JP2012238629A5 - - Google Patents

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Publication number
JP2012238629A5
JP2012238629A5 JP2011104841A JP2011104841A JP2012238629A5 JP 2012238629 A5 JP2012238629 A5 JP 2012238629A5 JP 2011104841 A JP2011104841 A JP 2011104841A JP 2011104841 A JP2011104841 A JP 2011104841A JP 2012238629 A5 JP2012238629 A5 JP 2012238629A5
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JP
Japan
Prior art keywords
electrode
heat treatment
treatment apparatus
plate
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011104841A
Other languages
English (en)
Japanese (ja)
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JP2012238629A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011104841A priority Critical patent/JP2012238629A/ja
Priority claimed from JP2011104841A external-priority patent/JP2012238629A/ja
Priority to US13/185,622 priority patent/US8569647B2/en
Publication of JP2012238629A publication Critical patent/JP2012238629A/ja
Publication of JP2012238629A5 publication Critical patent/JP2012238629A5/ja
Withdrawn legal-status Critical Current

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JP2011104841A 2011-05-10 2011-05-10 熱処理装置 Withdrawn JP2012238629A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011104841A JP2012238629A (ja) 2011-05-10 2011-05-10 熱処理装置
US13/185,622 US8569647B2 (en) 2011-05-10 2011-07-19 Heat treatment apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011104841A JP2012238629A (ja) 2011-05-10 2011-05-10 熱処理装置

Publications (2)

Publication Number Publication Date
JP2012238629A JP2012238629A (ja) 2012-12-06
JP2012238629A5 true JP2012238629A5 (OSRAM) 2014-05-22

Family

ID=47141176

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011104841A Withdrawn JP2012238629A (ja) 2011-05-10 2011-05-10 熱処理装置

Country Status (2)

Country Link
US (1) US8569647B2 (OSRAM)
JP (1) JP2012238629A (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8608900B2 (en) * 2005-10-20 2013-12-17 B/E Aerospace, Inc. Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes
JP5730521B2 (ja) * 2010-09-08 2015-06-10 株式会社日立ハイテクノロジーズ 熱処理装置
KR101310851B1 (ko) * 2011-11-08 2013-09-25 가부시키가이샤 히다치 하이테크놀로지즈 열처리 장치
JP5977986B2 (ja) * 2011-11-08 2016-08-24 株式会社日立ハイテクノロジーズ 熱処理装置
JP2013222878A (ja) * 2012-04-18 2013-10-28 Hitachi High-Technologies Corp プラズマ熱処理方法および装置
KR20150046966A (ko) * 2013-10-23 2015-05-04 삼성디스플레이 주식회사 플라즈마 처리 장치 및 플라즈마 처리 방법
JP2015106595A (ja) * 2013-11-29 2015-06-08 株式会社日立ハイテクノロジーズ 熱処理装置
JP6972131B2 (ja) * 2016-12-27 2021-11-24 エヴァテック・アーゲー 真空プラズマ加工対象物処理装置
CN117704810B (zh) * 2023-12-08 2025-02-21 北京碳源领航环保科技有限公司 热源供给装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE7328066U (de) * 1973-08-01 1974-01-24 Dietz Druckguss Kg Grillgerät mit Heizvorrichtung
US4922079A (en) * 1988-03-18 1990-05-01 Raytheon Company Combination cooking cartridge
US5221201A (en) * 1990-07-27 1993-06-22 Tokyo Electron Sagami Limited Vertical heat treatment apparatus
US7264850B1 (en) * 1992-12-28 2007-09-04 Semiconductor Energy Laboratory Co., Ltd. Process for treating a substrate with a plasma
JP3257328B2 (ja) * 1995-03-16 2002-02-18 株式会社日立製作所 プラズマ処理装置及びプラズマ処理方法
US6072160A (en) * 1996-06-03 2000-06-06 Applied Materials, Inc. Method and apparatus for enhancing the efficiency of radiant energy sources used in rapid thermal processing of substrates by energy reflection
US6632325B2 (en) * 2002-02-07 2003-10-14 Applied Materials, Inc. Article for use in a semiconductor processing chamber and method of fabricating same
US20060237398A1 (en) * 2002-05-08 2006-10-26 Dougherty Mike L Sr Plasma-assisted processing in a manufacturing line
US7189940B2 (en) * 2002-12-04 2007-03-13 Btu International Inc. Plasma-assisted melting
US7993489B2 (en) * 2005-03-31 2011-08-09 Tokyo Electron Limited Capacitive coupling plasma processing apparatus and method for using the same
US8608900B2 (en) * 2005-10-20 2013-12-17 B/E Aerospace, Inc. Plasma reactor with feed forward thermal control system using a thermal model for accommodating RF power changes or wafer temperature changes
JP5069967B2 (ja) 2007-07-25 2012-11-07 株式会社日立国際電気 熱処理用部材の製造方法
JP2009231341A (ja) 2008-03-19 2009-10-08 Ulvac Japan Ltd アニール装置、ＳｉＣ半導体基板の熱処理方法
JP2010034481A (ja) 2008-07-31 2010-02-12 Sumitomo Electric Ind Ltd 半導体装置の製造方法および半導体装置

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