JP2012189674A - Manufacturing method of electro-optical device, and element substrate inspection device for electro-optical device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electro-optical device that can surely prevent adhesion, to one surface of an element substrate, of foreign matters produced when an inspection terminal is contacted to a terminal of an element substrate, and an element substrate inspection device for the electro-optical device.SOLUTION: When an element substrate inspection device 300 tests an element substrate 10, an air stream S is blown in an oblique direction to one surface 10s of the element substrate 10 from a spraying port 351 of an air stream discharge device 350, and the inspection is conducted by bringing an inspection terminal 320 into contact with a terminal 102 of the element substrate 10, while sucking the air stream by a sucking port 361 of a sucking device 360. Accordingly, even if the foreign matters P are produced at the contact of the inspection terminal 320 and the terminal 102, the foreign matters P are separated from the element substrate 10 and the inspection terminal 320 and are sucked into the sucking port 361 of the sucking device 360 together with the air stream S.

Description

The present invention relates to a method for manufacturing an electro-optical device in which pixel transistors, terminals, and the like are formed on an element substrate, and an element substrate inspection device for an electro-optical device that performs an electrical inspection of the element substrate.

In an electro-optical device such as a liquid crystal device or an organic electroluminescence device, an element substrate on which a pixel transistor, a wiring, a pixel electrode, a terminal, and the like are formed is used.For such an element substrate, before bonding a counter substrate, A process of inspecting electrical characteristics of the pixel transistor or the like by bringing an inspection terminal such as a probe into contact with the terminal is performed.

A similar inspection is performed on the silicon wafer in the manufacturing process of the semiconductor device.
As such an inspection apparatus, a configuration in which air is blown from the outside of the probe and sucked from the center side (between the probe and the probe) has been proposed (see Patent Document 1). In addition, a configuration in which air is blown from the center side of the probe (between the probes) and sucked from the outside has been proposed (see Patent Document 2). Furthermore, the structure which ventilates from the outer side of a probe, the structure which ventilates from both sides of a probe, and the structure which installs ventilation and suction | inhalation in a pair on the outer side of a probe are also proposed (refer patent document 3).
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Japanese Patent Laid-Open No. 2007-120961 JP 2005-175094 A JP 2003-273174 A

In any of the configurations described in Patent Documents 1 to 3, the inspection is reliably performed by removing foreign matters (particles) such as metal powder adhering between the probe and the probe when the probe and the terminal come into contact with each other. Therefore, the airflow is mainly supplied toward the probe. For this reason, when the configurations described in Patent Documents 1 to 3 are applied to the inspection of the element substrate for the electro-optical device, it is insufficient in terms of preventing the occurrence of the defect of the element substrate due to the foreign matter. That is, in the case of an element substrate for a liquid crystal device among electro-optical devices, a semiconductor IC
Unlike the chip, the surface on the side where the terminals are formed is not sealed at the time of inspection, so that foreign matter such as metal powder generated when the probe and the terminals come into contact with each other is on one side of the element substrate. If it adheres to it, it may cause a malfunction. In addition, in the case of a liquid crystal device or an organic electroluminescence device, since display light passes through one side of the element substrate, foreign matter such as metal powder generated when the probe and the terminal come into contact with each other is on one side of the element substrate. If it adheres to it, it may cause a malfunction.

In view of the above problems, an object of the present invention is to provide an electro-optical device that can reliably prevent foreign matter generated when an inspection terminal comes into contact with a terminal of an element substrate from adhering to one surface of the element substrate. An object of the present invention is to provide an apparatus manufacturing method and an element substrate inspection apparatus for an electro-optical device.

In order to solve the above problems, an electro-optical device manufacturing method according to the present invention includes an element substrate forming step of forming at least a pixel transistor and a terminal on one surface of an element substrate for an electro-optical device, and the element substrate An inspection process for inspecting the element substrate by bringing an inspection terminal into contact with the terminal while blowing the airflow from an oblique direction toward one surface and sucking the airflow on the downstream side of the airflow, A bonding step of attaching a counter substrate to the one surface side of the element substrate on which the inspection step has been performed.

The element substrate inspection apparatus for an electro-optical device according to the present invention includes a substrate holder that holds an element substrate for an electro-optical device in which at least a pixel transistor and a terminal are formed on one side, and the substrate holder that holds the substrate. An inspection terminal that contacts the terminal of the element substrate, a drive mechanism that switches a relative position between the inspection terminal and the element substrate, and an airflow discharge that blows an airflow obliquely toward the one surface of the element substrate And a suction device that sucks the airflow downstream of the airflow.

In the present invention, when inspecting the element substrate, while blowing the airflow from an oblique direction toward one surface where the terminal is formed in the element substrate, while sucking the airflow on the downstream side of the airflow,
An inspection terminal is brought into contact with the terminal to perform an electrical inspection of the element substrate. For this reason, even if a foreign substance such as metal powder is generated when the inspection terminal and the terminal come into contact with each other, the foreign substance is separated from the element substrate and the inspection terminal by the air current and sucked. At that time, airflow is blown from an oblique direction,
Sufficient wind pressure is applied to the element substrate. Accordingly, the foreign matter is reliably separated from the element substrate and the inspection terminal by the air flow and sucked. Therefore, it is possible to reliably prevent the occurrence of defects due to the foreign matter reattaching to the element substrate, and to reliably prevent the occurrence of inspection defects due to the foreign matter adhering to the inspection terminal. it can.

In the electro-optical device manufacturing method and the electro-optical device element substrate inspection apparatus according to the present invention, the element substrate includes a plurality of the terminals arranged in one direction, and the element substrate includes:
The airflow is preferably blown from a direction intersecting the one direction in a plan view. According to such a configuration, the airflow is reliably blown toward each of the plurality of terminals. Therefore, even if a foreign substance is generated when the inspection terminal and the terminal come into contact with each other, the foreign substance is surely separated from the element substrate and the inspection terminal by the air current and sucked. For this reason, it is possible to reliably prevent the occurrence of defects due to the foreign matter reattaching to the element substrate, and to reliably prevent the occurrence of inspection defects due to the foreign matter adhering to the inspection terminals. it can.

In the method for manufacturing the electro-optical device according to the aspect of the invention, it is preferable that the suction of the airflow is performed by a suction port having a size larger than that of the blowout port that blows out the airflow. In the element substrate inspection apparatus for an electro-optical device according to the present invention, the suction port that sucks the airflow in the suction device is preferably larger in size than the blowout port that blows out the airflow in the airflow discharge device. According to this structure, even if the airflow blown out from the blowout port diffuses, it can be reliably sucked.

In the method for manufacturing an electro-optical device according to the invention, it is preferable that the inspection is performed while reversing a direction in which the airflow is blown onto the element substrate and a direction in which the airflow is sucked. In the element substrate inspection apparatus for an electro-optical device according to the present invention, the suction device includes an airflow discharge mechanism that blows out the airflow, and the airflow discharge device includes a suction mechanism that sucks the airflow, and the airflow discharge It is preferable that the device and the suction device alternately perform the blowing of the airflow and the suction. According to this configuration, even when the foreign object is located on either side of the inspection terminal when the inspection terminal and the terminal come into contact with each other, the foreign object can be reliably detached from the element substrate and the inspection terminal by the air flow. . For this reason, it is possible to reliably prevent the occurrence of defects due to the foreign matter reattaching to the element substrate, and to reliably prevent the occurrence of inspection defects due to the foreign matter adhering to the inspection terminals. it can.

In the method of manufacturing an electro-optical device according to the invention, it is preferable that the inspection is performed with the one surface facing downward in the inspection step. In the element substrate inspection apparatus for an electro-optical device according to the present invention, it is preferable that the substrate holder holds the element substrate with the one surface side facing downward. According to such a configuration, when a foreign object is generated when the inspection terminal and the terminal come into contact with each other, the foreign object falls by its own weight and is detached from the element substrate and the inspection terminal. For this reason, it is possible to reliably prevent the occurrence of defects due to the foreign matter reattaching to the element substrate, and to reliably prevent the occurrence of inspection defects due to the foreign matter adhering to the inspection terminals. it can.

It is a block diagram which shows the electric constitution of the liquid crystal device which concerns on this invention. It is explanatory drawing of the liquid crystal panel of the liquid crystal device which concerns on this invention. It is explanatory drawing which shows the structure of the electrode etc. which are formed in the element substrate of the liquid crystal device which concerns on this invention. It is explanatory drawing of the element substrate used for manufacture of the liquid crystal device which concerns on this invention. It is explanatory drawing which shows the manufacturing process of the liquid crystal device which concerns on this invention. It is explanatory drawing of the element board | substrate inspection apparatus (element board | substrate inspection apparatus for electro-optical devices) concerning Embodiment 1 of this invention. It is explanatory drawing of the element board | substrate inspection apparatus (element board | substrate inspection apparatus for electro-optical devices) concerning Embodiment 2 of this invention. It is explanatory drawing of the element board | substrate inspection apparatus (element board | substrate inspection apparatus for electro-optical apparatuses) which concerns on Embodiment 3 of this invention. It is a schematic block diagram of the projection type display apparatus using the liquid crystal device to which this invention is applied.

Embodiments of the present invention will be described with reference to the drawings. In the drawings to be referred to in the following description, the scales are different for each layer and each member so that each layer and each member have a size that can be recognized on the drawing. In addition, when the direction of the current flowing through the field effect transistor is reversed, the source and the drain are switched. In the following description, for convenience, the side to which the pixel electrode is connected is used as the drain and the data line is connected. The side will be described as a source. In the following description, the directions orthogonal to each other in the in-plane direction of the element substrate are defined as the X direction and the Y direction.
The direction normal to the element substrate will be described as the Z direction.

[Embodiment 1]
(overall structure)
FIG. 1 is a block diagram showing an electrical configuration of a liquid crystal device according to the present invention. In FIG.
The liquid crystal device 100 includes a liquid crystal panel 100p in a TN (Twisted Nematic) mode or a VA (Vertical Alignment) mode, and the liquid crystal panel 100p displays an image in which a plurality of pixels 100a are arranged in a matrix in the central region. A region 10a (effective pixel region) is provided. In the liquid crystal panel 100p, in the element substrate 10 (see FIG. 2) described later, a plurality of data lines 6a (image signal lines) and a plurality of scanning lines 3a extend vertically and horizontally inside the image display region 10a. A pixel 100a is configured at a position corresponding to the intersection. Each of the plurality of pixels 100a includes a pixel transistor 3 including a field effect transistor.
0 and a pixel electrode 9a described later are formed. The data line 6 a is electrically connected to the source of the pixel transistor 30, the scanning line 3 a is electrically connected to the gate of the pixel transistor 30, and the pixel electrode 9 a is electrically connected to the drain of the pixel transistor 30. Has been.

In the element substrate 10, a scanning line driving circuit 104 and a data line driving circuit 101 are provided on the outer peripheral side of the image display region 10 a. The data line driving circuit 101 is electrically connected to each data line 6a, and sequentially supplies the image signal supplied from the image processing circuit to each data line 6a. The scanning line driving circuit 104 is electrically connected to each scanning line 3a, and sequentially supplies a scanning signal to each scanning line 3a.

In the element substrate 10, the pixel electrode 9 a is opposed to a common electrode formed on a counter substrate 20 (see FIG. 2 and the like) to be described later via a liquid crystal layer, and constitutes a liquid crystal capacitor 50 a. Each pixel 100a includes a liquid crystal capacitor 5 in order to prevent fluctuations in the image signal held in the liquid crystal capacitor 50a.
A holding capacitor 55 is added in parallel with 0a. In this embodiment, in order to form the storage capacitor 55, the capacitor line 5b extending in parallel with the scanning line 3a is formed across the plurality of pixels 100a. In this embodiment, the capacitor line 5b is electrically connected to the constant potential wiring 6t to which the common potential Vcom is applied.

(Configuration of liquid crystal panel 100p and element substrate 10)
FIG. 2 is an explanatory diagram of the liquid crystal panel 100p of the liquid crystal device 100 according to the present invention, and FIG.
(B) and (b) are a plan view of the liquid crystal panel 100p as viewed from the counter substrate side together with the respective components, and a cross-sectional view thereof taken along line HH ′. FIG. 3 shows an element substrate 1 of the liquid crystal device 100 according to the present invention.
FIG. 3A and FIG. 3B are explanatory diagrams showing an overall layout of the electrodes and one of corner portions of the liquid crystal panel 100p. It is explanatory drawing which expands and shows. In FIG. 3, the number of pixel electrodes 9a, dummy pixel electrodes 9b, and the like are small.

As shown in FIGS. 2 and 3, in the liquid crystal panel 100p, the element substrate 10 and the counter substrate 20 are provided.
Are attached to each other with a sealant 107 through a predetermined gap, and the sealant 107 is provided in a frame shape along the outer edge of the counter substrate 20. The sealing material 107 is an adhesive made of a photo-curing resin, a thermosetting resin, or the like, and is mixed with a gap material 107a such as glass fiber or glass beads for setting the distance between both substrates to a predetermined value.

In the liquid crystal panel 100p having such a configuration, the element substrate 10 and the counter substrate 20 are both square, and the image display area 10a described with reference to FIG. 1 is provided as a square area in the approximate center of the liquid crystal panel 100p. ing. Corresponding to such a shape, the sealing material 107
Is also provided in a substantially rectangular shape, and the outer side of the image display area 10a is a rectangular frame-shaped outer peripheral area 10c.

In the element substrate 10, the data line driving circuit 101 and a plurality of terminals 102 are formed along one side of the element substrate 10 in the outer peripheral region 10 c, and the scanning line driving circuit 104 is formed along another side adjacent to the one side. Is formed. The terminals 102 are aligned in the X direction. A flexible wiring board (not shown) is connected to the terminals 102, and various potentials and various signals are input to the element substrate 10 through the flexible wiring board.

As will be described in detail later, the pixel transistor 30 described with reference to FIG. 1 and the pixel transistor 30 are electrically connected to the image display region 10a on the one substrate surface facing the counter substrate 20 in the element substrate 10. Connected pixel electrodes 9a (liquid crystal driving electrodes) are formed in a matrix, and an alignment film 16 as an element substrate-side alignment film is formed on the upper side of the pixel electrodes 9a.

On the substrate surface on one side of the element substrate 10, the image display region 10a in the outer peripheral region 10c.
A dummy pixel electrode 9b formed at the same time as the pixel electrode 9a is formed in a rectangular frame-shaped peripheral region 10b sandwiched between the sealing material 107 and the sealing material 107. In the dummy pixel electrode 9b, adjacent dummy pixel electrodes 9b are connected to each other by a narrow connecting portion 9f (see FIG. 3B). The dummy pixel electrode 9b is applied with the common potential Vcom, and prevents the disorder of the alignment of liquid crystal molecules at the outer peripheral side end of the image display region 10a. In addition, the dummy pixel electrode 9b is formed in the image display region 10a and the peripheral region 1 when the surface of the element substrate 10 on which the alignment film 16 is formed is planarized by polishing.
This compresses the difference in height position from 0b and contributes to flattening the surface on which the alignment film 16 is formed. In some cases, no potential is applied to the dummy pixel electrode 9b, and the dummy pixel electrode 9b is potentialally floated. Even in this case, the dummy pixel electrode 9b has a height difference between the image display region 10a and the peripheral region 10b. This contributes to compressing the difference in position and making the surface on which the alignment film 16 is formed flat.

As shown in FIG. 2B, a common electrode 21 (liquid crystal driving electrode) is formed on one side of the counter substrate 20 facing the element substrate 10. The common electrode 21 is formed across the plurality of pixels 100a as substantially the entire surface of the counter substrate 20 or a plurality of strip electrodes.

Further, a light shielding layer 29 is formed on the lower layer side of the common electrode 21 on one side of the counter substrate 20 facing the element substrate 10, and an alignment film 26 as a counter substrate side alignment film is formed on the surface of the common electrode 21. Are stacked. In this embodiment, the light shielding layer 29 includes a frame portion 29a extending along the outer peripheral edge of the image display region 10a, and a black matrix portion 29b that overlaps an inter-pixel region sandwiched between adjacent pixel electrodes 9a. Here, the frame portion 29 a is formed at a position overlapping the dummy pixel electrode 9 b, and the outer peripheral edge of the frame portion 29 a is at a position with a gap between it and the inner peripheral edge of the sealing material 107. Therefore, the frame portion 29a and the sealing material 107 do not overlap.

As shown in FIG. 2A and FIGS. 3A and 3B, in the liquid crystal panel 100p,
On the outer side of the sealing material 107, one surface side of the counter substrate 20 (surface side facing the element substrate 10).
An inter-substrate conduction electrode portion 25t as an opposing substrate-side substrate conduction electrode portion is formed at the corner portion of the element substrate 10, and on one side 10s side of the element substrate 10 (the surface side facing the counter substrate 20), An inter-substrate conducting electrode portion 8t is formed as an element substrate-side inter-substrate conducting electrode portion at a position facing a corner portion of the counter substrate 20 (inter-substrate conducting electrode portion 25t). The inter-substrate conducting electrode portion 8t is
The constant potential wiring 6t is electrically connected to the common potential Vcom, and the constant potential wiring 6t is connected to the terminal 1.
02 is electrically connected to the common potential application terminal 102a.

An inter-substrate conducting material 109 containing conductive particles is disposed between the inter-substrate conducting electrode portion 8t and the inter-substrate conducting electrode portion 25t, and the common electrode 21 of the counter substrate 20 serves as an inter-substrate conducting electrode. It is electrically connected to the element substrate 10 side via the electrode portion 8t, the inter-substrate conducting material 109, and the inter-substrate conducting electrode portion 25t. Therefore, the common potential Vcom is applied to the common electrode 21 from the element substrate 10 side.

The sealing material 107 is provided along the outer peripheral edge of the counter substrate 20 with substantially the same width dimension. For this reason, the sealing material 107 is substantially rectangular. However, the sealing material 107 is provided so as to pass through the inside avoiding the inter-substrate conduction electrode portions 8t and 25t in a region overlapping the corner portion of the counter substrate 20, and the corner portion of the sealing material 107 is substantially arc-shaped. is there.

In the liquid crystal device 100 having such a configuration, when the pixel electrode 9a and the common electrode 21 are formed of a light-transmitting conductive film, a transmissive liquid crystal device can be configured. On the other hand, among the pixel electrode 9a and the common electrode 21, for example, the common electrode 21 is formed of a translucent conductive film,
When the pixel electrode 9a is formed of a reflective conductive film, a reflective liquid crystal device can be configured. When the liquid crystal device 100 is of a reflective type, the light incident from the counter substrate 20 side of the element substrate 10 and the counter substrate 20 is modulated while being reflected by the element substrate 10 and emitted to display an image. In the case where the liquid crystal device 100 is a transmissive type, for example, light incident from the side of the counter substrate 20 out of the element substrate 10 and the counter substrate 20 is modulated while being transmitted through the element substrate 10 and is displayed. To do.

The liquid crystal device 100 can be used as a color display device for electronic devices such as mobile computers and mobile phones. In this case, the counter substrate 20 or the element substrate 10 includes:
A color filter (not shown) is formed. Further, in the liquid crystal device 100, the polarizing film, the retardation film, the polarizing plate, etc. have a predetermined orientation with respect to the liquid crystal panel 100p according to the type of the liquid crystal layer 50 to be used and the normally white mode / normally black mode. Placed in. Furthermore, the liquid crystal device 100 can be used as a light valve for RGB in a projection display device (liquid crystal projector) described later. In this case, each color liquid crystal device 100 for RGB receives light of each color separated through RGB color separation dichroic mirrors as projection light, so that no color filter is formed.

(Manufacturing method of the liquid crystal device 100)
4A and 4B are explanatory views of the element substrate 10 used for manufacturing the liquid crystal device 100 according to the present invention. FIGS. 4A and 4B are explanatory views of the single-size element substrate 10 and a large element. Board 1
FIG. FIG. 5 is an explanatory view showing a manufacturing process of the liquid crystal device 100 according to the present invention.

In manufacturing the liquid crystal device 100 of this embodiment, as the element substrate 10, as shown in FIG. 4A, a single-size element substrate 10 is used, and the single-size element substrate 10 is referred to FIG. 5. There is a case where the liquid crystal panel 100p is formed by performing the element substrate forming process to be described. Further, as shown in FIG. 4B, a large-sized substrate 10 that can take a large number of single-sized element substrates 10.
In the state t, an element substrate forming process described with reference to FIG. 5 may be performed. Similarly, a large substrate may be used as the counter substrate 20, and in this case, after the large substrates are bonded together to form a large panel structure, the liquid crystal panel 10 of a single product size is formed from the large panel structure.
A plurality of 0p are cut out. In the large substrate 10t, a single-sized element substrate 1 is used.
A region from which 0 is cut out (a region indicated by an alternate long and short dash line in FIG. 4B) is an effective region 10y, and a surrounding portion is a material removal region 10z that is removed when the large substrate 10t is cut. FIG.
The large substrate 10t shown in (b) may have a shape in which an orientation flat is formed on a disk-shaped substrate, such as a silicon wafer.

When the large substrate 10t is used, the element substrates 10 are formed in the same direction. For this reason, the terminals 102 are aligned in the X direction. In the following description, the case where the large substrate 10t is used will be described. In this case, the large substrate 10t is also described as the “element substrate 10”.

As shown in FIG. 5, in order to manufacture the liquid crystal device 100, first, an element substrate forming step S1 for forming the pixel transistors 30, various wirings, terminals 102, pixel electrodes 9a and the like on the large element substrate 10 is performed. Thereafter, an element substrate inspection step S10 described later is performed. The element substrate inspection step S10 may be performed during the element substrate formation step S1.

Next, the alignment film 16 is applied to the element substrate 10 by oblique vapor deposition, printing, spin coating, or the like.
An alignment film forming step S2 for forming is performed. When the alignment film 16 is made of a polyimide film, a rubbing process is performed on the alignment film 16 after the alignment film forming process S2. In the case where the alignment film 16 is an inorganic alignment film formed by oblique vapor deposition, the forming process of the alignment film 16 may be performed in the element substrate forming process S1.

On the other hand, for the counter substrate 20, after performing the counter substrate forming step S11 for forming the common electrode 21 and the like, the alignment film forming step for forming the alignment film 26 by oblique deposition, printing, spin coating, or the like. S12 is performed. When the alignment film 26 is made of a polyimide film, the alignment film forming step S1
2, a rubbing process is performed on the alignment film 26. When the alignment film 26 is an inorganic alignment film formed by oblique vapor deposition, the alignment film 26 is formed in a counter substrate forming process S11.
It may be performed in

Next, a bonding step S20 for bonding the element substrate 10 and the counter substrate 20 is performed. For this, first, a sealing material / inter-substrate conducting material application step S3 for applying the sealing material 107 and the inter-substrate conducting material 109 to the element substrate 10 is performed. The sealing material 107 is applied from the nozzle to the sealing material 10.
7 is discharged, the nozzle and the element substrate 10 are moved relative to each other, and the sealing material 107 is drawn in a rectangular frame shape. The inter-substrate conducting material 109 is applied by moving the nozzle and the element substrate 10 while discharging the inter-substrate conducting material 109 from the nozzle so that the inter-substrate conducting material 109 is dotted on the inter-substrate conducting electrode portion 8t. Deploy. The application of the sealing material 107 and the inter-substrate conducting material 109 is
You may go to the counter substrate 20 side. Next, the element substrate 10 and the counter substrate 20 are overlapped with the sealing material 107 and the inter-substrate conductive material 109 interposed therebetween. Next, the gap between the element substrate 10 and the counter substrate 20 is narrowed until the gap between the element substrate 10 and the counter substrate 20 is pressed and the gap material 107a of the sealant 107 is brought into contact with both the element substrate 10 and the counter substrate 20. After that,
A sealing material curing step S22 is performed. In the sealing material curing step S22, the sealing material 107 is cured by irradiating UV light or the like from the counter substrate 20 side.

Thereafter, a panel cutting step S23 for cutting a panel obtained by bonding the large element substrate 10 and the large counter substrate 20 into a single product size is performed, and then a liquid crystal sealing step S24 is performed. In the liquid crystal sealing step S24, the liquid crystal is supplied to the interrupted portion of the sealing material 107 in a reduced pressure atmosphere, and then the reduced pressure state is released. As a result, liquid crystal is injected inside the sealing material 107, and the liquid crystal panel 100p is completed. After the liquid crystal injection is completed, the interrupted portion of the sealing material 107 is sealed with a sealing material 107c (see FIG. 2A). As a result, the liquid crystal panel 100p is completed. In some cases, after the single-size counter substrate 20 is bonded to the large element substrate 10, liquid crystal is injected, and then the panel cutting step S23 is performed. Further, after the sealing material 107 is formed on the element substrate 10, liquid crystal is dropped inside the sealing material 107, and then the sealing material 10.
7 may be cured after the element substrate 10 and the counter substrate 20 are overlapped. In the case of such a method, it is not necessary to provide an interrupted portion or the sealing material 105 for the sealing material 107.

(Detailed description of inspection process S10)
FIG. 6 is an explanatory diagram of the element substrate inspection apparatus (element substrate inspection apparatus for electro-optical device) according to Embodiment 1 of the present invention. In the present embodiment, in manufacturing the liquid crystal device 100 by the process with reference to FIG. 5, after the element substrate forming process S <b> 1, in the inspection process S <b> 10, the element substrate inspection apparatus 300 shown in FIG. Conduct a physical inspection. More specifically, in the inspection step S <b> 10, the terminal 102 is energized to perform electrical inspections such as cutting and short-circuiting of the wiring and characteristics of the pixel transistor 30.

In this embodiment, the element substrate inspection apparatus 300 includes a substrate holder 310 that holds the large element substrate 10, an inspection terminal 320 that contacts the terminal 102 of the element substrate 10 held by the substrate holder 310, and an inspection terminal 320. And a drive mechanism 330 for switching the relative position between the element substrate 10 and the element substrate 10. In this embodiment, the substrate holder 310 is a stage provided with a vacuum chuck mechanism, and the drive mechanism 330 is configured so that at least one of the substrate holder 310 and the inspection terminal 320 is at an angle of 90 ° with respect to the X direction and the X direction. Are driven in the Y direction intersecting with the Z direction and the Z direction intersecting at an angle of 90 ° with respect to the X direction and the Y direction to switch the relative position between the inspection terminal 320 and the element substrate 10. The inspection terminal 320 is provided on the probe card and is electrically connected to the inspection circuit 340. A plurality of inspection terminals 320 are provided corresponding to the number of terminals 102. In addition, the inspection terminals 320 are provided in such a number that, for example, four single-size element substrates 10 can be simultaneously inspected so that a plurality of single-size element substrates 10 can be simultaneously inspected.

Further, the element substrate inspection apparatus 300 according to the present embodiment has one surface 10 s (terminal 102) of the element substrate 10.
Airflow discharge device 350 that blows airflow S from an oblique direction (a direction inclined obliquely to the normal direction) toward the surface on which the airflow is formed, and a suction device that performs suction on the downstream side of airflow S 36
0. In this embodiment, the airflow discharge device 350 blows an airflow S such as dry air from the angle position of about 20 ° to the element substrate 10 toward the tip of the inspection terminal 320. The suction device 360 is provided on the opposite side of the inspection terminal 320 from the side where the airflow ejection device 350 is located, and the suction port 361 of the suction device 360 has an angle of about 30 ° with respect to the element substrate 10. It is directed to the tip of the inspection terminal 320 in a tilted state. For this reason, the airflow S blown from the blowout port 351 of the airflow discharge device 350 is blown toward the distal end portion of the inspection terminal 320 in contact with the terminal 102 and then sucked by the suction port 361 of the suction device 360.

In this embodiment, the suction port 361 is larger in size than the blowout port 351. Although not shown, more specifically, the area of the opened suction port is larger than the area of the opened blowout port, and further, the direction intersecting the direction in which the airflow S flows on the element substrate 10. The width of the suction port corresponding to (one direction) is preferably larger than the width of the blowout port. The width of the suction port and the width of the blowout port are set to a plurality of terminals 10 in the element substrate 10.
2 is set to be larger than the width in the one direction of the region where 2 is disposed or the width in the one direction of the region where the inspection terminal 320 is disposed. In this embodiment,
Since the terminals 102 are arranged in the X direction, the air flow discharge device 350 and the suction device 360 are arranged in a direction intersecting the arrangement direction in a plan view. In this embodiment, the terminal 10
The airflow discharge device 350 and the suction device 360 are arranged in the Y direction that forms an angle of 90 ° with respect to the X direction in which the two are arranged.

When performing an inspection in such an element substrate inspection apparatus 300, the air stream S is blown from an oblique direction toward the one surface 10 s of the element substrate 10 from the outlet 351 of the air current discharge apparatus 350, and the air stream S is The inspection terminal 320 is brought into contact with the terminal 102 of the element substrate 10 while performing the inspection while sucking the airflow S through the suction port 361 of the discharge device 350. Therefore, even if foreign matter P such as metal powder is generated when the inspection terminal 320 and the terminal 102 are in contact with each other, the foreign matter P is separated from the element substrate 10 and the inspection terminal 320 by the airflow S, and the airflow discharge device 350 Are sucked into the suction port 361 together with the airflow S.

(Main effects of this form)
As described above, the manufacturing method of the liquid crystal device 100 of this embodiment (the inspection method of the element substrate 10)
In the element substrate inspection apparatus 300, when the element substrate 10 is inspected, the airflow S is blown from the oblique direction toward the one surface 10s where the terminal 102 is formed on the element substrate 10, and the airflow S is downstream of the airflow S. Then, the inspection terminal 320 is brought into contact with the terminal 102 and the element substrate 10 is electrically inspected. At that time, since the airflow S is blown from an oblique direction, a sufficient wind pressure is applied to the one surface 10 s of the element substrate 10. For this reason, even if a foreign matter P such as metal powder is generated when the inspection terminal 320 and the terminal 102 are in contact with each other, the foreign matter P is reliably separated from the element substrate 10 and the inspection terminal 320 by the air flow S and sucked. The Therefore, it is possible to surely prevent the occurrence of defects due to the foreign matter P reattaching to the element substrate 10 and to reliably prevent the occurrence of inspection defects due to the foreign matter P adhering to the inspection terminal 320. can do.

In this embodiment, since the air flow discharge device 350 and the suction device 360 are arranged in the Y direction orthogonal to the X direction in which the terminals 102 are arranged, the element substrate 10 and the inspection terminal 32 are arranged.
In 0, the airflow S is blown from the Y direction orthogonal to the X direction in which the terminals 102 are arranged in plan view. For this reason, the airflow S is reliably blown toward each of the plurality of terminals 102. Therefore, even if the foreign matter P is generated when the inspection terminal 320 and the terminal 102 are in contact, the foreign matter P
Is surely separated from the element substrate 10 and the inspection terminal 320 by the air flow S and sucked. Therefore, it is possible to reliably prevent the occurrence of defects caused by the foreign matter P re-adhering to the element substrate 10 and to ensure the occurrence of inspection defects due to the foreign matter P adhering to the inspection terminal 320. Can be prevented.

The suction of the air current S is performed by a suction port 361 having a size larger than that of the air outlet 351 that blows out the air current S. For this reason, even if the airflow S blown from the blowout port 351 diffuses, it can be reliably sucked.

[Embodiment 2]
FIG. 7 is an explanatory diagram of an element substrate inspection apparatus (element substrate inspection apparatus for an electro-optical device) according to Embodiment 2 of the present invention. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

Also in the present embodiment, as in the first embodiment, after the element substrate forming step S1, in the inspection step S10, the element substrate inspection apparatus 300 shown in FIG. In this embodiment, as in the first embodiment, the element substrate inspection apparatus 300 is inspected to contact the substrate holder 310 that holds the large element substrate 10 and the terminal 102 of the element substrate 10 that is held by the substrate holder 310. It has the terminal 320 and the drive mechanism 330 which switches the relative position of the inspection terminal 320 and the element substrate 10. Similarly to the first embodiment, the element substrate inspection apparatus 300 of the present embodiment also blows the airflow S from an oblique direction toward the one surface 10s of the element substrate 10 (the surface on which the terminals 102 and the like are formed). It has a discharge device 350 and a suction device 360 that performs suction on the downstream side of the airflow S. The suction port 361 is larger in size than the blowout port 351. Also in this embodiment, as in Embodiment 1, X in which terminals 102 are arranged
The air flow discharge device 350 and the suction device 36 in the Y direction forming an angle of 90 ° with respect to the direction in plan view.
0 is arranged.

Here, the suction device 360 includes an airflow discharge mechanism 365 that blows out the airflow S, and the airflow discharge device 350 includes a suction mechanism 355 that sucks the airflow S. Therefore, the airflow discharge device 35
0 and the suction device 360 can alternately perform blowing and suction of the airflow S. Therefore, in this embodiment, as indicated by an arrow C in FIG. 7, while the inspection terminal 320 is in contact with the terminal 102 or while the inspection terminal 320 is moving, the blowing direction and the suction direction of the airflow S are changed. Invert. The suction port 356 of the suction mechanism 355 provided in the airflow discharge device 350 is larger in size than the blowout port 366 of the airflow discharge mechanism 365 provided in the suction device 360.

When the inspection is performed in the element substrate inspection apparatus 300 configured as described above, the airflow S is blown from the oblique direction toward the one surface 10 s of the element substrate 10 from the air outlet 351 of the airflow discharge apparatus 350 as in the first embodiment. At the same time, on the downstream side of the airflow S, the airflow discharge device 35.
The inspection terminal 320 is connected to the terminal 102 of the element substrate 10 while sucking the airflow through the zero suction port 361.
The test is carried out by touching. For this reason, even if the foreign matter P is generated when the inspection terminal 320 and the terminal 102 are brought into contact with each other, the foreign matter P is surely separated from the element substrate 10 and the inspection terminal 320 by the air flow S and sucked. The same effects as in the first embodiment are obtained.

In the present embodiment, the direction in which the air current S is blown and the suction direction are reversed while the inspection terminal 320 is in contact with the terminal 102 or while the inspection terminal 320 is moving. For this reason, even if the foreign matter P is located on either side of the inspection terminal 320 when the inspection terminal 320 and the terminal 102 are in contact with each other, the foreign matter P is surely secured from the element substrate 10 and the inspection terminal 320 by the airflow S. Can be withdrawn. For this reason, it is possible to reliably prevent the occurrence of problems caused by the foreign matter P re-adhering to the element substrate 10, and the foreign matter P is in contact with the inspection terminal 3.
Thus, it is possible to reliably prevent the occurrence of inspection defects due to the adhesion to 20.

[Embodiment 3]
FIG. 8 is an explanatory diagram of an element substrate inspection apparatus (element substrate inspection apparatus for an electro-optical device) according to Embodiment 3 of the present invention. Since the basic configuration of this embodiment is the same as that of Embodiment 1, common portions are denoted by the same reference numerals and description thereof is omitted.

Also in the present embodiment, as in the first embodiment, after the element substrate forming step S1, in the inspection step S10, the element substrate inspection apparatus 300 shown in FIG. In this embodiment, as in the first embodiment, the element substrate inspection apparatus 300 is inspected to contact the substrate holder 310 that holds the large element substrate 10 and the terminal 102 of the element substrate 10 that is held by the substrate holder 310. It has the terminal 320 and the drive mechanism 330 which switches the relative position of the inspection terminal 320 and the element substrate 10. Similarly to the first embodiment, the element substrate inspection apparatus 300 of the present embodiment also blows the airflow S from an oblique direction toward the one surface 10s of the element substrate 10 (the surface on which the terminals 102 and the like are formed). It has a discharge device 350 and a suction device 360 that performs suction on the downstream side of the airflow S. The suction port 361 is larger in size than the blowout port 351. Also in this embodiment, as in Embodiment 1, X in which terminals 102 are arranged
The airflow discharge device 350 and the suction device 36 are indicated by an arrow Y that forms an angle of 90 ° in plan view with respect to the direction.
0 is arranged.

Here, the substrate holder 310 is a vacuum chuck mechanism, and at least one of the substrate holder 310 and the inspection terminal 320 is connected to the X direction, the Y direction that intersects the X direction at an angle of 90 °, the X direction, and Driving in the Z direction orthogonal to the X direction switches the relative position between the inspection terminal 320 and the element substrate 10.

The substrate holder 310 holds the element substrate 10 with one surface 10 s on which the terminals 102 and the like are formed on the element substrate 10 facing downward. For this reason, the airflow ejection device 350 and the airflow ejection device 350 are disposed obliquely upward.

When the inspection is performed in the element substrate inspection apparatus 300 configured as described above, the airflow S is blown from the oblique direction toward the one surface 10 s of the element substrate 10 from the air outlet 351 of the airflow discharge apparatus 350 as in the first embodiment. At the same time, on the downstream side of the airflow S, the airflow discharge device 35.
The inspection terminal 320 is connected to the terminal 102 of the element substrate 10 while sucking the airflow through the zero suction port 361.
The test is carried out by touching. For this reason, even if the foreign matter P is generated when the inspection terminal 320 and the terminal 102 are brought into contact with each other, the foreign matter P is surely separated from the element substrate 10 and the inspection terminal 320 by the air flow S and sucked. The same effects as in the first embodiment are obtained.

In the present embodiment, the element substrate 10 has one surface 10 on which the terminals 102 and the like are formed.
s is downward. For this reason, the foreign matter P generated when the inspection terminal 320 and the terminal 102 come into contact with each other is separated from the element substrate 10 and the inspection terminal 320 by the airflow S and sucked, and the element substrate 10 and the inspection are also caused by its own weight. Detach from terminal 320. For this reason, it is possible to surely prevent the occurrence of defects due to the reattachment of the foreign matter P to the element substrate 10, and to ensure the occurrence of inspection defects due to the foreign matter P adhering to the inspection terminal 320. Can be prevented.

[Other embodiments]
In the above embodiment, the airflow discharge device 350 and the suction device 360 are arranged in the Y direction orthogonal to the X direction in which the terminals 102 are arranged. For example, the Y direction may not be orthogonal. In this case, the intersecting direction depends on the formation pitch of the terminals 102, but preferably forms an angle of 60 ° or more with respect to the X direction in which the terminals 102 are arranged.

In the above embodiment, the liquid crystal device 100 is exemplified, but the present invention may be applied when inspecting an element substrate of an electro-optical device such as an organic electroluminescence device.

[Example of mounting on electronic devices]
An electronic apparatus including the liquid crystal device 100 according to the above-described embodiment will be described. FIG.
It is a schematic block diagram of the projection type display apparatus using the liquid crystal device 100 to which the present invention is applied, and FIG.
) And (b) are respectively an explanatory diagram of a projection display device using a transmissive liquid crystal device 100 and an explanatory diagram of a projection display device using a reflective liquid crystal device 100.

(First example of projection display device)
The projection display device 110 shown in FIG. 9A is a so-called projection type projection display device that irradiates light onto a screen 111 provided on the viewer side and observes the light reflected by the screen 111. . The projection display device 110 includes a light source unit 130 including a light source 112, dichroic mirrors 113 and 114, liquid crystal light valves 115 to 117 (liquid crystal device 100), a projection optical system 118, a cross dichroic prism 119, and a relay. System 120.

The light source 112 is composed of an ultrahigh pressure mercury lamp that supplies light including red light, green light, and blue light. The dichroic mirror 113 is configured to transmit red light from the light source 112 and reflect green light and blue light. The dichroic mirror 114 is configured to transmit blue light and reflect green light among the green light and the blue light reflected by the dichroic mirror 113. Thus, the dichroic mirror 113,
A color separation optical system 114 separates light emitted from the light source 112 into red light, green light, and blue light.

Here, the integrator 12 is interposed between the dichroic mirror 113 and the light source 112.
1 and the polarization conversion element 122 are arranged in order from the light source 112. Integrator 12
1 is configured to make the illuminance distribution of the light emitted from the light source 112 uniform. Further, the polarization conversion element 122 is configured to change the light from the light source 112 into polarized light having a specific vibration direction such as s-polarized light.

The liquid crystal light valve 115 is transmitted through the dichroic mirror 113 and reflected by the reflection mirror 123.
This is a transmissive liquid crystal device 100 that modulates red light reflected by the light according to an image signal. The liquid crystal light valve 115 includes a λ / 2 phase difference plate 115a, a first polarizing plate 115b, and a liquid crystal panel 115c.
And a second polarizing plate 115d. Here, the red light incident on the liquid crystal light valve 115 remains s-polarized light because the polarization of the light does not change even if it passes through the dichroic mirror 113.

The λ / 2 phase difference plate 115a is an optical element that converts s-polarized light incident on the liquid crystal light valve 115 into p-polarized light. The first polarizing plate 115b is a polarizing plate that blocks s-polarized light and transmits p-polarized light. The liquid crystal panel 115c is configured to convert p-polarized light into s-polarized light (circularly polarized light or elliptically polarized light in the case of halftone) by modulation according to the image signal. further,
The second polarizing plate 115d is a polarizing plate that blocks p-polarized light and transmits s-polarized light. Therefore, the liquid crystal light valve 115 is configured to modulate the red light in accordance with the image signal and to emit the modulated red light toward the cross dichroic prism 119.

Note that the λ / 2 phase difference plate 115a and the first polarizing plate 115b are disposed in contact with a light-transmitting glass plate 115e that does not convert polarized light, and the λ / 2 phase difference plate 115a and the first polarizing plate 115b. It is possible to avoid distortion of 115b due to heat generation.

The liquid crystal light valve 116 is a transmissive liquid crystal device 100 that modulates green light reflected by the dichroic mirror 114 after being reflected by the dichroic mirror 113 in accordance with an image signal. Similarly to the liquid crystal light valve 115, the liquid crystal light valve 116 includes a first polarizing plate 116b, a liquid crystal panel 116c, and a second polarizing plate 116d. Green light incident on the liquid crystal light valve 116 is s-polarized light that is reflected by the dichroic mirrors 113 and 114 and then incident. The first polarizing plate 116b is a polarizing plate that blocks p-polarized light and transmits s-polarized light. The liquid crystal panel 116c is configured to convert s-polarized light into p-polarized light (circularly polarized light or elliptically polarized light in the case of halftone) by modulation according to the image signal. And the 2nd polarizing plate 1
Reference numeral 16d denotes a polarizing plate that blocks s-polarized light and transmits p-polarized light. Accordingly, the liquid crystal light valve 116 is configured to modulate green light in accordance with the image signal and to emit the modulated green light toward the cross dichroic prism 119.

The liquid crystal light valve 117 is a transmissive liquid crystal device 100 that modulates blue light reflected by the dichroic mirror 113 and transmitted through the dichroic mirror 114 and then through the relay system 120 in accordance with an image signal. The liquid crystal light valve 117 is connected to the liquid crystal light valve 11.
5 and 116, the λ / 2 phase difference plate 117a, the first polarizing plate 117b, and the liquid crystal panel 117.
c and a second polarizing plate 117d. Here, since the blue light incident on the liquid crystal light valve 117 is reflected by the two reflecting mirrors 125a and 125b described later of the relay system 120 after being reflected by the dichroic mirror 113 and transmitted through the dichroic mirror 114, the s-polarized light is reflected. It has become.

The λ / 2 phase difference plate 117a is an optical element that converts s-polarized light incident on the liquid crystal light valve 117 into p-polarized light. The first polarizing plate 117b is a polarizing plate that blocks s-polarized light and transmits p-polarized light. The liquid crystal panel 117c is configured to convert p-polarized light into s-polarized light (circularly polarized light or elliptically polarized light in the case of halftone) by modulation according to the image signal. further,
The second polarizing plate 117d is a polarizing plate that blocks p-polarized light and transmits s-polarized light. Accordingly, the liquid crystal light valve 117 is configured to modulate blue light in accordance with an image signal and to emit the modulated blue light toward the cross dichroic prism 119. The λ / 2 phase difference plate 117a and the first polarizing plate 117b are disposed in contact with the glass plate 117e.

The relay system 120 includes relay lenses 124a and 124b and reflection mirrors 125a and 125b.
And. The relay lenses 124a and 124b are provided to prevent light loss due to a long blue light path. Here, the relay lens 124a is disposed between the dichroic mirror 114 and the reflection mirror 125a. The relay lens 12
4b is disposed between the reflection mirrors 125a and 125b. The reflection mirror 125a is
The blue light transmitted through the dichroic mirror 114 and emitted from the relay lens 124a is arranged to be reflected toward the relay lens 124b. The reflection mirror 125b is arranged to reflect the blue light emitted from the relay lens 124b toward the liquid crystal light valve 117.

The cross dichroic prism 119 includes two dichroic films 119a and 119b.
Is a color synthesizing optical system in which X is orthogonally arranged in an X shape. The dichroic film 119a is a film that reflects blue light and transmits green light, and the dichroic film 119b is a film that reflects red light and transmits green light. Therefore, the cross dichroic prism 119 is configured to combine the red light, the green light, and the blue light modulated by the liquid crystal light valves 115 to 117 and emit the resultant light toward the projection optical system 118.

The light that enters the cross dichroic prism 119 from the liquid crystal light valves 115 and 117 is s-polarized light, and the cross dichroic prism 1 from the liquid crystal light valve 116.
The light incident on 19 is p-polarized light. Thus, by making the light incident on the cross dichroic prism 119 different types of polarized light, the light incident from the liquid crystal light valves 115 to 117 in the cross dichroic prism 119 can be effectively combined. here,
In general, the dichroic films 119a and 119b are excellent in the reflection characteristics of s-polarized light. For this reason, red light and blue light reflected by the dichroic films 119a and 119b are s-polarized light,
Green light transmitted through the dichroic films 119a and 119b is p-polarized light. The projection optical system 118 has a projection lens (not shown) and is configured to project the light combined by the cross dichroic prism 119 onto the screen 111.

(Second example of projection display device)
A projection display device 1000 shown in FIG. 9B includes a light source unit 1021 that generates light source light, and a color separation light guide optical that separates the light source light emitted from the light source unit 1021 into three colors of red, green, and blue. Series 10
And a light modulation unit 1025 illuminated by the light source light of each color emitted from the color separation light guide optical system 1023. In addition, the projection display apparatus 1000 includes a cross dichroic prism 1027 (combining optical system) that combines image light of each color emitted from the light modulation unit 1025.
And a projection optical system 1029 that is a projection optical system for projecting the image light that has passed through the cross dichroic prism 1027 onto a screen (not shown).

In the projection display apparatus 1000, the light source unit 1021 includes a light source 1021a, a pair of fly-eye optical systems 1021d and 1021e, a polarization conversion member 1021g, and a superimposing lens 1021i. In the present embodiment, the light source unit 1021 includes a reflector 1021f having a paraboloid and emits parallel light. Fly's eye optical system 1021d, 10
21e is composed of a plurality of element lenses arranged in a matrix in a plane perpendicular to the system optical axis, and the light source light is divided by these element lenses to be individually condensed and diverged. The polarization conversion member 1021g converts the light source light emitted from the fly-eye optical system 1021e into, for example, only a p-polarized component parallel to the drawing, and supplies it to the optical path downstream optical system. Superimposing lens 1021i
The light source light that has passed through the polarization conversion member 1021g is appropriately converged as a whole, so that the plurality of liquid crystal devices 100 provided in the light modulation unit 1025 can be uniformly superimposed and illuminated.

The color separation light guide optical system 1023 includes a cross dichroic mirror 1023a, a dichroic mirror 1023b, and reflection mirrors 1023j and 1023k. In the color separation light guide optical system 1023, the substantially white light source light from the light source unit 1021 enters the cross dichroic mirror 1023a. The red (R) light reflected by one of the first dichroic mirrors 1031a constituting the cross dichroic mirror 1023a
3j is reflected through the dichroic mirror 1023b and incident side polarizing plate 1037r,
The light is incident on the red (R) liquid crystal device 100 as p-polarized light through the wire grid polarizer 1032r that transmits p-polarized light and reflects s-polarized light and the optical compensation plate 1039r.

Further, the green (G) light reflected by the first dichroic mirror 1031a is reflected by the reflecting mirror 1023j, and then also reflected by the dichroic mirror 1023b to transmit the incident-side polarizing plate 1037g and p-polarized light, and s-polarized light. Wire grid polarizer 1 that reflects light
Through 032g and the optical compensation plate 1039g, the light is incident on the liquid crystal device 100 for green (G) as p-polarized light.

On the other hand, the blue (B) light reflected by the other second dichroic mirror 1031b constituting the cross dichroic mirror 1023a is reflected by the reflection mirror 1023k and transmits the incident side polarizing plate 1037b and the p-polarized light. On the other hand, the light is incident on the blue (B) liquid crystal device 100 as p-polarized light through the wire grid polarizing plate 1032b that reflects s-polarized light and the optical compensation plate 1039b.

Note that the optical compensation plates 1039r, 1039g, and 1039b optically compensate the characteristics of the liquid crystal layer by adjusting the polarization states of the incident light and the emitted light to the liquid crystal device 100.

In the projection display apparatus 1000 configured as described above, the optical compensation plates 1039r and 1039g
Each of the three colors of light incident through 1039b is modulated in each liquid crystal device 100. At that time, of the modulated light emitted from the liquid crystal device 100, the s-polarized component light is reflected by the wire grid polarizing plates 1032r, 1032g, and 1032b, and the outgoing side polarizing plates 1038r, 1038b,
The light enters the cross dichroic prism 1027 through 38g and 1038b. The cross dichroic prism 1027 is formed with a first dielectric multilayer film 1027a and a second dielectric multilayer film 1027b that intersect in an X shape, and one of the first dielectric multilayer films 1027a is formed.
Reflects R light, and the other second dielectric multilayer film 1027b reflects B light. Therefore, the three colors of light are combined by the cross dichroic prism 1027 and emitted to the projection optical system 1029. The projection optical system 1029 projects the color image light synthesized by the cross dichroic prism 1027 on a screen (not shown) at a desired magnification.

(Other projection display devices)
In addition, about a projection type display apparatus, you may comprise the LED light source etc. which radiate | emit the light of each color as a light source part, and supply each color light radiate | emitted from this LED light source to another liquid crystal device. .

(Other electronic devices)
The liquid crystal device 100 to which the present invention is applied includes a mobile phone,
You may use as a direct-view type display apparatus in electronic devices, such as an information portable terminal (PDA: Personal Digital Assistants), a digital camera, a liquid crystal television, a car navigation apparatus, a videophone, a POS terminal, and a device provided with a touch panel.

9a..Pixel electrode, 30..Pixel transistor, 50..Liquid crystal layer, 102..Terminal, 1
00 ... Liquid crystal device, 110, 1000 ... Projection type display device, 300 ... Element substrate inspection device, 310 ... Substrate holder, 320 ... Inspection terminal, 330 ... Drive mechanism, 350 ... Airflow discharge device, 351, 366... Air outlet 355... Suction mechanism 360... Suction device 3
61, 356 .... Suction port, 365 .... Airflow discharge mechanism

Claims (10)

An element substrate forming step of forming at least a pixel transistor and a terminal on one surface of an element substrate for an electro-optical device;
An air current is blown in an oblique direction toward the one surface of the element substrate, and an electrical inspection of the element substrate is performed by bringing an inspection terminal into contact with the terminal while sucking the air flow downstream of the air flow. An inspection process to be performed;
A bonding step of attaching a counter substrate to the one surface side of the element substrate on which the inspection step has been performed;
A method for manufacturing an electro-optical device. In the element substrate, a plurality of the terminals are arranged in one direction,
2. The method of manufacturing an electro-optical device according to claim 1, wherein the air current is blown onto the element substrate from a direction intersecting the one direction in a plan view. The method of manufacturing an electro-optical device according to claim 1, wherein the suction of the airflow is performed by a suction port having a size larger than that of the blowout port that blows out the airflow. 4. The electro-optical device according to claim 1, wherein the inspection is performed while reversing a direction in which the airflow is blown against the element substrate and a direction in which the airflow is sucked. 5. Production method. 5. The method of manufacturing an electro-optical device according to claim 1, wherein the inspection is performed with the one surface facing downward. 6. A substrate holder for holding an element substrate for an electro-optical device in which at least a pixel transistor and a terminal are formed on one side;
An inspection terminal that comes into contact with the terminal of the element substrate held by the substrate holder;
A drive mechanism for switching a relative position between the inspection terminal and the element substrate;
An airflow discharge device that blows an airflow from an oblique direction toward the one surface of the element substrate;
A suction device for performing suction on the downstream side of the airflow;
An element substrate inspection apparatus for an electro-optical device, comprising: In the element substrate, a plurality of the terminals are arranged in one direction,
The element substrate inspection apparatus for an electro-optical device according to claim 6, wherein the airflow is blown from a direction intersecting the one direction in a plan view. 8. The element substrate inspection apparatus for an electro-optical device according to claim 6, wherein the suction port for sucking the airflow in the suction device is larger in size than the blowout port for blowing the airflow in the airflow ejection device. The suction device includes an airflow discharge mechanism that blows out the airflow,
The airflow discharge device includes a suction mechanism for sucking the airflow,
9. The element substrate inspection apparatus for an electro-optical device according to claim 6, wherein the air flow discharge device and the suction device alternately perform the blowing of the air flow and the suction. 10. 10. The element substrate inspection apparatus for an electro-optical device according to claim 6, wherein the substrate holder holds the element substrate with the one surface side facing downward.

Images