JP2012204467A5 - - Google Patents

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Publication number
JP2012204467A5
JP2012204467A5 JP2011065885A JP2011065885A JP2012204467A5 JP 2012204467 A5 JP2012204467 A5 JP 2012204467A5 JP 2011065885 A JP2011065885 A JP 2011065885A JP 2011065885 A JP2011065885 A JP 2011065885A JP 2012204467 A5 JP2012204467 A5 JP 2012204467A5
Authority
JP
Japan
Prior art keywords
forming
copper
wiring
dispersion liquid
wiring according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011065885A
Other languages
English (en)
Japanese (ja)
Other versions
JP5544324B2 (ja
JP2012204467A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2011065885A external-priority patent/JP5544324B2/ja
Priority to JP2011065885A priority Critical patent/JP5544324B2/ja
Priority to EP12761154.9A priority patent/EP2690938A4/en
Priority to CN2012800144030A priority patent/CN103460817A/zh
Priority to PCT/JP2012/056525 priority patent/WO2012128140A1/ja
Priority to TW101109784A priority patent/TW201244569A/zh
Publication of JP2012204467A publication Critical patent/JP2012204467A/ja
Priority to US14/033,412 priority patent/US20140020938A1/en
Publication of JP2012204467A5 publication Critical patent/JP2012204467A5/ja
Publication of JP5544324B2 publication Critical patent/JP5544324B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011065885A 2011-03-24 2011-03-24 銅配線の形成方法および配線基板の製造方法 Expired - Fee Related JP5544324B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011065885A JP5544324B2 (ja) 2011-03-24 2011-03-24 銅配線の形成方法および配線基板の製造方法
EP12761154.9A EP2690938A4 (en) 2011-03-24 2012-03-14 PROCESS FOR FORMING COPPER CABLING, METHOD FOR PRODUCING A CABINING SUBSTRATE AND CABINING SUBSTRATE
CN2012800144030A CN103460817A (zh) 2011-03-24 2012-03-14 铜配线的形成方法、配线基板的制造方法以及配线基板
PCT/JP2012/056525 WO2012128140A1 (ja) 2011-03-24 2012-03-14 銅配線の形成方法、配線基板の製造方法及び配線基板
TW101109784A TW201244569A (en) 2011-03-24 2012-03-22 Method of forming copper wiring, method of manufacturing wiring board, and wiring board
US14/033,412 US20140020938A1 (en) 2011-03-24 2013-09-20 Method of forming copper wiring, method of manufacturing wiring board, and wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011065885A JP5544324B2 (ja) 2011-03-24 2011-03-24 銅配線の形成方法および配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2012204467A JP2012204467A (ja) 2012-10-22
JP2012204467A5 true JP2012204467A5 (enExample) 2013-10-24
JP5544324B2 JP5544324B2 (ja) 2014-07-09

Family

ID=46879292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011065885A Expired - Fee Related JP5544324B2 (ja) 2011-03-24 2011-03-24 銅配線の形成方法および配線基板の製造方法

Country Status (6)

Country Link
US (1) US20140020938A1 (enExample)
EP (1) EP2690938A4 (enExample)
JP (1) JP5544324B2 (enExample)
CN (1) CN103460817A (enExample)
TW (1) TW201244569A (enExample)
WO (1) WO2012128140A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6133149B2 (ja) * 2013-06-28 2017-05-24 古河電気工業株式会社 導電性ペースト、及びその製造方法
JP2016009731A (ja) * 2014-06-24 2016-01-18 コニカミノルタ株式会社 導電パターン形成方法および導電パターン形成装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513412A (ja) 1991-07-02 1993-01-22 Nippon Steel Corp 半導体集積回路の配線
JPH06215617A (ja) * 1993-01-14 1994-08-05 Asahi Chem Ind Co Ltd 焼成用導電性ペースト
JPH10178247A (ja) * 1996-12-18 1998-06-30 Kyocera Corp 配線基板およびその製造方法
JP3599950B2 (ja) * 1997-04-16 2004-12-08 株式会社アルバック 金属ペーストの焼成方法
JP3690552B2 (ja) 1997-05-02 2005-08-31 株式会社アルバック 金属ペーストの焼成方法
JPH11312859A (ja) * 1998-04-28 1999-11-09 Murata Mfg Co Ltd 回路パターン形成方法及びそれにより形成された多層配線基板
JP2003311196A (ja) 2002-04-19 2003-11-05 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、非接触型カード媒体、圧電体素子、並びにインクジェット式記録ヘッド
CN100488339C (zh) * 2003-05-16 2009-05-13 播磨化成株式会社 形成微细铜颗粒烧结产物类的微细形状导电体的方法
EP1626614B1 (en) * 2003-05-16 2013-08-28 Harima Chemicals, Inc. Method for forming fine copper particle sintered product type of electric conductor having fine shape, method for forming fine copper wiring and thin copper film
KR100819876B1 (ko) * 2006-09-19 2008-04-07 삼성전기주식회사 합금배선기판 및 그 제조방법
JP4858057B2 (ja) * 2006-09-29 2012-01-18 大日本印刷株式会社 導電性基板の製造方法
EP2204824A4 (en) * 2007-10-22 2011-03-30 Hitachi Chemical Co Ltd Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same
JP5467855B2 (ja) * 2009-03-09 2014-04-09 富士フイルム株式会社 ラインパターン形成方法

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