JP2012175054A - Led package - Google Patents

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JP2012175054A
JP2012175054A JP2011038482A JP2011038482A JP2012175054A JP 2012175054 A JP2012175054 A JP 2012175054A JP 2011038482 A JP2011038482 A JP 2011038482A JP 2011038482 A JP2011038482 A JP 2011038482A JP 2012175054 A JP2012175054 A JP 2012175054A
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electrode patterns
pair
led package
light emitting
dummy electrode
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Yuichi Akiyama
友一 秋山
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
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Citizen Holdings Co Ltd
Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Abstract

PROBLEM TO BE SOLVED: To provide an LED package which allows multiple electrical and optical inspections to be easily conducted without affecting a light emitting element by including element electrode patterns on which the light emitting element is mounted and independent dummy electrode patterns for the inspections in the same package.SOLUTION: An LED package 11 comprises: a substrate 12; element electrode patterns 16a, 16b formed on the substrate 12; a light emitting element 15 electrically connecting with the element electrode patterns; and a sealing body 23 sealing the light emitting element 15. In the LED package 11, the element electrode patterns 16a, 16b, first dummy electrode patterns 17a, 17b and second dummy electrode patterns 18a, 18b which are provided so as to be electrically independent, and a first thin metal wire 21 and a second thin metal wire 22, which are arranged between the respective dummy electrode patterns and are broken when test currents flow, are provided on the substrate 12.

Description

本発明は、ＬＥＤの備える特性、例えば電気的特性や光学的特性などを検査するための検査部を備えたＬＥＤパッケージに関するものである。   The present invention relates to an LED package including an inspection unit for inspecting characteristics of an LED, such as electrical characteristics and optical characteristics.

従来、各種の発光ダイオードデバイス（ＬＥＤ）の定格電流値や最大定格電流値等の電気的特性や発光輝度や発光色等の光学的特性に関わる検査は、製造されたＬＥＤに対して所定範囲の電圧を印加し、そのときの特性を逐次計測及び記録することによって行われていた。そして、前記検査結果のデータに基づいて、製造されたＬＥＤの電気的及び光学的特性によるランク分けや不良品等の選別をしていた。   Conventionally, inspections relating to electrical characteristics such as rated current values and maximum rated current values of various light emitting diode devices (LEDs) and optical characteristics such as emission luminance and emission color are within a predetermined range for manufactured LEDs. This is done by applying a voltage and sequentially measuring and recording the characteristics at that time. Then, based on the data of the inspection results, the manufactured LEDs are ranked according to the electrical and optical characteristics, and defective products are selected.

このようなＬＥＤの検査あるいは調整手段については、いくつかの提案がなされている。特許文献１には、発光素子が実装される電極パターンの一部に狭い部分（狭窄部）を形成し、ショートモードで発生する電流のジュール熱によって前記狭窄部を断線させることで、許容電流値を超える電流が流れた際に電子部品を保護する接続装置が示されている。   Several proposals have been made for such LED inspection or adjustment means. In Patent Document 1, a narrow portion (constriction portion) is formed in a part of an electrode pattern on which a light emitting element is mounted, and the constriction portion is disconnected by the Joule heat of current generated in a short mode, thereby allowing an allowable current value. A connection device is shown that protects electronic components when a current greater than 1 flows.

また、特許文献２には、発光素子と並列にワイヤボンディングによる可変抵抗が実装されたＬＥＤパッケージが示されている。前記可変抵抗は、発光素子の色偏差を補正するために設けられたものであり、ＬＥＤをパッケージ化した後においても調整ができる構成となっている。   Patent Document 2 discloses an LED package in which a variable resistor by wire bonding is mounted in parallel with a light emitting element. The variable resistor is provided to correct the color deviation of the light emitting element, and can be adjusted even after the LED is packaged.

特開２００１−２３７５１３号公報JP 2001-237513 A 特開２００７−１１０１１３号公報JP 2007-110113 A

上述したように、従来のＬＥＤは、発光素子が実装される電極パターンから直接所定の電圧を印加して電気特性や光学特性を検査していたが、最大定格電流値に近いところの特性を検査する際に許容値を超えてしまう場合がある。これによって、製品化する前の検査段階で発光素子が劣化したり、場合によっては発光しなくなったりするなどの製品不良を引き起こすことがあった。一方、製品を劣化させずに検査するには、検査用として印加する電圧やそのときに流れる電流を制限しなければならず、最大定格電流値等の検査が不十分なものとなり、製品出荷後に発光不良等の問題を引き起こすおそれがあった。   As described above, the conventional LED inspects the electrical characteristics and optical characteristics by applying a predetermined voltage directly from the electrode pattern on which the light emitting element is mounted, but the characteristics near the maximum rated current value are inspected. In some cases, the tolerance may be exceeded. This may cause product defects such as deterioration of the light emitting element in the inspection stage before commercialization, or in some cases no light emission. On the other hand, in order to inspect without deteriorating the product, the voltage applied for inspection and the current flowing at that time must be limited, and the inspection of the maximum rated current value etc. becomes insufficient, and after product shipment There was a risk of causing problems such as poor light emission.

特許文献１に開示されている発明では、電子部品が配線されている電極パターンに流れる電流値が許容値を超えた場合に、前記電極パターンの一部に形成されている狭窄部が断線することによって、電子部品を過電流から保護することができる。しかしながら、これは単に電子部品を保護するためだけの構成であり、電子部品の電気的特性等を検査するものではない。   In the invention disclosed in Patent Document 1, a narrowed portion formed in a part of the electrode pattern is disconnected when a current value flowing through the electrode pattern on which the electronic component is wired exceeds an allowable value. Thus, the electronic component can be protected from overcurrent. However, this is merely a configuration for protecting the electronic component, and does not inspect the electrical characteristics or the like of the electronic component.

また、特許文献２に開示されている発明では、発光素子と並行して設けられているワイヤボンディングは可変抵抗となっているため、発光素子の光学的な調整をするには適している。しかしながら、印加された電流によって断線等を生じさせるような構成にはなっていないので、許容値を超える電流が流れた際に、電流の供給停止等を伴うような導通・非導通による検出はできない。   In the invention disclosed in Patent Document 2, wire bonding provided in parallel with the light emitting element has a variable resistance, and is suitable for optical adjustment of the light emitting element. However, since it is not configured to cause a disconnection or the like due to the applied current, when a current exceeding the allowable value flows, it cannot be detected by conduction / non-conduction that causes the supply of current to stop. .

さらに、前記特許文献１，２は共に、狭窄部や可変抵抗といった検査部位が発光素子や電子部品に接続される電極パターンと共用しているため、検査パターンをいくつか設定するといったことができない。   Further, in both Patent Documents 1 and 2, since the inspection site such as the constriction portion and the variable resistance is shared with the electrode pattern connected to the light emitting element and the electronic component, some inspection patterns cannot be set.

そこで、本発明の目的は、発光素子が実装される素子電極パターンと独立した検査用のダミー電極パターンを同一のパッケージ内に備えることで、前記発光素子に影響を及ぼすことなく、簡易に複数の電気的及び光学的な検査を実施することが可能なＬＥＤパッケージを提供することである。   Therefore, an object of the present invention is to provide a dummy electrode pattern for inspection independent of an element electrode pattern on which a light emitting element is mounted in the same package, so that a plurality of pieces can be easily obtained without affecting the light emitting element. An LED package capable of performing electrical and optical inspection is provided.

上記課題を解決するために、本発明のＬＥＤパッケージは、基板と、この基板上に形成される一対の素子電極パターンと、前記基板上に実装され一対の素子電極パターンと電気的に接続される発光素子と、この発光素子を封止する封止体とを備えるＬＥＤパッケージにおいて、前記基板上には、前記一対の素子電極パターンと電気的に独立して設けられる少なくとも一対のダミー電極パターンと、この一対のダミー電極パターン間に配線され、一対のダミー電極パターン間に試験電流を流したときに断線する金属細線とが設けられていることを特徴とする。   In order to solve the above problems, an LED package of the present invention includes a substrate, a pair of element electrode patterns formed on the substrate, and is electrically connected to the pair of element electrode patterns mounted on the substrate. In an LED package including a light emitting element and a sealing body that seals the light emitting element, on the substrate, at least a pair of dummy electrode patterns provided independently of the pair of element electrode patterns, A thin metal wire that is wired between the pair of dummy electrode patterns and is disconnected when a test current is passed between the pair of dummy electrode patterns is provided.

本発明に係るＬＥＤパッケージによれば、試験電流を一対のダミー電極パターン間に流し、このときの金属細線の状態を確認することで、前記発光素子に直接試験電流を流すことなく、発光素子が有する電気的、光学的特性を予め検知することができる。また、前記金属細線は、所定の試験電流が流れることで断線するように設定されているため、試験電流を流した後における一対のダミー電極パターン間の導通チェックを行うだけで発光素子に流し得る最大定格電流値等の特性を測ることが可能となる。   According to the LED package of the present invention, a test current is allowed to flow between the pair of dummy electrode patterns, and the state of the metal thin wire at this time is confirmed, so that the light emitting element can be directly supplied to the light emitting element without flowing the test current. The electrical and optical characteristics possessed can be detected in advance. Moreover, since the said metal fine wire is set so that it may be disconnected when a predetermined test current flows, it can be made to flow through the light emitting element only by conducting a continuity check between the pair of dummy electrode patterns after flowing the test current. It is possible to measure characteristics such as the maximum rated current value.

また、前記一対のダミー電極パターンを基板上に複数配置することによって、ＬＥＤの電気的及び光学的特性を数段階に選別することができ、製品の細かなランク分けができると共に、検査工程の短縮化も図られることになる。   In addition, by arranging a plurality of the pair of dummy electrode patterns on the substrate, the electrical and optical characteristics of the LED can be selected in several stages, and the product can be classified in detail and the inspection process can be shortened. It will be planned.

本発明に係る第１実施形態のＬＥＤパッケージの平面図（ａ）及び断面図（ｂ）である。It is the top view (a) and sectional drawing (b) of the LED package of 1st Embodiment concerning this invention. 本発明に係る第２実施形態のＬＥＤパッケージの平面図（ａ）及び断面図（ｂ）である。It is the top view (a) and sectional drawing (b) of the LED package of 2nd Embodiment which concern on this invention.

以下、添付図面に基づいて本発明に係るＬＥＤパッケージの実施形態を詳細に説明する。図１（ａ），（ｂ）は本発明の第１実施形態のＬＥＤパッケージ１１を示したものである。このＬＥＤパッケージ１１は、基板１２上に発光素子１５が実装される発光部１３と、この発光部１３に並行して設けられる２つの検査部１４ａ，１４ｂとを有して構成されている。   Hereinafter, embodiments of an LED package according to the present invention will be described in detail with reference to the accompanying drawings. FIGS. 1A and 1B show an LED package 11 according to a first embodiment of the present invention. The LED package 11 includes a light emitting unit 13 on which a light emitting element 15 is mounted on a substrate 12 and two inspection units 14 a and 14 b provided in parallel to the light emitting unit 13.

前記基板１２は、一般的なエポキシ樹脂やＢＴレジン等の絶縁材料で四角形状に形成され、前記発光部１３には、アノードとカソードからなる一対の素子電極パターン１６ａ，１６ｂが形成されている。また、発光部１３を挟んでその両側に設けられる２つの検査部のうち、一方の検査部１４ａには一対の第１ダミー電極パターン１７ａ，１７ｂが、他方の検査部１４ｂには一対の第２ダミー電極パターン１８ａ，１８ｂがそれぞれ形成されている。   The substrate 12 is formed in a square shape with an insulating material such as a general epoxy resin or BT resin, and the light emitting portion 13 is formed with a pair of element electrode patterns 16a and 16b including an anode and a cathode. Of the two inspection units provided on both sides of the light emitting unit 13, the pair of first dummy electrode patterns 17a and 17b is provided in one inspection unit 14a and the pair of second inspection units 14b is provided in the other inspection unit 14b. Dummy electrode patterns 18a and 18b are respectively formed.

前記発光素子１５は、一例として、上面にアノードとカソードからなる一対の電極部を備えたＰ層及びＮ層（図示せず）からなる四角形状の積層チップ体であり、ボンディングワイヤ１９ａ，１９ｂを介して、それぞれ素子電極パターン１６ａ，１６ｂに電気的に接続される。このような発光素子１５からなる発光部１３は、一般的な発光ダイオードの構成であるので、ボンディングワイヤ接続に限らず、バンプによって表面実装するタイプの発光素子であってもよい。   The light emitting element 15 is, for example, a quadrangular laminated chip body composed of a P layer and an N layer (not shown) provided with a pair of electrode parts consisting of an anode and a cathode on the upper surface, and bonding wires 19a and 19b are connected to each other. Are electrically connected to the device electrode patterns 16a and 16b, respectively. Since the light-emitting portion 13 composed of the light-emitting element 15 has a general light-emitting diode configuration, it is not limited to bonding wire connection, and may be a light-emitting element that is surface-mounted by bumps.

前記検査部１４ａの第１ダミー電極パターン１７ａ，１７ｂ間には第１金属細線２１が接続され、前記検査部１４ｂの第２ダミー電極パターン１８ａ，１８ｂ間には第２金属細線２２が接続される。前記第１金属細線２１と第２金属細線２２は、発光素子１５が備える電気的特性に模して形成されており、通常は各ダミー電極パターン間を電気的に繋ぐ導体として作用するが、ここに所定の試験電流が流れると、この電流によって発生したジュール熱によって、自らを溶かして断線、すなわち溶断する。これによって、各ダミー電極パターン間に印加する電圧を段階的に上げていき、第１金属細線２１又は第２金属細線２２が溶断して導通が遮断されたときの試験電流値によって、発光素子１５に流し得る定格電流値や最大定格電流値がどの程度であるかを予め検知することができる。また、前記試験電流を流した後においても、各ダミー電極パターン間の導通チェックをするだけで、発光素子１５が安定して発光可能であるものか、あるいは、製品として出荷できないものであるかどうかの選別を簡易且つ容易にすることができる。なお、前記第１金属細線２１及び第２金属細線２２は、導通チェックによらずとも、目視によっても溶断・非溶断の判別が可能である。   A first metal thin wire 21 is connected between the first dummy electrode patterns 17a and 17b of the inspection portion 14a, and a second metal thin wire 22 is connected between the second dummy electrode patterns 18a and 18b of the inspection portion 14b. . The first metal fine wire 21 and the second metal fine wire 22 are formed to imitate the electrical characteristics of the light emitting element 15 and normally function as conductors that electrically connect the dummy electrode patterns. When a predetermined test current flows, the Joule heat generated by this current melts itself and disconnects, that is, blows. As a result, the voltage applied between the dummy electrode patterns is increased stepwise, and the light emitting element 15 depends on the test current value when the first metal thin wire 21 or the second metal thin wire 22 is melted and cut off. It is possible to detect in advance how much the rated current value and the maximum rated current value that can be passed through the battery are. Whether or not the light-emitting element 15 can emit light stably or cannot be shipped as a product only by checking the continuity between the dummy electrode patterns even after passing the test current. Can be easily and easily selected. In addition, the said 1st metal fine wire 21 and the 2nd metal fine wire 22 can discriminate | determine a fusing and a non-melting | fusing by visual observation, without using a continuity check.

本実施形態では、２つの検査部１４ａ，１４ｂを備えているので、例えば、第１金属細線２１には発光素子１５の定格電流値を超えた場合に溶断可能な材質や太さのものを選択し、第２金属細線２２には発光素子１５の最大定格電流値を超えた場合に溶断可能な材質や太さのものを選択することができる。これによって、発光素子１５の定格電流値や最大定格電流値を同時に測ることができ、この定格電流値や最大定格電流値による駆動電流を素子電極パターン１６ａ，１６ｂに印加させることによって、実際に発光させた状態での発光素子１５の光量や輝度等の光学的特性を安全に測ることができる。   In the present embodiment, since the two inspection parts 14a and 14b are provided, for example, the first metal thin wire 21 is selected from materials and thicknesses that can be blown when the rated current value of the light emitting element 15 is exceeded. The second metal thin wire 22 can be selected from materials and thicknesses that can be fused when the maximum rated current value of the light emitting element 15 is exceeded. As a result, the rated current value and the maximum rated current value of the light emitting element 15 can be measured simultaneously, and the drive current based on the rated current value and the maximum rated current value is applied to the element electrode patterns 16a and 16b, thereby actually emitting light. It is possible to safely measure the optical characteristics such as the light amount and the luminance of the light emitting element 15 in the state of being made.

また、２つの検査部１４ａ，１４ｂを備えたことによって、第１金属細線２１と第２金属細線２２の双方が非溶断の導通状態、いずれか一方が非溶断の導通状態で他方が溶断の非導通状態、双方とも溶断の非導通の４パターンによるＬＥＤの特性を示すランク分けを行うことが可能となる。本実施形態では、２つの検査部を備えたが、ＬＥＤの種類に応じて、１つの検査部による導通と非導通の２パターンの検査や３つ以上の検査部を備えることでさらに細かくランク分けすることも可能となる。   In addition, since the two inspection portions 14a and 14b are provided, both the first metal thin wire 21 and the second metal thin wire 22 are in a non-blown conductive state, one is a non-blown conductive state, and the other is non-blown. It is possible to perform rank classification indicating the characteristics of the LEDs by the conductive state and the four patterns of fusing and non-conducting. In this embodiment, two inspection units are provided. However, according to the type of LED, two patterns of conduction and non-conduction by one inspection unit and three or more inspection units are provided for more detailed ranking. It is also possible to do.

前記素子電極パターン１６ａ，１６ｂ、第１ダミー電極パターン１７ａ，１７ｂ及び第２ダミー電極パターン１８ａ，１８ｂはそれぞれ電気的に独立して設けられているため、検査する際に発光素子１５やボンディングワイヤ１９ａ，１９ｂに影響を及ぼすことがない。また、前記各電極パターンは、スルーホールを介して基板１２の表面から裏面に導通させているため、図１（ｂ）に示したように、ＬＥＤパッケージ１１をマザーボード２０上や検査用の基板（図示せず）に実装した状態で外部から検査用の電圧を印加して検査することができる。   Since the element electrode patterns 16a and 16b, the first dummy electrode patterns 17a and 17b, and the second dummy electrode patterns 18a and 18b are provided independently of each other, the light emitting element 15 and the bonding wire 19a are used for inspection. 19b is not affected. Since each electrode pattern is electrically connected from the front surface to the back surface of the substrate 12 through a through hole, the LED package 11 is mounted on the mother board 20 or an inspection substrate (as shown in FIG. 1B). Inspection can be performed by applying a voltage for inspection from the outside in a state of being mounted in a not-shown state.

前記検査部１４ａ，１４ｂは、発光部１３を挟んだ基板１２の両側縁部に沿ってそれぞれが設けられる。また、この検査部１４ａ，１４ｂ及び発光部１３は基板１２上に設けられた封止体２３によって封止されている。この封止体２３は透光性を有する樹脂材からなり、発光素子１５から出射される光を拡散させたり、照明用途に応じて発光色を変換させたりするため、拡散剤や蛍光剤等が混入されている。このように、前記検査部１４ａ，１４ｂは、基板１２の略中央部に実装された発光素子１５から離れた基板１２の側縁部等の空きスペースを利用して設けることができるので、基板１２自体も大型化することがなく、また、発光部１３における発光作用を妨げることがない。   The inspection units 14 a and 14 b are provided along both side edges of the substrate 12 with the light emitting unit 13 interposed therebetween. The inspection units 14 a and 14 b and the light emitting unit 13 are sealed with a sealing body 23 provided on the substrate 12. The sealing body 23 is made of a resin material having translucency, and diffuses light emitted from the light emitting element 15 or changes the emission color according to the illumination application. It is mixed. As described above, the inspection portions 14 a and 14 b can be provided by using the empty space such as the side edge portion of the substrate 12 away from the light emitting element 15 mounted at the substantially central portion of the substrate 12. The device itself does not increase in size and does not hinder the light emitting action in the light emitting unit 13.

図２（ａ），（ｂ）には、上記ＬＥＤパッケージ１１の検査部１４ａ，１４ｂを外部から遮蔽するための構成を備えた第２実施形態のＬＥＤパッケージ３１が示されている。このＬＥＤパッケージ３１は、発光部１３及び２つの検査部１４ａ，１４ｂを備えた第１実施形態のＬＥＤパッケージ１１と基本構成は同じであるが、封止体３２が発光部１３を封止する封止本体部３３と、この封止本体部３３の外周を取り囲むようにして設けられ、前記検査部１４ａ，１４ｂを封止する封止枠部３４とで構成されている。前記封止本体部３３は発光素子１５から発せられる光の透過率の高い樹脂材を用い、封止枠部３４には遮光性を有した不透明の樹脂材を用いるか、着色した樹脂材を用いることによって、各ダミー電極パターンや各金属細線を目立たなくさせることができる。   FIGS. 2A and 2B show an LED package 31 according to the second embodiment having a configuration for shielding the inspection portions 14a and 14b of the LED package 11 from the outside. The LED package 31 has the same basic configuration as the LED package 11 of the first embodiment including the light emitting unit 13 and the two inspection units 14 a and 14 b, but the sealing body 32 seals the light emitting unit 13. The stopper main body portion 33 and a sealing frame portion 34 are provided so as to surround the outer periphery of the sealing main body portion 33 and seal the inspection portions 14a and 14b. The sealing main body portion 33 is made of a resin material having a high transmittance for light emitted from the light emitting element 15, and the sealing frame portion 34 is made of an opaque resin material having a light shielding property or a colored resin material. As a result, the dummy electrode patterns and the fine metal wires can be made inconspicuous.

以上説明したように、本発明のＬＥＤパッケージによれば、素子電極パターン及び発光素子からなる発光部と、この発光部から電気的に独立させたダミー電極パターン及び前記発光素子の特性に模した金属細線からなる検査部とが同一基板上に設けられているので、試験電流をダミー電極パターンに流し、このときの金属細線の断線・非断線をチェックすることで、発光部が備える特性を事前に検知することが可能となった。これによって、発光素子を劣化させることなく、電気的特性や光学的特性によるランク分けや良品・非良品の選別を安全且つ簡易に行うことができ、検査工程での作業の短縮化が図られることとなる。   As described above, according to the LED package of the present invention, the light emitting part composed of the element electrode pattern and the light emitting element, the dummy electrode pattern electrically isolated from the light emitting part, and the metal imitating the characteristics of the light emitting element Since the inspection unit consisting of thin wires is provided on the same substrate, the test current is passed through the dummy electrode pattern, and the characteristics of the light emitting unit are checked in advance by checking for disconnection / non-disconnection of the metal thin wire at this time. It became possible to detect. As a result, it is possible to safely and easily perform ranking according to electrical characteristics and optical characteristics and selection of non-defective products and non-defective products without degrading the light emitting elements, and shorten the work in the inspection process. It becomes.

なお、本実施形態ではＬＥＤを検査の対象としたが、ＬＥＤ以外の半導体素子を実装したパッケージにも採用することができ、これによって、簡易に電気的特性や信頼性等の検査や選別を行うことができる。   In the present embodiment, the LED is an object to be inspected, but it can also be used for a package on which a semiconductor element other than the LED is mounted, thereby easily inspecting and selecting electrical characteristics and reliability. be able to.

１１ ＬＥＤパッケージ
１２ 基板
１３ 発光部
１４ａ，１４ｂ 検査部
１５ 発光素子
１６ａ，１６ｂ 素子電極パターン
１７ａ，１７ｂ 第１ダミー電極パターン
１８ａ，１８ｂ 第２ダミー電極パターン
１９ａ，１９ｂ ボンディングワイヤ
２０ マザーボード
２１ 第１金属細線
２２ 第２金属細線
２３ 封止体
３１ ＬＥＤパッケージ
３２ 封止体
３３ 封止本体部
３４ 封止枠部
DESCRIPTION OF SYMBOLS 11 LED package 12 Board | substrate 13 Light emission part 14a, 14b Test | inspection part 15 Light emitting element 16a, 16b Element electrode pattern 17a, 17b 1st dummy electrode pattern 18a, 18b 2nd dummy electrode pattern 19a, 19b Bonding wire 20 Motherboard 21 1st metal fine wire 22 2nd metal fine wire 23 Sealing body 31 LED package 32 Sealing body 33 Sealing main-body part 34 Sealing frame part

Claims (13)

基板と、この基板上に形成される一対の素子電極パターンと、前記基板上に実装され一対の素子電極パターンと電気的に接続される発光素子と、この発光素子を封止する封止体とを備えるＬＥＤパッケージにおいて、
前記基板上には、前記一対の素子電極パターンと電気的に独立して設けられる少なくとも一対のダミー電極パターンと、この一対のダミー電極パターン間に配線され、一対のダミー電極パターン間に試験電流を流したときに断線する金属細線とが設けられていることを特徴とするＬＥＤパッケージ。 A substrate, a pair of element electrode patterns formed on the substrate, a light emitting element mounted on the substrate and electrically connected to the pair of element electrode patterns, and a sealing body for sealing the light emitting element; In an LED package comprising:
On the substrate, at least a pair of dummy electrode patterns provided electrically independently of the pair of element electrode patterns, and a wiring between the pair of dummy electrode patterns, and a test current between the pair of dummy electrode patterns. An LED package, comprising: a thin metal wire that is disconnected when flowing. 前記一対のダミー電極パターン間に試験電流を流すことによって、前記発光素子が備えている特性を検査する請求項１に記載のＬＥＤパッケージ。   The LED package according to claim 1, wherein characteristics of the light emitting element are inspected by passing a test current between the pair of dummy electrode patterns. 前記発光素子が備えている特性のうち、検査される特性は、発光素子の電気的特性及び光学的特性のいずれかである請求項２に記載のＬＥＤパッケージ。   The LED package according to claim 2, wherein a characteristic to be inspected among the characteristics of the light emitting element is one of an electrical characteristic and an optical characteristic of the light emitting element. 前記試験電流は、前記発光素子に流し得る最大定格電流値に近い電流値に設定される請求項１に記載のＬＥＤパッケージ。   The LED package according to claim 1, wherein the test current is set to a current value close to a maximum rated current value that can flow through the light emitting element. 前記金属細線は、前記一対のダミー電極パターン間に試験電流を流した時に発生するジュール熱によって溶断する請求項１に記載のＬＥＤパッケージ。   2. The LED package according to claim 1, wherein the thin metal wire is melted by Joule heat generated when a test current is passed between the pair of dummy electrode patterns. 前記一対のダミー電極パターンは、前記一対の素子電極パターンを挟んでその両側にそれぞれ設けられる一対の第１ダミー電極パターンと一対の第２ダミー電極パターンとからなる請求項１に記載のＬＥＤパッケージ。   2. The LED package according to claim 1, wherein the pair of dummy electrode patterns includes a pair of first dummy electrode patterns and a pair of second dummy electrode patterns provided on both sides of the pair of element electrode patterns, respectively. 前記一対の第１ダミー電極パターン間に配線される第１金属細線と、一対の第２ダミー電極パターン間に配線される第２金属細線とは、異なる試験電流値によって断線する請求項６に記載のＬＥＤパッケージ。   The first metal thin wire wired between the pair of first dummy electrode patterns and the second metal thin wire wired between the pair of second dummy electrode patterns are disconnected by different test current values. LED package. 前記異なる試験電流は、一方が前記発光素子に流し得る最大定格電流値に近い値、他方が前記発光素子の定格電流値に近い値に設定される請求項７に記載のＬＥＤパッケージ。   The LED package according to claim 7, wherein the different test currents are set to a value close to a maximum rated current value that can flow through the light emitting element and to a value close to a rated current value of the light emitting element. 前記一対の第１ダミー電極パターン間及び一対の第２ダミー電極パターン間にそれぞれ電流を流したときに、一対の第１ダミー電極パターン間に配線された第１金属細線及び一対の第２ダミー電極パターン間に配線された第２金属細線が断線し又は非断線である場合の導通・非導通状態を検出することで、発光素子の特性がランク分けされる請求項７に記載のＬＥＤパッケージ。   When a current is passed between the pair of first dummy electrode patterns and between the pair of second dummy electrode patterns, a first metal thin wire and a pair of second dummy electrodes wired between the pair of first dummy electrode patterns. The LED package according to claim 7, wherein the characteristics of the light emitting elements are ranked by detecting a conduction / non-conduction state when the second metal thin wires wired between the patterns are broken or not broken. 前記発光素子の特性は、第１金属細線及び第２金属細線のいずれか一方が断線し、又は双方が断線し、あるいは双方とも断線しない場合における導通・非導通状態を検出することで、４段階にランク分けされる請求項９に記載のＬＥＤパッケージ。   The light-emitting element has four characteristics by detecting a conduction / non-conduction state when one of the first metal thin wire and the second metal thin wire is broken, or both are broken, or both are not broken. The LED package according to claim 9, wherein the LED package is ranked. 前記一対のダミー電極パターン及び金属細線は、前記基板の縁部に沿って形成される請求項１又は６に記載のＬＥＤパッケージ。   The LED package according to claim 1, wherein the pair of dummy electrode patterns and the fine metal wires are formed along an edge of the substrate. 前記封止体は、前記素子電極パターン及び発光素子を封止する封止本体部と、この封止本体部の外周に設けられ前記ダミー電極パターン及び金属細線を封止する封止枠部とで形成される請求項１に記載のＬＥＤパッケージ。   The sealing body includes a sealing main body portion that seals the element electrode pattern and the light emitting element, and a sealing frame portion that is provided on an outer periphery of the sealing main body portion and seals the dummy electrode pattern and the thin metal wire. The LED package according to claim 1 formed. 前記封止本体部が透光性の樹脂材で形成され、前記封止枠部が遮光性の樹脂材で形成される請求項１２に記載のＬＥＤパッケージ。   The LED package according to claim 12, wherein the sealing main body portion is formed of a translucent resin material, and the sealing frame portion is formed of a light shielding resin material.
JP2011038482A 2011-02-24 2011-02-24 Led package Pending JP2012175054A (en)

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JP2015103802A (en) * 2013-11-27 2015-06-04 エルジー ディスプレイ カンパニー リミテッド Light emitting diode package, and light source module and backlight unit including the same
US10147856B2 (en) 2014-11-18 2018-12-04 Nichia Corporation Composite substrate, light emitting device, and method of manufacturing the light emitting device

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JP2015103802A (en) * 2013-11-27 2015-06-04 エルジー ディスプレイ カンパニー リミテッド Light emitting diode package, and light source module and backlight unit including the same
EP2879194B1 (en) * 2013-11-27 2019-08-28 LG Display Co., Ltd. Light source module and backlight unit including the same
US10147856B2 (en) 2014-11-18 2018-12-04 Nichia Corporation Composite substrate, light emitting device, and method of manufacturing the light emitting device
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