JP2013026061A - Lamp and lighting fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamp capable of miniaturizing while improving its luminance.SOLUTION: The lamp 1 includes a globe 7 formed of a translucent glass, wherein a helium gas is filled up inside, an LED module (light-emitting module) 5 having a mounting board 21 and LED chips arranged on the mounting board 21 and arranged in the globe 7, and a piezo fan 80 arranged in the globe 7 and promoting a convection current of the helium gas.

Description

  The present invention mainly relates to a lamp and a luminaire using an LED (Light Emitting Diode) as a light source, and more particularly to a technique for improving heat dissipation characteristics.

Conventionally, a light bulb-shaped lamp (LED lamp) having a light emitting element such as an LED as a light source, and heat generated in an LED module composed of the LED and a substrate on which the LED is mounted is mainly generated by a housing or There has been proposed a lamp that is conducted to the base and discharged from the outer surface of the housing to the outside, or from the base to the lighting fixture side through a socket (see Patent Documents 1 to 4).
These lamps include a globe formed of a translucent material, a light emitting element, a light emitting module disposed in the globe, a casing that supports the light emitting module, and a base.

JP 2006-313717 A Japanese Patent No. 4135485 Japanese Patent No. 4290887 US6793374 specification

By the way, in recent years, there is a demand for LED lamps to reduce the size of the entire lamp while improving the luminance.
However, in the lamps described in Patent Documents 1 to 4, when the power supplied to the LED module is increased in order to improve the luminance, the amount of heat generated from the LED module increases. Then, in these lamps, heat generated in the LED module is mainly conducted to the housing and the housing, so that the temperature of the housing and the base rises, and the heat load on the lighting circuit housed in the housing is large. turn into. For this reason, in order to efficiently release the heat generated by the LED module to the outside, the housing disposed outside the globe is enlarged to increase the area of the outer surface of the housing, or to the outside of the globe. A heat dissipating fin must be provided on the arranged housing. Then, the whole lamp will be enlarged.

  This invention is made | formed in view of the said reason, and it aims at providing the lamp | ramp and lighting fixture which can achieve size reduction, improving a brightness | luminance.

  In order to achieve the above object, a lamp according to the present invention includes a globe formed of a light-transmitting material and encapsulating a fluid having a higher thermal conductivity than air, and a light emitting element. The light emitting module is disposed, and convection promoting means is disposed in the globe and promotes convection of a fluid having a higher thermal conductivity than air.

  According to this configuration, by providing the convection promoting means for accelerating the convection of the fluid having a higher thermal conductivity than the air disposed in the globe and enclosed in the globe, the light emitting module and the fluid are provided with each other. Heat exchange and heat exchange between the fluid and the globe are promoted, and heat generated in the light emitting module is easily released to the outside through the fluid and the globe. Since the temperature rise of the light emitting module can be sufficiently suppressed even when the power is increased, the luminance can be improved. Further, since the convection promoting means is disposed in the globe, the entire lamp can be reduced in size.

In the lamp according to the present invention, the convection promoting means may cause the fluid to flow in a direction along the lamp axis.
In the lamp according to the present invention, the convection promoting means may be disposed on a part of the inner wall of the globe.
In the lamp according to the present invention, a part of the inner wall may cross a lamp axis on the inner wall of the globe.

The lamp according to the present invention includes a support member that extends toward the inside of the globe and supports the light emitting module, and the convection promoting means is disposed on a part of the peripheral wall of the support member. It may be.
According to this configuration, since the support member is hollow and the feed line can be inserted into the inside, power can be supplied to the convection promoting means by the feed line passing through the inside of the support member. Since the structure can be simplified as compared with the case where non-contact power feeding is performed, cost reduction and ease of manufacture can be achieved.

In the lamp according to the present invention, the convection promoting means may be a piezo fan.
According to this configuration, by using a piezo fan as the convection promoting means, low power consumption, long life, miniaturization and low noise can be achieved.
Moreover, the lamp | ramp which concerns on this invention may be provided with the stem by which the said glove | globe was provided continuously and integrally and the said supporting member was attached.

The lamp according to the present invention includes a lighting circuit for lighting the light emitting element, and a housing that houses the lighting circuit in a state in which a part of the lighting circuit is in contact with the inner wall, and the globe and the support member include: It may be attached to the casing, and a heat insulating material may be interposed between the glove and stem and the casing.
According to this configuration, the heat generated in the lighting circuit and conducted to the housing is not conducted to the globe and the stem, so that the heat generated in the lighting circuit can be prevented from being conducted to the light emitting module. Temperature rise can be suppressed.

  Further, the present invention may be a luminaire including the lamp described above.

1 is a schematic perspective view of a lamp according to Embodiment 1. FIG. FIG. 2 is a schematic sectional view of the lamp according to the first embodiment. The LED module which concerns on Embodiment 1 is shown, (a) is a top view, (b) is sectional drawing. The piezo fan which concerns on Embodiment 1 is shown, (a) is a schematic perspective view, (b) is sectional drawing which fractured | ruptured partially. The power transmission circuit and power receiving circuit which concern on Embodiment 1 are shown, (a) is a block diagram, (b) is a schematic plan view of the power transmission antenna which comprises a part of power transmission circuit, (c) is the outline of a power receiving circuit. Perspective view. FIG. 6 is an operation explanatory diagram of the lamp according to the first embodiment. The figure which shows the main manufacturing processes about the manufacturing method of the lamp | ramp which concerns on Embodiment 1. FIG. The figure which shows the main manufacturing processes about the manufacturing method of the lamp | ramp which concerns on Embodiment 1. FIG. The figure which shows the main manufacturing processes about the manufacturing method of the lamp | ramp which concerns on Embodiment 1. FIG. The figure which shows the main manufacturing processes about the manufacturing method of the lamp | ramp which concerns on Embodiment 1. FIG. FIG. 6 is a schematic side view showing a lighting apparatus according to Embodiment 2. The schematic perspective view which shows the lamp | ramp which concerns on a modification. The schematic sectional drawing which shows the lamp | ramp which concerns on a modification. The figure which shows the main manufacturing processes about the manufacturing method of the lamp | ramp which concerns on a modification. The schematic perspective view which shows the lamp | ramp which concerns on a modification. The principal part schematic sectional drawing of the lamp | ramp which concerns on a modification. The principal part schematic sectional drawing of the lamp | ramp which concerns on a modification.

<First Embodiment>
<1> Configuration The overall configuration of the lamp 1 according to the first embodiment will be described with reference to FIGS. 1 and 2. Here, FIG. 1 is a perspective view of the lamp 1, and FIG. 2 is a cross-sectional view of the lamp 1.
As shown in FIGS. 1 and 2, a lamp 1 according to the first embodiment is a light bulb-shaped LED lamp that replaces an incandescent light bulb, and includes an LED module (light emitting module) 5 that is a light source, and translucency. , A case (housing) 9, a base 11 for receiving power, a support member 17, a stem 13, a circuit unit 15, and a piezo fan 80.
<1-1> LED Module The LED module 5 includes a mounting substrate 21, a plurality of LEDs 22 mounted on the surface of the mounting substrate 21 (which is also the upper surface and opposite to the base 11), and a seal that covers the LEDs 22. And a stop body 23.

The mounting substrate 21 is made of a translucent material so as not to block light emitted backward from the light emitted from the LEDs 22. That is, the mounting substrate 21 is made of a translucent material so that light emitted from the LEDs 22 on the upper surface side of the mounting substrate 21 and traveling toward the mounting substrate 21 passes through the mounting substrate 21 and is emitted from the globe 7 as it is. Yes.
FIG. 3 is a diagram showing the structure of the LED module 5. FIG. 3A is a plan view of the LED module 5, and FIG. 3B is a cross-sectional view taken along the line AA ′ in FIG.

  As shown in FIG. 3A, the mounting substrate 21 has a rectangular shape in plan view. The material is made of, for example, glass or alumina. The mounting substrate 21 is provided with a wiring pattern (not shown) for electrically connecting the LEDs 22 (in series connection and / or parallel connection) or for connecting to the circuit unit 15. Yes. Considering the use of light emitted backward from the LED 22, it is preferable that the wiring pattern is also made of a light-transmitting material, such as ITO.

The LED 22 is mounted on the upper surface of the mounting substrate 21. The number, arrangement, and the like of the LEDs 22 are appropriately determined depending on the luminance required for the lamp 1. In the present embodiment, there are a plurality of LEDs 22, which are arranged in two lines in a straight line along the longitudinal direction of the rectangular mounting substrate 21 with an interval (for example, an equal interval).
The sealing body 23 is mainly made of a translucent material. The sealing body 23 has a function of preventing air and moisture from entering the LED 22. Here, LED22 which comprises the said row | line | column is coat | covered per row | line | column with which several LED22 is distribute | arranged to linear form.

The sealing body 23 has a wavelength conversion function for converting the wavelength of light from the LED 22 when it is necessary to convert the wavelength of light emitted from the LED 22 to a predetermined wavelength, in addition to the function of preventing the entry of air or the like. Also have. Note that the wavelength conversion function can be implemented, for example, by mixing a conversion material that converts the wavelength of predetermined light into the light-transmitting material.
As a translucent material constituting the sealing body 23, for example, a silicone resin can be used. In addition, when the wavelength conversion function is provided, for example, phosphor particles can be used as the conversion material.

Here, the LEDs 22 emit blue light, and phosphor particles that convert blue light into yellow light are used as a conversion material. As a result, white light mixed with blue light emitted from the LED 22 and yellow light wavelength-converted by the phosphor particles is emitted from the LED module 5 (lamp 1).
In the mounting substrate 21, through holes 26 are formed in the power supply terminals 24a and 24b of the wiring pattern and the periphery thereof. Thus, one end of the lead wires 49 and 51 that have passed through the through hole 26 is connected to the power supply terminals 24a and 24b of the wiring pattern by the solder 90 or the like.

The lead wire 49 is a positive voltage supply line that supplies a positive voltage from the circuit unit 15 to the LED module 5. One end portion of the lead wire 49 on the LED module 5 side is electrically connected to the power supply terminal 24 a by solder connection, and the other end portion of the lead wire 49 on the circuit unit 15 side is connected to the power output portion of the circuit unit 15. Electrically connected.
On the other hand, the lead wire 51 is a negative voltage supply line that supplies a negative voltage from the circuit unit 15 to the LED module 5. One end portion of the lead wire 51 on the LED module 5 side is electrically connected to the power supply terminal 24b by solder connection, and the other end portion of the lead wire 51 on the circuit unit 15 side is connected to the power output portion of the circuit unit 15. Electrically connected.

The through hole 25 provided in the approximate center of the mounting substrate 21 is used for coupling the mounting substrate 21 and the convex portion 17 a of the support member 17. By inserting the convex portion 17 a of the support member 17 into the through hole 25, the LED module 5 is supported in the globe 7 by the support member 17. Furthermore, since the LED module 5 is supported not only by the support member 17 but also by the lead wires 49 and 51, the LED module 5 can be stably supported. As a result, for example, the light emission center of the LED module 5 can be prevented from deviating from the lamp axis J when the LED lamp 100 is used or transported.
<1-2> Globe The globe 7 has a shape in which a tubular portion 7b having a tubular shape is smoothly connected to a spherical portion 7a having a hollow spherical shape. The cylindrical portion 7b is reduced in diameter as it moves away from the spherical portion 7a in the lamp axis J direction, and the entire shape of the globe 7 is a so-called A type in which the shape is similar to that of a general incandescent bulb (bulb having a filament). It approximates to a light bulb called. The entire globe 7 is made of a light transmissive material such as glass.

One end of the cylindrical portion 7 b is open, and this opening is closed by the stem 13. In the following, the end on the side where the opening exists is referred to as an opening side end.
<1-3> Case The case 9 is formed of a resin material (for example, a resin material mixed with polybutylene terephthalate (PBT) or glass fiber), and is similar to a portion close to the cap side of the bulb of the incandescent bulb. It has a shape. As shown in FIG. 2, in this embodiment, the case 9 has a large-diameter portion 9a on the globe side half in the lamp axis J direction and a small-diameter portion 9b on the base half. Further, there is a stepped portion 9c between the large diameter portion 9a and the small diameter portion 9b as shown in the enlarged view at the lower left in FIG.

  A stem 13 formed integrally with the globe 7 is fixed to the upper end portion of the large diameter portion 9a with an adhesive. A base 11 is attached to the side of the small diameter portion 9b opposite to the large diameter portion 9a side. Here, the outer periphery of the small diameter portion 9 b is a male screw and is screwed into the base 11. Thereby, the base 11 and the case 9 are coupled. A groove extending in parallel with the direction in which the central axis of the case 9 extends is formed in the small diameter portion 9b (groove 9d in FIG. 2). This groove fixes the lead wire 33 that connects the base 11 and the circuit unit 15 (regulates the movement of the lead wire 33).

As shown in FIG. 2, the case 9 has a sealed space inside because the opening on the upper end side is closed by the stem 13 and the opening on the lower end side is closed by the base 11. The circuit unit 15 is accommodated in this space. Note that the mounting method of the circuit unit 15 will be described when the circuit unit 15 is described.
<1-4> Base The base 11 is an Edison type. The base 11 includes a shell portion 27 having a cylindrical shape and a peripheral wall having a screw shape, and an eyelet portion 31 attached to the shell portion 27 via an insulating portion 29.

The shell portion 27 is connected to the circuit unit 15 via the lead wire 33, and the eyelet portion 31 is connected to the circuit unit 15 via the lead wire 35. The lead wire 33 is covered by the shell portion 27 in a state where the lead wire 33 is pulled out from the inside of the small-diameter portion 9b of the case 9 to the outside via the opening at the lower end and fitted in the groove 9d of the case 9. As a result, the lead wire 33 is sandwiched between the outer periphery of the case 9 and the inner periphery of the shell portion 27, and the lead wire 33 and the base 11 are electrically connected.
<1-5> Stem As shown in FIGS. 1 and 2, a stem 13 that closes an opening on the rear side of the globe 7 is attached to an end portion on the rear side of the globe 7. The stem 13 in this embodiment is made of the same translucent material as the globe 7, and the globe 7 and the stem 13 are integrally formed. As shown in FIG. 2, lead wires 49 and 51 are inserted through the stem 13.

  In the globe 7 closed by the stem 13 (also referred to as a valve) (region formed by the globe 7 and the stem 13 closing the opening thereof), a fluid having higher thermal conductivity than air is present. It is enclosed. In this embodiment, helium (He) gas is used as such a fluid. Advantages of using helium gas include inertness and low cost. Further, as described above, since the globe 7 and the stem 13 are integrally formed in the present embodiment, the inside of the globe 7 closed by the stem 13 can be tightly sealed.

  As described above, it is possible to efficiently conduct the heat generated when the LED 3 is turned on to the globe 7 by encapsulating the globe 7 with helium gas having higher thermal conductivity than air. The globe 7 is a member having a large envelope volume among the members constituting the LED lamp 100. Therefore, by conducting heat to the globe 7, it is possible to effectively use the globe 7 to efficiently dissipate the heat generated when the LED 3 emits light to the outside of the LED lamp 100.

In addition to helium gas, hydrogen gas, water, and the like can be used as fluids having higher thermal conductivity than air. When hydrogen gas is used, it is necessary to prevent oxygen from being contained in the globe 7 closed by the stem 13.
Further, the volume of helium gas sealed in the globe 7 is not particularly limited. Even when the inside of the globe 7 closed by the stem 13 is not filled with helium gas, the heat transfer to the globe 7 is promoted as compared with the case where helium gas is not enclosed in the globe 7. Is possible.

As shown in FIG. 1, the stem 13 is provided with an exhaust port 13a2. The helium gas is sealed through the exhaust port 13a2 and the exhaust pipe 13b1 continuous therewith. The exhaust pipe sealing portion 13b shown in FIG. 3 is the remaining portion of the exhaust pipe 13b1 whose end has been burned out to seal the inside of the globe 7 closed by the stem 13 after the helium gas is sealed.
The stem 13 has a function of closing the opening of the globe 7 and a function of conducting heat generated when the LED 22 is turned on to the globe 7. Details of this will be described later.
<1-6> Circuit Unit The circuit unit 15 includes a circuit board 41 and various electronic components 43 mounted on the circuit board 41.

The circuit board 41 is fixed inside the case 9 using a locking structure. Specifically, the peripheral edge portion of the back surface of the circuit board 41 abuts on the stepped portion 9c inside the case 9, and the surface of the circuit board 41 is locked by the locking portion 47 on the inner surface of the large diameter portion 9a.
A plurality (for example, four) of the locking portions 47 are formed at intervals (for example, equal intervals) in the circumferential direction. The locking portion 47 has a shape that protrudes toward the central axis side of the case 9 as it approaches the stepped portion 9 c, and the distance between the locking portion 47 and the stepped portion 9 c corresponds to the thickness of the circuit board 41.

When the circuit board 41 is mounted, the circuit unit 15 is inserted from the large diameter portion 9 a side of the case 9, and when the lower surface of the circuit board 41 (surface on the base 11 side) reaches the locking portion 47, The board 41 is further pushed to pass through the locking portion 47. As a result, the circuit board 41 is locked by the locking portion 47 and the circuit unit 15 is attached to the case 9.
The circuit unit 15 includes a rectifier circuit that rectifies commercial power (AC) received through the base 11 and a smoothing circuit that smoothes the rectified DC power. Here, the rectifying / smoothing circuit 15a is composed of the rectifying circuit and the smoothing circuit. The smoothed DC power is converted into a predetermined voltage, which is a voltage applied to the LED 22, by a step-up / step-down circuit or the like, if necessary.

Here, the rectifier circuit is constituted by a diode bridge, and the smoothing circuit is constituted by a capacitor. The diode bridge is mounted on the main surface of the circuit board 41 on the globe 7 side. The capacitor is mounted on the main surface of the circuit board 41 on the base 11 side and is located inside the base 11.
<1-7> Support Member As shown in FIGS. 1 and 2, a support member 17 is provided on the top of the stem 13 on the front side. The support member 17 has both a function as a support for the LED module 5 and a function as a heat dissipation member when the lamp 1 emits light.

The support member 17 includes a cylindrical portion 17b having a circular cross section and a flat portion 17c formed at the upper end of the cylindrical portion 17b.
A convex portion 17d is formed on the upper surface of the flat portion 17c, and the through hole 25 (FIG. 3) is formed in the approximate center of the mounting substrate 21 of the LED module 5 as described above. The shape of the convex portion 17d and the shape of the through hole 25 correspond to each other, and the convex portion 17d of the flat portion 17c is fitted into the through hole 25 of the mounting substrate 21 so that both are coupled.

The lower end portion of the cylindrical portion 17 b is attached to the stem 13 by the adhesive portion 14. Examples of the adhesive used for the bonding portion 14 include inorganic material-based adhesives such as ceramics and cement.
<1-8> Piezofan The piezofan 80 is provided as an example of convection promoting means, and is disposed at a portion where the inner wall of the globe 7 and the lamp axis J intersect. The detailed structure of the piezo fan 80 is shown in FIGS. 4 (a) and 4 (b). Here, FIG. 4B is a partially broken sectional view taken along line BB ′ in FIG.

The piezo fan 80 includes a first electrode 80d1, a piezoelectric element 80b provided on the first electrode 80d1, a blower plate 80a formed in an elongated flat plate shape and having a fixed end bonded to the piezoelectric element 80b, and a blower plate 80a. A second electrode 80d2 provided on the upper side, and a support portion 80c that supports the fixed end side of the piezoelectric element 80b and the blower plate 80a so that the first electrode 80d1 and the second electrode 80d2 are exposed to the outside. When an AC voltage is applied between the first electrode 80d1 and the second electrode 80d2, the piezoelectric element 80b repeatedly expands and contracts in the thickness direction. Along with this, the blower plate 80a to which the piezoelectric element 80b is bonded vibrates in the thickness direction of the blower plate 80a (see the broken line portion in FIG. 4 (b)) and flows the gas existing around the piezo fan 80. Let Here, the flow direction of the gas is the direction in which the blower plate 80a extends (see the arrow in FIG. 4B). That is, gas blows out from the piezo fan 80 in the direction in which the blower plate 80a extends.
Further, as shown in FIG. 1, the piezo fan 80 is arranged on the top of the clove 7 so that the extending direction of the blower plate 80 a coincides with the lamp axis J direction.

The piezo fan 80 is connected to a power receiving circuit 85 and is driven by electric power supplied from the power receiving circuit 85. The power receiving circuit 85 is fed (non-contact power feeding) from the power transmission circuit 16 provided in the circuit unit 15.
FIG. 5A shows a configuration diagram of a system that performs non-contact power supply to the piezo fan 80.
As shown in FIG. 5A, the circuit unit 15 is provided with a power transmission circuit 16 that outputs electromagnetic waves. The power transmission circuit 16 includes an inverter 16a that is connected to the output terminal of the rectifying and smoothing circuit 15a and generates AC power, and a power transmission antenna 16b that includes a coil antenna that is connected to the inverter 16a. The power transmission antenna 16b is configured by a wiring pattern formed on the circuit board 41 as shown in FIG.

The power receiving circuit 85 includes a power receiving antenna 85a including a coil antenna that receives electromagnetic waves transmitted from the power transmitting antenna 16b of the power transmitting circuit 16 included in the circuit unit 15, and a resonance circuit 85b connected to the power receiving antenna 85a. The An alternating voltage generated between the output ends of the resonance circuit 85b is applied between the two electrodes 80d1 and 80d2 provided on both sides in the thickness direction of the piezoelectric element 80b. Here, the power receiving antenna 85a is constituted by a coil antenna provided on the peripheral wall of the globe 7, as shown in FIG. The resonance circuit 85 b is composed of a capacitor and a resistor, and is provided adjacent to the piezo fan 80.
<2> Operation The operation of the lamp 1 according to the first embodiment will be described with reference to FIG.

As shown in FIG. 6, the lamp 1 is often mounted on a lighting fixture with the top of the globe 7 facing downward. Hereinafter, in the globe 7, the direction toward the top of the globe 7 on the lamp axis J will be described as downward, and the direction opposite to the direction toward the top of the globe 7 will be described as upward.
When the helium gas enclosed in the globe 7 is warmed by the heat generated from the LED module 5, it flows toward the stem 13 above the globe 7 by natural convection. Thereafter, the helium gas is cooled by exchanging heat with the outside air through the peripheral wall of the globe 7 or the stem 13 in the vicinity of the stem 13. Then, the cooled helium gas flows downward along the peripheral wall of the globe 7. Then, the helium gas that has flowed to the lower side of the globe 7 again flows to the LED module 5 side. Thereafter, the helium gas that has flowed to the LED module 5 side is warmed by exchanging heat with the LED module 5, and flows again above the globe 7.

In the first embodiment, the piezo fan 80 provided at the top of the globe 7 promotes the flow of helium gas flowing to the lower side of the globe 7 toward the LED module 5 (that is, convection of helium gas). (See the arrow in FIG. 6).
That is, when the helium gas sealed in the globe 7 is convected, the heat generated in the LED module 5 is conducted to the globe 7 through the helium gas, and then released to the outside from the outer surface of the globe 7. It will be. In the first embodiment, the convection of helium gas is promoted by the piezo fan 80, so that the release of heat generated in the LED module 5 to the outside of the globe 7 is promoted.

In the first embodiment, the example in which the lamp 1 is mounted so that the top of the globe 7 faces upward has been described. However, the top of the globe 7 faces downward, or the lamp axis J intersects the vertical direction. You may attach to. However, in the first embodiment, the effect is most obtained when the lamp 2 is mounted such that the top of the globe 7 faces downward.
Further, it has been proved by the inventor of the present application that the temperature of the LED module 5 is reduced by about 50 ° C. only by filling the globe 7 with helium gas. Then, it is considered that the temperature of the LED module 5 can be further lowered by providing the piezo fan 80 in the globe 7 and promoting the convection of helium gas in the globe 7 as in the first embodiment.
<3> Manufacturing Method The manufacturing method of the lamp 1 according to the first embodiment will be described based on FIGS. 7 to 10 while also referring to FIG.

  Here, FIG. 7 is a cross-sectional view in each step of the manufacturing process for obtaining the structure in which the tip of the thin tube 13b ′ is welded to the stem head 13a. FIGS. ) Is a cross-sectional view viewed from one direction orthogonal to the lamp axis J, and FIGS. 7A to 7C are cross-sectional views viewed from one direction orthogonal to the lamp axis J and the one direction. . In addition, the vertical direction in FIGS. 7 to 10 is the same as the vertical direction in the following description.

FIGS. 8 to 10 show the manufacturing until the lamp 1 is completed by attaching the globe 7, the case 9, and the base 11 to the structure in which the tip of the thin tube 13b ′ is welded to the stem head 13a. About a process, the schematic perspective view in each process is shown.
First, as shown in FIGS. 7 (a) and (a) ′, two lead wires 49 and 51 are inserted inside the flare tube 13a ′ that is the basis of the stem head 13a (see FIG. 2), and the exhaust gas is exhausted. A narrow tube 13b ′ serving as a base of the tube sealing portion 13b (see FIG. 2) is arranged so that the tip portion is located inside the flare tube 13a ′.

Next, by heating and melting the straight portion 13a1 ′ of the flare tube 13a ′, the front side (upper side) end portion of the flare tube 13a ′ is welded to the upper end portion of the narrow tube 13b ′, and FIG. And the structure formed by welding the upper end part of thin tube 13b 'to the downward side of stem head 13a as shown to (b)' is obtained.
Subsequently, the portion of the stem head 13a where the thin tube 13b ′ is welded is heated, and in the state where the portion of the stem head 13a where the thin tube 13b ′ is welded is softened, air is sealed in the thin tube 13b ′. Apply a predetermined internal pressure. Then, pressure is applied to the portion of the stem head 13a where the narrow tube 13b ′ is welded, and an exhaust port 13a2 is formed (see FIG. 8A). In this way, a structure is obtained in which the exhaust pipe 13b1 communicating with the exhaust port 13a2 opening in the stem head 13a is provided.

Thereafter, the support member 17 is fixed to the substantially central portion of the stem head 13a with an adhesive (see FIG. 8B). At this time, an adhesive portion 14 is formed between the stem head 13 a and the support member 17.
Next, the LED module 5 is attached to the tip of the support member 17. Here, the convex portion 17 d formed at the distal end portion of the support member 17 is inserted into the through hole 25 formed in the mounting substrate 21 of the LED module 5. Thereafter, one end of each of the lead wires 49 and 51 is joined to the power supply terminals 24a and 24b. In this way, a structure (hereinafter referred to as a mount) composed of the LED module 5, the support member 17, and the stem 13 as shown in FIG. 8C is obtained.

  Subsequently, a glass globe member 7 ′, which is the basis of the globe 7, is placed on the outside of the mount shown in FIG. Here, the piezo fan 80 is fixed to the top of the glove member 7 ′ with an adhesive in advance. Thereafter, by heating a portion of the peripheral wall of the glove member 7 ′ corresponding to the peripheral portion of the stem head 13a (see FIG. 8D), the peripheral portion of the stem head 13a is welded to the glove member 7 ′. . Thereafter, a portion 7 b ′ below the portion where the peripheral portion of the stem head 13 a in the glove member 7 ′ is welded is cut out (see FIG. 9A). Here, the portion 7 a ′ above the portion where the peripheral portion of the stem head 13 a in the glove member 7 ′ is welded corresponds to the globe 7.

  Then, after exhausting the air existing in the space surrounded by the globe 7 and the stem head 13a through the exhaust pipe 13b1 (see FIG. 9B), the globe 7 and the stem head through the exhaust pipe 13b1. Helium gas is sealed in the space surrounded by 13a (see FIG. 9C). At this time, the pressure of the helium gas filled in the space surrounded by the globe 7 and the stem head 13a is substantially the same as the atmospheric pressure or slightly higher than the atmospheric pressure.

Next, the exhaust pipe 13b1 is sealed by heating a part of the exhaust pipe 13b1 (see FIG. 10A). Then, the exhaust pipe sealing part 13b is formed, and the space in the globe 7 is sealed (see FIG. 10B).
Subsequently, the other end of the lead wires 49 and 51 opposite to the one connected to the power supply terminals 24a and 24b of the LED module 5 is connected to the power output unit of the circuit unit 15, and one end is an insulating case. The circuit unit 15 is connected to the other end of the lead wire 33 disposed in the slit 9c of the second case portion 9c and the other end of each of the lead wires 35 having one end connected to the eyelet portion 31 of the base 11. To the power input unit (see FIG. 10B).

Then, after the base 11 is screwed to the small diameter portion 9 b of the insulating case 9 and the globe 7 is fitted inside the large diameter portion 9 a of the insulating case 9, a gap between the large diameter portion 9 a and the globe 7 is obtained. The assembly of the lamp 1 is completed by pouring an adhesive made of a heat insulating resin into the large diameter portion 9a and the globe 7 (see FIG. 10C).
<Second Embodiment>
A lighting apparatus according to the second embodiment will be described with reference to FIG. FIG. 11 is a schematic cross-sectional view of the luminaire 100 according to the second embodiment.

As shown in FIG. 11, the lighting fixture 100 is used by being mounted on, for example, an indoor ceiling C, and includes the lamp 1 according to the first embodiment and the lighting fixture 102.
The lighting fixture 102 turns off and turns on the lamp 1, and includes a fixture main body 103 attached to the ceiling C and a lamp cover 4 that covers the lamp 1.
The instrument body 3 has a socket 103a. The base 11 of the lamp 1 is screwed into the socket 103a. Electric power is supplied from the external power source to the lamp 1 through the socket 103a.

Note that the lighting apparatus 100 illustrated in FIG. 11 is an example, and is not limited to this as long as the lighting apparatus 100 includes a socket that holds the lamp 1 and supplies power to the lamp 1. Moreover, although the lighting fixture 100 shown in FIG. 11 is provided with one lamp 1, it may be provided with a plurality of lamps 1.
<Modification>
As mentioned above, although the structure of this invention was demonstrated based on 1st, 2nd embodiment, this invention is not limited to the said embodiment etc. For example, the following modifications can be given.

  (1) In the first embodiment, the example in which the piezo fan 80 is disposed at the site corresponding to the top of the globe 7 on the inner wall of the globe 7 has been described, but the present invention is not limited to this. For example, the piezo fan 80 may be provided in each of one or more portions other than the portion corresponding to the top of the globe 7 on the inner wall of the globe 7. In this case, the direction of the blower plate 80a of the piezo fan 80 may be, for example, a direction along the inner wall of the globe 7 so as to obtain a convection promoting effect.

(2) In the first embodiment, the example in which the piezo fan 80 is disposed on the inner wall of the globe 7 has been described. However, the present invention is not limited to this. For example, as shown in FIG. 12, two piezo fans 80 may be provided on a part of the outer wall of the support member 17.
Here, each of the two piezo fans 80 is supplied with electric power via a feeder line (not shown) that is led out from the circuit unit 15 and passes through the inside of the support member 17.

In the present modification, power supply to the piezo fan 80 can be performed by a power supply line passing through the inside of the support member 17, so that the structure can be simplified as compared with the case where non-contact power supply is performed to the piezo fan 80. Therefore, there is an advantage that costs can be reduced and manufacturing can be facilitated.
(3) In the first embodiment, an example in which helium gas is filled in the globe 7 and a piezo fan 80 for promoting convection of the helium gas is disposed on the inner wall of the globe 7 has been described. However, the present invention is not limited to this. For example, the lamp 3 may be configured such that a region in the globe 57 is filled with water, and a stirrer 82 for promoting convection of water is attached in this region.

The lamp 3 according to this modification will be described in detail based on the schematic cross-sectional view of the lamp 3 shown in FIG.
The lamp 3 has substantially the same configuration as the lamp 1 having the configuration shown in FIG. 1, and, as shown in FIG. 13, two regions S <b> 1 and S <b> 2 (first region S <b> 1 and second region S <b> 2) in the globe 57. Is formed, the point provided with the first support member 67 and the second support member 63, and the second region S2 in the globe 57 is filled with water, and the water filled in the second region S2 The difference is that a stirrer 82 for promoting convection is attached to the top of the globe 57.

The globe 57 is formed of a translucent material on the inner side thereof, and is provided with a cylindrical portion 57 a for housing the LED module 5 and the stem 67.
The second support member 63 is made of a material having good thermal conductivity such as metal and supports the first support member 67.
The first region S <b> 1 surrounded by the inside of the cylindrical portion 57 a and the second support member 63 is filled with a translucent heat conductive resin 58. The heat conductive resin 58 has, for example, a through hole (not shown) for injecting the heat conductive resin into the first region S1 in a part of the support member 63 to open the globe 57. After fitting the second support member 63 to the portion 57b, the heat conductive resin may be injected and filled from the through hole into the first region S1.

The stirrer 82 includes, for example, a small screw. The stirrer 82 includes an antenna (not shown) that receives radio waves transmitted from the transmission unit, and a power conversion unit (not shown) that converts radio waves received by the antenna into electric power. The screw is rotated by electric power after being converted by the converter.
In this modification, the example in which the region S2 is filled with water has been described. However, the present invention is not limited to this, and the region S2 may be filled with helium gas. In this case, a piezo fan 80 is provided instead of the stirrer 82. Alternatively, the region S2 may be filled with neon gas, hydrogen gas, or silicon oil.
(4) In the first embodiment, in the manufacturing method of the lamp 1, a globe in which a piezo fan 80 is fixed to the top by an adhesive on the outside of a structure composed of the LED module 5, the support member 17 and the stem 13. 7, the portion corresponding to the peripheral portion of the stem head 13 a on the peripheral wall of the globe 7 is heated (see FIG. 8D), and then the peripheral portion of the stem head 13 a in the globe 7 is welded. Although the example of cutting out the lower part (see FIG. 9A) has been described, the method for manufacturing the lamp 1 is not limited to this. Hereinafter, another example of the method for manufacturing the lamp 1 will be described.

  First, the outer surface of the structure composed of the LED module 5, the support member 17, and the stem 13 is covered with a globe 7 having a piezo fan 80 fixed to the top with an adhesive, and then the periphery of the opening 7a of the globe 7 is covered. By heating (see FIG. 14A), the diameter of the opening 7a is reduced. At this time, the inner diameter of the opening 7a of the globe 7 is made smaller than the outer diameter of the stem head 13a (see FIG. 14B).

Then, the opening 7a of the globe 7 is welded to the peripheral wall of the stem head 13a (see FIG. 14C).
This manufacturing method is advantageous in that the material cost can be reduced because the work of cutting off a part of the lower end side of the globe 7 is not required.
(5) In the first embodiment, the example in which power is supplied from the commercial power supply to the piezo fan 80 via the power transmission circuit and the power reception circuit has been described, but the present invention is not limited to this. For example, power may be supplied from the solar cell to the piezo fan 80.

  (6) In the first embodiment, the example in which the power supply to the piezo fan 80 is performed by non-contact power supply has been described, but the present invention is not limited to this. For example, as shown in FIG. 15, power supply lines 90a and 90b may be provided on the inner wall of the globe, and power may be supplied to the piezo fan 80 via the power supply lines 90a and 90b. The power supply lines 90a and 90b may be formed of metal, but are preferably formed of a transparent conductive material such as ITO in consideration of the light distribution characteristics of the lamp.

  (7) In the first embodiment, the example in which the support member 17 and the stem 13 are joined by the adhesive portion 14 made of an adhesive has been described, but the present invention is not limited to this. For example, as shown in FIG. 16A, a wire 64 extending from the top of the stem head 13a constituting a part of the stem 13 is provided, and the stem 68 is fitted to the stem head 13a at the lower end thereof. The recess 68a may be formed, and the hole 68b through which the wire 64 can be inserted may be formed. Here, the hole 68 b penetrates from the bottom of the recess 68 a to the side surface of the stem 68.

  In the manufacturing method according to this modification, when attaching the stem 68 to the stem head 13a, first, the wire 64 is inserted into the hole 68b, and the stem head 13a is brought into contact with the recess 68a of the stem 68. At this time, the wire 64 is guided along the hole 68b, and the tip end portion of the wire 64 protrudes from the side surface of the stem 68 in a state where the stem head 13a is in contact with the recess 68a of the stem 68. Then, the stem 68 is fixed to the stem head 13a by bending the tip of the wire 64.

That is, in this modification, the stem 68 is fixed to the stem 13 by the wire 64.
Alternatively, as shown in FIG. 16 (b), a rod-shaped locking member 65 is provided that extends from the top of the stem head 13 a constituting a part of the stem 13 and locks the stem 69 to the stem 13. The stem 69 may be formed with a recess 69a fitted to the stem head 13a at the lower end thereof and a cavity 69b formed inside the stem 69. Here, the cavity 69b is provided on the opposite side of the first part 69b1 from the bottom part of the recess 68a in the longitudinal direction of the stem 69 and on the opposite side to the recess 69a side in the first part 69b1, and the stem 69 compared to the first part 69b1. The second portion 69b2 is formed so that the cross-sectional area perpendicular to the longitudinal direction of the second portion 69b increases. A claw piece 65 a is formed at the tip of the locking member 65.

  In the manufacturing method according to this modification, when attaching the stem 69 to the stem head 13a, first, the locking member 65 is inserted into the first portion 69b1 of the cavity 69b, and then the stem head 13a is inserted into the recess 69a of the stem 69. Abut. Here, the distal end portion of the locking member 65 is guided to the second portion 69b2 along the first portion 69b1 in a state where the claw piece 65a is bent, and the stem head 13a contacts the concave portion 69a of the stem 69. In the state of contact, the distal end portion of the locking member 65 is disposed in the second portion 69b2. Then, the claw piece 65a is locked to a stepped portion 69b3 formed between the first portion 69b1 and the second portion 69b2 in a state where the distal end portion of the locking member 65 is disposed in the second portion 69b2. The stem 69 is fixed to the stem head 13a.

That is, in this modification, the stem 69 is fixed to the stem 13 by the locking member 65.
(8) In the lamp 1 according to the first embodiment, a structure composed of the globe 7 and the stem 13 is fixed to the large-diameter portion 9a of the case 9, and as shown in FIG. An adhesive 339 made of a heat insulating resin may be interposed between the body and the large diameter portion 9a.

Thereby, since the heat generated in the circuit unit 15 and conducted to the case 9 is not conducted to the globe 7 and the stem 13, the heat generated in the circuit unit 15 can be prevented from being conducted to the LED module 5. The temperature rise of the module 5 can be suppressed.
(9) In the lamp 3 according to the modification described in the above (3), the globe 57 and the support member 63 are fixed by the adhesive 337 made of a heat conductive resin, and the large diameter portion 9a of the globe 57 and the case 9 is secured. May be fixed by an adhesive 339 made of a heat insulating resin.

  Thereby, the heat conducted from the circuit unit 15 to the large-diameter portion 9a of the case 9 is less likely to be conducted toward the globe 57 and the support member 63, while the support member 63 from the LED module 5 through the first support member 67. The heat conducted to is easily conducted to the globe 57. Accordingly, the heat generated in the circuit unit 15 is less likely to be conducted to the LED module 5 side via the globe 57 and the second support member 63, so that the temperature rise of the LED module 5 can be suppressed. .

(10) The thermally conductive resin filled in the first region S1 in the modification described in the above (3) may include phosphor particles. As the phosphor particles, three types of particles that convert to red light, particles that convert to green light, and particles that convert to blue light can be used.
(11) In the first embodiment, an LED is used as a light source. However, for example, a surface mount type or a shell type LED may be used. In this case, the LED element is resin-sealed, and the LED module has a mounting substrate and LEDs.

  In the above-described embodiments and modifications, the emission color of the LED is blue light, and the phosphor particles are described as converting blue light into yellow light. However, other combinations may be used. As an example of other combinations, when white light is emitted, the LED emission color is ultraviolet light, and phosphor particles are converted into red light, particles converted into green light, and particles converted into blue light. Can be used.

Furthermore, the light emission color of the LED may be mixed with white light by using three types of LEDs of red light emission, green light emission, and blue light emission. Needless to say, the light color emitted from the LED module 5 is not limited to white, and various LEDs (including elements and surface mount types) and phosphor particles can be used depending on the application. .
(12) In the first embodiment, the phosphor particles are mixed in the sealing body. For example, a phosphor layer containing the phosphor particles may be formed on the inner surface of the globe. In addition to the sealing body, a wavelength conversion member such as a fluorescent plate containing phosphor particles may be provided in the light emission direction of the LED. Here, when the temperature of the phosphor particles becomes high, the wavelength conversion efficiency decreases. Therefore, by forming the phosphor layer on the inner surface of the globe, the phosphor particles are less affected by heat at the time of LED emission than when the phosphor particles are mixed in the sealed body sealing the LED. The decrease in the wavelength conversion efficiency can be suppressed.

(13) In the first embodiment, the mounting substrate having a rectangular or circular shape in plan view has been described as an example. However, the shape of the substrate in plan view is not particularly limited.
In the above-described embodiment, a thin plate (having a side surface area smaller than the top surface area) has been described as an example. However, for example, a thick plate may be used, or a block-like shape may be used. You may use things.

In addition, the mounting board | substrate in this specification points out what has the pattern which mounts LED (an element and a surface mounting type are included) and is electrically connected with LED irrespective of a shape, thickness, and a form. . Therefore, the substrate may have a block shape.
In the above-described embodiment, the mounting substrate is made of a translucent material. However, when it is not necessary to extract light backward, it may be made of a material other than the translucent material.

(14) The LED module 5 in the first embodiment is configured such that the mounting substrate 21 is made of a light-transmitting material and irradiates the rear side, but light is irradiated rearward by other methods. Also good.
As another method, the mounting substrate may be made of a material that is not a light-transmitting material, and the LEDs may be mounted on both the front and back surfaces of the mounting substrate. Further, the mounting substrate is made of a material that is not a light-transmitting material, and the mounting substrate has a polyhedral configuration such as a spherical shape or a cubic shape (for example, six insulating plates are three-dimensionally bonded into a cubic shape). In addition, LEDs (including bullets and SMDs) may be mounted on the surface.

(15) In the first embodiment, the LED is used as the light emitting element, but a light emitting element other than the LED may be used. Examples of other light emitting elements include LD and EL light emitting elements (including organic and inorganic), and these may be used in combination, including LEDs.
(16) In the first embodiment, the A type and R type globes 7 are used, but other types, for example, B and G types, may be used. The shape may be completely different from the globe shape.

The globe may be transparent so that the inside can be seen, or may be translucent so that the inside cannot be seen. Translucency can be carried out, for example, by applying a diffusion layer mainly composed of calcium carbonate, silica, white pigment, or the like on the inner surface, or performing a treatment for making the inner surface uneven (for example, blasting).
In the first embodiment, the globe 7 is made of a glass material. However, the globe 7 can be made of another material. Other materials include translucent resins and ceramics.

  (17) In the first embodiment, the case 9 is made of a resin material, but can be made of other materials. When using a metal material as another material, it is necessary to ensure insulation from the base. Insulation with the base can be ensured by, for example, applying an insulating layer to the small-diameter portion of the case or by insulating the small-diameter portion. It can also be ensured by configuring each side with a resin material (two or more members are combined).

In the first embodiment, the surface of the case 9 is not particularly described. For example, a heat radiating fin may be provided, or a process for improving the radiation rate may be performed.
In the first embodiment, the case 9 is composed of one member, but can be composed of a plurality of members. For example, a large-diameter member corresponding to the large-diameter portion in the embodiment and a small-diameter member corresponding to the small-diameter portion may be joined with an adhesive. At this time, the large diameter member may be made of metal and the small diameter member may be made of resin.

In the first embodiment, the circuit unit 15 is stored in the case 9, but the inside may be filled with a resin material, for example. In this case, heat generated in the circuit unit can be transferred to the case, and a heat load acting on the circuit unit can be reduced.
(18) Although the Edison type base 11 is used in the first embodiment, other types, for example, pin types (specifically, G types such as GY and GX) may be used. In the first embodiment described above, the base 11 is attached to the case 9 by being screwed into the screw portion of the case 9 using the female screw of the shell portion 27. It may be joined to the case. Other methods include bonding by an adhesive, bonding by caulking, bonding by press-fitting, and the like, and two or more of these methods may be combined. Alternatively, the inside of the base may be filled with resin to improve the thermal conductivity to the peripheral wall of the base.

  (19) The circuit unit 15 is not limited to the configuration described in the first embodiment. For example, the circuit unit transmits and receives radio signals from the outside in addition to a circuit for converting AC power received from the base into DC power for lighting the semiconductor light emitting element, and based on the radio signals. A circuit for controlling lighting of the semiconductor light emitting element may be provided. Here, “lighting control” includes, for example, lighting, extinguishing, dimming, illumination color change, and the like.

Further, the posture in which the circuit board is fixedly accommodated in the case is not limited to the posture in which the main surface of the circuit board is substantially orthogonal to the lamp axis J. For example, the circuit board may be accommodated in a posture that is substantially parallel to the lamp axis J, or may be accommodated in a posture having a predetermined inclination angle with respect to the lamp axis J.
Further, the circuit board is not limited to a disk shape, and the shape in plan view may be a rectangular shape, a polygonal shape, or an indefinite shape such as a heart shape, or may be formed by a flexible member such as a flexible substrate and bent. It may be accommodated inside the case in a state where it is placed.

  Further, the method of fixing the circuit board inside the case is not limited to the locking structure by the locking part, and the circuit board may be fixed inside the case by, for example, screwing or bonding.

  The lamp according to the present invention can be widely used in general lighting applications.

1, 2, 3, 4 Lamp 5 LED module (light emitting module)
9 Case (housing)
9a 1st case part 9b 2nd case part 11 base 13 stem 13a stem head 13b narrow tube part 14 adhesion part 15 lighting circuit 16 power transmission circuit 16b power transmission antenna 17 support member 21 mounting board (board | substrate)
22 LED chip 23 Sealing material 33, 35, 49, 51 Lead wire 41 Circuit board 43 Electronic component 80 Piezo fan 85 Power receiving circuit 85a Power receiving antenna 339 Adhesive (heat insulating material)

Claims (9)

A globe formed of a translucent material and encapsulating a fluid having a higher thermal conductivity than air inside;
A light emitting module having a light emitting element and disposed in the globe;
A convection promoting means arranged in the globe and promoting convection of the fluid. The lamp according to claim 1, wherein the convection promoting means causes the fluid to flow in a direction along the lamp axis. The lamp according to claim 1, wherein the convection promoting means is disposed on a part of an inner wall of the globe. The lamp according to claim 3, wherein a part of the inner wall is a portion that intersects a lamp axis on the inner wall of the globe. A support member extending toward the inside of the globe and supporting the light emitting module;
The lamp according to claim 1, wherein the convection promoting means is disposed on a part of the outer wall of the support member. The lamp according to any one of claims 1 to 5, wherein the convection promoting means is a piezo fan. The lamp according to claim 6, further comprising a stem that is provided integrally with the globe and to which the support member is attached. A lighting circuit for lighting the light emitting element;
A housing that houses the lighting circuit in a state in which a part of the lighting circuit is in contact with an inner wall;
The globe and the stem are attached to the housing,
The lamp according to claim 7, wherein a heat insulating material is interposed between the globe and the stem and the housing. A lighting fixture comprising the lamp according to any one of claims 1 to 8.

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