JP2012233876A5 - - Google Patents
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- Publication number
- JP2012233876A5 JP2012233876A5 JP2012040395A JP2012040395A JP2012233876A5 JP 2012233876 A5 JP2012233876 A5 JP 2012233876A5 JP 2012040395 A JP2012040395 A JP 2012040395A JP 2012040395 A JP2012040395 A JP 2012040395A JP 2012233876 A5 JP2012233876 A5 JP 2012233876A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- cap
- fet
- frit material
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 13
- 239000000463 material Substances 0.000 claims 11
- 239000011241 protective layer Substances 0.000 claims 7
- 230000005669 field effect Effects 0.000 claims 4
- 238000000034 method Methods 0.000 claims 2
- 230000035945 sensitivity Effects 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/096,710 US8536626B2 (en) | 2011-04-28 | 2011-04-28 | Electronic pH sensor die packaging |
| US13/096,710 | 2011-04-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012233876A JP2012233876A (ja) | 2012-11-29 |
| JP2012233876A5 true JP2012233876A5 (cg-RX-API-DMAC7.html) | 2015-04-16 |
Family
ID=45930550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012040395A Pending JP2012233876A (ja) | 2011-04-28 | 2012-02-27 | 電子ｐＨセンサ・ダイ・パッケージ |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8536626B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2518483B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP2012233876A (cg-RX-API-DMAC7.html) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9524957B2 (en) * | 2011-08-17 | 2016-12-20 | Intersil Americas LLC | Back-to-back stacked dies |
| US8828207B2 (en) | 2012-06-13 | 2014-09-09 | Honeywell International Inc. | Deep sea pH sensor |
| US8701496B1 (en) | 2013-02-27 | 2014-04-22 | Honeywell International Inc. | Systems and methods for a pressure sensor having a two layer die structure |
| US10151647B2 (en) | 2013-06-19 | 2018-12-11 | Honeywell International Inc. | Integrated SOI pressure sensor having silicon stress isolation member |
| US9671362B2 (en) * | 2013-07-29 | 2017-06-06 | Honeywell International Inc. | ph sensor with bonding agent disposed in a pattern |
| US9664641B2 (en) * | 2013-07-29 | 2017-05-30 | Honeywell International Inc. | pH sensor with substrate or bonding layer configured to maintain piezoresistance of the ISFET die |
| CN110988085B (zh) * | 2013-09-18 | 2023-07-04 | 克莱米特有限责任公司 | 基于分子受体的化学场效应晶体管 |
| US9759679B2 (en) | 2014-02-07 | 2017-09-12 | Honeywell International Inc. | Fluid sensor with backside of sensor die contacting header |
| US9442090B2 (en) | 2014-03-27 | 2016-09-13 | Honeywell International Inc. | Magnetic stimulus of ISFET-based sensor to enable trimming and self-compensation of sensor measurement errors |
| US9140662B1 (en) * | 2014-08-19 | 2015-09-22 | Honeywell International Inc. | Preventing stray currents in sensors in conductive media |
| US9470652B1 (en) * | 2015-09-15 | 2016-10-18 | Freescale Semiconductor, Inc. | Sensing field effect transistor devices and method of their manufacture |
| US9899290B2 (en) | 2016-03-23 | 2018-02-20 | Nxp Usa, Inc. | Methods for manufacturing a packaged device with an extended structure for forming an opening in the encapsulant |
| CN106248761A (zh) * | 2016-08-01 | 2016-12-21 | 严媚 | 一种高灵敏度酸碱值生物传感器芯片 |
| TWI642171B (zh) * | 2017-11-09 | 2018-11-21 | 友達光電股份有限公司 | 感測裝置 |
| WO2019226831A1 (en) * | 2018-05-22 | 2019-11-28 | Gate Scientific, Inc. | Wirelessly sensing properties of a closed environment and devices thereof |
| JP7269559B2 (ja) | 2018-07-12 | 2023-05-09 | 浜松ホトニクス株式会社 | 匂いセンサ及び匂いセンサの製造方法 |
| JP7329854B2 (ja) * | 2018-09-04 | 2023-08-21 | 学校法人早稲田大学 | 水中通信装置及び水中通信方法 |
| JP7724213B2 (ja) * | 2019-11-06 | 2025-08-15 | コモンウェルス サイエンティフィック アンド インダストリアル リサーチ オーガナイゼーション | ｐＨを検知するための多層電極 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4056681A (en) | 1975-08-04 | 1977-11-01 | International Telephone And Telegraph Corporation | Self-aligning package for integrated circuits |
| US4133735A (en) * | 1977-09-27 | 1979-01-09 | The Board Of Regents Of The University Of Washington | Ion-sensitive electrode and processes for making the same |
| JPS5740641A (en) | 1980-08-25 | 1982-03-06 | Kuraray Co Ltd | Gas sensor |
| GB2126786B (en) * | 1982-09-04 | 1986-04-03 | Emi Ltd | Ion sensitive field effect transistor encapsulation |
| JPS62183133A (ja) * | 1986-02-07 | 1987-08-11 | Hitachi Ltd | 半導体装置 |
| US4889612A (en) * | 1987-05-22 | 1989-12-26 | Abbott Laboratories | Ion-selective electrode having a non-metal sensing element |
| US5068205A (en) | 1989-05-26 | 1991-11-26 | General Signal Corporation | Header mounted chemically sensitive ISFET and method of manufacture |
| US5221456A (en) * | 1991-10-22 | 1993-06-22 | Rosemount Inc. | Insulated core electrode for ph sensor |
| EP0740850A1 (en) | 1994-10-14 | 1996-11-06 | National Semiconductor Corporation | Hermetically sealed hybrid ceramic integrated circuit package |
| EP0840369A4 (en) | 1995-06-30 | 2001-12-19 | Toshiba Kk | ELECTRONIC COMPONENT AND PRODUCTION METHOD THEREFOR |
| US5833824A (en) | 1996-11-15 | 1998-11-10 | Rosemount Analytical Inc. | Dorsal substrate guarded ISFET sensor |
| US6117292A (en) | 1998-05-06 | 2000-09-12 | Honeywell International Inc | Sensor packaging having an integral electrode plug member |
| US6416653B1 (en) | 2000-07-18 | 2002-07-09 | Barben Analyzer Technology, Llc | Device for separating electrolyte chambers within an electrochemical sensor |
| JP4456303B2 (ja) | 2000-09-06 | 2010-04-28 | 株式会社堀場製作所 | ｐＨセンサ |
| US20020087057A1 (en) | 2000-12-29 | 2002-07-04 | Lovejoy David Anthony | Method and apparatus for assessing tissue perfusion |
| US20060029955A1 (en) | 2001-03-24 | 2006-02-09 | Antonio Guia | High-density ion transport measurement biochip devices and methods |
| JP3835195B2 (ja) * | 2001-03-30 | 2006-10-18 | セイコーエプソン株式会社 | バイオセンサの製造方法 |
| EP1413284A4 (en) | 2001-08-01 | 2006-06-14 | Nippon Sheet Glass Co Ltd | COSMETIC PRODUCT |
| CN1294260C (zh) | 2001-12-19 | 2007-01-10 | 株式会社日立高新技术 | 电位滴定dna微阵列、其制造方法及核酸解析方法 |
| WO2004076056A2 (en) * | 2003-02-26 | 2004-09-10 | Lake Shore Cryotronics Inc. | Microfluidic chemical reactor for the manufacture of chemically-produced nanoparticles |
| US7462512B2 (en) | 2004-01-12 | 2008-12-09 | Polytechnic University | Floating gate field effect transistors for chemical and/or biological sensing |
| EP1747451B1 (en) * | 2004-05-17 | 2011-11-02 | Medtronic, Inc. | Point of care heparin determination system |
| US7838912B2 (en) * | 2004-09-30 | 2010-11-23 | Waseda University | Semiconductor sensing field effect transistor, semiconductor sensing device, semiconductor sensor chip and semiconductor sensing device |
| JP2006138761A (ja) * | 2004-11-12 | 2006-06-01 | Univ Waseda | 半導体センサチップ及び半導体センシング装置 |
| EP1729121A1 (de) * | 2005-05-30 | 2006-12-06 | Mettler-Toledo AG | Elektrochemischer Sensor |
| US8637980B1 (en) | 2007-12-18 | 2014-01-28 | Rockwell Collins, Inc. | Adhesive applications using alkali silicate glass for electronics |
| US20100301398A1 (en) * | 2009-05-29 | 2010-12-02 | Ion Torrent Systems Incorporated | Methods and apparatus for measuring analytes |
-
2011
- 2011-04-28 US US13/096,710 patent/US8536626B2/en active Active
-
2012
- 2012-02-24 EP EP12157017.0A patent/EP2518483B1/en not_active Not-in-force
- 2012-02-27 JP JP2012040395A patent/JP2012233876A/ja active Pending