JP2013016445A - 発光装置、表示装置、および反射部材の設計方法 - Google Patents
発光装置、表示装置、および反射部材の設計方法 Download PDFInfo
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- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133605—Direct backlight including specially adapted reflectors
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
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- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
- G02F1/133607—Direct backlight including a specially adapted diffusing, scattering or light controlling members the light controlling member including light directing or refracting elements, e.g. prisms or lenses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
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- H01L2924/181—Encapsulation
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Abstract
被照射体に対して、輝度がその被照射体の面方向において均一となるように、光を照射することができる発光装置、表示装置、および反射部材の設計方法を提供する。
【解決手段】
バックライトユニット1に、プリント基板12と、基台111b、LEDチップ111a、およびレンズ112を有する複数の発光部111と、発光部111を取り囲む反射部材113とを設け、レンズ112の透過領域を透過して出射される光の量をαとし、レンズ112の全表面を透過して出射される光の量をβとし、レンズ112を光軸方向に平面視したときのレンズ112の面積をγとするときに、反射部材113を光軸方向に平面視したときの反射部材113の外形がなす図形の面積δを、γ×β/αに基づいて定める。
【選択図】 図2
Description
光を出射する発光素子と
前記発光素子に対向し、光を透過する透過領域と、この透過領域の周囲を取り囲み、光を反射する反射領域とを有し、前記発光素子を被覆するレンズと、
前記レンズの周囲に設けられ、光を反射する反射部材であって、
前記透過領域を透過して前記レンズから出射される光の光量をα[lm・s]とし、前記レンズの全表面を透過して前記レンズから出射される光の光量をβ[lm・s]とし、前記レンズを前記光軸方向に平面視したときの前記レンズの面積をγ[cm2]とするときに、
前記反射部材を前記光軸方向に平面視したときの前記反射部材の外形がなす図形の面積δ[cm2]が、γ×β/αに基づいて定められることを特徴とする発光装置である。
γ×β/α×90%≦δ≦γ×β/α×100% …(1)
また本発明は、前記レンズは、前記反射領域の周囲を取り囲み、前記透過領域を透過する光よりも前記光軸から離れる向きに光が進行するように、光を透過する第2の透過領域を有することを特徴とする。
表示パネルに背面側から光を照射するための、前記発光装置を備える照明装置とを含むことを特徴とする表示装置である。
前記透過領域を透過して前記レンズから出射される光の光量α[lm・s]を測定するステップと、
前記レンズの全表面を透過して前記レンズから出射される光の光量β[lm・s]を測定するステップと、
前記レンズを前記光軸方向に平面視したときの前記レンズの面積γ[cm2]を測定するステップと、
γ×β/α×90%を下限値とし、γ×β/α×100%を上限値として、下限値以上上限値以下の範囲内で、前記反射部材を前記光軸方向に平面視したときの前記反射部材の外形がなす図形の面積δ[cm2]を設定し、この設定を満たすように前記反射部材を設計するステップとを有することを特徴とする反射部材の設計方法である。
γ×β/α×90%≦δ≦γ×β/α×100% …(1)
2 液晶パネル
12 プリント基板
12a 実装面
100 液晶表示装置
111a LEDチップ
111b 基台
112 レンズ
112a 上面
112b 側面
113 反射部材
114 基部
115 傾斜部
1121 中央部分
1122 第1湾曲部分
1123 第2湾曲部分
Claims (6)
- 被照射体に光を照射するための発光装置であって、
光を出射する発光素子と
前記発光素子に対向し、光を透過する透過領域と、この透過領域の周囲を取り囲み、光を反射する反射領域とを有し、前記発光素子を被覆するレンズと、
前記レンズの周囲に設けられ、光を反射する反射部材であって、
前記透過領域を透過して前記レンズから出射される光の光量をα[lm・s]とし、前記レンズの全表面を透過して前記レンズから出射される光の光量をβ[lm・s]とし、前記レンズを前記光軸方向に平面視したときの前記レンズの面積をγ[cm2]とするときに、
前記反射部材を前記光軸方向に平面視したときの前記反射部材の外形がなす図形の面積δ[cm2]が、γ×β/αに基づいて定められることを特徴とする発光装置。 - 前記面積δ[cm2]は、下記式(1)を満たすことを特徴とする請求項1に記載の発光装置。
γ×β/α×90%≦δ≦γ×β/α×100% …(1) - 前記透過領域に、光を拡散する拡散部が形成されることを特徴とする請求項1または2に記載の発光装置。
- 前記レンズは、前記反射領域の周囲を取り囲み、前記透過領域を透過する光よりも前記光軸から離れる向きに光が進行するように、光を透過する第2の透過領域を有することを特徴とする請求項1〜3のいずれか1つに記載の発光装置。
- 表示パネルと、
表示パネルに背面側から光を照射するための、請求項1〜4のいずれか1つに記載の発光装置を備える照明装置とを含むことを特徴とする表示装置。 - 光を出射する発光素子と、前記発光素子に対向し、光を透過する透過領域、および、この透過領域の周囲を取り囲み、光を反射する反射領域を有し、前記発光素子を被覆するレンズと、前記レンズの周囲に設けられ、光を反射する反射部材とを備える発光装置の前記反射部材を設計する設計方法であって、
前記透過領域を透過して前記レンズから出射される光の光量α[lm・s]を測定するステップと、
前記レンズの全表面を透過して前記レンズから出射される光の光量β[lm・s]を測定するステップと、
前記レンズを前記光軸方向に平面視したときの前記レンズの面積γ[cm2]を測定するステップと、
γ×β/α×90%を下限値とし、γ×β/α×100%を上限値として、下限値以上上限値以下の範囲内で、前記反射部材を前記光軸方向に平面視したときの前記反射部材の外形がなす図形の面積δ[cm2]を設定し、この設定を満たすように前記反射部材を設計するステップとを有することを特徴とする反射部材の設計方法。
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US13/533,369 US20130013252A1 (en) | 2011-07-06 | 2012-06-26 | Light-emitting device, display apparatus, and method for designing reflective member |
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KR101962121B1 (ko) * | 2011-12-12 | 2019-03-28 | 삼성디스플레이 주식회사 | 렌즈, 및 이를 포함하는 백라이트 어셈블리 및 표시 장치 |
KR101491207B1 (ko) * | 2012-07-18 | 2015-02-06 | 엘지이노텍 주식회사 | 표시 장치 및 발광 장치 |
JP6327465B2 (ja) * | 2014-07-25 | 2018-05-23 | 日本精機株式会社 | 発光装置 |
JP6820768B2 (ja) * | 2017-03-03 | 2021-01-27 | 株式会社エンプラス | 面光源装置および表示装置 |
EP3760919B1 (en) * | 2019-01-31 | 2023-01-11 | LG Electronics Inc. | Backlight unit and display device comprising same |
DE102020115536A1 (de) * | 2019-06-21 | 2020-12-24 | Lg Display Co., Ltd. | Lichtleiterfilm, Hintergrundlichteinheit und Anzeigevorrichtung |
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US8469554B2 (en) * | 2009-02-12 | 2013-06-25 | Panasonic Corporation | Illuminating lens, lighting device, surface light source, and liquid-crystal display apparatus |
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US9823507B2 (en) | 2013-02-14 | 2017-11-21 | Lg Electronics Inc. | Display device |
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