JP2012533184A - 単極半導体部品と半導体装置の製造方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 63
- 239000000463 material Substances 0.000 claims abstract description 62
- 239000002800 charge carrier Substances 0.000 claims abstract description 58
- 230000012010 growth Effects 0.000 claims abstract description 30
- 230000008021 deposition Effects 0.000 claims abstract description 25
- 230000007423 decrease Effects 0.000 claims abstract description 23
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 21
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 230000003247 decreasing effect Effects 0.000 claims abstract description 8
- 239000002019 doping agent Substances 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 44
- 230000015556 catabolic process Effects 0.000 claims description 33
- 230000005684 electric field Effects 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 19
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- 229910002601 GaN Inorganic materials 0.000 claims description 13
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 13
- 238000009792 diffusion process Methods 0.000 abstract description 10
- 238000011143 downstream manufacturing Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 23
- 238000000151 deposition Methods 0.000 description 21
- 230000008901 benefit Effects 0.000 description 19
- 230000014509 gene expression Effects 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 230000008569 process Effects 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000000407 epitaxy Methods 0.000 description 8
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- 239000013078 crystal Substances 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000003698 anagen phase Effects 0.000 description 2
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- 230000015572 biosynthetic process Effects 0.000 description 2
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Abstract
Description
あるいは、次式を適用してもよい。
ここで、
λは10〜1000の範囲である。
。
ここでαは所謂ラグランジュ乗数である。
ここで、基準層厚depi.const、基準面ドーピングN0.constおよび基準層抵抗ρconstはそれぞれ、成長方向に沿って一定の電荷キャリアドーピングを有する対応する基準ドリフト層(E(z=dEpi)=0によるパンチスルー設計の)、同じ最大電界Emaxおよび同じ降伏電圧VBrのパラメータに関係する。
dEpi:層厚
Emax:最大電界λ
λ:勾配パラメータ
Nmax:最大表面ドーピング
Nmin:最小表面ドーピング
ρ:層抵抗
S1〜S9:方法工程
t:時間
VBr:降伏電圧
10:半導体装置
12:基板
14:ドレインコンタクト
16:ドリフト層
18,20:界面
19:方向
22:pドープ領域
24:nドープ領域
26:ゲートコンタクト
28:ソースコンタクト
30:半導体装置
40、42:1/2セル
44、46:pドープ層
48:nドープ層
50:絶縁層
60:半導体装置
62:裏側コンタクト
64:フィールドストップ層
66:ショットキー接触
68:JTE領域
70:アルミニウム層
72:パッシベーション
Claims (11)
- ドリフト層(16)を有する単極半導体部品の製造方法であって、
少なくとも1つの広いバンドギャップ材料を含む前記ドリフト層(16)の材料のエピタキシャル堆積により、前記ドリフト層(16)の成長方向(z,19)に沿って連続的に低下する電荷キャリアドーピング(n)の濃度(N(z))を有する前記ドリフト層(16)を形成する工程、
を含む方法。 - 前記ドリフト層(16)は前記広いバンドギャップ材料と前記電荷キャリアドーピング(n)で形成される、ことを特徴とする請求項1に記載の製造方法。
- 前記ドリフト層(16)は少なくともシリコンのエネルギーギャップより大きなエネルギーギャップを有する広いバンドギャップ材料で形成される、ことを特徴とする請求項1または2に記載の製造方法。
- 前記ドリフト層(16)は少なくとも炭化ケイ素および/または窒化ガリウムで形成される、ことを特徴とする請求項1〜3のいずれか一項に記載の製造方法。
- 前記勾配パラメータ(λ)は50〜200の範囲である、ことを特徴とする請求項6または7に記載の製造方法。
- 前記ドリフト層(16)の前記成長方向(z、19)に沿って前記連続的に低下する前記電荷キャリアドーピング(n)の濃度(N(z))は、前記ドリフト層(16)の材料の前記エピタキシャル堆積中に前記電荷キャリアドーピング(n)の少なくとも1つのドープ材(A)のガス流を変えることにより形成される、ことを特徴とする請求項1〜8のいずれか一項に記載の製造方法。
- 前記ドリフト層(16)の前記成長方向(z、19)に沿った前記連続的に低下する前記電荷キャリアドーピング(n)の濃度(N(z))は、前記ドリフト層(16)の前記材料の前記エピタキシャル堆積中に、前記広いバンドギャップ材料を含む第1のガス流と第2のガス流の比を変えることにより形成される、ことを特徴とする請求項1〜9のいずれか一項に記載の製造方法。
- 基板領域(12)とドリフト層(16)を有する単極半導体部品とを有する半導体装置(10、30、40、42、60)であって、前記ドリフト層(16)は、前記基板領域(12)に対向する第1の界面(18)から前記第1の界面(18)の反対側の第2の界面(20)への方向(z、19)に沿って連続的に低下する電荷キャリアドーピング(n)の濃度(N(z))を有し、かつ少なくとも1つの広いバンドギャップ材料を含む、半導体装置。
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DE102009033302A DE102009033302B4 (de) | 2009-07-15 | 2009-07-15 | Herstellungsverfahren für ein unipolares Halbleiter-Bauelement und Halbleitervorrichtung |
PCT/EP2010/059976 WO2011006866A1 (de) | 2009-07-15 | 2010-07-12 | Herstellungsverfahren für ein unipolares halbleiter-bauelement und halbleitervorrichtung |
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JP2015156479A (ja) * | 2014-01-20 | 2015-08-27 | 住友電気工業株式会社 | Iii族窒化物半導体デバイス |
US9722017B2 (en) | 2014-01-28 | 2017-08-01 | Mitsubishi Electric Corporation | Silicon carbide semiconductor device |
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JP2014527302A (ja) | 2011-08-17 | 2014-10-09 | ラムゴス インコーポレイテッド | 酸化物半導体基板上の縦型電界効果トランジスタおよびその製造方法 |
JP2013232564A (ja) * | 2012-04-27 | 2013-11-14 | National Institute Of Advanced Industrial & Technology | 半導体装置および半導体装置の製造方法 |
US11721547B2 (en) * | 2013-03-14 | 2023-08-08 | Infineon Technologies Ag | Method for manufacturing a silicon carbide substrate for an electrical silicon carbide device, a silicon carbide substrate and an electrical silicon carbide device |
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US10600903B2 (en) * | 2013-09-20 | 2020-03-24 | Cree, Inc. | Semiconductor device including a power transistor device and bypass diode |
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US9318597B2 (en) | 2013-09-20 | 2016-04-19 | Cree, Inc. | Layout configurations for integrating schottky contacts into a power transistor device |
US9425063B2 (en) * | 2014-06-19 | 2016-08-23 | Infineon Technologies Ag | Method of reducing an impurity concentration in a semiconductor body, method of manufacturing a semiconductor device and semiconductor device |
US9899482B2 (en) * | 2015-08-11 | 2018-02-20 | Hrl Laboratories, Llc | Tunnel barrier schottky |
CN113013229A (zh) * | 2021-02-25 | 2021-06-22 | 厦门大学 | 一种碳化硅umosfet功率器件及其制备方法 |
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DE102007014038B4 (de) * | 2007-03-23 | 2015-02-12 | Infineon Technologies Austria Ag | Verfahren zur Herstellung eines Halbleiterbauelements |
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WO2003078702A1 (fr) * | 2002-03-19 | 2003-09-25 | Central Research Institute Of Electric Power Industry | Procede de preparation de cristal sic et cristal sic ainsi prepare |
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JP2015156479A (ja) * | 2014-01-20 | 2015-08-27 | 住友電気工業株式会社 | Iii族窒化物半導体デバイス |
US9722017B2 (en) | 2014-01-28 | 2017-08-01 | Mitsubishi Electric Corporation | Silicon carbide semiconductor device |
Also Published As
Publication number | Publication date |
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JP5497894B2 (ja) | 2014-05-21 |
CN102549751B (zh) | 2015-02-04 |
DE102009033302A1 (de) | 2011-01-20 |
DE112010002925A5 (de) | 2012-08-02 |
CN102549751A (zh) | 2012-07-04 |
DE102009033302B4 (de) | 2012-01-26 |
US8772140B2 (en) | 2014-07-08 |
WO2011006866A1 (de) | 2011-01-20 |
US20120187419A1 (en) | 2012-07-26 |
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