JP2012523091A5 - - Google Patents

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Publication number
JP2012523091A5
JP2012523091A5 JP2012503646A JP2012503646A JP2012523091A5 JP 2012523091 A5 JP2012523091 A5 JP 2012523091A5 JP 2012503646 A JP2012503646 A JP 2012503646A JP 2012503646 A JP2012503646 A JP 2012503646A JP 2012523091 A5 JP2012523091 A5 JP 2012523091A5
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JP
Japan
Prior art keywords
metal
composition
melting point
low melting
particles
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Pending
Application number
JP2012503646A
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English (en)
Japanese (ja)
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JP2012523091A (ja
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Priority claimed from PCT/US2010/029330 external-priority patent/WO2010114874A2/en
Publication of JP2012523091A publication Critical patent/JP2012523091A/ja
Publication of JP2012523091A5 publication Critical patent/JP2012523091A5/ja
Pending legal-status Critical Current

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JP2012503646A 2009-04-02 2010-03-31 混合された合金フィラーを含む伝導性組成物 Pending JP2012523091A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16601509P 2009-04-02 2009-04-02
US61/166,015 2009-04-02
PCT/US2010/029330 WO2010114874A2 (en) 2009-04-02 2010-03-31 Conductive compositions containing blended alloy fillers

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014059793A Division JP2014167915A (ja) 2009-04-02 2014-03-24 混合された合金フィラーを含む伝導性組成物

Publications (2)

Publication Number Publication Date
JP2012523091A JP2012523091A (ja) 2012-09-27
JP2012523091A5 true JP2012523091A5 (https=) 2012-11-08

Family

ID=42825368

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2012503646A Pending JP2012523091A (ja) 2009-04-02 2010-03-31 混合された合金フィラーを含む伝導性組成物
JP2014059793A Pending JP2014167915A (ja) 2009-04-02 2014-03-24 混合された合金フィラーを含む伝導性組成物
JP2016158377A Active JP6976028B2 (ja) 2009-04-02 2016-08-12 混合された合金フィラーを含む伝導性組成物
JP2021126418A Pending JP2021178366A (ja) 2009-04-02 2021-08-02 混合された合金フィラーを含む伝導性組成物

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2014059793A Pending JP2014167915A (ja) 2009-04-02 2014-03-24 混合された合金フィラーを含む伝導性組成物
JP2016158377A Active JP6976028B2 (ja) 2009-04-02 2016-08-12 混合された合金フィラーを含む伝導性組成物
JP2021126418A Pending JP2021178366A (ja) 2009-04-02 2021-08-02 混合された合金フィラーを含む伝導性組成物

Country Status (5)

Country Link
US (1) US8221518B2 (https=)
JP (4) JP2012523091A (https=)
KR (2) KR20120032463A (https=)
TW (1) TWI555032B (https=)
WO (1) WO2010114874A2 (https=)

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JP7500943B2 (ja) * 2019-10-11 2024-06-18 株式会社レゾナック 接合用金属ペースト、接合体の製造方法、及び接合体
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JP2024542294A (ja) * 2021-11-23 2024-11-13 オーメット サーキッツ，インコーポレイティド 電子部品の低温アセンブリのための伝導性組成物
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