JP2013080041A - Electro-optic device, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electro-optic device that reliably photo-cures a seal member without largely increasing wiring resistance of a power line even in the case where the power line and the seal member are provided in an area held by an edge of an element substrate and an edge of an image display area; and an electronic apparatus.SOLUTION: An electro-optic device 100 includes a signal line 11 and a power line 16 that are provided in an area held by a side 10f of an element substrate 10 and an edge of an image display area 10a; and the power line 16 has a wide wiring width dimension, and is provided between an inner edge 81 of a seal member 80 and the edge of the image display area 10a. Openings 17a and 18a for transmitting light are provided respectively to intersections 17c and 18c where the power line 16 intersects with the seal member 80. The openings 17a and 18a each has a slit shape extending in the extension direction of the power line 16, and has a linear dimension smaller than the width dimension of the seal member 80.

Description

  The present invention relates to an electro-optical device in which an element substrate and a counter substrate are bonded together with a photocurable sealing material, and an electronic apparatus including the electro-optical device.

  Electro-optical devices such as liquid crystal devices are widely adopted as light valves for projection display devices and direct-view display devices. Among such electro-optical devices, for example, in a liquid crystal device, a translucent element substrate provided with a pixel electrode and a translucent counter substrate provided with a common electrode facing the pixel electrode are included in an image display region. A liquid crystal layer is provided in a region which is bonded to the outside by a sealing material and surrounded by the sealing material. When manufacturing a liquid crystal device having such a configuration, a photocurable sealing material is applied to the outside of the image display region on the element substrate or the counter substrate, and then light is applied to the sealing material from the element substrate side. The sealing material is cured by irradiating the sealing material with light from the side. At that time, if the wiring is present at a high density in a region overlapping with the sealing material, the irradiation of light to the sealing material is hindered, so that the sealing material cannot be sufficiently cured.

  On the other hand, a configuration has been proposed in which a power supply line for supplying a power supply potential to the drive circuit and a signal line for supplying a signal to the drive circuit are provided inside the inner edge of the sealing material (see Patent Document 1).

  Further, there has been proposed a configuration in which a slit-like opening extending in the extending direction of the sealing material is provided in a common potential line (common potential supply wiring / light-shielding body) overlapping the sealing material (see Patent Document 2).

JP 2006-171385 A JP 2002-311439 A

  However, even when the power supply line and the signal line are provided inside the inner edge of the sealing material as in the configuration described in Patent Document 1, the power supply line and the signal line intersect with the sealing material. When the sealing material is irradiated with light from the substrate side, the light is blocked. Here, since the signal line has a narrow wiring width dimension, it does not hinder the curing of the sealing material, but the power line has a large wiring width dimension, which hinders the curing of the sealing material.

  On the other hand, Patent Document 2 describes a configuration in which a slit-like opening is provided in the common potential line to transmit light, but the common potential line disclosed therein is wider than the width of the sealing material. For this reason, the increase in wiring resistance does not become a problem at the position where the opening is formed only in the region overlapping the sealing material in the width direction of the common potential line. Therefore, as in the configuration described in Patent Document 1, it is difficult to apply the configuration described in Patent Document 2 to a power supply line having a large restriction on the wiring width dimension because it is provided inside the sealing material. .

  In view of the above problems, an object of the present invention is to reduce the wiring resistance of the power supply line even when the power supply line and the sealing material are provided in the region sandwiched between the end portion of the element substrate and the end portion of the image display region. It is an object of the present invention to provide an electro-optical device capable of reliably photocuring a sealing material without greatly increasing, and an electronic apparatus including the electro-optical device.

  In order to solve the above-described problem, an electro-optical device according to the present invention includes a light-transmitting element substrate in which a plurality of pixel electrodes are arranged on one surface side, and an opposing arrangement on the one surface side of the element substrate. A translucent counter substrate, and a photocurable sealing material that is provided so as to surround the image display region in which the plurality of pixel electrodes are arranged and that bonds the counter substrate and the element substrate. The element substrate has an inner edge of the sealing material and an end portion of the image display area from a region sandwiched between the driving circuit, an outer edge of the sealing material, and an end portion of the element substrate on the one surface side. A power supply line extending in a region sandwiched between the power supply lines to supply a power supply potential to the drive circuit, and an opening is provided at an intersection of the power supply line and the sealing material. It is characterized by.

  In the present invention, in the element substrate, the power supply line extends from the region sandwiched between the outer edge of the sealing material and the end of the element substrate to the region sandwiched between the inner edge of the sealing material and the end of the image display region. Therefore, the power line does not overlap with the sealing material except at the intersection with the sealing material. For this reason, when the sealing material is irradiated with light from the element substrate side, sufficient light reaches the sealing material except at a portion that intersects the power supply line, so that the sealing material is appropriately photocured. Further, since the power supply line does not overlap with the sealing material except at the intersection with the sealing material, the wiring width dimension of the power supply line need not be narrowed. Therefore, the wiring resistance of the power supply line is low. In addition, since an opening is formed at the intersection of the power line with the sealing material, when the sealing material is irradiated with light from the element substrate side, the light irradiated to the intersecting portion is transmitted through the opening. Therefore, the sealing material is surely cured even at the intersection. Further, since the opening may be provided in a narrow region called an intersection, the wiring resistance of the power supply line does not increase greatly.

  According to another aspect of the electro-optical device of the present invention, a translucent element substrate in which a plurality of pixel electrodes are arranged on one side and a translucency arranged to face the one side of the element substrate. And a photo-curable sealing material that is provided so as to surround an image display region in which the plurality of pixel electrodes are arranged, and bonds the counter substrate and the element substrate. The element substrate includes an electrostatic protection circuit provided in an area sandwiched between an outer edge of the sealing material and an end portion of the element substrate on the one surface side, an inner edge of the sealing material, and an edge of the image display area. A power supply line extending from a region sandwiched between the outer peripheral portion of the sealing material and an end portion of the element substrate to supply a power supply potential to the electrostatic protection circuit. In the intersection of the power line with the sealing material, an opening is provided. And butterflies.

  In the present invention, in the element substrate, the power line extends from the area sandwiched between the inner edge of the sealing material and the edge of the image display area to the area sandwiched between the outer edge of the sealing material and the edge of the element substrate. Therefore, the power line does not overlap with the sealing material except at the intersection with the sealing material. For this reason, when the sealing material is irradiated with light from the element substrate side, sufficient light reaches the sealing material except at a portion that intersects the power supply line, so that the sealing material is appropriately photocured. Further, since the power supply line does not overlap with the sealing material except at the intersection with the sealing material, the wiring width dimension of the power supply line need not be narrowed. Therefore, the wiring resistance of the power supply line is low. In addition, since an opening is formed at the intersection of the power line with the sealing material, when the sealing material is irradiated with light from the element substrate side, the light irradiated to the intersecting portion is transmitted through the opening. Therefore, the sealing material is surely cured even at the intersection. Further, since the opening may be provided in a narrow region called an intersection, the wiring resistance of the power supply line does not increase greatly.

  In this invention, it is preferable that the said opening part is extended in the width direction of the said sealing material. According to such a configuration, the wiring resistance of the power supply line is low as compared with the case where the slit-shaped opening extends in the extending direction of the sealing material.

  In this invention, it is preferable that the both ends of the said opening part exist in the position which overlaps with the said sealing material. According to such a configuration, the length dimension of the slit-shaped opening is smaller than the width dimension of the sealing material, so that the wiring resistance of the power supply line does not increase greatly.

  In the present invention, it is preferable that a wiring density of the power supply lines in the intersecting portion is 40% to 60%. According to such a configuration, when the sealing material is irradiated with light from the element substrate side, the light irradiated to the intersecting portion reaches the sealing material through the opening, so that the sealing material is reliably cured even at the intersecting portion. Further, since the wiring density of the power supply line is not too low, the wiring resistance of the power supply line does not increase greatly.

  In the present invention, it is preferable that the driving circuit is provided in a region sandwiched between an inner edge of the sealing material and an end of the image display region. According to such a configuration, when the sealing material is irradiated with light from the element substrate side, the light is not blocked by the drive circuit. Further, it is not necessary to provide a wiring connecting the drive circuit and the power supply line in a region overlapping with the sealant. Therefore, the sealing material can be appropriately photocured.

  In the present invention, the element substrate has a signal line for supplying a signal to the drive circuit having a portion extending along the seal material in a region overlapping the seal material on the one surface side. preferable. According to such a configuration, the width dimension of the region occupied by the sealing material, the signal line, and the power line outside the image display region, compared to the case where both the signal line and the power source line are provided inside the inner edge of the sealing material. Can be reduced.

  In the present invention, a configuration in which a liquid crystal layer is provided in a region surrounded by the sealing material between the element substrate and the counter substrate can be employed.

  The electro-optical device according to the present invention can be used in electronic devices such as a mobile phone, a mobile computer, and a projection display device. Among these electronic devices, the projection display device includes a light source unit for supplying light to an electro-optical device (liquid crystal device) and a projection optical system that projects light modulated by the electro-optical device. ing.

It is explanatory drawing which shows the electrical structure of the electro-optical apparatus (liquid crystal device) to which this invention is applied. It is explanatory drawing of the liquid crystal panel used for the electro-optical apparatus to which this invention is applied. FIG. 3 is an explanatory diagram showing, in an enlarged manner, signal lines, power supply lines, and the like formed on the element substrate of the electro-optical device according to Embodiment 1 of the invention. FIG. 3 is an explanatory diagram showing an enlarged view of the periphery of an electrostatic protection circuit formed on an element substrate of the electro-optical device according to Embodiment 1 of the invention. FIG. 10 is an explanatory diagram showing, in an enlarged manner, signal lines, power supply lines, and the like formed on an element substrate of an electro-optical device according to Embodiment 2 of the present invention. It is a schematic block diagram of the projection type display apparatus (electronic device) and optical unit to which this invention is applied.

  Hereinafter, a liquid crystal device which is a typical electro-optical device will be described as an embodiment of the present invention. In the drawings to be referred to in the following description, the scales are different for each layer and each member so that each layer and each member have a size that can be recognized on the drawing. In the drawings referred to in the following description, the number of wirings such as scanning lines, data lines, and signal lines is reduced.

[Embodiment 1]
(Overall configuration of electro-optical device)
FIG. 1 is an explanatory diagram showing an electrical configuration of an electro-optical device (liquid crystal device) to which the present invention is applied. FIGS. 1A and 1B are electrical diagrams of the entire electro-optical device to which the present invention is applied. FIG. 2 is a block diagram illustrating a configuration and an equivalent circuit diagram illustrating a configuration of a pixel. In FIG. 1, the sealing material is represented as a one-dot chain line and a gray region.

  An electro-optical device 100 illustrated in FIG. 1 is a liquid crystal device and includes a liquid crystal panel 100p. The liquid crystal panel 100p includes an image display region 10a in which a plurality of pixels 100a are arranged in a matrix in the central region. In the liquid crystal panel 100p, in the element substrate 10 to be described later, a plurality of data lines 6a and a plurality of scanning lines 3a extend vertically and horizontally inside the image display region 10a, and the pixel 100a is located at a position corresponding to the intersection. It is configured. In each of the plurality of pixels 100a, a field effect transistor 30 as a switching element and a pixel electrode 9a are formed. The data line 6 a is electrically connected to the source of the field effect transistor 30, the scanning line 3 a is electrically connected to the gate of the field effect transistor 30, and the pixel electrode is connected to the drain of the field effect transistor 30. 9a is electrically connected. Thus, in each of the plurality of pixels 100a, the field effect transistor 30 and the pixel electrode 9a are provided correspondingly.

  In the element substrate 10, a scanning line driving circuit 60, a data line driving circuit 70, a peripheral circuit 84 such as an inspection circuit and a precharge circuit, an electrostatic protection circuit 85, and the like are provided in a non-display area 10 u outside the image display area 10 a. It is configured. The data line driving circuit 70 is electrically connected to one end of the plurality of data lines 6a, and the peripheral circuit 84 is electrically connected to the other end of the plurality of data lines 6a. The scanning line driving circuit 60 is electrically connected to the plurality of scanning lines 3a. The scanning line driving circuit 60 includes, for example, a shift register 61 and an output circuit 62. The scanning line driving circuit 60 generates a scanning signal based on a clock signal, a clock inversion signal, and a start pulse input to the shift register 61. Sequentially supplied to each of the scanning lines 3a.

  The data line driving circuit 70 includes, for example, a shift register 71 and a sample hold circuit 74, and the sample hold circuit 74 includes a plurality of video signal lines 75, a first latch circuit 72, and a second latch circuit 73. Yes. The data line driving circuit 70 holds the video signal supplied from the video signal line 75 in the first latch circuit 72 at a predetermined timing based on the clock signal, the clock inversion signal, and the start pulse input to the shift register 71. After that, the data is transferred to the second latch circuit 73, and an image signal is output to each of the plurality of data lines 6a based on the latch transfer signal.

  In each pixel 100a, the pixel electrode 9a faces a common electrode formed on a counter substrate, which will be described later, via a liquid crystal layer, and constitutes a liquid crystal capacitor 5a. Each pixel 100a is provided with a holding capacitor 40 in parallel with the liquid crystal capacitor 5a in order to prevent fluctuations in the image signal held in the liquid crystal capacitor 5a. In this embodiment, in order to form the storage capacitor 40, the capacitor line 3b extending in parallel with the scanning line 3a is formed across the plurality of pixels 100a, and the common potential Vcom is applied to the capacitor line 3b. . Note that as the common potential Vcom, the same potential as a common potential applied to a common electrode described later can be used.

(Specific configuration example of the liquid crystal panel 100p)
FIG. 2 is an explanatory diagram of a liquid crystal panel 100p used in the electro-optical device 100 to which the present invention is applied. FIGS. 2A and 2B each show the liquid crystal panel 100p together with each component from the counter substrate side. It is the top view seen, and its HH 'sectional drawing.

  As shown in FIGS. 2A and 2B, in the liquid crystal panel 100p, the element substrate 10 and the counter substrate 20 are bonded to each other with a sealing material 80 through a predetermined gap. It is provided in the shape of a frame along the outer edge. The element substrate 10 and the counter substrate 20 are made of a translucent substrate such as a quartz substrate or a heat-resistant glass substrate.

  The sealing material 80 is an adhesive made of a photocurable resin, and is mixed with a gap material such as glass fiber or glass beads for setting the distance between the two substrates to a predetermined value. Between the element substrate 10 and the counter substrate 20, the liquid crystal layer 5 is held in a region surrounded by the sealing material 80.

  When manufacturing the electro-optical device 100, the element substrate 10 and the counter substrate 20 are overlapped with the seal material 80 interposed therebetween, and then the light is applied to the seal material 80 from the element substrate 10 side. The sealing material 80 is also cured by irradiating the sealing material 80 with light from the substrate 20 side. The sealing material 80 is formed with an injection port 88 formed of a discontinuous portion. After the liquid crystal material is vacuum injected from the injection port 88 into a region surrounded by the sealing material 80, the injection port 88 is sealed with the sealing material 87. By stopping, the liquid crystal layer 5 is held inside the sealing material 80.

  In some cases, the sealing material 80 applied in a frame shape to the element substrate 10 is semi-cured, and then a liquid crystal material is dropped into a region surrounded by the sealing material 80 and then the counter substrate 20 is overlapped. In this case, it is not necessary to provide the injection port 88 in the sealing material 80, and therefore the sealing material 87 is unnecessary. Even when such a method is adopted, the sealing material 80 is irradiated with light from the element substrate 10 side while the element substrate 10 and the counter substrate 20 are stacked with the sealing material 80 interposed therebetween, and the counter substrate 20 The sealing material 80 is also irradiated with light from the side to completely cure the sealing material 80.

  In the liquid crystal panel 100p of this embodiment, the element substrate 10 has a quadrangular shape and includes four sides 10e, 10f, 10g, and 10h (end portions). Similarly to the element substrate 10, the counter substrate 20 also includes four sides 20e, 20f, 20g, and 20h (end portions). The image display area 10a described with reference to FIG. 1 is provided as a quadrangular area substantially at the center of the liquid crystal panel 100p, and the end of the image display area 10a and the end of the element substrate 10 (sides 10e, 10f). 10g, 10h) is a rectangular frame-like non-display area 10u. Corresponding to this shape, the sealing material 80 is also provided in a substantially square shape in the non-display area 10u, and a substantially rectangular peripheral area 10b is provided between the inner edge 81 of the sealing material 80 and the end of the image display area 10a. It is provided in a frame shape.

  Of the one surface 10s and the other surface 10t of the element substrate 10, on the one surface 10s side facing the counter substrate 20, the field effect transistor 30 and the field effect transistor described with reference to FIG. Pixel electrodes 9a electrically connected to the transistors 30 are formed in a matrix, and a first alignment film 14 is formed on the upper layer side of the pixel electrodes 9a. In addition, on the one surface 10s side of the element substrate 10, a dummy pixel electrode 9b formed simultaneously with the pixel electrode 9a is formed in the peripheral region 10b. The dummy pixel electrode 9b is configured to be electrically connected to a dummy field effect transistor, configured to be electrically connected directly to a wiring without a dummy field effect transistor, or to be applied with a potential. A configuration that is not in a floating state is adopted. The dummy pixel electrode 9b compresses the height positions of the image display region 10a and the peripheral region 10b when the surface on which the first alignment film 14 is formed in the element substrate 10 is flattened by polishing, and the first alignment film This contributes to making the surface on which 14 is formed flat. Further, if the dummy pixel electrode 9b is set to a predetermined potential, it is possible to prevent the disorder of the alignment of the liquid crystal molecules at the outer peripheral side end of the image display region 10a.

  Here, the element substrate 10 is larger in size than the counter substrate 20. For this reason, the side where the side 10e of the element substrate 10 is located protrudes from the side 20e of the counter substrate 20, and the overhanging area (outside of the image display area 10a / the end of the image display area 10a and the element substrate 10) A data line driving circuit 70 and a plurality of terminals 50 are formed along the side 10e of the element substrate 10 on the one surface 10s side (between the side 10e). Further, on the one surface 10s side of the element substrate 10, a scanning line driving circuit 60 is formed along the other sides 10f and 10h adjacent to the side 10e, and a peripheral circuit is formed along the side 10g of the element substrate 10. 84 is formed. A flexible wiring board (not shown) is connected to the terminal 50, and various potentials and various signals are input to the element substrate 10 through the flexible wiring board.

  A common electrode 21 is formed on the one surface 20 s of the counter substrate 20 on the side of the one surface 20 s facing the element substrate 10, and a second alignment film 24 is formed on the common electrode 21. ing. The common electrode 21 is formed across the plurality of pixels 100a as substantially the entire surface of the counter substrate 20 or a plurality of strip electrodes. In this embodiment, the common electrode 21 is formed on substantially the entire surface of the counter substrate 20.

  A light shielding layer 29 is formed on the lower surface side of the common electrode 21 on the one surface 20 s side of the counter substrate 20. In this embodiment, the light shielding layer 29 is formed in a frame shape extending along the outer peripheral edge of the image display region 10a, and functions as a parting. For this reason, the outer edge of the image display region 10 a is defined by the inner edge of the light shielding layer 29. The outer edge of the light shielding layer 29 is at a position spaced from the inner edge 81 of the sealing material 80, and the light shielding layer 29 and the sealing material 80 do not overlap. In the counter substrate 20, the light shielding layer 29 is also formed as a black matrix portion 29 b in a region overlapping with a region between pixels sandwiched between adjacent pixel electrodes 9 a.

  In the liquid crystal panel 100p configured as described above, the element substrate 10 and the counter substrate 20 are provided at four positions on the one surface 10s side of the element substrate 10 that overlap the four corners of the counter substrate 20 outside the sealing material 80. An inter-substrate conduction electrode 109 is formed for electrical conduction therebetween. The inter-substrate conducting electrode 109 is provided with an inter-substrate conducting material containing conductive particles, and the common electrode 21 of the counter substrate 20 is connected to the element substrate via the inter-substrate conducting material and the inter-substrate conducting electrode 109. It is electrically connected to the 10 side. Therefore, the common potential Vcom is applied to the common electrode 21 from the element substrate 10 side.

  The sealing material 80 is provided along the outer peripheral edge of the counter substrate 20 with substantially the same width dimension. For this reason, the sealing material 80 is substantially rectangular. However, the sealing material 80 is provided so as to pass inside avoiding the inter-substrate conduction electrode 109 in a region overlapping the corner portion of the counter substrate 20, and the corner portion of the sealing material 80 has a substantially arc shape.

  In the electro-optical device 100 having such a configuration, when the pixel electrode 9a and the common electrode 21 are formed of a light-transmitting conductive film such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide), a transmissive liquid crystal device is configured. be able to. On the other hand, when the common electrode 21 is formed of a light-transmitting conductive film such as ITO or IZO and the pixel electrode 9a is formed of a reflective conductive film such as aluminum, a reflective liquid crystal device can be configured. When the electro-optical device 100 is a reflection type, light incident from the counter substrate 20 side is modulated while being reflected and emitted by the substrate on the element substrate 10 side, and an image is displayed. In the case where the electro-optical device 100 is a transmissive type, the light incident from one of the element substrate 10 and the counter substrate 20 is modulated while being transmitted through the other substrate and emitted to display an image. .

  The electro-optical device 100 can be used as a color display device of an electronic device such as a mobile computer or a mobile phone. In this case, a color filter (not shown) and a protective film are formed on the counter substrate 20. In the electro-optical device 100, a retardation film, a polarizing plate, and the like are arranged in a predetermined direction with respect to the liquid crystal panel 100p according to the type of the liquid crystal layer 5 to be used and the normally white mode / normally black mode. Is done. Furthermore, the electro-optical device 100 can be used as a light valve for RGB in a projection display device (liquid crystal projector / electronic device) described later. In this case, each of the RGB electro-optical devices 100 receives light of each color separated through RGB color separation dichroic mirrors as projection light, so that no color filter is formed. .

(Configuration of wiring etc.)
FIG. 3 is an explanatory diagram showing, in an enlarged manner, signal lines, power supply lines, and the like formed on the element substrate 10 of the electro-optical device 100 according to Embodiment 1 of the present invention. The side 10f side of the element substrate 10 is enlarged. It is shown. In FIG. 3, the number of pixels 100a is reduced, the dummy pixel electrode 9b and the capacitor line 3b are not shown, and two signal lines from the terminal 50 to the scanning line driving circuit 60 are shown. Only shown. In FIG. 3, the seal material is represented as a one-dot chain line and a gray region, the wiring is represented as a hatched region that rises to the right, and the circuit is represented as a hatched region that descends to the right.

  As shown in FIGS. 1, 2, and 3, a plurality of terminals 50 are provided along the side 10 e of the element substrate 10 on the one surface 10 s side of the element substrate 10. The wiring described below is extended.

  First, a scanning line driving circuit 60 is formed in a region sandwiched between the side 10f of the element substrate 10 and the end of the image display region 10a, and the signal line 11 (first wiring) and the power supply line 16 ( Second wiring) and a common potential line 15 are formed. Here, the signal line 11, the power supply line 16, and the common potential line 15 are formed of a metal layer, a conductive silicon compound, or the like, and have a light shielding property. In addition, the scanning line driving circuit 60, the shift register 71 and the sample and hold circuit 74 (first latch circuit 71 and second latch circuit 72) of the data line driving circuit 70 described with reference to FIG. The electric protection circuit 85 has a high wiring density.

  The common potential line 15 extends from the terminal for common potential among the terminals 50 provided on the side 10e of the element substrate 10 toward the side 10f of the element substrate 10, and then the side 10f of the element substrate 10 and the image display area. It extends along the sealing material 80 between the ends of 10a. Here, the common potential line 15 extends along the sides 10f, 10g, and 10h of the element substrate 10 and is electrically connected to each of the plurality of inter-substrate conduction electrodes 109. Therefore, the common potential line 15 can supply the common potential Vcom to each of the plurality of inter-substrate conduction electrodes 109.

  The signal line 11 extends from the signal terminal among the terminals 50 provided on the side 10e of the element substrate 10 toward the side 10f of the element substrate 10, and then the side 10f of the element substrate 10 and the image display region 10a. It extends along the sealing material 80 between the ends. In this embodiment, the signal line 11 is a signal line that supplies a signal to the scanning line driving circuit 60, and is, for example, the signal line 12 that supplies the clock signal CLY, the signal line 13 that supplies the clock inversion signal CBY, or the like. .

  The power supply line 16 extends from the power supply terminal to the side 10f of the element substrate 10 among the terminals 50 provided on the side 10e of the element substrate 10, and then the side 10f of the element substrate 10 and the image display region 10a. It extends along the sealing material 80 between the ends. In this embodiment, the power supply line 16 is a power supply line that supplies a power supply potential to the scanning line driving circuit 60. For example, the power supply line 17 that supplies a high potential Vdd (power supply potential) and a low potential Vss (power supply potential) are supplied. The power supply line 18 and the like are supplied.

The wiring width dimensions of the signal line 11 and the power supply line 16 are as follows: Signal line 11 (signal lines 12 and 13) <Power supply line 16 (power supply lines 17 and 18)
The power supply line 16 (power supply lines 17 and 18) is larger in wiring width than the signal line 11 (signal lines 12 and 13). In the present embodiment, the common potential line 15 has a wiring width dimension smaller than that of the power supply line 16 (power supply lines 17 and 18) and substantially the same wiring width dimension as the signal line 11 (signal lines 12 and 13). Yes.

  In the electro-optical device 100 configured as described above, the scanning line driving circuit 60 is provided between the inner edge 81 of the sealing material 80 and the end of the image display region 10a. Here, the scanning line driving circuit 60 includes a shift register 61 and an output circuit 62 such as a buffer circuit that outputs a signal output from the shift register 61 as a scanning signal. The output circuit 62 is provided between the inner edge 81 of the sealing material 80 and the end of the image display area 10a on the side where the sealing material 80 is located, and the output circuit 62 is connected to the inner edge 81 of the sealing material 80 and the end of the image display area 10a. It is provided on the side where the image display area 10a is located.

  Further, in the electro-optical device 100 of this embodiment, the signal line 11 extends along the sealing material 80 after extending in a region sandwiched between the outer edge 82 of the sealing material 80 and the end portion (side 10 e) of the element substrate 10. A portion extending along the seal material 80 of the signal line 11 is provided in a region overlapping the seal material 80. The wiring density of the signal lines 11 in the region overlapping with the sealing material 80 is, for example, 40% to 60%. More specifically, the wiring width dimension of the signal line 11 (signal lines 12, 13) is equal to the space width dimension, and the wiring density is 50%.

  The power line 16 extends in a region sandwiched between the outer edge 82 of the sealing material 80 and the end portion (side 10e) of the element substrate 10, and then crosses the sealing material 80 to the region surrounded by the sealing material 80. It extends along the sealing material 80. Therefore, a portion of the power supply line 16 that extends along the sealing material 80 is provided between the inner edge 81 of the sealing material 80 and the end of the image display region 10a. More specifically, a portion extending along the sealing material 80 in the power supply line 16 is provided between the shift register 61 and the output circuit 62.

  The common potential line 15 extends in a region sandwiched between the outer edge 82 of the sealing material 80 and the end portion (side 10e) of the element substrate 10, and then extends along the sealing material 80. A portion extending along the 15 seal members 80 is provided in a region overlapping the seal member 80. In this embodiment, the common potential line 15 is provided outside the signal line 11 (between the signal line 11 and the side 10 f of the element substrate 10).

  For this reason, the overlapping of the sealing material 80 on the side where the side 10f of the element substrate 10 is located is directed to a direction intersecting the common potential line 15, the signal line 11, and the extending direction of the sealing material 80. Only the wiring 68 that extends and electrically connects the signal line 11 and the scanning line driving circuit 60 is provided.

  In addition to the side 10 f of the element substrate 10, the signal line 11, the power supply line 16, and the common potential line 15 also extend in regions along the sides 10 g and 10 h. For this reason, the signal line 11, the power supply line 16, and the common potential line 15 are all the sides 10f, 10g of the four sides 10e, 10f, 10g, 10h of the element substrate 10 other than the side 10e where the terminal 50 is provided. It extends along the sealing material 80 in a region along 10 h.

  The configuration on the side where the side 10h is located in the element substrate 10 is similar to the side where the side 10f is located in a region sandwiched between the side 10h of the element substrate 10 and the end of the image display region 10a. 60, the signal line 11, the power supply line 16, and the common potential line 15 are formed. Further, on the side of the element substrate 10 where the side 10 h is located, the portion extending along the sealing material 80 of the signal line 11 is provided in a region overlapping the sealing material 80, similarly to the side where the side 10 f is located. The portion of the power line 16 that extends along the sealing material 80 is provided between the inner edge 81 of the sealing material 80 and the end of the image display area 10a. The common potential line 15 extends along the sealing material 80 between the signal line 11 and the side 10 h of the element substrate 10.

  On the side where the side 10g of the element substrate 10 is located, the peripheral circuit 84 is formed, and the scanning line driving circuit 60 is not formed. However, on the side of the element substrate 10 where the side 10g is located, the portion extending along the sealing material 80 of the signal line 11 is provided in a region overlapping the sealing material 80, similarly to the side where the side 10f is located. The portion of the power line 16 that extends along the sealing material 80 is provided between the inner edge 81 of the sealing material 80 and the end of the image display area 10a. The common potential line 15 extends along the sealing material 80 between the signal line 11 and the side 10 g of the element substrate 10. The peripheral circuit 84 is provided between the power supply line 16 and the image display area 10a. Therefore, the data line 6 a extends to the peripheral circuit 84 without overlapping the sealing material 80.

  On the side where the side 10 e of the element substrate 10 is located, the shift register 71 of the data line driving circuit 70 is formed between the sealing material 80 and the side 10 e of the element substrate 10 and does not overlap the sealing material 80. Further, the sample and hold circuit 74 of the data line driving circuit 70 is formed between the inner edge 81 of the sealing material 80 and the end of the image display region 10 a and does not overlap the sealing material 80. Therefore, in the data line driving circuit 70 provided on the side where the side 10 e of the element substrate 10 is located, only the wiring 78 extending in the direction intersecting the sealing material 80 overlaps with the sealing material 80. .

In the element substrate 10 configured as described above, the wiring density is in the following relational signal line 12 and 13 formation region <shift register 61 formation region <power source line 17 and 18 formation region, and the layout is also in this order. . That is, in this embodiment, the signal lines 12 and 13 are arranged so as to overlap with the sealing material 80, and the power supply lines 17 and 18 are arranged so as not to overlap with the sealing material 80. Further, since the wiring density of the formation region of the shift register 61 is relatively low, the sealing material 80 can be cured even if it overlaps with the sealing material 80. Further, since the shift register 61 does not need to be connected to the power supply lines 17 and 18, it can be arranged outside the power supply lines 17 and 18. Therefore, in this embodiment, a configuration is adopted in which the wiring density decreases from a position away from the sealing material 80 toward the sealing material 80.

  As shown in FIGS. 1 and 2, an electrostatic protection circuit 85 is provided on the side where the side 10 e of the element substrate 10 is located. The electrostatic protection circuit 85 includes the sealing material 80 and the side of the element substrate 10. 10e and does not overlap with the sealing material 80.

(Configuration of intersection of power line 16 and sealing material 80)
FIG. 4 is an explanatory diagram showing an enlarged view of the periphery of the electrostatic protection circuit 85 formed on the element substrate 10 of the electro-optical device 100 according to Embodiment 1 of the present invention. In FIG. 4, the number of video signal lines 75 is reduced.

  In the electro-optical device 100 of this embodiment, most of the power supply lines 16 (power supply lines 17 and 18) do not overlap with the sealing material 80, but the portions extending from the terminals 50 of the power supply lines 16 are the sealing material 80. The crossing portions 17c and 18c overlap each other so as to be orthogonal to each other, and the crossing portions 17c and 18c act as light shielding portions when the sealing material 80 is irradiated with light from the element substrate 10 side. Further, as shown in FIG. 1, the portion of the power supply line 16 extending toward the electrostatic protection circuit 85 also has intersecting portions 17c and 18c that are overlapped so as to be orthogonal to the sealing material 80. The intersecting portions 17c and 18c act as light shielding portions when the sealing material 80 is irradiated with light from the element substrate 10 side.

  Therefore, in this embodiment, as shown in FIG. 3, light-transmitting openings 17 a and 18 a are provided at the intersections 17 c and 18 c of the power line 16 (power lines 17 and 18) with the sealing material 80. Yes. In this embodiment, the openings 17a and 18a are slit-like extending in the width direction of the sealing material 80 (extending direction of the power supply line 16), and the extending direction of the sealing material 80 (width direction of the power supply line 16). Are formed in parallel. Here, the lengths of the openings 17 a and 18 a are smaller than the width of the sealing material 80, and both ends of the openings 17 a and 18 a are in positions where they overlap with the sealing material 80. For this reason, the wiring density of the power supply lines 16 at the intersecting portions 17c and 18c is 40% to 60%.

  Further, in this embodiment, as shown in FIG. 4, on the side where the side 10 h of the element substrate 10 is located, electrostatic discharge is performed in a region sandwiched between the outer edge 82 of the sealing material 80 and the sides 10 e and 10 h of the element substrate 10. A protection circuit 85 is provided. The power supply line 16 (power supply lines 17 and 18) is connected to the outer edge 82 of the sealing material 80 and the side 10e of the element substrate 10 from the region sandwiched between the inner edge 81 of the sealing material 80 and the end of the image display region 10a. The region extending between 10 h extends to the electrostatic protection circuit 85 and supplies the power supply potential to the electrostatic protection circuit 85. For this reason, the power supply line 16 (power supply lines 17 and 18) intersects with the sealing material 80, but light-transmitting openings 17a and 18a are provided at the intersecting portions 17c and 18c. In this embodiment, the openings 17a and 18a are slit-like extending in the width direction of the sealing material 80 (extending direction of the power supply line 16), and the extending direction of the sealing material 80 (width direction of the power supply line 16). Are formed in parallel. Here, the lengths of the openings 17 a and 18 a are smaller than the width of the sealing material 80, and both ends of the openings 17 a and 18 a are in positions where they overlap with the sealing material 80. For this reason, the wiring density of the power supply lines 16 at the intersecting portions 17c and 18c is 40% to 60%.

(Main effects of this form)
As described above, in the electro-optical device 100 of this embodiment, the signal line 11 provided in the region sandwiched between the end portions (sides 10f, 10g, 10h) of the element substrate 10 and the end portion of the image display region 10a. Of the power supply line 16 and the common potential line 15, the power supply line 16 having a wide wiring width dimension is provided between the inner edge 81 of the sealing material 80 and the end of the image display region 10a. For this reason, when light is irradiated from the element substrate 10 side in order to photocure the sealing material 80, the light is not blocked by the power line 16. Therefore, since it is not necessary to reduce the wiring width dimension of the power supply line 16, the wiring resistance of the power supply line 16 is low.

  Further, the signal line 11 and the common potential line 15 are provided in a region overlapping with the sealing material 80. However, since the signal line 11 and the common potential line 15 have a narrow wiring width dimension, wiring in the region overlapping with the sealing material 80 is performed. The density is low. For example, the wiring density of the signal lines 11 in the region overlapping with the sealing material 80 is 40% to 60%. For this reason, even when the signal line 11 is provided in a region overlapping with the sealing material 80, when the light is irradiated from the element substrate 10 side, sufficient light reaches the sealing material 80 due to a light scattering effect or the like. Can be reliably cured.

  The power supply line 16 has intersecting portions 17c and 18c with the sealing material 80. The intersecting portions 17c and 18c are provided with light-transmitting openings 17a and 18a. For this reason, when light is irradiated from the element substrate 10 side in order to photocure the sealing material 80, the light reaches the sealing material 80 through the openings 17a and 18a. For this reason, the sealing material 80 can be hardened reliably.

  The openings 17a and 18a each have a short side and a long side, and the long sides of the openings 17a and 18a extend in the width direction of the seal material 80 (the direction in which the power supply line 16 extends). Compared with the case where the long sides of the openings 17a and 18a extend in the extending direction of 80, the wiring resistance of the power supply line 16 is low. Further, the lengths of the openings 17a and 18a are smaller than the width of the seal member 80, and both end portions of the openings 17a and 18a in the long side direction are positioned so as to overlap with the seal member 80. For this reason, even if the openings 17a and 18a are provided in the power supply line 16, the wiring resistance of the power supply line 16 does not increase greatly. Furthermore, since the wiring density of the power supply lines 16 at the intersecting portions 17c and 18c is 40% to 60%, the light irradiated to the intersecting portions 17c and 18c from the element substrate 10 side is sealed through the openings 17a and 18a. Since it reaches the material 80 sufficiently, the sealing material 80 is reliably cured even at the intersecting portions 17c and 18c. Moreover, since the wiring density of the power supply line 16 is not too low, the wiring resistance of the power supply line 16 does not increase greatly.

  Further, since the signal line 11 and the common potential line 15 are provided in the region overlapping with the sealing material 80, all of the signal line 11, the power supply line 16 and the common potential line 15 are provided inside the inner edge 81 of the sealing material 80. Compared to the case, the width dimension of the region occupied by the sealing material 80 and the wiring (the signal line 11, the power supply line 16, and the common potential line 15) outside the image display region 10a can be reduced.

[Embodiment 2]
FIG. 5 is an explanatory view showing, in an enlarged manner, the signal lines 11 and the power supply lines 16 formed on the element substrate 10 of the electro-optical device 100 according to the second embodiment of the present invention. The side 10f side of the element substrate 10 is illustrated. It is shown enlarged. In FIG. 5, as in FIG. 3, the number of pixels 100a is reduced, and the dummy pixel electrode 9b and the capacitor line 3b are not shown. Only two signal lines from the terminal 50 to the scanning line driving circuit 60 are shown. In addition, since the basic configuration of the present embodiment is the same as that of the first embodiment, common portions are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 5, in this embodiment as well, in the same manner as in the first embodiment, it is provided in a region sandwiched between the end portions (sides 10f, 10g, 10h) of the element substrate 10 and the end portion of the image display region 10a. Of the signal line 11 (first wiring), the power supply line 16 (second wiring), and the common potential line 15, the power supply line 16 having a wide wiring width dimension includes an inner edge 81 of the sealing material 80 and an end portion of the image display region 10a. It is provided between. Further, the signal line 11 having a narrow wiring width dimension is provided in a region overlapping the sealing material 80, and the wiring density of the signal line 11 in the region overlapping the sealing material 80 is 40% to 60%. The power supply line 16 has intersecting portions 17c and 18c with the sealing material 80. Since the intersecting portions 17c and 18c are provided with light-transmitting openings 17a and 18a, the intersecting portions are provided. The wiring density of the power supply line 16 in 17c and 18c is 40% to 60%. For this reason, although the sealing material 80 has an overlap part with wiring, the sealing material 80 can be photocured appropriately.

  In this embodiment, a third wiring having a wiring density of 40% to 60% is provided in a region that does not overlap with the signal line 11 in a region that overlaps with the sealing material 80. More specifically, the common potential line 15 that overlaps with the sealing material 80 has a wiring width dimension wider than that of the first embodiment and is equal to the wiring width dimension of the power supply line 16. However, the common potential line 15 is formed with a plurality of slits 15a in parallel, and the common potential line 15 is configured as a third wiring having a wiring density of 40% to 60%.

  In this embodiment, the dummy wiring 19 that does not contribute to signal supply or the like is formed in the region overlapping with the sealing material 80. The dummy wiring 19 has a wide wiring width dimension and the wiring width dimension of the power supply line 16. Is equivalent to However, the dummy wiring 19 has a plurality of slits 19a formed in parallel, and the dummy wiring 19 is configured as a third wiring having a wiring density of 40% to 60%.

  For this reason, in this embodiment, substantially the entire region where the sealing material 80 is formed is a region where the wiring density is 40% to 60%. Accordingly, when the gap member for controlling the gap between the element substrate 10 and the counter substrate 20 is included in the sealing material 80, the number of gap materials that contact the element substrate 10 side is the same over the entire formation region of the sealing material 80. It becomes. Therefore, it is possible to reduce variations in the distance between the substrates due to the wiring density. In addition, the wiring resistance of the common potential line 15 can be reduced. Even when such a configuration is adopted, since the wiring density in the region overlapping with the sealing material 80 is 40% to 60%, when light is irradiated from the element substrate 10 side, sufficient light is emitted due to the light scattering effect or the like. It reaches the sealing material 80. Therefore, there is no problem in curing the sealing material 80.

[Other embodiments]
In the above embodiment, the slits extending in the width direction of the sealing material 80 (the extending direction of the power supply line 16) are provided as the openings 17a and 18a. However, when there is a margin in the wiring resistance of the power supply line 16 The openings 17a and 18a may be provided with slits extending in the extending direction of the sealing material 80 (the width direction of the power supply line 16).

  In the above embodiment, the lengths of the openings 17a and 18a are smaller than the width of the sealing material 80. However, if there is a margin in the wiring resistance of the power supply line 16, the openings 17a and 18a A configuration in which the length dimension is larger than the width dimension of the sealing material 80 and both end portions of the openings 17a and 18a protrude from the sealing material 80 may be employed.

  In the above embodiment, the slits are provided as the openings 17a and 18a. However, the dot-like openings 17a and 18a may be provided.

  In the above embodiment, the example in which the present invention is applied to the transmission type electro-optical device 100 has been described. However, the present invention may be applied to the reflection type electro-optical device 100. In the above embodiment, the entire data line driving circuit 70 is configured on the element substrate 10. However, for example, only the sample hold circuit 74 is formed on the element substrate 10, and the shift register 71 is connected to the element substrate 10. The present invention may be applied to a case where an integrated circuit is mounted on a connected flexible wiring board.

[Example of mounting on electronic devices]
(Configuration example of projection display device and optical unit)
FIG. 6 is a schematic configuration diagram of a projection display device (electronic device) and an optical unit to which the present invention is applied. The projection display device 110 shown in FIG. 6 is a so-called projection type projection display device that irradiates light onto a screen 111 provided on the viewer side and observes light reflected by the screen 111. The projection display device 110 includes a light source unit 130 including a light source 112, dichroic mirrors 113 and 114, liquid crystal light valves 115 to 117, a projection optical system 118, a cross dichroic prism 119 (combining optical system), and a relay. System 120. In the projection type display device 110, an optical unit 200 including the electro-optical device 100 and a cross dichroic prism 119 (light combining optical system) is used.

  The light source 112 is composed of an ultrahigh pressure mercury lamp that supplies light including red light R, green light G, and blue light B. The dichroic mirror 113 is configured to transmit the red light R from the light source 112 and reflect the green light G and the blue light B. The dichroic mirror 114 is configured to transmit the blue light B and reflect the green light G out of the green light G and the blue light B reflected by the dichroic mirror 113. Thus, the dichroic mirrors 113 and 114 constitute a color separation optical system that separates the light emitted from the light source 112 into red light R, green light G, and blue light B.

  Here, between the dichroic mirror 113 and the light source 112, an integrator 121 and a polarization conversion element 122 are arranged in order from the light source 112. The integrator 121 is configured to uniformize the illuminance distribution of the light emitted from the light source 112. Further, the polarization conversion element 122 is configured to change the light from the light source 112 into polarized light having a specific vibration direction such as s-polarized light.

  The liquid crystal light valve 115 is a transmissive liquid crystal device that modulates red light transmitted through the dichroic mirror 113 and reflected by the reflection mirror 123 in accordance with an image signal. The liquid crystal light valve 115 includes a λ / 2 phase difference plate 115a, a first polarizing plate 115b, an electro-optical device 100 (red liquid crystal panel 100R), and a second polarizing plate 115d. Here, the red light R incident on the liquid crystal light valve 115 remains as s-polarized light because the polarization of the light does not change even if it passes through the dichroic mirror 113.

  The λ / 2 phase difference plate 115a is an optical element that converts s-polarized light incident on the liquid crystal light valve 115 into p-polarized light. The first polarizing plate 115b is a polarizing plate that blocks s-polarized light and transmits p-polarized light. The electro-optical device 100 (the red liquid crystal panel 100R) is configured to convert p-polarized light into s-polarized light (circularly polarized light or elliptically polarized light in the case of halftone) by modulation according to an image signal. Furthermore, the second polarizing plate 115d is a polarizing plate that blocks p-polarized light and transmits s-polarized light. Therefore, the liquid crystal light valve 115 is configured to modulate the red light R according to the image signal and emit the modulated red light R toward the cross dichroic prism 119.

  Note that the λ / 2 phase difference plate 115a and the first polarizing plate 115b are disposed in contact with a light-transmitting glass plate 115e that does not convert the polarization, and the λ / 2 phase difference plate 115a and the first polarization plate 115b are arranged in contact with each other. It is possible to avoid the polarizing plate 115b from being distorted by heat generation.

  The liquid crystal light valve 116 is a transmissive liquid crystal device that modulates green light G reflected by the dichroic mirror 114 after being reflected by the dichroic mirror 113 in accordance with an image signal. Similar to the liquid crystal light valve 115, the liquid crystal light valve 116 includes a first polarizing plate 116b, an electro-optical device 100 (green liquid crystal panel 100G), and a second polarizing plate 116d. Green light G incident on the liquid crystal light valve 116 is s-polarized light that is reflected by the dichroic mirrors 113 and 114 and then incident. The first polarizing plate 116b is a polarizing plate that blocks p-polarized light and transmits s-polarized light. The electro-optical device 100 (green liquid crystal panel 100G) is configured to convert s-polarized light into p-polarized light (circularly polarized light or elliptically polarized light in the case of halftone) by modulation according to an image signal. The second polarizing plate 116d is a polarizing plate that blocks s-polarized light and transmits p-polarized light. Therefore, the liquid crystal light valve 116 is configured to modulate the green light G in accordance with the image signal and emit the modulated green light G toward the cross dichroic prism 119.

  The liquid crystal light valve 117 is a transmissive liquid crystal device that modulates the blue light B reflected by the dichroic mirror 113, transmitted through the dichroic mirror 114, and then passed through the relay system 120 in accordance with an image signal. Like the liquid crystal light valves 115 and 116, the liquid crystal light valve 117 includes a λ / 2 phase difference plate 117a, a first polarizing plate 117b, an electro-optical device 100 (blue liquid crystal panel 100B), and a second polarizing plate 117d. I have. Here, the blue light B incident on the liquid crystal light valve 117 is reflected by two reflecting mirrors 125a and 125b (to be described later) of the relay system 120 after being reflected by the dichroic mirror 113 and transmitted through the dichroic mirror 114. It has become.

  The λ / 2 phase difference plate 117a is an optical element that converts s-polarized light incident on the liquid crystal light valve 117 into p-polarized light. The first polarizing plate 117b is a polarizing plate that blocks s-polarized light and transmits p-polarized light. The electro-optical device 100 (blue liquid crystal panel 100B) is configured to convert p-polarized light to s-polarized light (circularly polarized light or elliptically polarized light if it is a halftone) by modulation according to an image signal. Furthermore, the second polarizing plate 117d is a polarizing plate that blocks p-polarized light and transmits s-polarized light. Therefore, the liquid crystal light valve 117 is configured to modulate the blue light B according to the image signal and emit the modulated blue light B toward the cross dichroic prism 119. The λ / 2 phase difference plate 117a and the first polarizing plate 117b are arranged in contact with the glass plate 117e.

  The relay system 120 includes relay lenses 124a and 124b and reflection mirrors 125a and 125b. The relay lenses 124a and 124b are provided to prevent light loss due to the long optical path of the blue light B. Here, the relay lens 124a is disposed between the dichroic mirror 114 and the reflection mirror 125a. The relay lens 124b is disposed between the reflection mirrors 125a and 125b. The reflection mirror 125a is disposed so as to reflect the blue light B transmitted through the dichroic mirror 114 and emitted from the relay lens 124a toward the relay lens 124b. The reflection mirror 125b is disposed so as to reflect the blue light B emitted from the relay lens 124b toward the liquid crystal light valve 117.

  The cross dichroic prism 119 is a color combining optical system in which two dichroic films 119a and 119b are arranged orthogonally in an X shape. The dichroic film 119a is a film that reflects blue light B and transmits green light G, and the dichroic film 119b is a film that reflects red light R and transmits green light G. Therefore, the cross dichroic prism 119 is configured to combine the red light R, the green light G, and the blue light B modulated by each of the liquid crystal light valves 115 to 117 and emit the resultant light toward the projection optical system 118. Yes.

  Note that light incident on the cross dichroic prism 119 from the liquid crystal light valves 115 and 117 is s-polarized light, and light incident on the cross dichroic prism 119 from the liquid crystal light valve 116 is p-polarized light. Thus, by making the light incident on the cross dichroic prism 119 into different types of polarized light, the light incident from the liquid crystal light valves 115 to 117 in the cross dichroic prism 119 can be synthesized. Here, in general, the dichroic films 119a and 119b are excellent in s-polarized reflection transistor characteristics. For this reason, red light R and blue light B reflected by the dichroic films 119a and 119b are s-polarized light, and green light G transmitted through the dichroic films 119a and 119b is p-polarized light. The projection optical system 118 has a projection lens (not shown) and is configured to project the light combined by the cross dichroic prism 119 onto the screen 111.

(Other projection display devices)
In addition, about a projection type display apparatus, you may comprise the LED light source etc. which radiate | emit the light of each color as a light source part, and supply each color light radiate | emitted from this LED light source to another liquid crystal device. .

(Other electronic devices)
As for the electro-optical device 100 to which the present invention is applied, in addition to the electronic devices described above, mobile phones, personal digital assistants (PDAs), digital cameras, liquid crystal televisions, car navigation devices, video phones, POS terminals In addition, it may be used as a direct-view display device in an electronic device such as a device provided with a touch panel.

(Other electro-optical devices)
In the above embodiment, the liquid crystal device has been described as an example of the electro-optical device. However, the present invention is not limited to this, and an organic electroluminescence display device, a plasma display, a field emission display (FED), a SED ( The present invention may be applied to an electro-optical device such as a surface-conduction electron-emitter display (LED), an LED (light emitting diode) display device, and an electrophoretic display device.

5 .... Liquid crystal layer, 9a..Pixel electrode, 10..Element substrate, 10a..Image display area, 11, 12, 13, ..Signal line, 15..Common potential line, 16, 17, 18, ..Power supply Lines 17a, 18a, .., openings, 17c, 18c, .. intersections, 20 .. counter substrate, 21 .. common electrodes, 30 .. field effect transistors (pixel transistors / switching elements), 60 .. scanning lines Driving circuit, 70 ... Data line driving circuit, 80 ... Sealing material, 100 ... Electro-optical device, 100a ... Pixel

Claims (9)

A translucent element substrate in which a plurality of pixel electrodes are arranged on one side, a translucent counter substrate arranged to face the one side of the element substrate, and the plurality of pixel electrodes are arranged A photo-curing sealing material that is provided so as to surround an image display region and bonds the counter substrate and the element substrate;
The element substrate is sandwiched between the inner side of the sealing material and the end of the image display region from the region sandwiched between the driving circuit, the outer edge of the sealing material, and the end of the element substrate on the one surface side. A power supply line extending in the region and supplying a power supply potential to the drive circuit,
An electro-optical device, wherein an opening is provided at a portion where the power supply line intersects with the sealing material. A translucent element substrate in which a plurality of pixel electrodes are arranged on one side, a translucent counter substrate arranged to face the one side of the element substrate, and the plurality of pixel electrodes are arranged A photo-curing sealing material that is provided so as to surround an image display region and bonds the counter substrate and the element substrate;
The element substrate has an electrostatic protection circuit provided in an area sandwiched between an outer edge of the sealing material and an end portion of the element substrate on the one surface side, an inner edge of the sealing material, and an image display area. A power line that extends from the region sandwiched between the end portions to the region sandwiched between the outer edge of the sealing material and the end portion of the element substrate and supplies a power source potential to the electrostatic protection circuit. And
An electro-optical device, wherein an opening is provided at a portion where the power supply line intersects with the sealing material.   The electro-optical device according to claim 1, wherein the opening extends in a width direction of the sealing material.   4. The electro-optical device according to claim 3, wherein both end portions of the opening portion are positioned so as to overlap the sealing material.   5. The electro-optical device according to claim 1, wherein a wiring density of the power supply lines at the intersecting portion is 40% to 60%.   The electro-optical device according to claim 1, wherein the driving circuit is provided in a region sandwiched between an inner edge of the sealing material and an end of the image display region.   The element substrate has a signal line for supplying a signal to the drive circuit, with a portion extending along the seal material in a region overlapping the seal material on the one surface side. Item 7. The electro-optical device according to Item 1 or 6.   The electro-optical device according to claim 1, wherein a liquid crystal layer is provided between the element substrate and the counter substrate in a region surrounded by the sealing material.   An electronic apparatus comprising the electro-optical device according to claim 1.