZT can be cited. By using the expansion / contraction response of the piezo element, positioning can be performed in submicron units. In addition, the piezoelectric element has advantages such as high energy efficiency, large load resistance, fast response, no wear deterioration, and no magnetic field. In the present invention, a single bipolar piezo element may be used. Two unipolar piezoelectric elements may be used.

D. Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention has the above-described suspension with an element.

  FIG. 19 is a schematic plan view showing an example of the hard disk drive of the present invention. A hard disk drive 500 shown in FIG. 19 includes the above-described suspension 400 with an element, a disk 401 on which data is written and read by the suspension 400 with an element, a spindle motor 402 that rotates the disk 401, and the elements of the suspension 400 with an element. Arm 403 and voice coil motor 404, and a case 405 for sealing the above members.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  The hard disk drive of the present invention has at least a suspension with an element, and usually further includes a disk, a spindle motor, an arm, and a voice coil motor. Since the suspension with an element is the same as the content described in “C. Suspension with an element”, description thereof is omitted here. As other members, the same members as those used in a general hard disk drive can be used.

E. Next, a method for manufacturing a suspension substrate according to the present invention will be described. The method for manufacturing a suspension substrate of the present invention can be roughly divided into four embodiments. The manufacturing method of the suspension substrate according to the present invention will be described separately for the first to fourth embodiments.

1. First Embodiment A method for manufacturing a suspension substrate according to a first embodiment includes a metal support substrate made of stainless steel, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer. A method of manufacturing a suspension substrate, comprising: an insulating layer forming step of forming the insulating layer having an opening; a first adhesion layer containing Ni or Cu in the opening of the insulating layer; An adhesion layer forming step of forming an adhesion layer formed on the surface of the first adhesion layer, comprising a second adhesion layer containing a metal and not protruding from the insulating layer, and on the adhesion layer, A via layer forming step of forming a via layer; and a wiring layer forming step of forming a wiring layer covering the via layer, wherein the via layer is not protruded from the wiring layer.

  FIG. 20 is a schematic cross-sectional view showing an example of a manufacturing method of the suspension substrate of the first embodiment. In FIG. 20, first, a member having a metal support member 1A and an insulating layer 2 formed on the metal support member 1A is prepared (FIG. 20A). Next, pretreatment is performed on the surface of the metal support member 1A exposed at the opening of the insulating layer 2, and the first adhesion layer 5a is formed by a strike plating method. Thereafter, a second adhesion layer 5b is formed on the surface of the first adhesion layer 5a by an electrolytic plating method (FIG. 20B). Next, the via layer 6 is formed on the second adhesion layer 5b by plating or printing (FIG. 20C).

  Next, although not shown, a seed layer is formed on the surface of the via layer 6 and the insulating layer 2 by sputtering, and a predetermined resist pattern is formed on the surface of the seed layer using DFR (dry film resist). To do. Thereafter, the wiring layer 3 is formed on the seed layer exposed from the resist pattern by electrolytic plating (FIG. 20D). Next, an unnecessary resist pattern and seed layer are removed, and a cover layer 4 covering the wiring layer 3 is formed (FIG. 20E). Next, by performing wet etching on the metal support member 1A, the metal support member 1A is trimmed to form the metal support substrate 1 (FIG. 20F). Thereby, a suspension substrate is obtained.

According to the first embodiment, since the via layer does not protrude from the wiring layer, it is possible to prevent an adverse effect due to the protrusion of the via layer. Furthermore, according to the first embodiment, since the specific adhesion layer is formed between the via layer and the metal support substrate, the adhesion is improved and the diameter of the via layer can be reduced. In this manner, a suspension substrate can be obtained in which the adverse effects due to the protrusion of the via layer can be prevented and the diameter of the via layer can be reduced.
Hereinafter, the manufacturing method of the suspension substrate according to the first embodiment will be described step by step.

(1) Insulating layer forming step The insulating layer forming step in the first embodiment is a step of forming the insulating layer having an opening.

  The method for forming the insulating layer is not particularly limited as long as it can form a patterned insulating layer on a metal supporting substrate (metal supporting member). As an example of a method for forming an insulating layer, a two-layer material composed of a metal support member and an insulating member is prepared, and a resist pattern is formed on the insulating member using a dry film resist (DFR) or the like. A method of wet etching the insulating member exposed from the resist pattern can be mentioned. The type of etchant used for wet etching is preferably selected as appropriate according to the type of insulating member. For example, when the material of the insulating member is a polyimide resin, an alkaline etchant or the like can be used. Another example of the method for forming the insulating layer is a method in which an insulating film of a photosensitive material is formed on a metal support member, and is exposed and developed.

(2) Adhesion layer forming step The adhesion layer forming step in the first embodiment is formed on the surface of the first adhesion layer and the first adhesion layer containing Ni or Cu in the opening of the insulating layer. And a step of forming an adhesion layer which is composed of a second adhesion layer containing a metal and which does not protrude from the insulating layer.

  Although the formation method of a 1st contact | adherence layer is not specifically limited, For example, the strike plating method can be mentioned. By using the strike plating method, a first adhesion layer having good adhesion to the metal support substrate can be obtained. The strike plating method is a method of forming a thin plating at a high current density in a short period of time usually using an electrolytic bath having a low ion concentration. In the first embodiment, it is preferable to perform a pretreatment for activating the surface of the metal support member before forming the first adhesion layer. Examples of such pretreatment include plasma treatment, acid washing treatment, electrolytic washing treatment, and the like.

  Although the formation method of a 2nd contact | adherence layer is not specifically limited, For example, the plating method can be mentioned, Among these, the electrolytic plating method is preferable. For example, when forming the 2nd adhesion layer comprised from Cu plating, a copper sulfate bath, a copper pyrophosphate bath, a copper bromide bath, etc. can be mentioned as an electrolytic Cu plating bath used. Moreover, when forming the 2nd contact | adherence layer comprised from Ni plating, a watt bath, a sulfamic acid bath, etc. can be mentioned as an electrolytic Ni plating bath used. Moreover, the conditions of electrolytic plating are not specifically limited, What is necessary is just to select desired conditions (plating time, applied voltage, etc.).

(3) Via layer forming step The via layer forming step in the first embodiment is a step of forming a via layer on the adhesive layer.

  The method for forming the via layer is not particularly limited as long as a via layer capable of electrically connecting the adhesion layer and the wiring layer can be obtained, and examples thereof include a plating method and a printing method. The plating method is preferably an electrolytic plating method. The plating bath used in the electrolytic plating method is not particularly limited, and may be appropriately selected according to the type of electrolytic plating. Examples of the printing method include a screen printing method. In the first embodiment, it is preferable to form a via layer by filling a paste containing metal fine particles on the adhesion layer by a printing method.

  As shown in FIG. 7A, when the second adhesion layer 5b and the via layer 6 are the same layer, the second adhesion layer forming process in the adhesion layer forming process and the via layer forming process are as follows. It becomes the same process.

(4) Wiring layer forming step The wiring layer forming step in the first embodiment is a step of forming a wiring layer covering the via layer.

  Although the formation method of a wiring layer is not specifically limited, For example, the electrolytic plating method etc. can be mentioned. For example, when forming a wiring layer composed of Cu plating, examples of the electrolytic Cu plating bath used include a copper sulfate bath and a copper pyrophosphate bath. Moreover, when using an electroplating method, it is preferable to form a seed layer on the surface of the via layer and the insulating layer by sputtering or the like before forming the wiring layer.

  As shown in FIG. 7B, when the via layer 6 and the wiring layer 3 are the same layer, the via layer forming step and the wiring layer forming step are the same step. If necessary, it is preferable to form a seed layer.

(5) Cover layer forming step In the first embodiment, it is preferable to perform a cover layer forming step of forming a cover layer on the wiring layer. The method for forming the cover layer is not particularly limited, and is preferably selected as appropriate according to the material of the cover layer. For example, when the material of the cover layer is a photosensitive material, a patterned cover layer can be obtained by exposing and developing the cover layer formed on the entire surface. In addition, when the cover layer material is a non-photosensitive material, a predetermined resist pattern is formed on the entire surface of the cover layer, and a portion exposed from the resist pattern is removed by wet etching. The cover layer can be obtained.

(6) Other steps In the first embodiment, it is preferable to perform a metal support substrate forming step of etching the metal support member to form a metal support substrate. In this step, the outer shape of the metal support substrate is usually processed. Although the etching method of a metal supporting member is not specifically limited, For example, wet etching can be mentioned. Specifically, a method may be mentioned in which a resist pattern is formed on a metal support member using a dry film resist (DFR) or the like, and the metal support member exposed from the resist pattern is wet-etched. The type of etchant used for wet etching is preferably selected as appropriate according to the type of metal support member. For example, when the material of the metal support member is stainless steel, an iron chloride-based etchant or the like can be used. .

2. Second Embodiment Next, a second embodiment of the method for manufacturing a suspension substrate according to the present invention will be described. A method of manufacturing a suspension substrate according to a second embodiment includes a metal support substrate made of stainless steel, an insulation layer formed on the metal support substrate, and a wiring layer formed on the insulation layer. And a first adhesion layer, which is a strike plating layer containing Ni or Cu, in the opening of the insulating layer, and a step of forming the insulating layer having the opening. An adhesion layer forming step to be formed; and a wiring layer forming step of forming the wiring layer on the first adhesion layer, wherein the wiring layer in the opening is connected to the wiring layer around the opening. It is characterized by not protruding from.

  FIG. 21 is a schematic cross-sectional view showing an example of a manufacturing method of the suspension substrate of the second embodiment. In FIG. 21, first, a member having a metal support member 1A and an insulating layer 2 formed on the metal support member 1A is prepared (FIG. 21A). Next, pretreatment is performed on the surface of the metal support member 1A exposed at the opening of the insulating layer 2, and the first adhesion layer 5a is formed by a strike plating method (FIG. 21B).

  Next, although not shown, a seed layer is formed by sputtering on the surfaces of the first adhesion layer 5a and the insulating layer 2, and a predetermined resist pattern is formed on the surface of the seed layer using DFR (dry film resist). Form. Thereafter, the wiring layer 3 is formed on the seed layer exposed from the resist pattern by electrolytic plating (FIG. 21C). Next, an unnecessary resist pattern and seed layer are removed, and a cover layer 4 that covers the wiring layer 3 is formed (FIG. 21D). Next, the outer shape of the metal support member 1A is processed to form the metal support substrate 1 (FIG. 21E). Thereby, a suspension substrate is obtained.

  According to the second embodiment, since the wiring layer in the opening does not protrude from the surrounding wiring layer, it is possible to prevent the adverse effect caused by the protrusion of the via portion (wiring layer formed in the opening of the insulating layer). Furthermore, according to the second embodiment, since the specific adhesion layer is formed between the wiring layer and the metal support substrate, the adhesion can be improved and the diameter of the via portion can be reduced. In this way, it is possible to obtain a suspension substrate that can prevent the adverse effects caused by the protrusion of the via portion and can reduce the diameter of the via portion.

  The manufacturing method of the suspension substrate of the second embodiment usually includes an insulating layer forming step, an adhesion layer forming step, and a wiring layer forming step. Since these steps and other steps are the same as the contents described in the first embodiment described above, description thereof is omitted here.

3. Third Embodiment Next, a third embodiment of the method for manufacturing a suspension substrate according to the present invention will be described. The method of manufacturing the suspension substrate according to the third embodiment includes a metal support substrate made of stainless steel, a first insulating layer formed on the metal support substrate, and a first wiring formed on the first insulating layer. A suspension substrate having a layer, a second insulating layer formed on the first wiring layer, and a second wiring layer formed on the second insulating layer, wherein an opening is formed A first insulating layer forming step for forming the first insulating layer, a first adhesive layer containing Ni or Cu in the opening of the first insulating layer, and a surface formed on the surface of the first adhesive layer An adhesion layer forming step of forming an adhesion layer that is formed of a second adhesion layer containing metal and does not protrude from the second insulating layer, and forming a via layer on the adhesion layer And a second wiring layer forming a second wiring layer covering the via layer It includes a forming step, and the via layer is characterized in that does not project from the second wiring layer.

  FIG. 22 is a schematic cross-sectional view showing an example of a manufacturing method of the suspension substrate of the second embodiment. In FIG. 22, first, a laminated member in which the metal supporting member 1A, the insulating member 2A, and the conductor member 3A are laminated in this order is prepared (FIG. 22A). Next, the conductive member 3A is patterned by wet etching to form the first wiring layer 3x (FIG. 22B). Next, the second insulating layer 2y is formed on the first wiring layer 3x (FIG. 22C), and the insulating member 2A is wet-etched to form the first insulating layer 2x having an opening (FIG. 22). 22 (d)). Next, pretreatment is performed on the surface of the metal support member 1A exposed at the opening of the first insulating layer 2x, and the first adhesion layer 5a is formed by strike plating. Thereafter, the second adhesion layer 5b is formed on the surface of the first adhesion layer 5a by the electrolytic plating method (FIG. 22E). Next, the via layer 6 is formed on the second adhesion layer 5b by plating or printing (FIG. 22F).

  Next, although not shown, a seed layer is formed on the surfaces of the via layer 6 and the second insulating layer 2y by sputtering, and a predetermined resist pattern is formed on the surface of the seed layer using DFR (dry film resist). Form. Thereafter, the second wiring layer 3y is formed by electrolytic plating on the seed layer exposed from the resist pattern (FIG. 22G). Next, an unnecessary resist pattern and seed layer are removed, and a cover layer 4 covering the second wiring layer 3y is formed (FIG. 22H). Next, the first insulating layer 2x is patterned (FIG. 22 (i)). Next, the outer shape of the metal support member 1A is processed to form the metal support substrate 1 (FIG. 22 (j)). Thereby, a suspension substrate is obtained.

  According to the third embodiment, since the via layer does not protrude from the second wiring layer, it is possible to prevent an adverse effect due to the protrusion of the via layer. Furthermore, according to the third embodiment, since the specific adhesion layer is formed between the via layer and the metal support substrate, the adhesion is improved and the diameter of the via layer can be reduced. In this manner, a suspension substrate can be obtained in which the adverse effects due to the protrusion of the via layer can be prevented and the diameter of the via layer can be reduced.

  The suspension substrate manufacturing method of the third embodiment usually includes a first insulating layer forming step, an adhesion layer forming step, a via layer forming step, and a second wiring layer forming step. The first insulating layer forming step and the second wiring layer forming step are the same as the contents described in the insulating layer forming step and the wiring layer forming step in the first embodiment described above, respectively. Further, the other steps are the same as the contents described in the first embodiment described above, and therefore description thereof is omitted here.

4). Fourth Embodiment Next, a fourth embodiment of the method for manufacturing a suspension substrate according to the present invention will be described. A method for manufacturing a suspension substrate according to a fourth embodiment includes a metal support substrate made of stainless steel, a first insulating layer formed on the metal support substrate, and a first wiring formed on the first insulating layer. A suspension substrate having a layer, a second insulating layer formed on the first wiring layer, and a second wiring layer formed on the second insulating layer, wherein the first substrate has an opening. A first insulating layer forming step of forming one insulating layer; an adhesive layer forming step of forming a first adhesive layer that is a strike plating layer containing Ni or Cu in the opening of the first insulating layer; A second wiring layer forming step of forming the second wiring layer on the first adhesion layer, and the second wiring layer in the opening is separated from the second wiring layer around the opening. It is characterized by not projecting.

  FIG. 23 is a schematic cross-sectional view showing an example of a manufacturing method of the suspension substrate of the fourth embodiment. In FIG. 23, first, a laminated member in which the metal supporting member 1A, the insulating member 2A, and the conductor member 3A are laminated in this order is prepared (FIG. 23 (a)). Next, the conductive member 3A is patterned by wet etching to form the first wiring layer 3x (FIG. 23B). Next, the second insulating layer 2y is formed on the first wiring layer 3x (FIG. 23C), and the insulating member 2A is wet etched to form the first insulating layer 2x having an opening (FIG. 23). 23 (d)). Next, pretreatment is performed on the surface of the metal support member 1A exposed at the opening of the first insulating layer 2x, and the first adhesion layer 5a is formed by a strike plating method (FIG. 23E).

  Next, although not shown, a seed layer is formed by sputtering on the surfaces of the first adhesion layer 5a and the second insulating layer 2y, and a predetermined layer is formed on the surface of the seed layer using DFR (dry film resist). A resist pattern is formed. Thereafter, the second wiring layer 3y is formed by electrolytic plating on the seed layer exposed from the resist pattern (FIG. 23F). Next, an unnecessary resist pattern and seed layer are removed, and a cover layer 4 that covers the second wiring layer 3y is formed (FIG. 23G). Next, the first insulating layer 2x is patterned (FIG. 23 (h)). Next, the metal support member 1A is trimmed to form the metal support substrate 1 (FIG. 23 (i)). Thereby, a suspension substrate is obtained.

  According to the fourth embodiment, since the second wiring layer in the opening does not protrude from the surrounding second wiring layer, the via portion (the second insulating layer formed in the opening of the first insulating layer and the second insulating layer) It is possible to prevent adverse effects caused by the protrusion of the wiring layer. Furthermore, according to the fourth embodiment, since the specific adhesion layer is formed between the second wiring layer and the metal support substrate, the adhesion is improved and the diameter of the via portion can be reduced. In this way, it is possible to obtain a suspension substrate that can prevent the adverse effects caused by the protrusion of the via portion and can reduce the diameter of the via portion.

  The suspension substrate manufacturing method of the fourth embodiment usually includes a first insulating layer forming step, an adhesion layer forming step, and a second wiring layer forming step. Since these steps and other steps are the same as the contents described in the third embodiment, description thereof is omitted here.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples.

[Example 1]
On a metal supporting member made of stainless steel (SUS304) having a thickness of 18 μm, an insulating member having a thickness of 10 μm was formed by a coating method using non-photosensitive polyimide as an insulating member forming material. Thereby, a two-layer material was obtained. Next, a resist pattern was formed on the two-layer insulating member using a dry film resist (DFR). Next, the insulating member exposed from the resist pattern was etched using an organic alkali etching solution to obtain an insulating layer having an opening (FIG. 20A).

  Thereafter, in order to activate the surface of the metal support member exposed from the opening of the insulating layer, plasma treatment, acid cleaning, and electrolytic cleaning were performed. Next, a first adhesion layer was formed by Ni strike plating, and a second adhesion layer was formed by electrolytic Ni plating (FIG. 20B). Next, a via layer was formed by an electrolytic Cu plating method (FIG. 20C). The thickness of the via layer was adjusted so that the via layer did not protrude from the insulating layer. Next, a seed layer is formed on the surface of the via layer and the insulating layer by a sputtering method, a resist pattern is formed on the seed layer, and wiring is formed on the seed layer exposed from the resist pattern by an electrolytic Cu plating method. A layer was formed (FIG. 20 (d)).

  Thereafter, a liquid cover layer forming material of non-photosensitive polyimide is coated with a die coater, dried, resist-made, etched simultaneously with development, and then cured to form a patterned cover layer (FIG. 20 ( e)). Thereafter, resist plate-making was performed, and Ni plating and Au plating were performed on the connection terminal portion. Finally, the metal support member was wet-etched using an iron chloride-based etchant to perform external processing. As a result, a suspension substrate was obtained (FIG. 20F).

[Example 2]
A suspension substrate was obtained in the same manner as in Example 1 except that the second adhesion layer was formed by electrolytic Cu plating.

[Example 3]
A suspension substrate was obtained in the same manner as in Example 1 except that the via layer was formed by screen printing using a copper paste containing copper fine particles.

[Example 4]
A suspension substrate was obtained in the same manner as in Example 1 except that the via layer was formed by screen printing using a silver paste containing silver fine particles.

  DESCRIPTION OF SYMBOLS 1 ... Metal support substrate, 1a ... Terminal part, 1b ... Jumper part, 2 ... Insulating layer, 2x ... First insulating layer, 2y ... Second insulating layer, 3 ... Wiring layer, 3x ... First wiring layer, 3y ... First Two wiring layers, 3a ... terminal part, 4 ... cover layer, 5 ... adhesion layer, 5a ... first adhesion layer, 5b ... second adhesion layer, 6 ... via layer, 7 ... protective plating part, 11 ... via, 101 ... Element mounting area for recording / reproducing, 102 ... External circuit board connection area, 103 ... Wiring layer

Claims (19)

A suspension substrate having a metal support substrate made of stainless steel, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer,
On the surface of the metal support substrate in the opening of the insulating layer, an adhesion layer, a via layer, and the wiring layer are formed in this order,
The adhesion layer is formed on the surface of the metal support substrate and includes a first adhesion layer containing Ni or Cu, and a second adhesion layer formed on the surface of the first adhesion layer and containing a metal. And formed so as not to protrude from the insulating layer,
The wiring layer is formed so as to cover the via layer,
The suspension substrate, wherein the via layer does not protrude from the wiring layer.   The suspension substrate according to claim 1, wherein the first adhesion layer is a strike plating layer.   The suspension substrate according to claim 1, wherein the second adhesion layer contains Ni or Cu.   The suspension substrate according to any one of claims 1 to 3, wherein the via layer is a plating layer or a metal fine particle-containing layer.   The suspension substrate according to any one of claims 1 to 4, wherein the second adhesion layer and the via layer are the same layer.   The suspension substrate according to any one of claims 1 to 4, wherein the via layer and the wiring layer are the same layer. A suspension substrate having a metal support substrate made of stainless steel, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer,
On the surface of the metal support substrate in the opening of the insulating layer, a first adhesion layer and the wiring layer are formed in this order,
The first adhesion layer is a strike plating layer containing Ni or Cu,
The suspension substrate, wherein the wiring layer in the opening does not protrude from the wiring layer around the opening. A metal supporting board made of stainless steel, a first insulating layer formed on the metal supporting board, a first wiring layer formed on the first insulating layer, and formed on the first wiring layer A suspension substrate having a second insulating layer and a second wiring layer formed on the second insulating layer,
On the surface of the metal support substrate in the opening of the first insulating layer, an adhesion layer, a via layer, and the second wiring layer are formed in this order,
The adhesion layer is formed on the surface of the metal support substrate and includes a first adhesion layer containing Ni or Cu, and a second adhesion layer formed on the surface of the first adhesion layer and containing a metal. And formed so as not to protrude from the second insulating layer,
The second wiring layer is formed so as to cover the via layer,
The suspension substrate, wherein the via layer does not protrude from the second wiring layer. A metal supporting board made of stainless steel, a first insulating layer formed on the metal supporting board, a first wiring layer formed on the first insulating layer, and formed on the first wiring layer A suspension substrate having a second insulating layer and a second wiring layer formed on the second insulating layer,
On the surface of the metal support substrate in the opening of the first insulating layer, the first adhesion layer and the second wiring layer are formed in this order,
The first adhesion layer is a strike plating layer containing Ni or Cu,
The suspension substrate, wherein the second wiring layer in the opening does not protrude from the second wiring layer around the opening.   A suspension board comprising: the suspension board according to any one of claims 1 to 9; and a load beam provided on a surface of the suspension board on the metal support board side. .   11. A suspension with an element, comprising: the suspension according to claim 10; and a recording / reproducing element disposed on the suspension.   A hard disk drive comprising the element-equipped suspension according to claim 11. A method for producing a suspension substrate comprising a metal support substrate made of stainless steel, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer,
An insulating layer forming step of forming the insulating layer having an opening;
The opening of the insulating layer includes a first adhesion layer containing Ni or Cu and a second adhesion layer formed on the surface of the first adhesion layer and containing a metal, and the insulation An adhesion layer forming step of forming an adhesion layer that does not protrude from the layer;
A via layer forming step of forming a via layer on the adhesion layer;
A wiring layer forming step of forming the wiring layer covering the via layer,
A method for manufacturing a suspension substrate, wherein the via layer does not protrude from the wiring layer.   The method for manufacturing a suspension substrate according to claim 13, wherein the first adhesion layer is formed by a strike plating method.   The method for manufacturing a suspension substrate according to claim 13 or 14, wherein the second adhesion layer is formed by a plating method.   The method of manufacturing a suspension substrate according to any one of claims 13 to 15, wherein the via layer is formed by a plating method or a printing method. A method for producing a suspension substrate comprising a metal support substrate made of stainless steel, an insulating layer formed on the metal support substrate, and a wiring layer formed on the insulating layer,
An insulating layer forming step of forming the insulating layer having an opening;
An adhesion layer forming step of forming a first adhesion layer, which is a strike plating layer containing Ni or Cu, in the opening of the insulating layer;
A wiring layer forming step of forming the wiring layer on the first adhesion layer;
A method of manufacturing a suspension substrate, wherein the wiring layer in the opening is not protruded from the wiring layer around the opening. A metal supporting board made of stainless steel, a first insulating layer formed on the metal supporting board, a first wiring layer formed on the first insulating layer, and formed on the first wiring layer A method for manufacturing a suspension substrate having a second insulating layer and a second wiring layer formed on the second insulating layer,
A first insulating layer forming step of forming the first insulating layer having an opening;
The opening of the first insulating layer includes a first adhesion layer containing Ni or Cu, and a second adhesion layer formed on the surface of the first adhesion layer and containing a metal, and An adhesion layer forming step of forming an adhesion layer that does not protrude from the second insulating layer;
A via layer forming step of forming a via layer on the adhesion layer;
A second wiring layer forming step of forming a second wiring layer covering the via layer,
A method of manufacturing a suspension substrate, wherein the via layer does not protrude from the second wiring layer. A metal supporting board made of stainless steel, a first insulating layer formed on the metal supporting board, a first wiring layer formed on the first insulating layer, and formed on the first wiring layer A suspension substrate having a second insulating layer and a second wiring layer formed on the second insulating layer,
A first insulating layer forming step of forming the first insulating layer having an opening;
An adhesion layer forming step of forming a first adhesion layer, which is a strike plating layer containing Ni or Cu, in the opening of the first insulating layer;
A second wiring layer forming step of forming the second wiring layer on the first adhesion layer;
The method for manufacturing a suspension substrate, wherein the second wiring layer in the opening is not protruded from the second wiring layer around the opening.

Images