KR20120032463A - 혼합된 합금 충전재를 함유하는 전도성 조성물 - Google Patents
혼합된 합금 충전재를 함유하는 전도성 조성물 Download PDFInfo
- Publication number
- KR20120032463A KR20120032463A KR1020117024999A KR20117024999A KR20120032463A KR 20120032463 A KR20120032463 A KR 20120032463A KR 1020117024999 A KR1020117024999 A KR 1020117024999A KR 20117024999 A KR20117024999 A KR 20117024999A KR 20120032463 A KR20120032463 A KR 20120032463A
- Authority
- KR
- South Korea
- Prior art keywords
- metal
- composition
- low melting
- particles
- reactive low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/09—Mixtures of metallic powders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Conductive Materials (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16601509P | 2009-04-02 | 2009-04-02 | |
| US61/166,015 | 2009-04-02 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177013835A Division KR102089843B1 (ko) | 2009-04-02 | 2010-03-31 | 혼합된 합금 충전재를 함유하는 전도성 조성물 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20120032463A true KR20120032463A (ko) | 2012-04-05 |
Family
ID=42825368
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117024999A Ceased KR20120032463A (ko) | 2009-04-02 | 2010-03-31 | 혼합된 합금 충전재를 함유하는 전도성 조성물 |
| KR1020177013835A Active KR102089843B1 (ko) | 2009-04-02 | 2010-03-31 | 혼합된 합금 충전재를 함유하는 전도성 조성물 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020177013835A Active KR102089843B1 (ko) | 2009-04-02 | 2010-03-31 | 혼합된 합금 충전재를 함유하는 전도성 조성물 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8221518B2 (https=) |
| JP (4) | JP2012523091A (https=) |
| KR (2) | KR20120032463A (https=) |
| TW (1) | TWI555032B (https=) |
| WO (1) | WO2010114874A2 (https=) |
Families Citing this family (57)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010114874A2 (en) | 2009-04-02 | 2010-10-07 | Ormet Circuits Inc. | Conductive compositions containing blended alloy fillers |
| JP6203493B2 (ja) * | 2009-11-05 | 2017-09-27 | オーメット サーキッツ インク | 冶金ネットワーク組成物の調製およびその使用方法 |
| US9636784B2 (en) * | 2010-05-03 | 2017-05-02 | Indium Corporation | Mixed alloy solder paste |
| US9017446B2 (en) | 2010-05-03 | 2015-04-28 | Indium Corporation | Mixed alloy solder paste |
| DE102011102555A1 (de) * | 2011-05-26 | 2012-11-29 | Forschungszentrum Jülich GmbH | Lotmaterial, Verwendung des Lotmaterials in einer Lotpaste sowie Verfahren zur Herstellung einer Lötverbindung mit Hilfe des Lotmaterials |
| CN102935511B (zh) * | 2011-08-15 | 2015-05-20 | 上海核威实业有限公司 | 一种提高铜铅合金粉末烧结的铜铅合金金相组织的方法 |
| WO2013038816A1 (ja) * | 2011-09-16 | 2013-03-21 | 株式会社村田製作所 | 導電性材料、それを用いた接続方法、および接続構造 |
| TW201332122A (zh) * | 2011-12-13 | 2013-08-01 | Dow Corning | 光伏打電池及其形成方法 |
| US8551367B2 (en) | 2012-01-19 | 2013-10-08 | E I Du Pont De Nemours And Company | Polymer thick film solder alloy conductor composition |
| US8557146B1 (en) | 2012-03-26 | 2013-10-15 | E I Du Pont De Nemours And Company | Polymer thick film solder alloy/metal conductor compositions |
| US9583453B2 (en) | 2012-05-30 | 2017-02-28 | Ormet Circuits, Inc. | Semiconductor packaging containing sintering die-attach material |
| JP2013256584A (ja) * | 2012-06-12 | 2013-12-26 | Panasonic Corp | 熱硬化性樹脂組成物およびフラックス組成物とそれを用いた半導体装置 |
| US12053934B2 (en) | 2012-06-18 | 2024-08-06 | Ormet Circuits, Inc. | Conductive film adhesive |
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| US9005330B2 (en) * | 2012-08-09 | 2015-04-14 | Ormet Circuits, Inc. | Electrically conductive compositions comprising non-eutectic solder alloys |
| US9034417B2 (en) * | 2012-08-20 | 2015-05-19 | E I Du Pont De Nemours And Company | Photonic sintering of polymer thick film conductor compositions |
| JP5599497B2 (ja) | 2012-08-29 | 2014-10-01 | 有限会社 ナプラ | 機能性材料 |
| US8696860B1 (en) | 2012-10-10 | 2014-04-15 | E I Du Pont De Nemours And Company | Lamination of polymer thick film conductor compositions |
| US8986579B2 (en) | 2012-10-10 | 2015-03-24 | E I Du Pont De Nemours And Company | Lamination of polymer thick film conductor compositions |
| US11440142B2 (en) | 2012-11-16 | 2022-09-13 | Ormet Circuits, Inc. | Alternative compositions for high temperature soldering applications |
| GB201222620D0 (en) * | 2012-12-14 | 2013-01-30 | Conpart As | Method of applying a conductive adhesive |
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| CN105934308B (zh) | 2014-02-10 | 2018-12-21 | 三菱电机株式会社 | 接合材料、接合方法以及电力用半导体装置 |
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| WO2016144945A1 (en) * | 2015-03-10 | 2016-09-15 | Indium Corporation | Mixed alloy solder paste |
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| US10563292B2 (en) * | 2015-04-09 | 2020-02-18 | Electronics And Telecommunications Research Institute | Metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same |
| KR101873491B1 (ko) * | 2015-04-09 | 2018-08-03 | 한국전자통신연구원 | 3d 프린팅용 금속 소재, 그 제조 방법, 및 그를 이용하는 3d 프린터 |
| EP3939740A1 (en) * | 2015-04-28 | 2022-01-19 | Ormet Circuits, Inc. | Sintering pastes with high metal loading for semiconductor die attach applications |
| US9780067B2 (en) * | 2015-06-04 | 2017-10-03 | Advanced Micro Devices, Inc. | Semiconductor chip metal alloy thermal interface material |
| US10376997B2 (en) * | 2016-06-23 | 2019-08-13 | Purdue Research Foundation | Transient liquid phase bonding process and assemblies formed thereby |
| CN110050033A (zh) * | 2016-12-09 | 2019-07-23 | 日立化成株式会社 | 组合物、粘接剂、烧结体、接合体和接合体的制造方法 |
| WO2018105126A1 (ja) * | 2016-12-09 | 2018-06-14 | 日立化成株式会社 | 組成物、接着剤、焼結体、接合体及び接合体の製造方法 |
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| US11395413B2 (en) * | 2017-09-13 | 2022-07-19 | Carnegie Mellon University | Liquid metal fusion with conductive inks and pastes |
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| CN111344806A (zh) * | 2017-11-20 | 2020-06-26 | 泰拉能源公司 | 钠-锡冷却剂和钠-锡-铅冷却剂 |
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| JP7406069B2 (ja) * | 2019-09-26 | 2023-12-27 | ダイキン工業株式会社 | 熱交換器 |
| JP7500943B2 (ja) * | 2019-10-11 | 2024-06-18 | 株式会社レゾナック | 接合用金属ペースト、接合体の製造方法、及び接合体 |
| JP2021063262A (ja) * | 2019-10-11 | 2021-04-22 | 昭和電工マテリアルズ株式会社 | 接合用金属ペースト、接合体の製造方法、及び接合体 |
| US11819953B2 (en) * | 2020-10-18 | 2023-11-21 | Mesoglue, Inc | Method of using amalgamation preform |
| JP7656862B2 (ja) * | 2021-06-18 | 2025-04-04 | パナソニックIpマネジメント株式会社 | 導電性ペーストおよびそれを用いて形成される導電膜 |
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| CN114833494B (zh) * | 2022-05-17 | 2023-04-14 | 南京恒电电子有限公司 | 实现低温焊接高温服役的过程反应性焊料及接头制备方法 |
| CN115555757B (zh) * | 2022-06-07 | 2024-07-26 | 苏州优诺电子材料科技有限公司 | 一种中温焊接的高可靠性焊锡膏及其应用 |
| CN119421760A (zh) * | 2022-07-05 | 2025-02-11 | 松下知识产权经营株式会社 | 接合材料和接合结构体 |
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| JP6203493B2 (ja) | 2009-11-05 | 2017-09-27 | オーメット サーキッツ インク | 冶金ネットワーク組成物の調製およびその使用方法 |
-
2010
- 2010-03-31 WO PCT/US2010/029330 patent/WO2010114874A2/en not_active Ceased
- 2010-03-31 KR KR1020117024999A patent/KR20120032463A/ko not_active Ceased
- 2010-03-31 US US12/751,030 patent/US8221518B2/en active Active
- 2010-03-31 KR KR1020177013835A patent/KR102089843B1/ko active Active
- 2010-03-31 JP JP2012503646A patent/JP2012523091A/ja active Pending
- 2010-04-02 TW TW099110429A patent/TWI555032B/zh active
-
2014
- 2014-03-24 JP JP2014059793A patent/JP2014167915A/ja active Pending
-
2016
- 2016-08-12 JP JP2016158377A patent/JP6976028B2/ja active Active
-
2021
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2021178366A (ja) | 2021-11-18 |
| WO2010114874A3 (en) | 2011-03-03 |
| KR20170059019A (ko) | 2017-05-29 |
| JP2012523091A (ja) | 2012-09-27 |
| TWI555032B (zh) | 2016-10-21 |
| JP2014167915A (ja) | 2014-09-11 |
| TW201108248A (en) | 2011-03-01 |
| JP6976028B2 (ja) | 2021-12-01 |
| JP2017039167A (ja) | 2017-02-23 |
| US8221518B2 (en) | 2012-07-17 |
| KR102089843B1 (ko) | 2020-03-17 |
| WO2010114874A2 (en) | 2010-10-07 |
| US20100252616A1 (en) | 2010-10-07 |
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