JP2012221994A - Multilayer electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer electronic component which can prevent occurrence of a problem in a coil conductor even if it is made compact.SOLUTION: In the multilayer electronic component 1, when an insulator layer 11 is pressure bonded, the central part of the insulator layer 11 where a coil conductor 12 is formed is pushed in by a lead-out conductor 13 and a connection conductor 14 to produce a wedge effect, and displacement of the coil conductor 12 is suppressed. In the multilayer electronic component 1, the pad 23 of the coil conductor 12 has a contour shape escaping from the contour shape of the pad 26 of the lead-out conductor 13 when the coil conductor 12 and the lead-out conductor 13 are viewed from the lamination direction of an element 2 while being superimposed. Consequently, a certain amount of space is provided between the lead-out conductor 13 and the coil conductor 12 even if the multilayer electronic component 1 is made compact, and since excessive wedge effect can be prevented, occurrence of a problem in the coil conductor 12 can be prevented.

Description

  The present invention relates to a multilayer electronic component.

  For example, there is an electronic component described in Patent Document 1 as a conventional multilayer electronic component. This conventional electronic component includes a coil in a substantially rectangular parallelepiped body. The lead portion of the coil extends along the central axis of the coil and is connected to a terminal electrode formed on the end face of the element body. In such an electronic component, since the coil is parallel to the mounting surface and the stray capacitance between the terminal electrode and the coil can be reduced, a noise removal function in a high frequency band can be ensured.

JP-A-11-260644

  By the way, the multilayer electronic component as described above includes, for example, an insulator layer including an inner conductor (coil conductor) that forms a coil, and an insulator layer including an inner conductor (leader conductor) that forms a lead portion; It is produced by laminating an insulator layer provided with an internal conductor (connection conductor) connecting the coil and the lead-out portion in a predetermined order and sintering it. When the lead conductor is disposed along the central axis of the coil conductor, the lead conductor and the connecting conductor become wedges when the respective insulator layers are laminated and crimped, and the effect of suppressing the displacement of the coil conductor (wedge) Effect).

  However, in recent years, the miniaturization of multilayer electronic components has progressed, and the coil diameter has also become smaller accordingly. Therefore, the wedge effect tends to be excessive, and when the insulator layer is pressure-bonded, there is a possibility that problems such as stacking deviation, deformation, and tearing may occur in the coil conductor.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a multilayer electronic component that can suppress the occurrence of defects in coil conductors even when the size is reduced.

  In order to solve the above problems, a multilayer electronic component according to the present invention includes an element body formed by laminating a plurality of insulator layers, and a terminal electrode provided at an end of the element body in the stacking direction, In the element body, a coil conductor forming a coil extending in the stacking direction, a lead conductor extending along the central axis of the coil and connected to the terminal electrode, and a connection for connecting the coil conductor and the lead conductor The conductor pattern of the coil conductor is substantially U-shaped and has pad portions with through holes formed at both ends. The conductor pattern of the lead conductor is coaxial with the central axis. It has a pad part in which a through hole is formed, and the contour shape of the pad part of the lead conductor is the contour of the pad part of the coil conductor when the coil conductor and the lead conductor are viewed from the stacking direction of the element body. Escape shape that escapes from the shape It is characterized in that.

  In this multilayer electronic component, when a plurality of insulator layers are pressure-bonded, a wedge effect is caused by the vicinity of the center of the insulator layer on which the coil conductor is formed being pushed by the lead conductor and the connection conductor, and the coil conductor is displaced. Is suppressed. At this time, in this multilayer electronic component, when the coil conductor and the lead conductor are viewed from the stacking direction of the element body, the contour shape of the pad portion of the lead conductor is different from the contour shape of the pad portion of the coil conductor. Escape shape to escape. For this reason, even when the multilayer electronic component is downsized, since a certain space is provided between the lead conductor and the coil conductor, it is possible to prevent the wedge effect from becoming excessive. Therefore, it is possible to suppress the occurrence of problems such as misalignment, deformation, and tearing in the coil conductor.

  The contour shape of the pad portion of the lead conductor includes a plurality of corner portions and opposing sides facing the pad portion of the coil conductor, and the opposing sides are inside the straight line connecting the corner portions and the straight line. Preferably, it is either a straight line passing through or a curved line. Thereby, the space between an extraction conductor and a coil conductor is suitably securable.

  In addition, when the coil conductor and the lead conductor are viewed from the stacking direction of the element body, the contour shape of the pad portion of the coil conductor is a relief shape that escapes from the contour shape of the pad portion of the lead conductor. Is preferred. In this case, a space between the lead conductor and the coil conductor is further secured, and it is possible to more reliably suppress the occurrence of problems such as misalignment, deformation, and tearing in the coil conductor.

  In addition, the contour shape of the pad portion of the coil conductor includes a plurality of corner portions and opposing sides facing the pad portion of the lead conductor, and the opposing sides are inside the straight line connecting the corner portions and the straight line. Preferably, it is either a straight line passing through or a curved line. Thereby, the space between an extraction conductor and a coil conductor is suitably securable.

  In addition, the conductor pattern of the connection conductor has a pad portion corresponding to the pad portion of the coil conductor and the pad portion of the lead conductor, and the coil conductor and the connection conductor are viewed from the stacking direction of the element body. The contour shape of the pad portion of the connecting conductor is preferably a relief shape that escapes from the contour shape of the pad portion of the coil conductor. In this case, a space between the connection conductor and the coil conductor is ensured, and it is possible to more reliably suppress the occurrence of problems such as misalignment, deformation, and tearing in the coil conductor.

  The contour shape of the pad portion of the connection conductor includes a plurality of corner portions and opposing sides that face the pad portion of the coil conductor, and the opposing sides are inside the straight line connecting the corner portions and the straight line. Preferably, it is either a straight line passing through or a curved line. Thereby, the space between a connection conductor and a coil conductor is suitably securable.

  According to the present invention, it is possible to suppress the occurrence of defects in the coil conductor even when it is downsized.

1 is a perspective view showing an embodiment of a multilayer electronic component according to the present invention. FIG. 2 is an exploded perspective view showing a layer configuration of the multilayer electronic component shown in FIG. 1. It is the III-III sectional view taken on the line in FIG. It is a top view which shows an example of the pattern of a coil conductor. It is a top view which shows an example of the pattern of an extraction conductor. It is a top view which shows an example of the pattern of a connection conductor. It is the figure which piled up and looked at the coil conductor and the lead conductor from the lamination direction of the element body. It is the figure which overlapped and looked at the coil conductor and the connection conductor from the lamination direction of the element body. It is a figure which shows the modification of the pad part of a coil conductor. It is a figure which shows the modification of the pad part of an extraction conductor. It is a figure which shows the modification of the pad part of a connection conductor.

  Hereinafter, preferred embodiments of a multilayer electronic component according to the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing an embodiment of a multilayer electronic component according to the present invention. 2 is an exploded perspective view showing a layer structure of the multilayer electronic component shown in FIG. 1, and FIG. 3 is a cross-sectional view taken along line III-III in FIG. As shown in FIGS. 1 to 3, the multilayer electronic component 1 includes a substantially rectangular parallelepiped element body 2 and a pair of terminal electrodes 3 and 3 provided on the surface of the element body 2.

  The element body 2 is configured by laminating a plurality of insulator layers 11 (see FIG. 2). The insulator layer 11 is formed using a green sheet of a ferrite material whose main component is, for example, Fe, Ni, Cu, Zn or the like. The element body 2 is produced by forming a predetermined conductor pattern and through-holes in each green sheet, and firing the laminated body obtained by laminating and press-bonding them in a predetermined order. In the element body 2, the insulator layers 11 are integrated to such an extent that the boundary between them cannot be visually recognized.

  The terminal electrode 3 is formed so as to cover the end surface of the element body 2 in the stacking direction. The terminal electrode 3 is obtained by, for example, applying a conductive paste containing Ag or glass as a main component by a dipping method or the like after the element body 2 is formed, and firing the paste. The surface of the terminal electrode 3 is plated as necessary.

  As shown in FIGS. 2 and 3, the element body 2 includes a coil conductor 12 that forms a coil M, a lead conductor 13 that pulls the coil M toward the terminal electrode 3, a coil conductor 12, and a lead conductor 13. A connecting conductor 14 interposed between the two is disposed.

  As shown in FIG. 4, the conductor pattern 21 that forms the coil conductor 12 is formed in a substantially U shape. Pad portions 23 corresponding to the through holes 22 are respectively formed at one end and the other end of the conductor pattern 21. As shown in FIG. 2, the conductor patterns 21 are connected in series via the through holes 22 with the phases being shifted by 90 degrees to form a coil M extending in the stacking direction.

  As shown in FIG. 5, the conductor pattern 24 that forms the lead conductor 13 includes a pad portion 26 corresponding to the through hole 25, and is coaxial with the central axis L (see FIG. 3) of the coil M formed by the coil conductor 12. Is arranged. As shown in FIG. 2, each conductor pattern 24 is connected in series via a through hole 25, and forms a lead conductor 13 that extends along the central axis L of the coil M. The outer end portion of the lead conductor 13 is exposed at the end face in the stacking direction of the element body 2 and is connected to the terminal electrode 3.

  As shown in FIG. 6, the conductor pattern 27 forming the connection conductor 14 is formed so as to connect a position corresponding to one pad portion 23 of the coil conductor 12 and a position corresponding to the pad portion 26 of the lead conductor 13. Has been. A pad portion 28 corresponding to the through hole 25 is formed coaxially with the pad portion 26 of the lead conductor 13 at one end portion of the conductor pattern 27, and a pad portion corresponding to the through hole 22 is formed at the other end portion of the conductor pattern 27. 29 is formed coaxially with the pad portion 23 of the coil conductor 12. As shown in FIG. 2, one end of the conductor pattern 27 is connected to the other end of the lead conductor 13 through the through hole 25, and the other end of the conductor pattern 27 is connected to the coil conductor 12 through the through hole 22. Is connected to the end of the.

  The conductor pattern 21, the conductor pattern 24, and the conductor pattern 27 as described above are obtained, for example, by patterning a conductive paste mainly composed of Ag on a green sheet using screen printing or the like, and baking it. . At this time, the thickness of the conductor pattern 21, the conductor pattern 24, and the conductor pattern 27 is set to, for example, 5 to 20 μm, preferably 10 to 15 μm.

  Next, the shapes of the pad portion 23 of the coil conductor 12, the pad portion 26 of the lead conductor 13, and the pad portion 28 of the connection conductor 14 will be described.

  As shown in FIG. 4, the contour shape of the pad portion 23 of the coil conductor 12 is mostly circular. On the other hand, the contour shape of the pad portion 23 has corner portions 23 a and 23 a at the root portion and the tip of the overhanging portion projecting from the other pad portion 23, respectively. As shown in FIG. 7, the straight sides connecting these corners 23 a and 23 a are formed when the coil conductor 12 and the lead conductor 13 are superposed from the stacking direction of the element body 2. It is a facing side 23 b that faces the pad portion 26.

  Further, as shown in FIG. 5, the contour shape of the pad portion 26 of the lead conductor 13 is a rectangular shape. In the outline shape of the pad portion 26, each of the straight sides connecting the corner portions 26a and 26a is viewed by superimposing the coil conductor 12 and the lead conductor 13 from the stacking direction of the element body 2 as shown in FIG. Sometimes, the opposing side 26 b faces the pad portion 23 of the coil conductor 12.

  By forming the opposing sides 23b and 26b as described above, when the coil conductor 12 and the lead conductor 13 are superposed from the stacking direction of the element body 2, the contour shape of the pad portion 23 of the coil conductor 12 is the lead conductor. 13 is a relief shape that escapes from the contour shape of the pad portion 26, and the contour shape of the pad portion 26 of the lead conductor 13 is a relief shape that escapes from the contour shape of the pad portion 23 of the coil conductor 12. Therefore, a certain space is formed between the pad portion 26 of the lead conductor 13 and the pad portion 23 of the coil conductor 12 due to these relief shapes.

  Further, as shown in FIG. 6, the contour shape of the pad portion 28 of the connection conductor 14 has a rectangular shape similar to that of the pad portion 26 of the lead conductor 13 except for a portion extending to the pad portion 29 side. In the contour shape of the pad portion 28, each of the straight sides connecting the corner portions 28a, 28a is viewed by superimposing the coil conductor 12 and the connection conductor 14 from the stacking direction of the element body 2 as shown in FIG. In some cases, the side 28 b faces the pad portion 23 of the coil conductor 12.

  When the coil conductor 12 and the connection conductor 14 are overlapped from the stacking direction of the element body 2 due to the formation of the opposing side 28b, the contour shape of the pad portion 28 of the connection conductor 14 is The relief shape escapes from the contour shape of the pad portion 23. Therefore, a certain space is formed between the pad portion 28 of the connection conductor 14 and the pad portion 23 of the coil conductor 12 due to the relief shape.

  In the multilayer electronic component 1 having the above configuration, when the plurality of insulator layers 11 are crimped, the vicinity of the center of the insulator layer 11 on which the coil conductor 12 is formed is pushed by the lead conductor 13 and the connection conductor 14. The wedge effect is generated, and the displacement of the coil conductor 12 is suppressed.

  At this time, in the multilayer electronic component 1, when the coil conductor 12 and the lead conductor 13 are overlapped from the stacking direction of the element body 2, the contour shape of the pad portion 23 of the coil conductor 12 is the same as that of the lead conductor 13. The contour shape of the pad portion 26 escapes from the contour shape of the pad portion 26, and the contour shape of the pad portion 26 of the lead conductor 13 is a relief shape that escapes from the contour shape of the pad portion 23 of the coil conductor 12. For this reason, even when the multilayer electronic component 1 is downsized, since a certain space is provided between the lead conductor 13 and the coil conductor 12, it is possible to prevent the wedge effect from becoming excessive. Therefore, it is possible to suppress the occurrence of defects such as misalignment, deformation, and tearing in the coil conductor 12.

  In the multilayer electronic component 1, when the coil conductor 12 and the connection conductor 14 are viewed from the stacking direction of the element body 2, the contour shape of the pad portion 28 of the connection conductor 14 is the pad of the coil conductor 12. The relief shape escapes from the contour shape of the portion 23. Thereby, since a certain space is provided between the connection conductor 14 and the coil conductor 12, it is possible to prevent the wedge effect from becoming excessive. Therefore, it is possible to more reliably suppress the occurrence of problems such as misalignment, deformation, and tearing in the coil conductor 12.

  The present invention is not limited to the above embodiment. For example, in the above-described embodiment, the opposing sides 23b, 26b, and 28b are formed in a straight line, but these opposing sides are either a straight line or a curve that passes through the inside of a straight line that connects the corners. Also good.

  As a modification of the pad portion 23 of the coil conductor 12, for example, as shown in FIG. 9A, the opposing side 23c may be formed by a curve that draws an arc inside the straight line connecting the corner portions 23a and 23a. As shown in FIG. 9 (b), another corner 23d is provided on the inner side of the straight line connecting the corners 23a and 23a, and is opposed by a straight line connecting the corners 23a and 23d and a straight line connecting the corners 23d and 23a. The side 28e may be formed.

  As a modification of the pad portion 26 of the lead conductor 13, for example, as shown in FIG. 10 (a), the opposing side 26c may be formed by a curve that draws an arc inside the straight line connecting the corner portions 26a, 26a. As shown in FIG. 10B, another corner portion 26d is provided on the inner side of the straight line connecting the corner portions 26a and 26a, and is opposed by a straight line connecting the corner portions 26a and 26d and a straight line connecting the corner portions 26d and 26a. The side 26e may be formed.

  As a modification of the pad portion 28 of the connecting conductor 14, for example, as shown in FIG. 11A, the opposing side 28c may be formed by a curve that draws an arc inside the straight line connecting the corner portions 28a, 28a. As shown in FIG. 11B, another corner portion 28d is provided on the inner side of the straight line connecting the corner portions 28a and 28a, and is opposed by the straight line connecting the corner portions 28a and 28d and the straight line connecting the corner portions 28d and 28a. The side 28e may be formed.

  In such a modification, the space between the pad portion 23 of the coil conductor 12 and the pad portion 26 of the lead conductor 13 and the pad portion 28 of the connecting conductor 14 when viewed from the stacking direction of the element body 2. And a space between the pad portion 23 of the coil conductor 12 can be secured more widely. Therefore, it is possible to more reliably suppress the occurrence of problems such as misalignment, deformation, and tearing in the coil conductor 12.

  DESCRIPTION OF SYMBOLS 1 ... Laminated type electronic component, 2 ... Element body, 3 ... Terminal electrode, 11 ... Insulator layer, 12 ... Coil conductor, 13 ... Lead conductor, 14 ... Connection conductor, 23 ... Pad part (of coil conductor), 22, 25... Through hole, 26... Pad part (of the lead conductor), 28... Pad part (of the connection conductor), 23 a, 26 a, 28 a. 28e ... opposite side, M ... coil, L ... central axis.

Claims (6)

An element body formed by laminating a plurality of insulator layers;
A terminal electrode provided at an end of the element body in the stacking direction,
In the body,
A coil conductor forming a coil extending in the stacking direction;
A lead conductor extending along the central axis of the coil and connected to the terminal electrode;
A connection conductor connecting the coil conductor and the lead conductor is disposed;
The conductor pattern of the coil conductor is substantially U-shaped and has a pad portion formed with a through hole at both ends,
The conductor pattern of the lead conductor has a pad portion in which a through hole is formed coaxially with the central axis,
When the coil conductor and the lead conductor are viewed from the stacking direction of the element body, the contour shape of the pad portion of the lead conductor is a relief shape that escapes from the contour shape of the pad portion of the coil conductor. A multilayer electronic component characterized by comprising: The contour shape of the pad portion of the lead conductor includes a plurality of corner portions and opposing sides facing the pad portion of the coil conductor,
2. The multilayer electronic component according to claim 1, wherein the opposing side is one of a straight line connecting the corners and a straight line or a curve passing through the inside of the straight line.   When the coil conductor and the lead conductor are viewed from above in the stacking direction of the element body, the contour shape of the pad portion of the coil conductor is a relief shape that escapes from the contour shape of the pad portion of the lead conductor. The multilayer electronic component according to claim 1, wherein the multilayer electronic component is provided. The contour shape of the pad portion of the coil conductor includes a plurality of corner portions and opposing sides facing the pad portion of the lead conductor,
4. The multilayer electronic component according to claim 3, wherein the opposite side is one of a straight line connecting the corners and a straight line or a curve passing through the inner side of the straight line. The conductor pattern of the connection conductor has a pad portion corresponding to the pad portion of the coil conductor and the pad portion of the lead conductor,
When the coil conductor and the connection conductor are viewed from the stacking direction of the element body, the contour shape of the pad portion of the connection conductor is a relief shape that escapes from the contour shape of the pad portion of the coil conductor. The multilayer electronic component according to claim 1, wherein the multilayer electronic component is a multilayer electronic component. The contour shape of the pad portion of the connection conductor includes a plurality of corner portions and opposing sides facing the pad portion of the coil conductor,
6. The multilayer electronic component according to claim 5, wherein the opposing side is one of a straight line connecting the corners and a straight line or a curve passing through the inside of the straight line.

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