JP2012227386A - Method and apparatus for manufacturing laser element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide method and apparatus for manufacturing a laser element which can inexpensively completely separate a laser bar and a spacer.SOLUTION: The method of manufacturing a laser element includes: an overlapping step of alternately overlapping a laser bar and a spacer; a film formation step of forming a dielectric film on the laser bar and the spacer; and a separation step of separating the laser bar and the spacer by allowing the laser bar and the spacer to slide relative to each other.

Description

  The present invention relates to a method for manufacturing a laser element used for optical recording, for example, and a laser element manufacturing apparatus used therefor.

  Patent Document 1 discloses a laser element manufacturing method in which a laser bar and spacers longer than the laser bar are alternately overlapped and a film forming process is performed on these. The laser bar and the spacer integrated by the film formed by the film forming process are separated by pushing the both end portions of the spacer in one direction and bending the spacer.

JP 2008-306098 A

  In the laser element manufacturing method disclosed in Patent Document 1, the laser bar and the spacer may not be completely separated. In addition, since the spacer needs to be longer than the laser bar, the cost may increase.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a laser element manufacturing method and a laser element manufacturing apparatus capable of completely separating a laser bar and a spacer at low cost. .

  The method of manufacturing a laser device according to the present invention includes an overlapping process of alternately stacking laser bars and spacers, a film forming process of forming a dielectric film on the laser bars and the spacers, the laser bar and the spacers, And a separation step of separating the laser bar and the spacer from each other.

  A laser element manufacturing apparatus according to the invention of the present application includes a support base for supporting a work in which a laser bar and a spacer are superposed, a film forming unit for forming a dielectric film on one surface of the work, the laser bar and the spacer. And a pressing means for separating the laser bar and the spacer by sliding each other.

  According to the present invention, the laser bar and the spacer are separated from each other by sliding them, so that the laser bar and the spacer can be completely separated at low cost.

1 is an overall view of a laser element manufacturing apparatus according to Embodiment 1 of the present invention. It is a figure which shows the structure of the lower jig | tool for film-forming, and its periphery. It is XZ top view of a pressing component. FIG. 4 is a sectional view taken along the line IV-IV in FIG. 2. It is a figure which shows a pattern recognition apparatus. It is a figure which shows overlapping a laser bar and a spacer alternately. It is a perspective view which shows a laser bar and a spacer shifting and overlapping. It is a figure which shows the workpiece | work just before film-forming, and its vicinity. It is a perspective view which shows that the dielectric film was formed on the upper surface of a workpiece | work after finishing the film-forming process. It is a figure which shows the workpiece | work and dielectric film after evacuating the film-forming upper jig. It is a figure which shows that a pressing component presses a workpiece | work. It is a figure which shows evacuating a pressing component. It is a figure which shows moving a workpiece | work piece with a collet. It is a figure which shows the isolation | separation process which concerns on Embodiment 2 of this invention. FIG. 15 is an XV-XV cross-sectional arrow view of FIG. 14. It is a figure which shows sliding a laser bar and a spacer collectively. It is a figure which shows retracting | retreating an arm. It is a figure which shows that a laser bar and a spacer are sequentially taken out from the lower jig | tool for film-forming by a collet. It is a figure which shows the state before the isolation | separation process in Embodiment 3 of this invention. FIG. 20 is a sectional view taken along the line XX-XX in FIG. 19. It is a figure which shows the film-forming lower jig in Embodiment 4 of this invention. It is a figure which shows mounting a laser bar and a spacer on protrusion. It is sectional drawing in the broken line A of FIG. It is sectional drawing in the broken line B of FIG. It is a figure which shows pressing the upper surface of a workpiece | work with a pressing component. It is a figure which shows the lower jig | tool for film-forming in Embodiment 5 of this invention. It is a figure which shows arrange | positioning a laser bar on a processus | protrusion. It is a figure which shows the workpiece | work after film-forming. It is a figure which shows pressing the upper surface of a workpiece | work with a pressing component.

Embodiment 1 FIG.
FIG. 1 is an overall view of a laser device manufacturing apparatus according to Embodiment 1 of the present invention. The laser element manufacturing apparatus according to Embodiment 1 of the present invention includes a film forming / separating apparatus 10. The film forming / separating apparatus 10 is an apparatus for forming a film on a workpiece and then separating the film. A workpiece is a superposition of a laser bar and a spacer. The film forming / separating apparatus 10 includes a stage 12 movable in the Y-axis direction by a Y-axis adjuster 12a. A workpiece suction stage 14 is fixed on the stage 12. A film forming lower jig 18 is fixed on the workpiece suction stage 14 by positioning pins 16. The film forming lower jig 18 and the surrounding configuration will be described with reference to FIG.

  FIG. 2 is a diagram showing a configuration of the film forming lower jig 18 and its surroundings. The film forming lower jig 18 is fixed by the positioning pins 16 in the X-axis direction and the Y-axis direction. A work suction hole 18 a is formed in the film forming lower jig 18. The work suction hole 18a is a hole for sucking and fixing the work. A pressing part 22 is arranged above (Z-axis) the film forming lower jig 18.

  FIG. 3 is an XZ plan view of the pressing component 22. The pressing component 22 includes two arms 22a and 22b. The arm 22a and the arm 22b are movable in a direction (Lx direction) that increases or decreases the distance between the arm 22a and the arm 22b.

  4 is a cross-sectional view taken along the line IV-IV in FIG. A sputtering apparatus 23 is arranged directly above the film forming lower jig 18 (Z direction). The sputtering device 23 is a device for forming a dielectric film on the workpiece.

  Returning to the description of FIG. The laser element manufacturing apparatus according to Embodiment 1 of the present invention includes a pattern recognition apparatus 30. The pattern recognition device 30 includes a stage 32 that is movable in the X-axis direction and the Y-axis direction by an X-axis adjuster 32a and a Y-axis adjuster 32b. The pattern recognition device 30 is a device that determines whether the object on the stage 32 is a laser bar or a spacer.

  The laser element manufacturing apparatus according to Embodiment 1 of the present invention includes a spacer storage device 50. The spacer storage device 50 is a device that stores a spacer. The spacer storage device 50 includes a stage 52 that is movable in the Y-axis direction by a Y-axis adjuster 52a. A spacer storage tray 54 is fixed on the stage 52.

  The laser element manufacturing apparatus according to Embodiment 1 of the present invention includes a dicing apparatus 70. The dicing apparatus 70 is an apparatus that cleaves a semiconductor wafer or a laser bar. The dicing apparatus 70 includes a stage 72 that is movable in the X-axis direction and the Y-axis direction by an X-axis adjuster 72a and a Y-axis adjuster 72b. A dicing frame 74 is fixed to the stage 72. The dicing frame 74 has an adhesive sheet 76 fixed thereto.

  The laser element manufacturing apparatus according to Embodiment 1 of the present invention includes a transport system 100. The conveyance system 100 is a system for conveying the laser bar and the spacer to each apparatus. The transport system 100 includes a collet 102 that is movable in the Z-axis direction and the X-axis direction by a Z-axis adjuster 102a and an X-axis adjuster 102b. The collet 102 is used for moving the laser bar and the spacer into the film forming lower jig 18 and for taking out from the film forming lower jig 18. The transport system 100 includes a work position recognition camera 104 so that the collet can accurately perform these operations.

  The transport system 100 includes a collet 106 that is movable in the Z-axis direction and the X-axis direction by a Z-axis adjuster 106a and an X-axis adjuster 106b. The collet 106 is used for moving the workpiece among the pattern recognition device 30, the spacer storage device 50, and the dicing device 70. In order to recognize the pattern of the workpiece on the stage 32 of the pattern recognition apparatus 30, the transport system 100 includes a pattern recognition camera 108.

  FIG. 5 is a diagram showing the pattern recognition device 30. The pattern recognition device 30 includes a positioning guide 36 in the work suction unit 34 on the stage 32. Positioning is performed by pressing a laser bar or a spacer against the positioning guide 36. The reason for positioning the laser bar or spacer is to read these patterns by the pattern recognition camera 108.

  Hereinafter, a laser element manufacturing method using the above-described laser element manufacturing apparatus will be described. First, a wafer on which a plurality of laser elements are formed is attached to the adhesive sheet 76 of the dicing apparatus 70. Then, the wafer is diced to form a laser bar.

  Next, an overlapping process is performed in which laser bars and spacers are alternately stacked. FIG. 6 is a diagram showing that the laser bars 20a and the spacers 20b are alternately stacked. Using the collet 102, the laser bars 20a and the spacers 20b are alternately arranged on the lower film forming jig 18. Here, in this superposition process, the laser bar 20a and the spacer 20b are shifted and superposed. Then, the laser bar 20a and the spacer 20b are fixed to the film forming lower jig 18 by sucking air from the workpiece suction hole 18a. A workpiece 20 is formed by alternately laminating the laser bar 20a and the spacer 20b.

  FIG. 7 is a perspective view showing that the laser bar 20a and the spacer 20b are shifted and overlapped. The laser bar 20a and the spacer 20b are overlapped so as to be displaced in the X direction. The surfaces of the laser bar 20a and the spacer 20b facing the Z direction form one plane (this surface may be referred to as the upper surface of the workpiece). The surface facing the Z direction of the laser bar 20a is a light emitting surface.

  Next, a film forming process for forming a film on the laser bar and the spacer is performed. FIG. 8 is a diagram illustrating a workpiece immediately before film formation and the vicinity thereof. In the film forming step, the film forming upper jig 29 is placed on the film forming lower jig 18 so as to sandwich the workpiece 20. Then, the lower film-forming jig 18 and the upper film-forming jig 29 are fixed with fixing screws 29a. Further, the workpiece fixing plate 29b is pressed against the workpiece 20 so that the workpiece 20 does not shift in the Y direction, and the workpiece fixing plate 29b is fixed to the film forming upper jig 29 with a fixing screw 29c. With the workpiece 20 fixed, a dielectric film is formed on the upper surface of the workpiece using the sputtering apparatus 23 shown in FIG. FIG. 9 is a perspective view showing that the dielectric film 21 is formed on the upper surface of the workpiece 20 after the film forming process is completed. Thus, in the film forming process, a dielectric film is formed on the light emitting surface of the laser bar.

  When the formation of the dielectric film 21 is completed, the fixing screws 29a and 29c are loosened, and the film forming upper jig 29 is retracted to the outside. FIG. 10 is a view showing the workpiece 20 and the dielectric film 21 after the upper jig 29 for film formation is retracted. When the film forming process is completed, the laser bar 20 a and the spacer 20 b are connected via the dielectric film 21.

  Next, a separation process for separating the laser bar and the spacer is performed. First, the position information of the workpiece 20 is acquired by the workpiece position recognition camera 104. Based on this position information, the pressing component 22 presses the workpiece 20. FIG. 11 is a diagram illustrating that the pressing component 22 presses the workpiece. The arms 22a and 22b of the pressing component 22 press the laser bar 20a and the spacer 20b so as to reduce the shift between the laser bar 20a and the spacer 20b that are shifted and overlapped. Thus, by pressing the laser bar 20a and the spacer 20b using the pressing component 22, the laser bar 20a is slid with respect to the adjacent spacer 20b, and the spacer 20b is slid with respect to the adjacent laser bar 20a.

  The laser bar 20a and the spacer 20b connected through the dielectric film 21 are separated by this slide. When the separation of the laser bar 20a and the spacer 20b is completed, the pressing part 22 is retracted. FIG. 12 is a diagram illustrating that the pressing component is retracted.

  Next, a moving process of moving the separated laser bar 20a to the dicing device 70 and moving the separated spacer 20b to the spacer storage device 50 is performed. The moving process is performed as follows. First, the position information of the workpiece 20 position is acquired by the workpiece position recognition camera 104. Based on the work position information, the collet 102 is used to move the laser bar 20a or the spacer 20b (one of the laser bar 20a or the spacer 20b is referred to as a work piece) to the stage 32 of the pattern recognition apparatus 30. FIG. 13 is a diagram illustrating that the work piece is moved by the collet 102.

  The work piece is pressed against the positioning guide 36 of the pattern recognition device 30 and positioned. Thereafter, the position of the work piece is recognized by the pattern recognition camera 108, and it is determined whether the work piece is the laser bar 20a or the spacer 20b.

  When the work piece is the laser bar 20 a, the laser bar 20 a is attached to the adhesive sheet 76 of the dicing apparatus 70 using the collet 106. The laser bar attached to the adhesive sheet 76 is divided into a plurality of laser elements by cleavage. On the other hand, when the work piece is the spacer 20 b, the spacer 20 b is transported to the spacer storage tray 54 using the collet 106.

  In the technique disclosed in the cited document 1, the laser bar and the spacer cannot be separated after the film is formed on the workpiece, and the spacer may be adsorbed to the collet while being in close contact with the laser bar, resulting in a conveyance error. In addition, since the spacer needs to be longer than the laser bar, the cost may increase. However, according to the manufacturing method of the laser element according to the first embodiment of the present invention, the laser bars 20a and the spacers 20b are formed so as to reduce the deviation between the laser bars 20a and the spacers 20b that are shifted and stacked. Press. Thereby, the laser bar 20a and the spacer 20b can be separated easily and reliably. In addition, since the separation process can be performed by a very simple method, it is possible to separate the workpieces while preventing a decrease in yield due to foreign matter adhesion or chipping. Further, since it is not necessary to make the spacer longer than the laser bar, the laser element can be manufactured at low cost.

  In the laser element manufacturing method according to Embodiment 1 of the present invention, the laser bars and the spacers are alternately shifted and overlapped, but the present invention is not limited to this. That is, as long as the laser bar and the spacer can be separated from each other by pressing at least one of the laser bar and the spacer using the pressing part, the laser bar and the spacer can be separated. Also good. For example, the laser bar and the spacer may be overlapped without deviation. In this case, if the laser bar and the spacer are individually pressed and slid to each other, they can be easily separated.

  In the superimposing step, the workpiece is placed on the film forming lower jig 18, but the present invention is not limited to this. The work is not limited to the film forming lower jig 18 and may be placed on a support base for supporting the work. Moreover, since the press component should just be a press means which can press at least one of a laser bar and a spacer, it is not limited to the shape of the press component 22 which concerns on Embodiment 1 of this invention.

  Sputtering is employed as a film forming means in the film forming process, but vapor deposition or CVD may be used in addition to sputtering. In the film forming process, a film other than the dielectric film may be formed. In the film forming process, a dielectric film may be formed on a surface other than the light emitting surface of the laser bar.

Embodiment 2. FIG.
The laser element manufacturing method according to the second embodiment of the present invention is different from the first embodiment in the separation step. Other steps are the same as those in the first embodiment. Hereinafter, the separation process according to Embodiment 2 of the present invention will be mainly described. In addition, the already described part attaches | subjects the same code | symbol as the said already described part in subsequent figures, and abbreviate | omits description.

  FIG. 14 is a diagram showing a separation process according to Embodiment 2 of the present invention. The arms 130a and 130b of the pressing component 130 of the present invention are formed wide so that all the laser bars 20a and the spacers 20b can be pressed together. 15 is a cross-sectional view taken along the line XV-XV in FIG. FIG. 16 is a diagram showing that the laser bar and the spacer are slid together. The arms 130a and 130b of the pressing component 130 collectively press all the laser bars 20a and all the spacers 20b constituting the workpiece 20. When the pressing is finished, the arms 130a and 130b are retracted. FIG. 17 is a diagram illustrating retracting the arms 130a and 130b.

  Next, a moving process of moving the separated laser bar 20a to the dicing device 70 and moving the separated spacer 20b to the spacer storage device 50 is performed. FIG. 18 is a view showing that the laser bar 20 a and the spacer 20 b are sequentially taken out from the lower film-forming jig 18 by the collet 102.

  In the laser element manufacturing method according to the second embodiment of the present invention, the pressing component 130 collectively slides the laser bar 20a and the spacer 20b, so that all laser bars 20a and the spacer 20b are separated by a single pressing. Can finish. Therefore, the time required for the separation process can be shortened. The laser element manufacturing method according to the second embodiment of the present invention can be modified at least as much as the first embodiment.

Embodiment 3 FIG.
The laser element manufacturing method according to the third embodiment of the present invention is different from the first embodiment in that a mechanism for preventing the workpiece from falling down is used before the separation step. Other points are the same as in the first embodiment.

  FIG. 19 is a diagram showing a state before the separation step in the third embodiment of the present invention. Prior to the separation step according to the third embodiment of the present invention, the elongate-shaped collapse preventing parts 132a and 132b are applied to the upper surface of the work and the portion where the dielectric film 21 is not formed. 20 is a sectional view taken along the line XX-XX in FIG. The fall prevention part 132b hits the entire workpiece 20 (all laser bars and all spacers). The same applies to the fall prevention component 132a. The separation step is performed with the fall prevention parts 132a and 132b in contact with the upper surface of the workpiece 20. That is, the workpiece 20 is pressed by the pressing component 22. After separating the laser bar 20a and the spacer 20b and retracting the pressing part 22, the fall prevention parts 132a and 132b are retracted.

  In the laser element manufacturing method according to Embodiment 3 of the present invention, the fall prevention parts 132a and 132b are applied to the workpiece from a direction (Z-axis direction) other than the direction in which the laser bar or spacer slides (X-axis direction). . Accordingly, the laser bar and the spacer can be prevented from falling in the separation step while allowing the laser bar and the spacer to slide.

  The fall-preventing component does not have to touch the upper surface of the workpiece. That is, the fall prevention component may be brought close to the upper surface of the workpiece to such an extent that the workpiece can be prevented from falling. Moreover, you may implement separation work collectively like the press component which concerns on Embodiment 2 of this invention. The laser element manufacturing method according to the third embodiment of the present invention can be modified at least as much as the first embodiment.

Embodiment 4 FIG.
The laser element manufacturing method according to the fourth embodiment of the present invention is different from the first embodiment in the method of superimposing the laser bar and the spacer and the method of separating them. Other points are the same as in the first embodiment.

  FIG. 21 is a diagram showing a film forming lower jig according to the fourth embodiment of the present invention. Of the lower jig 18 for film formation, the surface on which the laser bar and the spacer are placed is referred to as a placement surface 18b. Projections 150a and 150b are formed on the mounting surface 18b. The protrusions 150a and 150b are formed to float and arrange the laser bar and the spacer. FIG. 22 is a diagram showing that the laser bar 20a and the spacer 20b are placed on the protrusions. 23 is a cross-sectional view taken along broken line A in FIG. The laser bar 20a is placed on the protrusion 150a and is inclined with respect to the mounting surface 18b of the film forming lower jig 18. 24 is a cross-sectional view taken along broken line B in FIG. The spacer 20 b is placed on the protrusion 150 b and is inclined with respect to the mounting surface 18 b of the film forming lower jig 18. In this manner, the laser bar 20a is placed on the protrusion 150a and the spacer 20b is placed on the protrusion 150b, so that the laser bar 20a and the spacer 20b are shifted and overlapped.

  Next, a film forming process is performed as in the first embodiment. Next, a separation step is performed. In the separation step according to Embodiment 4 of the present invention, the pressing component presses the upper surface of the workpiece. FIG. 25 is a diagram showing that the upper surface of the workpiece is pressed by the pressing component 160. The arm 160a of the pressing component 160 presses a portion of the upper surface of the laser bar 20a where the dielectric film 21 is not formed downward (Z-axis direction). On the other hand, the arm 160b presses a portion of the upper surface of the spacer 20b where the dielectric film 21 is not formed downward.

  The laser bar 20a slides with respect to the spacer 20b and the spacer 20b slides with respect to the laser bar 20a by the above-described pressing, so that the laser bar 20a and the spacer 20b can be separated. The laser element manufacturing method according to the fourth embodiment of the present invention can be modified at least as much as the first embodiment.

Embodiment 5 FIG.
The laser element manufacturing method according to the fifth embodiment of the present invention is different from the first embodiment in the method of superimposing the laser bar and the spacer and the method of separating them. Other points are the same as in the first embodiment.

  FIG. 26 is a diagram showing a film forming lower jig according to the fifth embodiment of the present invention. Projections 170 a and 170 b are formed on the mounting surface 18 b of the film forming lower jig 18. The protrusions 170a and 170b are formed so that the laser bar is shifted upward from the spacer. FIG. 27 is a diagram showing that the laser bar 20a is disposed on the protrusion. The film forming lower jig 18 and the like shown in this figure have a 27-27 cross section in FIG. The laser bar 20a is placed on the protrusions 170a and 170b by the collet 102. On the other hand, the spacer 20 b is directly placed on the mounting surface 18 b of the film forming lower jig 18. Thereby, the laser bar 20a and the spacer 20b are shifted and overlapped. It should be noted that the superposition process in the fifth embodiment of the present invention is performed with the workpiece suction stage 14 tilted to prevent the laser bar 20a and the spacer 20b from falling.

  Next, a film forming process is performed as in the first embodiment. FIG. 28 is a diagram illustrating the workpiece 20 after film formation. Next, a separation step is performed. In the separation step according to the fifth embodiment of the present invention, the pressing component presses the upper surface of the workpiece. FIG. 29 is a diagram showing that the upper surface of the workpiece 20 is pressed by the pressing component 180. The arm 180a and the arm 180b of the pressing component 180 press the portion of the upper surface of the laser bar 20a where the dielectric film 21 is not formed downward (Z-axis direction). The laser bar 20a can slide with respect to the spacer 20b by the above-described pressing, and the laser bar 20a and the spacer 20b can be separated. The separation step is performed after placing the workpiece on a portion where no protrusion is formed.

  In the fourth and fifth embodiments of the present invention, protrusions are formed on the mounting surface 18b of the lower jig 18 for film formation. In the overlaying step, the laser bar and the spacer are placed on the placement surface so that at least one of the laser bar and the spacer is placed on the protrusion, and the laser bar and the spacer are shifted and overlapped. In this way, the laser bar and the spacer can be easily shifted and overlapped. By the way, the projections formed on the mounting surface 18b of the film forming lower jig need not be formed as in the fourth and fifth embodiments. That is, the shape and arrangement of the protrusions are not limited as long as at least one of the laser bar and the spacer is placed on the protrusion so that the laser bar and the spacer can be shifted and overlapped.

  Even when a work is placed on a support table instead of the lower jig for film formation, the effect of the present invention can be obtained if a protrusion for lifting at least one of the laser bar and the spacer is formed on the support table. The laser device manufacturing method according to the fifth embodiment of the present invention can be modified at least as much as the first embodiment.

  18 Lower jig for film formation, 20 Workpiece, 20a Laser bar, 20b Spacer, 21 Dielectric film, 22 Press part, 22a, 22b Arm, 23 Sputtering device (film formation means), 132a, 132b Fall prevention part, 150a, 150b protrusion

Claims (8)

An overlapping process of alternately stacking laser bars and spacers;
Forming a dielectric film on the laser bar and the spacer; and
A laser element manufacturing method comprising: a separation step of separating the laser bar and the spacer by sliding the laser bar and the spacer relative to each other. In the overlapping step, the laser bar and the spacer are shifted and overlapped,
2. The method of manufacturing a laser element according to claim 1, wherein in the separation step, the laser bar and the spacer are slid relative to each other so as to reduce a deviation between the laser bar and the spacer. The laser bar is plural,
The spacer is plural,
3. The method of manufacturing a laser element according to claim 1, wherein in the separation step, all the laser bars and all the spacers are slid together.   The method for manufacturing a laser element according to any one of claims 1 to 3, wherein a fall prevention component is applied to the laser bar and the spacer before the separation step.   4. The method of manufacturing a laser element according to claim 1, wherein a fall prevention component is brought close to the laser bar and the spacer before the separation step. 5. Before the superposition step, prepare a mounting surface on which a protrusion is formed,
In the superimposing step, the laser bar and the spacer are placed on the mounting surface so that at least one of the laser bar and the spacer is placed on the protrusion, and the laser bar and the spacer are shifted and overlapped. The method for manufacturing a laser element according to claim 2, wherein the laser elements are combined. A support base for supporting a workpiece in which a laser bar and a spacer are superimposed;
A film forming means for forming a dielectric film on one surface of the workpiece;
An apparatus for manufacturing a laser element, comprising: a pressing means for separating the laser bar and the spacer by sliding the laser bar and the spacer relative to each other.   8. The laser element manufacturing apparatus according to claim 7, wherein a protrusion for lifting at least one of the laser bar and the spacer is formed on the support base.

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