JP2011028829A - Magnetic head suspension and manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a magnetic head suspension of which the problem in a mounting of the magnetic head is eliminated by reducing a height of a conductor connecting material protruding from a surface of the wiring layer, in a substrate for magnetic head suspension laminated on a metal support through an insulating layer, and to provide the manufacturing method thereof. <P>SOLUTION: In the substrate for magnetic head suspension, on which the wiring layers are laminated on the metal support through the insulating layer, the substrate for magnetic head suspension includes an opening penetrating the insulating layer and the wiring layer, and a surface of the metal support exposed by the opening and an internal surface of the opening of wiring layer are connected, and the substrate for suspension is used, in which the conductor connecting material having no connection is arranged on the layer surface of the wiring layer. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention belongs to the technical field of a magnetic head suspension assembly used in a hard disk drive (HDD), and in particular, a suspension board in which wiring for connecting a magnetic head and a control circuit board is integrally formed, The present invention relates to a suspension, a suspension with a head, a hard disk drive, and a method for manufacturing a suspension substrate. The present invention also relates to a circuit board capable of preventing adverse effects on elements due to via terminals.

  In recent years, due to the spread of the Internet and the like, there has been a demand for an increase in the amount of information processing of personal computers and an increase in information processing speed, and along with this, the capacity of hard disk drives (HDD) incorporated in personal computers has increased. Increasing information transmission speed is required. In addition, a component called a magnetic head suspension that supports the magnetic head used in the HDD also has a signal line such as a copper wiring directly formed on a stainless steel spring from a conventional type in which a signal line such as a gold wire is connected. The so-called wireless suspension has been shifted to the integrated wiring type.

  As one method for manufacturing such a wiring-integrated suspension, [Patent Document 1] uses a laminated plate made of a spring metal layer / insulating layer / conductive layer such as stainless steel (SUS), and uses a spring metal layer. And a method of removing a part of the insulating layer by plasma etching after applying a predetermined pattern to the conductive layer. As a result, a magnetic head suspension is obtained in which a plurality of wires for connecting the magnetic head and the control circuit board are integrally formed on the thin metal plate having spring properties via the insulating layer.

  As described above, the magnetic head suspension has a structure in which a plurality of wirings for connecting the magnetic head and the control circuit board are integrally formed through an insulating layer on a thin metal plate having a spring property. Yes. And the metal thin plate which comprises the base material of a suspension (flexure) uses metals, such as flexible SUS, so that the function as a spring may be exhibited at the time of use. However, the metal thin plate functions as a spring as well as a base, but does not play any special role other than that. Therefore, it is advantageous if the thin metal plate can have some additional function for the magnetic head suspension, and it is even more advantageous if this can be done easily.

For the above purpose, in [Patent Document 2], a plurality of wirings for connecting a magnetic head and a control circuit board are integrally formed on a thin metal plate having spring properties through an insulating layer. In the magnetic head suspension, a metal pad made of the same metal layer as the wiring is formed independently of the wiring, and an opening extending from a part of the metal pad through the insulating layer to the metal thin plate is provided. There is described a magnetic head suspension characterized in that a metal pad and a metal thin plate are electrically connected by providing a conductive portion by metal plating.
However, in this method, when the metal connection layer is electroplated on the opening portion of the metal pad, when the plating grows from the metal support to the metal conductor layer, the exposed metal conductor layer other than the opening portion is exposed. Since plating grows also from the surface, when the resist is peeled off, the metal connection layer formed by plating protrudes from the surface of the metal conductor layer, which causes a problem in mounting the magnetic head.

  For example, as a circuit board used for an HDD (Hard Disk Drive), a suspension board on which an element such as a magnetic head slider is mounted is known. The suspension substrate usually has a basic structure in which a first metal layer (for example, SUS), an insulating layer (for example, polyimide), and a second metal layer (for example, Cu) are laminated in this order. It has an element mounting area for mounting elements, and a connection area for connecting to another circuit board at the other end.

  On the other hand, the first metal layer is partially formed in the vicinity of the element mounting region of the suspension board for the purpose of suppressing characteristic changes of the element due to static electricity and reducing electric signal noise. It is known to provide a via terminal that electrically connects a metal part and a second metal part constituting a part of the second metal layer. For example, in FIG. 1 of Patent Document 2, the metal pad 6 is provided in the vicinity of the element mounting portion 5, and the metal pad (second metal portion) 6 and the metal thin plate (first metal portion) 1 are formed on the insulating layer 2. A magnetic head suspension that is electrically connected via a via terminal made of plating through an opening 8 is disclosed.

JP-A-8-180353 JP 2006-202359 A

  In the magnetic head suspension substrate laminated on the metal support via the insulating layer, the height of the conductor connecting material protruding beyond the surface of the wiring layer is reduced, and the magnetic head suspension has solved the problem in mounting the magnetic head. The main purpose is to provide the manufacturing method.

  In addition, when the via terminal is formed by plating as in Patent Document 2, the position of the top of the via terminal is usually higher than the position of the top of the second metal part (or cover part), and the via terminal protrudes. (See FIGS. 14B and 22 to be described later). Even in such a case, as in Patent Document 2, when the via terminal is not located in the element mounting region but at a position away from the element so as not to contact the element, a large problem does not occur.

  On the other hand, when the purpose is to increase the functionality of the circuit board, via terminals may be inevitably arranged in the element mounting region in design. In such a case, if the via terminal protrudes, there is a problem that when the element is mounted on the circuit board, the element is inclined and the connection between the element and the circuit board cannot be performed satisfactorily. Further, since the via terminal and the element are in point contact, there is a possibility that the element may be damaged when stress concentration occurs at the point contact point.

  The present invention has been made in view of the above problems, and a main object of the present invention is to provide a circuit board capable of preventing adverse effects on elements due to via terminals.

  A first aspect of the present invention for solving the above problems is a magnetic head suspension substrate in which a wiring layer is laminated on a metal support via an insulating layer, and the magnetic head suspension substrate includes the insulating layer and the insulating layer. Conductor connection having an opening penetrating the wiring layer, connecting the surface portion of the metal support exposed through the opening and the inner surface portion of the opening of the wiring layer, and having no connection portion on the surface of the wiring layer A suspension substrate, characterized in that a material is provided.

  A second aspect of the present invention for solving the above problems is a magnetic head suspension substrate in which a wiring layer is laminated on a metal support via an insulating layer, and the magnetic head suspension substrate includes the insulating layer and the insulating layer. An opening penetrating the wiring layer, the wiring layer in contact with the opening has an opening peripheral portion formed lower than the surface of the other wiring layer, and the surface portion of the metal support exposed by the opening; A suspension substrate comprising a conductor connecting material for connecting the wiring layer.

  A third aspect of the present invention for solving the above problem is that the periphery of the opening is formed lower than the surface of another wiring layer by etching, and the suspension substrate according to the second aspect of the present invention It is.

  A fourth aspect of the present invention for solving the above problems is that the wiring layer is composed of two conductor layers, and the opening of the wiring layer that passes through the insulating layer and the wiring layer is formed of the two layers. A second feature of the invention is that the periphery of the opening is formed lower than the surface of the other wiring layer by forming the opening in the lower layer of the conductor layer and the opening in the upper layer larger than the opening in the lower layer. It is a board | substrate for suspension as described.

  The fifth of the gist of the present invention for solving the above problems is that the height of the conductor connecting material is the same as or lower than the surface of the wiring layer. It is a board | substrate for suspension as described.

  A sixth aspect of the present invention for solving the above problem is that the conductor connection material and the wiring layer are connected only at a portion lower than the surface of the wiring layer. The suspension substrate according to any one of 1 to 5.

  A seventh aspect of the present invention for solving the above problems is the suspension substrate according to any one of the first to sixth aspects, wherein the conductor connecting material is formed by metal plating. .

  An eighth aspect of the present invention for solving the above problem is the suspension substrate according to the seventh aspect, wherein the metal plating is nickel plating.

  A ninth aspect of the present invention for solving the above problems is the suspension board according to any one of the first to eighth aspects, wherein the conductor connecting material is a ground terminal or a signal transmission terminal. .

  A tenth aspect of the present invention for solving the above problems is a suspension using the suspension substrate according to any one of the first to ninth aspects of the present invention.

  An eleventh aspect of the present invention for solving the above-mentioned problems is a suspension with a head, characterized in that it has the suspension according to the tenth aspect of the present invention and a magnetic head slider mounted on the suspension. is there.

  A twelfth aspect of the present invention for solving the above problems is a hard disk drive using the suspension with a head described in the eleventh aspect of the present invention.

The thirteenth aspect of the present invention for solving the above problems is
In the base material in which the wiring layer is laminated via the insulating layer on the metal support,
Forming an opening penetrating the insulating layer and the wiring layer to expose the surface of the metal support;
Forming a resist layer that exposes the opening of the wiring layer without exposing the layer surface of the wiring layer;
Power feeding from the metal support and metal plating to form a conductor connecting material;
A method for manufacturing a suspension substrate, comprising:

The fourteenth aspect of the present invention for solving the above problem is
A step of preparing a substrate with wiring in which a wiring layer is laminated on a metal support through an insulating layer, the insulating layer and the wiring layer are opened, and an opening is formed so as to expose the surface of the metal support;
Forming the wiring layer so that the height around the opening is lower than the other wiring layers;
Forming a conductor connecting material for connecting the metal support layer and the wiring layer by metal plating on the opening and the periphery of the opening; and
A method for manufacturing a suspension substrate, comprising:

The fifteenth aspect of the present invention for solving the above problems is
The step of forming the height of the wiring layer around the opening is lower than the other wiring layers,
15. The method for manufacturing a suspension substrate according to the fourteenth aspect, wherein a dry film resist is formed except for the opening of the wiring layer and the periphery of the opening and is etched.

The sixteenth aspect of the present invention for solving the above problem is
The step of forming the conductor connecting material includes forming a resist layer that exposes the opening and peripheral portion of the wiring layer without exposing the layer surface of the wiring layer, and metal plating is performed on the opening and wiring layer. According to any one of the thirteenth to fifteenth aspects, the conductor connecting material is formed so as to have a height equal to or less than a height of the wiring layer. This is a method of manufacturing a suspension substrate.

According to the first to sixth inventions of the above summary, since the conductor connecting material does not have a protruding portion, the magnetic head slider can be connected with high accuracy, and the yield can be prevented from being lowered due to poor connection. For this reason, connection with components mounted on the suspension substrate of the present invention, such as a magnetic slider, can be facilitated.
Moreover, since there is no protrusion in the conductor connecting material, it can be mounted while maintaining the parallelism to the metal support of the magnetic head slider,
When the suspension substrate of the present invention is used in a hard disk drive, the accuracy of data reading and writing can be increased.

  According to the seventh aspect of the present invention, the metal support layer and the wiring layer can be electrically and reliably connected in a fine opening. According to the eighth aspect of the present invention, nickel (Ni) is used. Because it is used, it has excellent electrical conductivity, is inexpensive, and has material properties with excellent corrosion resistance.

  According to the ninth aspect of the present invention, the conductor connecting material releases the charge accumulated in the magnetic head slider to the metal support to remove static electricity, suppresses noise contained in the signal wiring, and transmits an electric signal. Therefore, the accuracy of reading and writing data can be increased.

  According to a tenth aspect of the present invention, there is provided a suspension including the suspension substrate. According to the present invention, when the suspension is used in a hard disk drive, the accuracy of data reading and writing can be increased.

  According to an eleventh aspect of the present invention, there is provided a suspension with a head comprising the suspension and a magnetic head slider mounted on the suspension. According to the present invention, when the suspension with a head is used in a hard disk drive, the accuracy of data reading and writing can be increased.

  According to a twelfth aspect of the present invention, there is provided a hard disk drive including the suspension with a head. According to the present invention, since it is a hard disk drive including the suspension with the head, it is possible to improve the accuracy of data reading and writing, and as a result, it is possible to achieve excellent data reliability and the like. .

  According to the thirteenth to sixteenth aspects of the present invention, a suspension substrate having the characteristics of the first to ninth aspects of the present invention can be manufactured.

  In order to solve the above problems, the present invention includes a basic structure in which a first metal layer, an insulating layer, and a second metal layer are stacked in this order, and constitutes a part of the first metal layer. Constituting one metal part, a part of the insulating layer, an insulating part having an insulating layer opening formed so as to expose the first metal part, and a part of the second metal layer; A second metal portion having a second metal layer opening formed so that the first metal portion is exposed from the insulating layer opening, and the insulating layer opening and the second metal layer opening, A via portion having a first metal portion and a via terminal made of plating for electrically connecting the second metal portion, and the via terminal is formed in or near an element mounting region for mounting an element. The circuit board, wherein the second metal part is an end of the second metal layer opening. And a top surface of the thin portion is covered with the via terminal, and the via terminal has a shape that does not protrude from the via portion (excluding the via terminal). Providing a substrate.

  According to the present invention, since the via terminal has a shape that does not protrude from the via portion, it is possible to prevent the element from being inclined when the element is mounted on the circuit board. Thereby, a connection with an element and a circuit board can be performed favorably.

  In the above invention, the via portion preferably includes a cover portion having an opening formed on the second metal portion so that the via terminal is exposed. This is because by adding the thickness of the cover portion as the thickness of the via portion, it becomes easy to form a via terminal having a shape that does not protrude from the via portion.

  In the said invention, it is preferable that the edge part of the opening part of the said cover part is located inside the outer side edge part formed of the said thin part. Thereby, a protrusion is formed on the cover, and the plating thickness by the protrusion can be controlled.

  The present invention also provides a suspension substrate, which is the circuit substrate described above.

  According to the present invention, when the above-described circuit board is used as a suspension substrate, when the element is mounted, the inclination of the element can be prevented and the connection between the element and the suspension substrate can be performed satisfactorily.

  The present invention also provides a suspension including the above-described suspension substrate.

  According to the present invention, by using the above-described suspension substrate, it is possible to obtain a suspension having good connectivity with the element.

  The present invention also provides an element-equipped suspension comprising the above-described suspension and an element mounted in an element mounting region of the suspension.

  According to the present invention, by using the above-described suspension, a suspension with an element having good connectivity between the element and the suspension can be obtained.

  The present invention also provides a hard disk drive including the above-described suspension with an element.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  Further, in the present invention, the first metal layer, the insulating layer, and the second metal layer have a basic structure in which the first metal layer, the second metal layer, and the insulating layer. An insulating part having an insulating layer opening formed so as to expose the first metal part, and a part of the second metal layer, the first part extending from the insulating layer opening. A second metal part having a second metal layer opening formed so as to expose the metal part; and the first metal part and the second metal through the insulating layer opening and the second metal layer opening. A circuit board manufacturing method comprising a via portion having a via terminal made of plating for electrically connecting a metal portion, wherein the via terminal is formed in or near an element mounting region for mounting an element. The first metal part, the insulating part and the second metal part, The second metal part has a thin part formed along the end of the second metal layer opening, and has a via part having a mask part that masks plating when the via part is formed on the second metal part. A plated member forming step for forming a plated member having a portion, and a plating step for forming the via terminal by growing plating by feeding from the first metal portion of the plated member. In the plating process, the top surface of the thin portion is covered with the via terminal, and the via terminal is shaped so as not to protrude from the via portion (excluding the via terminal). A manufacturing method is provided.

  According to the present invention, by using the member to be plated having a thin portion, a via terminal having a shape that does not protrude from the via portion can be easily formed. As a result, when the element is mounted on the circuit board, the element can be prevented from being inclined, and the connection between the element and the circuit board can be performed satisfactorily.

  In the said invention, it is preferable that the said mask part is a cover part or a dry film resist part. This is because a desired circuit board can be obtained without significantly changing the conventional manufacturing method.

  In the present invention, by defining the shape and manufacturing method of the conductor connecting material as described above, the conductor connecting material is formed such that the height of the conductor connecting material is the same as or lower than the surface of the wiring layer. Thus, in the area where the magnetic head slider is mounted, the conductor connecting material can be prevented from hindering the mounting of the magnetic head slider. For this reason, the magnetic head slider can be placed at any position, and the high degree of freedom in wiring design enables high-density mounting, reducing the size and cost of the device, and improving data reliability. Benefits such as improvement are obtained.

  In addition, the present invention has an effect that the adverse effect on the element due to the via terminal can be prevented.

It is sectional drawing which shows an example of the 1st aspect of the board | substrate for magnetic head suspensions of this invention. It is sectional drawing which shows an example of the 2nd aspect of the board | substrate for magnetic head suspensions of this invention. It is sectional drawing explaining the example of the opening part of the 2nd aspect of the board | substrate for magnetic head suspensions of this invention. It is process drawing explaining an example of the manufacturing method of the 1st form of the board | substrate for magnetic head suspensions of this invention. It is process drawing explaining an example of the manufacturing method of the 2nd form of the board | substrate for magnetic head suspensions of this invention. It is a figure explaining the 1st Example of the board | substrate for magnetic head suspensions of this invention. It is a figure explaining the 2nd Example of the board | substrate for magnetic head suspensions of this invention. It is the schematic which shows an example of the suspension of this invention. It is the schematic which shows an example of the suspension with a head of this invention. It is the schematic which shows an example of the internal structure of the hard-disk drive of this invention. It is sectional drawing which shows an example of the board | substrate for the conventional magnetic head suspension. It is a schematic plan view which shows an example of the circuit board of this invention. FIG. 13 is an enlarged view showing the vicinity of an element mounting region 201 in FIG. 12. It is a schematic sectional drawing which compares the via part in this invention, and the conventional via part. It is a schematic sectional drawing explaining the effect of this invention. It is a schematic sectional drawing explaining the thin part in this invention. It is a schematic sectional drawing explaining the via part in this invention. It is a schematic sectional drawing explaining the via part in this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the circuit board of this invention. It is a schematic sectional drawing which shows the other example of the manufacturing method of the circuit board of this invention. It is a schematic sectional drawing explaining the via installation part in this invention. It is a schematic sectional drawing which shows an example of the manufacturing method of the circuit board in the past. It is a schematic sectional drawing explaining the to-be-plated member formation process in this invention. It is a schematic sectional drawing explaining the to-be-plated member formation process in this invention. It is a schematic sectional drawing explaining the to-be-plated member before forming a thin part. It is a schematic sectional drawing explaining the to-be-plated member which has a thin part. It is a schematic sectional drawing explaining the via part in this invention. 6 is a cross-sectional photograph of a via portion obtained in Example 3.

  The present invention relates to a suspension board, a suspension using the same, a suspension with a head, and a hard disk drive. Hereinafter, these will be described in detail. Further, the circuit board, circuit board manufacturing method, suspension board, suspension, suspension with element, and hard disk drive of the present invention will be described in detail.

A. First, the suspension substrate of the present invention will be described. In the suspension substrate of the present invention, a wiring layer is laminated on a metal support through an insulating layer, and the surface of the metal support that has an opening penetrating the insulating layer and the wiring layer and is exposed through the opening. A conductor connecting material that connects the portion and the inner surface of the opening of the wiring layer and has no connection portion on the surface of the wiring layer, and a metal support. A wiring layer is laminated on the insulating layer, and has an opening penetrating the insulating layer and the wiring layer, and the wiring layer in contact with the opening is formed lower in the periphery of the opening than the surface of the other wiring layer And a conductor connecting material for connecting the surface portion of the metal support exposed through the opening and the wiring layer can be provided (second embodiment). Hereinafter, the suspension substrate of the present invention will be described in each embodiment.

1. First Aspect First, a first aspect of the suspension substrate of the present invention will be described. In the suspension substrate of this aspect, a wiring layer is laminated on a metal support through an insulating layer, and the surface of the metal support that has an opening penetrating the insulating layer and the wiring layer is exposed through the opening. And a conductor connecting material that does not have a connecting portion is provided on the surface of the wiring layer.

  Such a suspension substrate of this aspect will be described with reference to FIG. FIG. 1 is a cross-sectional view showing an example of the suspension substrate of this embodiment. The suspension substrate according to this aspect includes a metal support 1, an insulating layer 2 formed on the support 1, a wiring layer 3 laminated via the insulating layer 2, and the metal support 1 and the wiring layer. 3 is provided with a conductor connecting material 4 for connecting 3. Here, the suspension substrate of this aspect connects the surface portion 62 of the metal support 1 where the conductor connecting material 4 is exposed through the opening 7 and the opening inner surface portion 61 of the wiring layer 3, so that the wiring layer 3 The layer surface 5 is formed so as not to have a connection portion.

The height of the conductor connecting material 4 is formed to be the same as or less than the layer surface 5 of the wiring layer 3. Here, it is assumed that the wiring layers 3 are formed to be the same or smaller than that in FIG. 1, the thickness of the wiring layer 3 is X3, the thickness of the insulating layer 2 is X2, and the conductor connection is made from the surface portion 62 of the metal support. If the height of the conductor connecting material 4 up to the connecting material surface 6 of the material 4 is Y, X2 <Y ≦ X
It shows that it is formed at a height that satisfies the range of 2 + X3. Especially, it is preferable that the conductor connection material 4 is formed with the height which satisfy | fills the range of X2 + (X3) / 2 <= Y <= X2 + X3. This is because if the conductor connecting material 4 is formed within the above range, the connection reliability is further improved.

  By forming the conductor connecting material 4 at the above height, the connection between the conductor connecting material 4 and the wiring layer 3 does not have a connecting portion on the layer surface 5 of the wiring layer 3, and the wiring It is carried out only in the part below the layer surface 5 of the layer 3.

  In the conventional suspension substrate, as shown in the cross-sectional view illustrated in FIG. 11, the wiring layer 73 is laminated on the metal support 1 via the insulating layer 72, and penetrates the insulating layer 72 and the wiring layer 73. The surface portion 762 of the metal support 71 having an opening 77 and exposed through the opening 77 is connected to the opening inner surface portion 761 of the wiring layer 73, and the conductor connecting material 74 is also applied to the layer surface 75 of the wiring layer 73. Is formed. For this reason, when the conductor connecting material 74 is formed at the magnetic head slider position, the surface 76 of the conductor connecting material 74 protrudes beyond the layer surface 75 of the wiring layer 73, which hinders the mounting of the magnetic head slider. There was a problem.

  On the other hand, according to this aspect, since the conductor connection material 4 is formed so as not to have a connection portion on the layer surface 5 of the wiring layer 3, the conductor connection material 4 does not have a protruding shape, and the magnetic head The slider can be mounted with high accuracy, and a decrease in yield due to poor connection can be prevented.

  The suspension substrate of this aspect has at least a metal support, an insulating layer, wiring, and a conductor connecting material. Hereinafter, each configuration of the suspension substrate according to this aspect will be described.

(1) Wiring The wiring layer used for this aspect is formed on an insulating layer. When the suspension board of the present invention is used in a hard disk drive, the wiring layer is a signal wiring for transmitting data written to the disk via a slider or data read from the disk as an electrical signal. This layer is a grounding wiring layer for releasing the charge accumulated in the magnetic head slider to the metal support and reducing noise contained in the signal wiring.

  Examples of the material for the wiring layer used in the present invention include copper (Cu).

  The thickness of the wiring layer used in the present invention is not particularly limited as long as desired electrical conductivity can be exhibited, but it is usually preferably in the range of 4 μm to 18 μm, and more preferably 5 μm to It is preferable to be within the range of 14 μm. This is because, if it is within the above range, the suspension substrate of the present invention can be prevented from becoming an obstacle when components such as a slider are mounted.

  The line width of the wiring layer used in the present invention is not particularly limited as long as it can exhibit desired conductivity, but is preferably in the range of 10 μm to 100 μm. It is preferably within the range of 15 μm to 50 μm. By being in the above range, the wiring layer can be stably formed even when the pitch is narrowed by increasing the density.

  The pitch width of the wiring layer used in the present invention is preferably within a range of 30 μm to 200 μm at the narrowest portion, and more preferably within a range of 30 μm to 100 μm.

In general, the wiring layer used in the present invention preferably has a protective plating layer formed of nickel (Ni) or gold (Au) on the surface thereof. This is because the wiring layer can be made resistant to corrosion.
Further, the thickness of the protective plating layer is not limited as long as the corrosion resistance can be ensured, but is preferably 5 μm or less, and more preferably in the range of 1 μm to 2 μm.
Further, the wiring layer may be partially covered with a cover lay that is superior in insulation reliability as compared with the protective plating layer.

(2) Conductor connection material The conductor connection material used for this aspect connects the surface of a metal support body and the said wiring layer. In addition to being a ground terminal, the conductor connecting material is a signal transmission terminal.

  When the conductor connecting material is connected to the ground wiring, it has a function as a ground terminal. Here, when the main function of the ground terminal is formed in the magnetic head slider installation position of the suspension board, it is a static electricity removing function for letting the electric charge accumulated in the magnetic head slider escape to the metal support. In the case where it is formed at the tip of the suspension substrate and when it is formed between the signal wirings other than the tip of the suspension substrate and is not connected to the magnetic head slider, the signal This is a noise suppression function for reducing noise included in the wiring.

  When the conductor connecting material is connected to the signal wiring, it has a function as a signal transmission terminal. The main function of the signal transmission terminal is a function of connecting and transmitting the metal support and the signal wiring using the data written to the disk via the magnetic head slider or the data read from the disk as an electrical signal.

The metal for a conductor connection material forming the conductor connection material used in the present invention is not particularly limited as long as it is a metal having conductivity, but is a metal having excellent adhesion to a metal support. Is preferred. Specifically, silver (Ag), gold (Au), copper (Cu), nickel (Ni) and the like can be used, and among them, copper (Cu) and nickel (Ni) can be preferably used. Nickel (Ni) can be preferably used. This is because it is highly conductive and inexpensive. Moreover, it is because it is a material excellent in corrosion resistance.
These materials can be identified by XPS (X-ray Photoelectron Spectroscopy).
As a result, a decrease in yield due to poor connection can be prevented, and when used in a hard disk drive or the like, data can be read stably via the slider.

  When nickel is used as the metal for the conductor connection material and the conductor connection material is formed by an electrolytic plating method as shown in the manufacturing method described later, the conductor connection material is formed in a desired shape as the electrolytic Ni plating solution. However, a Watt bath, a sulfamic acid bath, or the like can be used. Moreover, it is possible to adjust glossiness and film | membrane stress by adding an additive to a plating bath suitably.

(3) Insulating layer The insulating layer used in the present invention is formed on a metal support.

  Examples of the material for the insulating layer include polyimide (PI).

  The thickness of the insulating layer is not particularly limited as long as a desired insulating property can be exhibited, but is usually about 5 μm to 30 μm.

(4) Metal support The metal support used for this invention has electroconductivity, and since it is used for a suspension use, it usually has moderate springiness.

  Examples of the material for the metal support include SUS.

  In this invention, it is preferable that the said metal support body has a conductive layer in the surface side in which a conductor connection material is formed. This is because by providing the conductive layer, conduction by the conductor connecting material becomes more efficient. Specific examples of the material for the conductive layer include copper (Cu). The conductive layer can be formed by, for example, a plating method.

  The thickness of the metal support is not particularly limited as long as the desired spring characteristics can be exhibited, and varies depending on the material of the metal support, but usually 10 μm to 30 μm. However, it is preferable to be in the range of 15 μm to 25 μm.

  Next, an example of a method for manufacturing the suspension substrate according to this aspect will be described with reference to FIG. It is not particularly limited as long as each configuration of the suspension substrate can be accurately arranged at a desired position. For example, as shown in FIG. A laminated body formed on the metal support 1 and having an insulating layer 2 made of a material constituting the insulating layer and a wiring layer 3 made of a material constituting the signal wiring and the ground wiring is formed. Next, a photoresist 8b such as DFR is provided on the laminate and patterned into a predetermined shape (FIG. 4B). Thereafter, the wiring layer 3 is patterned by etching, and the photoresist 8b is peeled off to form a ground wiring and a signal wiring having an opening 7 (FIG. 4C). Thereafter, a photoresist 8b such as DFR is provided and patterned into a predetermined shape (FIG. 4D), and then the insulating layer 2 is patterned by etching, and the photoresist 8b is peeled off, whereby the insulating layer 2 And an insulating layer 2 having an opening 7 penetrating the wiring layer 3 and exposing the surface portion 62 of the metal support 1 is formed (FIG. 4E).

  Subsequently, a photoresist 8b such as DFR is provided and patterned so as to expose the opening 7 of the wiring layer without exposing the layer surface 5 of the wiring layer 3 (FIG. 4F). Next, using the metal support 1 as a power feeding layer, the conductor connection material 4 is formed at a height equal to or lower than the layer surface 5 of the wiring layer 3 by metal plating as the ground terminal or the signal transmission terminal. Next, by removing the photoresist 8b, the suspension of this embodiment can be manufactured (FIG. 4G).

2. Second Aspect Next, a second aspect of the suspension substrate of the present invention will be described. The suspension substrate of this aspect has a wiring layer laminated on a metal support through an insulating layer, and has an opening penetrating the insulating layer and the wiring layer. It is an aspect characterized by having a peripheral part of the opening formed lower than the surface of the wiring layer, and a conductor connecting material for connecting the surface part of the metal support exposed through the opening and the wiring layer. .

  Such a suspension substrate of this embodiment will be described with reference to FIG. FIG. 2 is a cross-sectional view showing an example of the conductor connecting material of the magnetic head suspension board of the present invention. A metal support 1, an insulating layer 2 formed on the support 1, a wiring layer 3 laminated via the insulating layer 2, and a conductor connecting material 4 connecting the metal support 1 and the wiring layer 3. It is what has. Here, the suspension substrate of this aspect includes an opening peripheral portion 60 lower than the layer surface 5 of the wiring layer 3 where the conductor connecting material 4 is in contact with the opening 7, and a surface portion 62 of the metal support 1 exposed by the opening 7. Are formed so as not to have a connecting portion on the layer surface 5 of the wiring layer 3.

  Here, the suspension board of this aspect is characterized in that the opening peripheral portion 60 is formed lower than the surface 5 of the wiring layer 3 by etching. Here, when the thickness of the wiring layer 3 is X3 and the depth to the opening peripheral bottom 63 at the lowest position among the opening peripheral portion 60 formed by etching and the layer surface 5 of the wiring layer is Z, It is preferable that the opening peripheral portion 60 lower than the layer surface 5 of the wiring layer 3 is formed at a depth satisfying the range of 0 <Z <X3. In particular, it is preferable to be formed with a depth satisfying the range of (X3) / 6 ≦ Z ≦ 5 (X3) / 6. This is because if the opening peripheral portion 60 lower than the wiring layer surface 5 is formed at a depth in the above range, the area where the conductor connecting material 4 is connected to the inner surface portion 61 of the wiring layer 3 is increased, and the connection reliability is improved. Because.

  FIG. 3 is a cross-sectional view described as an example other than FIG. 2 in which the peripheral portion of the opening is formed lower than the surface of the other wiring layer by etching, and the second mode may be this embodiment. . In FIG. 3A, the wiring layer 3 is composed of two layers of metal 3a and metal 3b, and an opening peripheral portion 60 lower than the surface of the wiring layer is formed around the opening 7 of the upper metal 3b. In FIG. 3B, the wiring layer 3 is composed of two layers of the metal 3a and the metal 3b, and the opening diameter of the upper metal 3b is set larger than the opening diameter of the lower metal 3a. An opening peripheral portion 60 lower than the surface of the wiring layer is formed around the periphery. FIG. 3C shows an example in which the periphery of the opening 7 of the wiring layer 3 is tapered, and FIG. 3D shows an example in which the periphery of the opening 7 of the wiring layer 3 is formed with concave portions having different steps. Show. Any of the above examples of openings can be formed in a combination of resist pattern formation and etching or plating.

  The height of the conductor connecting material 4 is formed to be the same as or less than the layer surface 5 of the wiring layer 3. Here, it is formed so as to be the same or less than that, from FIG. 2, the thickness of the wiring layer 3 is X3, the thickness of the insulating layer 2 is X2, and the conductor connection is made from the surface portion 62 of the metal support. If the height of the conductor connecting material 4 up to the connecting material surface 6 of the material 4 is Y, it indicates that the conductor connecting material 4 is formed at a height that satisfies the range of X2 <Y ≦ X2 + X3. Especially, it is preferable that the conductor connection material 4 is formed with the height which satisfy | fills the range of X2 + (X3) / 2 <= Y <= X2 + X3. This is because if the conductor connecting material 4 is formed within the above range, the connection reliability is further improved.

  By forming the conductor connecting material 4 at the above height, the connection between the conductor connecting material 4 and the wiring layer 3 does not have a connection portion on the layer surface 5 of the wiring layer 3, and the wiring layer 3. This is performed only in a portion lower than the surface 5 of the layer.

  The conventional suspension substrate has a shape in which the conductor connecting material protrudes from the surface of the wiring layer when the conductor connecting material is formed at the magnetic head slider position, as described in the section “1. First aspect” above. Thus, there is a problem that the mounting of the magnetic head slider is hindered.

  Also in this aspect, as described in the above section “1. First aspect”, the conductor connection material is formed so as not to have a connection portion on the surface of the wiring layer, so that the conductor layer protrudes. Therefore, the magnetic head slider can be mounted with high accuracy and the yield can be prevented from being lowered due to poor connection.

  The suspension board of this aspect has at least a metal substrate, an insulating layer, a wiring, and a conductor connecting material, and has the same contents as those described in the section “1. First aspect”. Is omitted.

  Next, an example of a manufacturing method of the suspension board of this aspect will be described with reference to FIG. It is not particularly limited as long as each configuration of the suspension substrate can be accurately arranged at a desired position. For example, as shown in FIG. A laminated body formed on the metal support 1 and having an insulating layer 2 made of a material constituting the insulating layer and a wiring layer 3 made of a material constituting the signal wiring and the ground wiring is formed. Next, a photoresist 8b such as DFR is provided on the laminate and patterned into a predetermined shape (FIG. 5B). Thereafter, the wiring layer 3 is patterned by etching, and the photoresist 8b is peeled off to form a ground wiring and a signal wiring having an opening 7 (FIG. 5C).

  Thereafter, a photoresist 8b such as DFR is provided and patterned so as to remove the opening 7 of the wiring layer and the periphery of the opening 60 (FIG. 5D). Next, the opening peripheral portion 60 of the wiring layer is formed so as to be lower than the wiring layer 3 by a bipolar phenomenon that occurs during chemical etching, electrolytic etching, or electrolytic etching (FIG. 5E). ). Next, the insulating layer 2 is patterned by etching, and the photoresist 8b is peeled off so that the opening 7 has an opening 7 penetrating the insulating layer 2 and the wiring layer 3, and the metal support The insulating layer 2 from which the surface portion 62 of the body 1 is exposed is formed (FIG. 5F).

  Subsequently, a photoresist 8b such as DFR is provided and patterned so as to expose the opening 7 and the opening peripheral portion 60 of the wiring layer 3 without exposing the layer surface 5 of the wiring layer 3 (FIG. 5G). Then, using the metal support 1 as a power feeding layer, the opening 7 and the opening peripheral portion 60 of the wiring layer 3 are formed by metal plating as the ground terminal or the signal transmission terminal, thereby forming a wiring layer. The conductor connection material 4 is formed at a height equal to or less than the layer surface 5 of 3. Next, by removing the photoresist 8b, the suspension of this embodiment can be manufactured (FIG. 5 (h)).

B. Suspension Next, the suspension of the present invention will be described. The suspension of the present invention includes the above-described suspension substrate.

Such a suspension of the present invention will be described with reference to the drawings. FIG. 8 is a schematic view showing an example of the suspension of the present invention. As illustrated in FIG. 8, the suspension 30 of the present invention includes the suspension substrate 10 and a load beam 31, and the load beam 31 is a slider on the suspension substrate 10 on which a magnetic head slider is installed. It is adhered to the surface on the side where the installation position 20 is not formed.
Here, the suspension substrate is the suspension substrate described in the section “A. Suspension substrate”.

  According to the present invention, since the suspension substrate is included, when used in a hard disk drive, the accuracy of data reading and writing can be increased.

  The suspension of the present invention has at least the suspension substrate. Such a suspension substrate is the same as the content described in the above section “A. Suspension substrate”, and thus the description thereof is omitted here.

  The suspension of the present invention has at least the suspension substrate, but usually has a load beam. As such a load beam, any material can be used as long as it can give a desired rigidity to the suspension when the suspension of the present invention is used in the hard disk drive. Can be used.

  As an application of the suspension of the present invention, a suspension with a head of a hard disk drive can be mentioned, and among these, it is preferably used for a suspension with a head that requires high data reading and writing accuracy.

C. Next, the suspension with a head according to the present invention will be described. A suspension with a head according to the present invention includes the suspension and a magnetic head slider mounted on the suspension.

Such a suspension with a head according to the present invention will be described with reference to the drawings. FIG. 9 is a schematic view showing an example of a suspension with a head according to the present invention. As illustrated in FIG. 9, the suspension with head 40 of the present invention includes the suspension 30 and a magnetic head slider 41 mounted on a slider installation position on the suspension 30.
Here, the suspension is the suspension described in the section “B. Suspension”.
Note that the reference numerals in FIG. 9 are the same as those in FIG.

  According to the present invention, since the suspension is included, when used in a hard disk drive, the accuracy of data reading and writing can be improved.

The suspension with a head of the present invention has at least the suspension and the magnetic head slider.
The suspension is the same as that described in the section “B. Suspension”, and thus the description thereof is omitted here.

  The magnetic head slider used in the present invention is not limited as long as it can write and read data on the disk when the suspension with a head of the present invention is used in a hard disk drive. What is used can be used.

  As an application of the suspension with a head of the present invention, a hard disk drive can be cited, and among these, it is preferably used for a hard disk drive that requires high data reading and writing accuracy.

D. Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention includes the above suspension with a head.

Such a hard disk drive of the present invention will be described with reference to the drawings. FIG. 10 is a schematic plan view showing an example of the internal structure of the hard disk drive of the present invention. As illustrated in FIG. 10, the hard disk drive 50 of the present invention includes a suspension 40 with a head, a disk 51 on which data is written to and read from the suspension 40 with a head, and a spindle motor 52 that rotates the disk 51. An arm 53 connected to the suspension 40 with the head, a voice coil motor 54 that moves the slider of the suspension 40 with the head to a desired position on the disk 51 by moving the arm 53, and the above And a case 55 for sealing each component.
Here, the suspension with a head is the suspension described in the section “C. Suspension with a head”.

  According to the present invention, since the suspension with the head is included, when used in a hard disk drive, the accuracy of data reading and writing can be improved. As a result, the data reliability and the like can be improved.

The hard disk drive of the present invention has at least the above suspension with a head.
Such a suspension with a head is the same as the content described in the section “C. Suspension with a head”, and therefore, description thereof is omitted here.

  The hard disk drive of the present invention has at least the above suspension with a head, but usually has a disk, a spindle motor, an arm, and a voice coil motor. As such a disk, a spindle motor, an arm, and a voice coil motor, those generally used for hard disk drives can be used.

E. Circuit Board Next, the circuit board of the present invention will be described. The circuit board of the present invention has a basic structure in which a first metal layer, an insulating layer, and a second metal layer are laminated in this order, and includes a first metal portion that constitutes a part of the first metal layer, and the insulating layer. An insulating part having an insulating layer opening formed so as to expose the first metal part, and a part of the second metal layer, the first part extending from the insulating layer opening. A second metal part having a second metal layer opening formed so as to expose the metal part; and the first metal part and the second metal through the insulating layer opening and the second metal layer opening. A circuit board having a via portion having a via terminal made of plating for electrically connecting the metal portion, wherein the via terminal is formed in or near an element mounting region for mounting an element. The bimetallic part has a thin part along the end of the second metal layer opening, Top surface of the parts is covered by the via terminals, the via terminal is characterized in that a shape which does not protrude from the via portion (excluding the via terminals).

  According to the present invention, since the via terminal has a shape that does not protrude from the via portion, it is possible to prevent the element from being inclined when the element is mounted on the circuit board. Thereby, a connection with an element and a circuit board can be performed favorably. In addition, since the via terminal has a shape that does not protrude, the via terminal and the element are not in point contact, and damage to the element due to stress concentration can be prevented. Further, according to the present invention, since the via portion has a thin portion, the first metal portion and the second metal portion can be reliably connected even when the via terminal does not protrude. .

  FIG. 12 is a schematic plan view showing an example of the circuit board of the present invention. More specifically, it is a schematic plan view showing an example of a suspension substrate used in an HDD. For convenience, the cover layer is not shown. A suspension substrate 210 shown in FIG. 12 has an element mounting area 201 for mounting an element at one end, and a connection area for connecting to another circuit board at the other end. 202. Further, the suspension substrate 210 has wiring 203 (wirings 203a to 203d) for connecting the element mounting region 201 and the connection region 202. The wirings 203a and 203b and the wirings 203c and 203d form a wiring pair, one for recording and the other for reproduction. As shown in FIG. 13, the present invention is characterized in that the via terminal 104 of the via portion 110 is formed in (or in the vicinity of) the element mounting region 201.

  FIG. 14 is a schematic cross-sectional view comparing the via portion in the present invention and the conventional via portion. 14 is a cross-sectional view corresponding to the AA ′ cross section of FIG. As shown in FIG. 14A, the via portion 110 in the present invention includes a first metal portion 101, an insulating portion 102 having an insulating layer opening 102a formed so that the first metal portion 101 is exposed, A second metal part 103 having a second metal layer opening 103a formed so that the first metal part 101 is exposed from the insulating layer opening 102a, and the insulating layer opening 102a and the second metal layer opening 103a. The first metal part 101 and the second metal part 103 are electrically connected to the via terminals 104 made of plating. The second metal portion 103 has a thin portion 105 along the end of the second metal layer opening 103 a, and the top surface of the thin portion 105 is covered with the via terminal 104. Furthermore, one feature is that the via terminal 104 has a shape that does not protrude from the via portion 110 (excluding the via terminal 104). In that case, the thickness X of the via terminal 104 is equal to or less than the thickness Y of the via part 110 excluding the via terminal 104 and the first metal part 101. In FIG. 14A, the values of X and Y are the same. However, as will be described later, when a cover portion or the like is provided on the second metal portion 103, the value of X is greater than the value of Y. Becomes smaller.

  As described above, one feature of the present invention is that the via terminal 104 has a shape that does not protrude from the via portion 110 (excluding the via terminal 104). The reason for removing the via terminal 104 from the via portion 110 is that the via terminal 104 itself is a component of the via portion 110. That is, even if the via terminal 104 protrudes from the second metal portion 103 or the like, the via terminal 104 itself is a constituent element of the via portion 110, so the top portion of the via terminal 104 and the top portion of the via portion 110 are always one. The via terminal 104 cannot protrude from the via portion 110. In FIG. 14A, the top portion of the via terminal 104 has a lower shape than the top portion of the second metal portion 103 (the top portion of the member excluding the via terminal 104 from the via portion 110). Although not shown, when a cover portion described later is formed on the second metal portion 103, the via portion has a cover portion, so the top portion of the via terminal 104 is the top portion of the cover portion. The shape is lower than (the top of the member excluding the via terminal 104 from the via portion 110).

  On the other hand, as shown in FIG. 14B, in the conventional via portion 110, since the second metal portion 103 does not have the thin portion 105, the via terminal 104 protrudes from the via portion 110 (excluding the via terminal 104). The shape becomes. Specifically, the top portion of the via terminal 104 has a higher shape than the top portion of the second metal portion 103 (the top portion of the member excluding the via terminal 104 from the via portion 110). Further, the thickness X of the via terminal 104 is larger than the thickness Y of the via part 110 excluding the via terminal 104 and the first metal part 101. Note that a conventional method for forming a via portion will be described later with reference to FIG.

  Next, the effect of the present invention will be described with reference to FIG. FIG. 15 is a schematic cross-sectional view when the element 120 is mounted on the element mounting region 201 having the via part 110. FIG. 15A shows a mode in which a conventional via portion 110 and a wiring portion 111 are formed in the element mounting region 201. In this case, the via portion 110 has a shape in which the via terminal 104 protrudes, and the position of the top portion is higher than the second metal portion 103 of the wiring portion 111. Therefore, when the element 120 is mounted on the element mounting region 201 via the adhesive portion 115, the element 120 is inclined. As a result, there is a problem that the connection between the element 120 and the circuit board cannot be performed satisfactorily. Furthermore, since the via terminal 104 and the element 120 are in point contact, there is a possibility that the element 120 may be damaged when stress concentration occurs at the point contact point.

  FIG. 15B shows a mode in which two conventional via portions 110 are formed in the element mounting region 201. A plurality of via portions 110 may be formed in the element mounting region 201 as the functionality of the circuit board increases. In this case, the two via portions 110 have shapes in which the via terminals 104 protrude. The thickness of the via terminal 104 usually greatly depends on the area of the metal part exposed during plating. The area of the exposed metal part depends on the patterning accuracy of the dry film resist or the like. The thickness of the via terminal 104 also depends on the electric resistance value during plating for forming the via portion. Due to the above factors, when the plurality of via portions 110 are formed, the height of each via terminal varies slightly, and as a result, the element 120 is inclined as in FIG. 15A. There are problems such as.

On the other hand, as shown in FIG. 15C, the via portion 110 in the present invention has a thin portion 105 and has a shape in which the via terminal 104 does not protrude, so that the inclination of the element 120 can be prevented. Thus, the connection between the element 120 and the circuit board can be performed satisfactorily.
Hereinafter, the circuit board of the present invention will be described separately for the circuit board member and the circuit board configuration.

1. Circuit Board Members First, the circuit board members of the present invention will be described. The circuit board of the present invention has a basic structure in which a first metal layer, an insulating layer, and a second metal layer are laminated in this order. Furthermore, the circuit board of the present invention includes a first metal part, an insulating part, a second metal part, and a via part having at least a via terminal.

(1) First metal layer and second metal layer The first metal layer and the second metal layer in the present invention are not particularly limited as long as they have conductivity, and are appropriately selected depending on the type of circuit board. Is to be selected. In the present invention, a portion constituting the via portion in the first metal layer is referred to as a first metal portion. Similarly, in the second metal layer, a portion constituting the via portion is referred to as a second metal portion.

  For example, when the circuit board of the present invention is a suspension board, the first metal layer usually has a function as a support board. Further, such a support substrate has a predetermined spring property. Examples of the material of the first metal layer include SUS. Moreover, as thickness of a 1st metal layer, although it changes with the materials etc., it exists in the range of 10 micrometers-20 micrometers normally. When the circuit board of the present invention is a suspension board, the second metal layer usually has a function as a wiring. Examples of the material of the second metal layer include copper (Cu). Moreover, as thickness of a 2nd metal layer, it is in the range of 5 micrometers-18 micrometers, for example, and it is preferable that it is in the range of 9 micrometers-12 micrometers especially.

  In this invention, when using a part of 2nd metal layer as wiring, it is preferable that the gold plating layer is formed in the surface. This is because corrosion of the wiring can be suppressed. The thickness of the gold plating layer is, for example, in the range of 0.1 μm to 4.0 μm. In the present invention, an Ni plating layer may be provided between the wiring and the gold plating layer.

(2) Insulating layer The insulating layer in the present invention is formed between the first metal layer and the second metal layer. The material of the insulating layer is not particularly limited as long as desired insulating properties can be exhibited. For example, when the circuit board of the present invention is a suspension board, for example, polyimide (PI) can be used as the material of the insulating layer. Moreover, the thickness of an insulating layer exists in the range of 5 micrometers-10 micrometers, for example.

(3) Via Terminal The via terminal in the present invention is made of plating for electrically connecting the first metal part and the second metal part in the via part. Examples of the material for the via terminal include nickel (Ni), silver (Ag), gold (Au), and copper (Cu). Of these, nickel (Ni) is preferable. This is because it is excellent in conductivity and corrosion resistance and is inexpensive. In particular, when the via terminal is formed by electrolytic plating using nickel, examples of the electrolytic Ni plating bath used include a watt bath and a sulfamic acid bath. In addition, glossiness and a film | membrane stress can be adjusted by using an additive for these plating baths suitably.

(4) Cover layer The circuit board of the present invention may have a cover layer on the second metal layer. By providing the cover layer, the exposed insulating layer and second metal layer can be protected. Examples of the material for the cover layer include polyimide. The material of the cover layer may be a photosensitive resin or a non-photosensitive resin. The thickness of the cover layer is, for example, in the range of 2 μm to 30 μm, and preferably in the range of 4 μm to 15 μm. In the present invention, a portion constituting the via portion in the cover layer is referred to as a cover portion.

2. Configuration of Circuit Board Next, the configuration of the circuit board of the present invention will be described. The circuit board of the present invention has a basic structure in which a first metal layer, an insulating layer, and a second metal layer are laminated in this order. Furthermore, as described above, a cover layer may be formed on the second metal layer. Further, at least one insulating layer may be formed between the first metal layer and the second metal layer. Therefore, a single layer structure having only an insulating layer may be provided between the first metal layer and the second metal layer, or a multilayer structure having an insulating layer and another metal layer may be used. In the latter case, it usually has a plurality of insulating layers.

  Further, the via terminal in the present invention is formed in or near an element mounting region for mounting an element. Here, the “element mounting area” in the present invention refers to an area of the circuit board that coincides with the area where the element is mounted in a plan view (dotted line portion in FIG. 13). Further, “in the vicinity of the element mounting area” means a position that is outside the element mounting area and can be contacted with the element on which the via terminal is mounted. For example, when the circuit board has a spring property, the via terminal may be in contact with the element due to the circuit board being bent even if the via portion is formed outside the element mounting region. Further, when the element is actually mounted, there may be a slight deviation (error) at the mounting position. Even in such a case, the use of the circuit board of the present invention can prevent the via terminal from adversely affecting the element. When the via terminal is in the vicinity of the element mounting region, the shortest distance in plan view between the via terminal and the element mounting region is preferably 100 μm or less, for example.

  Next, the via portion in the present invention will be described with reference to FIG. In the present invention, the via part 110 has an insulating part 102 on the first metal part 101. Furthermore, the insulating part 102 has an insulating layer opening 102a formed so that the first metal part 101 is exposed. The planar view shape of the insulating layer opening 102a is not particularly limited as long as a predetermined via terminal can be formed. For example, a circular shape; an elliptical shape; an arbitrary polygonal shape such as a quadrilateral, a pentagon, Examples thereof include a comb shape, a cross shape, and a rod shape. In addition, as a shape of an insulating-layer opening part, circular shape is common, and the diameter is in the range of 30 micrometers-200 micrometers in that case, for example.

  In addition, the via part 110 in the present invention has the second metal part 103 on the insulating part 102. Furthermore, the second metal portion 103 has a second metal layer opening 103a formed so that the first metal portion 101 is exposed from the insulating layer opening 102a. The shape of the second metal layer opening 103a in plan view is the same as that of the insulating layer opening 102a described above. Further, the diameter of the second metal layer opening 103a is not particularly limited as long as the first metal portion 101 is exposed.

  Here, when the insulating layer opening 102a is formed by chemical etching, depending on the etching conditions, the insulating portion 102 is etched in a range larger than the opening of the second metal layer opening 103a, and the diameter of the insulating layer opening 102a is increased. It becomes larger than the diameter of the second metal layer opening 103a. That is, the end portion of the second metal layer opening 103a is positioned inside the end portion of the insulating layer opening 102a, and a protrusion is formed on the second metal portion 103 (FIG. 14B). reference). As shown in FIG. 14B, the conventional via portion 110 is formed with a protrusion of the second metal portion 103. The via portion 110 according to the present invention will be described later with reference to FIGS. 23 and 24. In addition, when forming the thin-walled portion, the protruding portion of the second metal portion 103 disappears, and thus usually does not have such a protruding portion. As a result, the diameter of the second metal layer opening 103a in the present invention is usually the same as or larger than the diameter of the insulating layer opening 102a.

Further, the second metal portion 103 has a thin portion 105 along the end portion of the second metal layer opening 103a. The thin portion 105 is a portion thinner than the normal second metal portion 103. By forming the thin portion 105, it is possible to prevent the via terminal 104 from protruding and obtain the via terminal 104 having good connectivity. The thin portion 105 can be formed by chemically etching the second metal portion 103 as will be described later. Here, as shown in FIG. 16, when the thickness of the second metal portion 103 is T and the thickness etched to form the thin portion 105 is T ₁ , the value of T ₁ / T is, for example, 0 Within the range of 0.3 to 0.8, in particular within the range of 0.4 to 0.7, particularly preferably within the range of 0.4 to 0.6. If the value of T ₁ / T is too small, it may be difficult to control the plating so that the via terminal forms a shape that does not protrude from the via portion (excluding the via terminal), and T ₁ / T If the value of is too large, the mechanical strength of the thin-walled portion is lowered, and the thin-walled portion may be damaged. The value of _{T 1} is is different depending on the thickness of the second metal portion 103, for example in the range of 4Myuemu～10myuemu, preferably in the range of inter alia 5Myuemu～8myuemu. On the other hand, as shown in FIG. 16, when the width of the thin portion 105 is W, the value of W is preferably in the range of 3 to 30 μm, and more preferably in the range of 4 to 20 μm. The thin-walled portion 105 is formed along the end of the second metal layer opening 103a, and may be formed at least partially with respect to the periphery of the end. It is preferably formed over the entire circumference. This is because it becomes easier to control the plating thickness.

  Moreover, the via part 110 in the present invention preferably has a cover part having an opening formed on the second metal part 103 so that the via terminal 104 is exposed. An example of the via part 110 having such a cover part is shown in FIG. In FIG. 17, a cover portion 106 having an opening portion 106 a formed so as to expose the via terminal 104 is formed on the second metal portion 103. The shape of the opening 106a in plan view is the same as that of the insulating layer opening 102a described above. In the present invention, as shown in FIG. 17, it is preferable that the end portion of the opening portion 106 a of the cover portion 106 is located inside the outer end portion 105 a formed by the thin portion 105. Thereby, a protrusion is formed on the cover portion 106, and the plating thickness can be controlled by the protrusion. The control of the plating thickness by the protrusion will be described in “F. Circuit board manufacturing method” described later. Here, as shown in FIG. 17, when the width of the protrusion of the cover portion 106 is Z, the value of Z is, for example, 3 μm or more, and preferably in the range of 4 μm to 8 μm. If the value of Z is too small, it may be difficult to control the plating thickness by the protrusion, and if the value of Z is too large, the adhesion between the plating (via terminal) and the cover layer may be reduced. Because there is.

  In the present invention, the thickness X of the via terminal 104 is equal to or less than the thickness Y of the via portion 110 excluding the via terminal 104 and the first metal portion 101. As shown in FIG. 17, when the cover portion 106 is formed on the second metal portion 103, the thickness Y is the sum of the thicknesses of the insulating portion 102, the second metal portion 103, and the cover portion 106. . Thus, the thickness Y changes depending on the configuration of the via portion. Further, in the present invention, as shown in FIG. 18, a gold plating portion 107 may be provided on the surface of the via terminal 104. In this case, the thickness X of the via terminal 104 includes the thickness of the gold plating portion 107.

3. Circuit board The circuit board of the present invention has the above-described members and configuration. Furthermore, as described above, the circuit board of the present invention has an element mounting region. Examples of the element mounted in the element mounting area include a magnetic head slider, an actuator, and a semiconductor. The actuator may have a magnetic head or may not have a magnetic head.

  The circuit board of the present invention is preferably a flexible flexible board. Specific examples of the use of the circuit board include a suspension board (flexure), a semiconductor package board, a flexible printed board, and the like used in HDDs and the like.

F. Next, a method for manufacturing a circuit board according to the present invention will be described. The circuit board manufacturing method of the present invention comprises a basic structure in which a first metal layer, an insulating layer, and a second metal layer are laminated in this order, and a first metal part constituting a part of the first metal layer; An insulating part having a part of the insulating layer and having an insulating layer opening formed to expose the first metal part, and a part of the second metal layer, the insulating layer opening. A second metal part having a second metal layer opening formed so as to expose the first metal part, and through the insulating layer opening and the second metal layer opening, the first metal part and A circuit board manufacturing method comprising a via portion having a via terminal made of plating for electrically connecting the second metal portion, wherein the via terminal is formed in or near an element mounting region for mounting an element. And having the first metal part, the insulating part and the second metal part. The second metal portion has a thin portion formed along the end of the second metal layer opening, and has a mask portion for masking plating when the via portion is formed on the second metal portion. A plated member forming step for forming a plated member having a via installation portion, and a plating step for forming the via terminal by growing plating by feeding from the first metal portion of the plated member. And in the plating step, the top surface of the thin portion is covered with the via terminal, and the via terminal has a shape that does not protrude from the via portion (excluding the via terminal). Is.

  According to the present invention, by using the member to be plated having a thin portion, a via terminal having a shape that does not protrude from the via portion can be easily formed. As a result, when the element is mounted on the circuit board, the element can be prevented from being inclined, and the connection between the element and the circuit board can be performed satisfactorily. In addition, since the via terminal has a shape that does not protrude, the via terminal and the element are not in point contact, and damage to the element due to stress concentration can be prevented.

  FIG. 19 is a schematic cross-sectional view showing an example of a circuit board manufacturing method of the present invention. FIG. 19 shows an aspect in which the mask portion is the cover portion 106. In FIG. 19, first, the first metal portion 101, the insulating portion 102 having the insulating layer opening 102a formed so as to expose the first metal portion, and the first metal portion 101 from the insulating layer opening 102a. A second metal portion 103 having a second metal layer opening 103a formed so as to be exposed, and the second metal portion 103 is a thin-walled portion 105 along an end of the second metal layer opening 103a. A member to be plated 210a provided with a via installation portion 110a having a shape is formed (FIG. 19A). In particular, in FIG. 19A, a cover portion 106 having an opening 106a is formed on the second metal portion 103 as a mask portion.

  Next, plating is grown by feeding from the first metal part 101 of the member to be plated 210a. At the start of plating, plating is formed to fill the insulating layer opening 102a. Thereafter, the first metal part 101 and the second metal part 103 are brought into conduction at the moment when the grown plating part 104a comes into contact with the second metal part 103 (FIG. 19B). As a result, the plating of the second metal part 103 is started, and the top surface of the thin part 105 is covered with the plating part 104a (FIG. 19C). Thereafter, by further growing the plating, a circuit board including the via terminal 104 having a shape that does not protrude from the via portion 110 is obtained (FIG. 19D).

  FIG. 20 is a schematic cross-sectional view showing another example of the circuit board manufacturing method of the present invention. FIG. 20 shows an aspect in which the mask portion is a dry film resist portion (DFR portion) 131. In FIG. 20, first, a member to be plated 210a similar to that shown in FIG. 19A is formed (FIG. 20A). However, in FIG. 20A, the DFR portion 131 having the opening 131 a is formed as a mask portion on the second metal portion 103 instead of the cover portion 106.

  Next, plating is grown by feeding from the first metal part 101 of the member to be plated 210a. At the start of plating, plating is formed to fill the insulating layer opening 102a. Thereafter, the first metal part 101 and the second metal part 103 are brought into conduction at the moment when the grown plating part 104a comes into contact with the second metal part 103 (FIG. 20B). As a result, the plating of the second metal portion 103 is started, and the top surface of the thin portion 105 is covered with the plating portion 104a (FIG. 20C). Thereafter, the via terminal 104 is obtained by further growing the plating (FIG. 20D), and finally the circuit including the via terminal 104 having a shape that does not protrude from the via part 110 by peeling off the DFR part. A substrate is obtained (FIG. 20 (e)).

  20A shows a member to be plated 210a that does not have a cover portion. In the present invention, as shown in FIG. 21, the via installation portion 110a is connected to the second metal portion 103. A cover unit 106 may be provided between the DFR unit 131 and the DFR unit 131.

On the other hand, FIG. 22 is a schematic sectional view showing an example of a conventional method for manufacturing a circuit board. In FIG. 22, first, a member to be plated 210a similar to that shown in FIG. 20 (a) is formed (FIG. 22 (a)). However, in FIG. 22A, the second metal part 103 does not have the thin part 105. Next, the plating is grown by feeding from the first metal part 101 of the member to be plated 210a. At the start of plating, plating is formed to fill the insulating layer opening 102a. Thereafter, the first metal part 101 and the second metal part 103 are brought into conduction at the moment when the grown plating part 104a comes into contact with the second metal part 103 (FIG. 22B). As a result, the plating of the second metal portion 103 is started (FIG. 22C). Thereafter, the via terminal 104 is obtained by further growing the plating (FIG. 22D), and finally, the circuit board is obtained by removing the DFR portion (FIG. 22E). In the circuit board obtained by the conventional manufacturing method, since the via part 110 does not have the thin part 105, the via terminal 104 is formed on the second metal part 103 and has a shape protruding from the via part 110. As described above, in the present invention, since the via portion 110 includes the thin portion 105, the via terminal 104 having a shape that does not protrude from the via portion 110 can be obtained.
Hereafter, the manufacturing method of the circuit board of this invention is demonstrated for every process.

1. To-be-plated member formation process First, the to-be-plated member formation process in this invention is demonstrated. This step has the first metal part, the insulating part, and the second metal part, and the second metal part is formed with a thin part along the end of the second metal layer opening, It is a step of forming a member to be plated provided with a via installation portion having a mask portion for masking plating when forming the via portion on the second metal portion.

  The member to be plated in the present invention is not particularly limited as long as it has the above-described first metal part, insulating part, second metal part, thin part, and mask part. Among these members, members other than the mask portion are the same as the contents described in the above-mentioned “E. Circuit board”, so description thereof is omitted here.

  Moreover, the mask part in this invention is formed on the 2nd metal part, and masks the surface of the 2nd metal part other than the place which forms a via terminal. Specific examples of such a mask portion include a cover portion and a dry film resist portion. Hereinafter, a method for forming a member to be plated will be described for each aspect of the mask portion.

(1) A mode in which the mask portion is the cover portion As an example of the member forming step in this case, a step of preparing a laminate in which the first metal layer, the insulating layer, and the second metal layer are laminated in this order; Etching the second metal layer to form a second metal part having a second metal layer opening, and a surface of the second metal part for forming a thin part on the second metal part A step of forming a cover portion having an opening exposing the insulating layer, a step of etching the insulating layer exposed from the second metal layer opening to form an insulating portion having an insulating layer opening, and the cover portion. And etching the exposed second metal part to form the thin part.

  Such a member-to-be-plated forming process will be described with reference to FIG. In FIG. 23, first, a laminate in which the first metal layer 101b, the insulating layer 102b, and the second metal layer 103b are laminated in this order is prepared (FIG. 23A). Next, a dry film resist is laminated on the surface of the second metal layer 103b, and exposure development is performed to form a resist pattern for forming the second metal portion. Thereafter, the second metal layer 103b exposed from the resist pattern is etched with an etchant, and the resist pattern is peeled off to form the second metal portion 103 having the second metal layer opening 103a (FIG. 23B). ). Although not shown, the first metal portion 101 can be formed simultaneously with the second metal portion 103 by providing a resist pattern on the surface of the first metal layer 101 b. It is preferable that the type of the etching solution is appropriately selected according to the materials of the first metal layer 101b and the second metal layer 103b. For example, when the material of the first metal layer 101b is SUS and the material of the second metal layer 103b is Cu, an iron chloride based etchant or the like can be used as the etchant.

  Next, a cover part 106 is formed by applying a photosensitive cover part forming material (for example, photosensitive polyimide) so as to cover the second metal part 103 and performing exposure and development (FIG. 23C). ). At this time, the cover portion 106 is formed so as to have the opening portion 106a through which the surface of the second metal portion for forming the thin portion is exposed. In the present invention, a non-photosensitive cover part forming material may be used for forming the cover part 106. In this case, the cover part 106 is usually formed by patterning with a dry film resist and an etching solution.

  Next, a dry film resist is laminated so as to cover the second metal part 103 and the cover part 106, and a resist pattern for forming an insulating part is formed by performing exposure and development. Thereafter, the insulating layer 102b exposed from the resist pattern is etched with an etching solution, and the resist pattern is peeled off to form the insulating portion 102 having the insulating layer opening 102a (FIG. 23D). The type of the etchant is preferably selected as appropriate depending on the type of the insulating layer 102b.

  Next, the surface of the second metal part 103 exposed from the cover part 106 is etched with an etching solution to form a thin part 105 (FIG. 23E). At this time, the protruding portion of the second metal portion 103 described above usually disappears. Thereby, the to-be-plated member 210a which used the cover part 106 as a mask part can be obtained. In the present invention, when the thin portion 105 is formed, a selective etching solution that etches the second metal portion 103 without etching the first metal portion 101 is usually used. The type of the selective etching solution is preferably selected as appropriate according to the types of the first metal part 101 and the second metal part 103. For example, when the first metal part 101 is SUS and the material of the second metal part 103 is Cu, as a selective etching solution, a mixed solution of hydrogen peroxide and sulfuric acid, a potassium hydrogen sulfate solution, sodium persulfate A system solution, a potassium persulfate solution, an ammonium persulfate solution, an ammonium chloride solution, or the like can be used. In addition, since the film thickness of the second insulating portion may occur due to the plating pretreatment (for example, electrolytic degreasing), the etching amount when forming the thin portion may be set in consideration of the film thickness reduction or the like. preferable.

  Next, the member to be plated obtained by the above method will be described. In the member to be plated obtained by the above method (member to be plated 210a shown in FIG. 23 (e)), the end portion of the opening 106a of the cover portion 106 is formed by the thin portion 105, as in FIG. It will be located inside the outer end 105a (when half-etching is performed using the cover 106 as a mask, side etching will occur, so it will usually be located inside). Thereby, a protrusion is formed on the cover portion 106, and the plating thickness can be controlled by the protrusion. More specifically, as shown in FIG. 19D, the protrusion of the cover portion 106 functions as a stopper when the plating grows, so that the plating thickness can be easily controlled. In addition, as a method for forming the protruding portion of the cover portion 106, for example, a method in which etching conditions for forming the thin portion 105 are appropriately selected to cause side etching can be cited.

(2) A mode in which the mask portion is a dry film resist portion As an example of the member forming step in this case, a step of preparing a laminate in which the first metal layer, the insulating layer, and the second metal layer are laminated in this order. And etching the second metal layer to form a second metal portion having a second metal layer opening, etching the insulating layer exposed from the second metal layer opening, and opening the insulating layer. Forming an insulating portion having a portion, forming a resist pattern having an opening exposing the surface of the second metal portion for forming a thin portion, etching the exposed second metal portion, Examples thereof include a step of forming a thin portion and a step of forming a dry film resist portion on the surface of the second metal portion other than the thin portion.

  Such a member-to-be-plated forming process will be described with reference to FIG. In FIG. 24, first, a laminate in which the first metal layer 101b, the insulating layer 102b, and the second metal layer 103b are laminated in this order is prepared (FIG. 24A). Next, a dry film resist is laminated on the surface of the second metal layer 103b, and exposure development is performed to form a resist pattern for forming the second metal portion. Thereafter, the second metal layer 103b exposed from the resist pattern is etched with an etchant, and the resist pattern is peeled off to form the second metal portion 103 having the second metal layer opening 103a (FIG. 24B). ). Although not shown, the first metal portion 101 can be formed simultaneously with the second metal portion 103 by providing a resist pattern on the surface of the first metal layer 101 b.

  FIG. 24 illustrates the member to be plated that does not have a cover portion. However, since it is usually necessary to form a cover layer in a place other than the via installation portion of the member to be plated, the above-described FIG. ) To form a patterned cover layer. In addition, when forming a plated part having a via installation part having a cover part, after forming the first metal part 101 and the second metal part 102, the cover part is formed in the same manner as in FIG. Can be formed. In this case, a member to be plated as shown in FIG. 21 can be obtained.

  Next, a dry film resist is laminated so as to cover the second metal part 103, and exposure development is performed to form a resist pattern for forming an insulating part. Thereafter, the insulating layer 102b exposed from the resist pattern is etched with an etching solution, and the resist pattern is peeled off to form the insulating portion 102 having the insulating layer opening 102a (FIG. 24C).

  Next, a dry film resist is laminated so as to cover the insulating portion 102 and the second metal portion 103, and exposure development is performed to form a DFR portion 131 for forming a thin portion (FIG. 24D). ). Thereafter, the surface of the second metal portion 103 exposed from the DFR portion 131 is etched with an etchant to form the thin portion 105 (FIG. 24E). At this time, the protruding portion of the second metal portion 103 described above usually disappears. Thereby, the to-be-plated member 210a which used the DFR part 131 as the mask part can be obtained. In the present invention, when the thin portion 105 is formed, a selective etching solution that etches the second metal portion 103 without etching the first metal portion 101 is usually used. The selective etching solution is as described above.

  Next, the member to be plated obtained by the above method will be described. In the member to be plated obtained by the above method (the member to be plated 210 a shown in FIG. 24E), the end of the opening 131 a of the DFR portion 131 is inside the outer end 105 a formed by the thin portion 105. Will be located. Thereby, a protrusion is formed in the DFR portion 131, and the plating thickness can be controlled by the protrusion. More specifically, as shown in FIG. 20D, the protrusion of the DFR portion 131 functions as a stopper when the plating grows, so that the plating thickness can be easily controlled. Examples of the method for forming the protrusions of the DFR portion 131 include a method of appropriately adjusting the exposure and developing conditions of the dry film resist. Further, the width of the protrusion of the DFR portion 131 is preferably the same as the width Z of the protrusion of the cover portion 106 shown in FIG.

2. Next, the plating process in the present invention will be described. This step is a step of forming the via terminal by growing plating by feeding from the first metal portion of the member to be plated. Further, in the present invention, in the plating step, the top surface of the thin portion is covered with the via terminal, and the via terminal is shaped so as not to protrude from the via portion (excluding the via terminal). One feature.

  The type of plating bath is preferably selected as appropriate according to the type of metal described in “E. Circuit board”. For example, when forming a via terminal made of Ni plating, examples of the electrolytic Ni plating bath used include a Watt bath and a sulfamic acid bath. Moreover, in order to make the via terminal into a shape that does not protrude from the via portion (excluding the via terminal), it is usually necessary to adjust plating conditions (for example, plating time and applied voltage). Desired plating conditions can be set by repeating the preliminary test.

3. Other Steps In the present invention, when the above-described DFR portion is used as a mask portion, a DFR portion peeling step for peeling off the normal DFR portion is usually provided after the above-described plated member forming step and the plating step. Moreover, in this invention, you may have a gold plating part formation process etc., and may form a gold plating part in the surface of a via terminal in that case. The circuit board manufacturing method other than the via portion is the same as the general circuit board manufacturing method.

G. Next, the suspension substrate of the present invention will be described. The suspension board of the present invention is the circuit board described above.

  According to the present invention, when the above-described circuit board is used as a suspension substrate, when the element is mounted, the inclination of the element can be prevented and the connection between the element and the suspension substrate can be performed satisfactorily.

  The suspension board of the present invention is not particularly limited as long as it has the characteristics described in the above “E. circuit board” and has a predetermined spring property. In the suspension substrate of the present invention, the first metal layer is preferably SUS, the insulating layer is preferably polyimide (PI), and the second metal layer is preferably Cu. The suspension substrate of the present invention may be one in which the above-described element is mounted in an element mounting region.

H. Suspension Next, the suspension of the present invention will be described. The suspension of the present invention includes the above-described suspension substrate.

  According to the present invention, by using the above-described suspension substrate, it is possible to obtain a suspension having good connectivity with the element.

  Since the specific example of the suspension of the present invention is the same as the contents described in FIG. 8 described above, description thereof is omitted here. Further, the suspension substrate is the same as that described in “G. Suspension substrate”, and therefore description thereof is omitted here.

I. Next, the suspension with an element of the present invention will be described. A suspension with an element of the present invention includes the above-described suspension and an element mounted in an element mounting region of the suspension.

  According to the present invention, by using the above-described suspension, a suspension with an element having good connectivity between the element and the suspension can be obtained.

  Since a specific example of the suspension with an element of the present invention is the same as the contents described in FIG. 9 except that the magnetic head is changed to an element, description thereof is omitted here. Further, the suspension is the same as that described in “H. Suspension”, and therefore the description thereof is omitted here. The elements are the same as the contents described in the above “E. circuit board”, and the description is omitted here.

  Further, as described with reference to FIG. 15, the suspension and the element can be bonded using an adhesive via the bonding portion. The adhesive used in the present invention may be a conductive adhesive or a non-conductive adhesive, but is preferably a conductive adhesive. The adhesive used in the present invention may be a thermosetting adhesive.

J. et al. Next, the hard disk drive of the present invention will be described. The hard disk drive of the present invention is characterized by including the above-described suspension with an element.

  According to the present invention, a hard disk drive with higher functionality can be obtained by using the above-described suspension with an element.

  Since the specific example of the suspension of the present invention is the same as that described in FIG. 10 described above, description thereof is omitted here. The suspension with elements is the same as the contents described in the above “I. Suspension with elements”, and the description thereof is omitted here. As other members, the same members as those used in a general hard disk drive can be used.

The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the technical idea described in the claims of the present invention has substantially the same configuration and exhibits the same function and effect regardless of the case. It is included in the technical scope of the invention.

  Hereinafter, the present invention will be described more specifically with reference to examples.

[Example 1]
FIG. 6 is an explanatory view for explaining a first embodiment of the magnetic head suspension of the present invention.
FIG. 6A shows a three-layer material of Cu (copper) / PI (polyimide) / SUS (stainless steel) used in the present invention. The metal support 1 was SUS304 material having a thickness of 20 μm, the insulating layer 2 was polyimide having a thickness of 10 μm, and the wiring layer 3 was electrolytic copper having a thickness of 9 μm. A laminated body laminated in this order was used.
FIG. 6B shows a state where a DFR (dry film resist) 8 a is made on the wiring layer 3. Pattern exposure and development are performed under standard DFR conditions, and patterning is performed so that the diameter of the opening for forming the conductor connecting material is about 70 μm.
FIG. 6C shows a state in which the wiring layer 3 has been etched with an iron chloride etchant to form openings.
FIG. 6D shows a state where the DFR is stripped with a sodium hydroxide solution.
FIG. 6E shows a state in which the second DFR 8 a is made on the wiring layer 3. The opening diameter of the DFR is set to 20 μm larger than the opening diameter formed in the wiring layer 3.
FIG. 6 (f) shows a state after the second etching. The periphery of the opening exposed by DFR plate making is etched to a depth of 4.5 μm with an etching solution containing sulfuric acid and hydrogen peroxide solution to form a recess. Since the etching proceeds isotropically, side etching is performed to form a recess, and the periphery of the DFR opening is overhanged.
FIG. 6G shows a state in which the opening 7 is formed by etching the insulating layer 2 using the wiring layer 3 as a mask. Thereby, the opening which exposed the surface of the metal support body 1 is obtained.
FIG. 6 (h) shows a state where the DFR is peeled off.

FIG. 6 (i) shows a state in which the Au plating layer 9 is formed on the wiring layer 3. After supplying power only to the wiring layer 3 of FIG. 3 (h) and performing Ni plating on the base, the wiring layer is covered with Au plating 9. The Au plating layer 9 is also included in the wiring layer 3 after the next step.
FIG. 6 (j) shows a state in which DFR is made for Ni plating to be the conductor connecting material 4. The opening of the DFR is set so that the inner periphery of the opening is located in the recess of the wiring layer 3 so that the wiring layer surface 5 is not exposed. As a result, the conductor connecting material 4 is not connected to the wiring layer surface 5 but is connected to the opening peripheral portion 60 of the wiring layer 3.
FIG. 6K shows a state in which the conductor connecting material 4 is formed by Ni plating. Ni plating is performed by supplying power to the metal support 1. The Ni plating is deposited on the surface of the metal support 1 exposed at the opening 7 and is electrically connected to the wiring layer 3 when the thickness becomes equal to that of the insulating layer 2. The plating also grows on the exposed surface of the wiring layer 3. . The thickness of the plating is set so that the height of the conductor connecting material surface 6 is equal to the wiring layer surface 5.
FIG. 6 (l) shows a state where the DFR is peeled off and the formation of the conductor connecting material 4 is completed.

[Example 2]
FIG. 7 is an explanatory view for explaining a second embodiment of the magnetic head suspension of the present invention.
Fig.7 (a) shows the base material of the same state as FIG.6 (h).
FIG. 7B shows a state in which the DFR 8 a is made for Cu plating to be the conductor connecting material 4. The opening of the DFR is set so that the inner periphery of the opening is located in the recess of the wiring layer 3 so that the wiring layer surface 5 is not exposed. As a result, the conductor connecting material 4 is not connected to the wiring layer surface 5 but is connected to the opening peripheral portion 60 of the wiring layer 3.
FIG.7 (c) shows the state which formed the conductor connection material 4 by Cu plating. Cu plating is performed by supplying power to the metal support 1. Cu plating is deposited on the surface of the metal support 1 exposed at the opening 7, and is electrically connected to the wiring layer 3 when the thickness becomes equal to that of the insulating layer 2. The plating also grows on the exposed surface of the wiring layer 3. . The thickness of the plating is set so that the height of the conductor connecting material surface 6 is equal to the wiring layer surface 5.
FIG. 7D shows a state where the DFR is peeled off.
FIG. 7E shows a state where the lower surface of the metal support 1 is masked with DFR.
FIG. 7F shows a state in which a gold plating layer 9 is formed on the wiring layer 3.
FIG. 7G shows a state where the masking by DFR is removed and the formation of the conductor connecting material 4 by Cu plating is completed.

[Production example]
First, a three-layer material shown in FIG. Here, the first metal layer 101b is SUS304 having a thickness of 20 μm, the insulating layer 102b is a polyimide layer having a thickness of 10 μm, and the second metal layer 103b is an electrolytic copper foil having a thickness of 12 μm. Next, as shown in FIGS. 23B to 23D, the second metal layer 103b is etched, the cover portion 106 made of polyimide is formed, and the insulating layer 102b is etched. As shown in FIG. The member 201b to be plated before forming the part was obtained. The insulating layer opening 102a, the second metal layer opening 103a, and the opening 106a are all openings having a circular planar shape, and the opening diameters were 70 μm, 70 μm, and 95 μm, respectively.

Next, the thin part was formed using the member 201b to be plated before forming the thin part. Specifically, as shown in FIG. 23 (d), the thin metal portion 105 was formed by etching the second metal portion 103 exposed from the cover portion 106 under the following conditions. The results are shown in Table 1.
<Etching conditions>
Treatment liquid: Potassium hydrogen sulfate solution (150 g / l)
: Sulfuric acid (10ml / l)
・ Liquid temperature: 30 ° C, 25 ° C
・ Processing time: 1 minute, 2 minutes, 3 minutes, 5 minutes

  T1 in Table 1 refers to the distance from the top of the cover portion 106 to the top of the thin portion 105, as shown in FIG. In addition, the top part of the most etched part was selected as the top part of the thin part 105. Further, t1 at 0 minutes corresponds to the thickness of the cover portion. Furthermore, the etching amount of the second metal part 103 is calculated from the difference between the value of t1 at 1 minute, 2 minutes, 3 minutes, and 5 minutes and the value of t1 at 0 minute, and the etching amount is divided by the processing time. Thus, the etching rate is calculated. As shown in Table 1, the average value of the etching rate at 30 ° C. was 1.73 μm / min, and the average value of the etching rate at 25 ° C. was 0.77 μm / min. As described above, it was confirmed that a thin portion having a desired thickness can be formed by adjusting the processing temperature and the processing time.

[Example 3]
A via terminal (ground terminal) made of Ni plating was formed on a member to be plated on which a thin portion was formed under the conditions of a processing temperature of 30 ° C. and a processing time of 2 minutes described in the production example. Ni plating was performed under the following conditions.
<Plating conditions>
・ Plating bath: Ni plating bath for sulfamic acid ・ Plating method: Electrolytic immersion plating (0.2 A, 14 minutes)

  After forming the via terminal, the distance t2 from the top of the cover portion 106 to the top of the via terminal 104 was measured as shown in FIG. For the top of the via terminal 104, the top of the thickest part was selected. When the value of t2 was measured in 24 samples, the maximum was 6.94 μm, the minimum was 1.90 μm, and the average was 4.07 μm. In either case, the value of t2 did not become negative (the via terminal protruded).

  Further, FIG. 28 shows a cross-sectional photograph of the obtained via part. As shown in FIG. 28, the obtained via part has a first metal part, an insulating part, a second metal part having a thin part, a cover part, and a via terminal. Furthermore, it was confirmed that the via terminal has a shape that does not protrude from the via part (excluding the via terminal). Further, it was confirmed that the thickness of the via terminal was controlled by the cover portion 106 having the protruding portion.

  DESCRIPTION OF SYMBOLS 1 ... Metal support body, 2 ... Insulating layer, 3 ... Wiring layer, 3a, 3b ... Metal layer, 4 ... Conductor connection material, 5 ... Wiring layer surface, 6 ... Conductor connection material surface, 7 ... Opening part, 8a ... DFR 8 ... Photoresist, 9 ... Gold plated layer, 10 ... Suspension board, 20 ... Slider installation position, 30 ... Suspension, 31 ... Load beam, 40 ... Suspension with head, 41 ... Magnetic head slider, 50 ... Hard disk drive, 51 ... Disc, 52 ... Spindle motor, 53 ... Arm, 54 ... Voice coil motor, 55 ... Sealed case, 60 ... Opening periphery, 61 ... Opening inner surface, 62 ... Metal support surface exposed by opening, 63 ... Opening periphery bottom , X2 ... thickness of insulating layer 2, X3 ... thickness of wiring layer 3, Y ... conductor connection from surface portion 62 of metal support to connecting material surface 6 of conductor connecting material 4 , Z: depth to the surface 5 of the wiring layer and the bottom 63 of the opening periphery, 101: first metal portion, 101b: first metal layer, 102: insulating portion, 102a: insulating layer opening, 102b ... Insulating layer, 103 ... second metal portion, 103a ... second metal layer opening, 103b ... second metal layer, 104 ... via terminal, 105 ... thin portion, 105a ... outer end of thin portion, 106 ... cover portion, 106a ... opening of cover part, 107 ... gold plating part, 110 ... via part, 110a ... via installation part, 111 ... wiring part, 115 ... adhesive part, 120 ... element, 131 ... dry film resist part, 131a ... dry film Opening portion of resist portion, 201 ... element mounting area, 202 ... connection area, 203 ... wiring, 210 ... circuit board, 210a ... member to be plated

Claims (26)

  In the magnetic head suspension substrate in which the wiring layer is laminated on the metal support through the insulating layer, the magnetic head suspension substrate has an opening penetrating the insulating layer and the wiring layer, and is exposed through the opening. A suspension substrate, characterized in that a conductor connecting material that connects a surface portion of a metal support and the inner surface of the opening of the wiring layer and does not have a connecting portion on the surface of the wiring layer is provided.   A magnetic head suspension substrate in which a wiring layer is laminated on a metal support via an insulating layer, wherein the magnetic head suspension substrate has an opening penetrating the insulating layer and the wiring layer, and the wiring layer in contact with the opening Has a peripheral portion of the opening formed lower than the surface of the other wiring layer, and is provided with a conductor connecting material that connects the wiring layer and the surface portion of the metal support exposed by the opening. Suspension substrate.   3. The suspension substrate according to claim 2, wherein the peripheral portion of the opening is formed lower than the surface of another wiring layer by etching.   The wiring layer is composed of two conductor layers, and the opening of the wiring layer in the opening penetrating the insulating layer and the wiring layer has an opening in the lower layer of the two conductor layers and an upper layer larger than the opening in the lower layer. 3. The suspension substrate according to claim 2, wherein the periphery of the opening is formed lower than the surface of another wiring layer by being formed by the opening.   The suspension board according to claim 1 or 2, wherein a height of the conductor connecting material is equal to or less than a surface of the wiring layer.   6. The suspension substrate according to claim 1, wherein the conductor connection material and the wiring layer are connected only at a portion lower than the surface of the wiring layer.   The suspension substrate according to claim 1, wherein the conductor connecting material is formed by metal plating.   The suspension substrate according to claim 7, wherein the metal plating is nickel plating.   9. The suspension board according to claim 1, wherein the conductor connecting material is a ground terminal or a signal transmission terminal.   A suspension using the suspension board according to any one of claims 1 to 9.   A suspension with a head, comprising the suspension according to claim 10 and a magnetic head slider mounted on the suspension.   A hard disk drive using the suspension with a head according to claim 11. In the base material in which the wiring layer is laminated via the insulating layer on the metal support,
Forming an opening penetrating the insulating layer and the wiring layer to expose the surface of the metal support;
Forming a resist layer that exposes the opening of the wiring layer without exposing the layer surface of the wiring layer;
Power feeding from the metal support and metal plating to form a conductor connecting material;
A method for manufacturing a suspension substrate, comprising: A step of preparing a substrate with wiring in which a wiring layer is laminated on a metal support through an insulating layer, the insulating layer and the wiring layer are opened, and an opening is formed so as to expose the surface of the metal support;
Forming a height around the opening of the wiring layer to be lower than other wiring layers;
Forming a conductor connecting material for connecting the metal support layer and the wiring layer by metal plating the opening and the periphery of the opening; and
A method for manufacturing a suspension substrate, comprising: The step of forming the height of the wiring layer around the opening is lower than the other wiring layers,
15. The method for manufacturing a suspension substrate according to claim 14, wherein a dry film resist is formed except for the opening of the wiring layer and the periphery of the opening and etched.   The step of forming the conductor connecting material includes forming a resist layer that exposes an opening portion and an opening peripheral portion of the wiring layer without exposing a layer surface of the wiring layer, and metal plating is performed on the opening portion and the wiring layer. The suspension connection according to any one of claims 13 to 15, wherein the height of the conductor connecting material is the same as or lower than the height of the wiring layer by forming up to the periphery of the opening. A method for manufacturing a substrate. A basic structure in which a first metal layer, an insulating layer, and a second metal layer are laminated in this order,
A first metal part constituting a part of the first metal layer; an insulating part comprising an insulating layer opening formed so as to expose a part of the insulating layer and the first metal part; Forming a part of the second metal layer, and having a second metal layer opening formed so that the first metal part is exposed from the insulating layer opening, the insulating layer opening, and A via part having a via terminal made of plating for electrically connecting the first metal part and the second metal part through the second metal layer opening;
The via terminal is a circuit board formed in or near an element mounting region for mounting an element,
The second metal part has a thin part along the end of the second metal layer opening, and the top surface of the thin part is covered by the via terminal,
The circuit board, wherein the via terminal has a shape that does not protrude from the via portion (excluding the via terminal).   The circuit board according to claim 17, wherein the via portion includes a cover portion having an opening formed on the second metal portion so that the via terminal is exposed.   The circuit board according to claim 18, wherein an end portion of the opening of the cover portion is positioned inside an outer end portion formed by the thin portion.   A circuit board according to any one of claims 17 to 19, wherein the circuit board is a suspension board.   A suspension comprising the suspension substrate according to claim 20.   A suspension with an element, comprising: the suspension according to claim 21; and an element mounted in an element mounting region of the suspension.   A hard disk drive comprising the suspension with an element according to claim 22. A basic structure in which a first metal layer, an insulating layer, and a second metal layer are laminated in this order,
A first metal part constituting a part of the first metal layer; an insulating part comprising an insulating layer opening formed so as to expose a part of the insulating layer and the first metal part; Forming a part of the second metal layer, and having a second metal layer opening formed so that the first metal part is exposed from the insulating layer opening, the insulating layer opening, and A via part having a via terminal made of plating for electrically connecting the first metal part and the second metal part through the second metal layer opening;
A method of manufacturing a circuit board in which the via terminal is formed in or near an element mounting region for mounting an element,
The second metal part includes the first metal part, the insulating part, and the second metal part, and the second metal part is formed with a thin part along an end of the second metal layer opening, and the second metal part To-be-plated member forming step for forming a to-be-plated member having a via installation portion having a mask portion for masking plating when forming the via portion on the top,
A plating step for forming the via terminal by growing plating by feeding from the first metal part of the member to be plated,
In the plating process, the top surface of the thin portion is covered with the via terminal, and the via terminal is shaped so as not to protrude from the via portion (excluding the via terminal). Production method.   The method of manufacturing a circuit board according to claim 24, wherein the mask portion is a cover portion.   The method for manufacturing a circuit board according to claim 24, wherein the mask portion is a dry film resist portion.