JPH02134261A - Led array chip - Google Patents

Led array chip

Info

Publication number
JPH02134261A
JPH02134261A JP63288584A JP28858488A JPH02134261A JP H02134261 A JPH02134261 A JP H02134261A JP 63288584 A JP63288584 A JP 63288584A JP 28858488 A JP28858488 A JP 28858488A JP H02134261 A JPH02134261 A JP H02134261A
Authority
JP
Japan
Prior art keywords
light
light emitting
parts
memory
rank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63288584A
Other languages
Japanese (ja)
Inventor
Toshiji Sueyasu
利次 末安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63288584A priority Critical patent/JPH02134261A/en
Publication of JPH02134261A publication Critical patent/JPH02134261A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To easily and surely select a quantity-of-light rank by incorporating a bonding pad for connecting a light emitting part to a wire and a memory part for storing the quantity-of-light rank of the light emitting part. CONSTITUTION:An LED array chip is constituted of light emitting parts 2, bonding pads 1 for connecting the light emitting parts to wires and memory parts 3 for storing the quantity-of-light ranks of the light emitting parts 2. Each of the memory parts 3 is constituted of an aluminum pad part 4 against which a needle allowing a current to flow strikes when the quantity-of-light is written, a contact part 5 constituting a memory cell having memory function and a diffusion part 6 and, when the quantity-of-light rank is written, a current is allowed to flow between each of the pad parts and each rear electrode to fuse a contact part 5. The quantity-of-light rank thus written can be read electrically.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、LEDアレイチップ、特に、LEDプリンタ
に使用するLEDアレイチップに関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an LED array chip, and particularly to an LED array chip used in an LED printer.

〔従来の技術〕[Conventional technology]

従来のLEDアレイチップは、光量ランクの選別を行う
場合、ウェハー状態で光量測定しチップに切断後、光量
ランクごとに選別するのが一般的であった。
When sorting conventional LED array chips by light intensity rank, it is common to measure the light intensity in a wafer state, cut into chips, and then sort by light intensity rank.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

しかしながら、このような上述した従来のLEDアレイ
チップは、光量ランクの選別を行う場合に、光量の測定
データとチップ本体とを別々に管理しなければならない
ため、チップ位置の誤認識等により誤った光量ランクに
選別される可能性があり、しかもその場合の確認は非常
に困難であり、選別に多大の手段を要するという欠点が
ある。
However, with the above-mentioned conventional LED array chips, when sorting the light intensity rank, the light intensity measurement data and the chip body must be managed separately, so there is a risk of errors due to misrecognition of the chip position, etc. There is a possibility that they will be sorted by light intensity rank, and furthermore, in that case, it is very difficult to confirm, and there is a disadvantage that a large amount of means is required for sorting.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のLEDアレイチップは本来の機能である発光に
関与する発光部とは別に外部より電気的方法により、光
量ランクを記憶することのできる記憶部として外部より
電極をたてるためのパッド部と、このパッド部より電流
を流すことにより記°゛憶を行う素子で外部電流により
溶断されるヒユーズ状素子または、絶縁破壊をおこすダ
イオード素子を含んで構成される。
The LED array chip of the present invention has, in addition to the light emitting part that is involved in light emission, which is its original function, a pad part for erecting electrodes from the outside as a storage part that can store the light intensity rank by an external electrical method. , an element that performs storage by passing a current through the pad portion, and includes a fuse-like element that is blown by an external current, or a diode element that causes dielectric breakdown.

〔実施例〕〔Example〕

次に、本発明の実施例について、図面を参照して説明す
る。
Next, embodiments of the present invention will be described with reference to the drawings.

第1図は本発明の一実施例を示す平面図、第2図は第1
図に示す記憶部の詳細平面図である。
Fig. 1 is a plan view showing one embodiment of the present invention, and Fig. 2 is a plan view showing an embodiment of the present invention.
FIG. 3 is a detailed plan view of the storage unit shown in the figure.

第1図に示すLEDアレイチップは発光部2と、この発
光部2をワイヤに接続するためのボリディングパット1
と、発光部2の光量ランクを記憶するための記憶部3と
を含んで構成される。
The LED array chip shown in FIG.
and a storage section 3 for storing the light intensity rank of the light emitting section 2.

記憶部3は、第2図に示すように光量ランクを書き込む
とき電流を流す針のあたるアルミのパッド部4と、記憶
の機能を有する記憶セルを構成するコンタクト部5と、
拡散部6とで構成されている。
As shown in FIG. 2, the memory section 3 includes an aluminum pad section 4 that is touched by a needle through which a current flows when writing a light intensity rank, and a contact section 5 that constitutes a memory cell having a memory function.
It is composed of a diffusion section 6.

この記憶部3に光量ランクを書き込むときには、パッド
部4と裏面電極の間に電流を流しコンタクト部5を溶断
する。
When writing the light intensity rank into the storage section 3, a current is passed between the pad section 4 and the back electrode to melt down the contact section 5.

なお、設計上では、拡散面積を広くしコンタクト部5を
゛小さくして、電流密度を最適化するとよい。
In addition, in terms of design, it is preferable to widen the diffusion area and make the contact portion 5 small to optimize the current density.

いずれにしてもこのような記憶部3は第1図に示すLE
Dアレイチップには4個設けられており、2’=16ラ
ンク分の光量ランクを書き込むことができる。また、こ
のようなパターンを配置することにより、ウェハー状態
で光量を測定後そのまま外部より電流を流し光量ランク
を書き込むことができる。
In any case, such a storage unit 3 is an LE shown in FIG.
The D array chip is provided with four, and can write light quantity ranks for 2'=16 ranks. In addition, by arranging such a pattern, it is possible to write a light intensity rank by directly passing a current from outside after measuring the light intensity in a wafer state.

さらに、このようにして書き込まれた光量ランクは、電
気的に読取可能である。
Furthermore, the light quantity ranks written in this way can be electrically read.

第3図は第2図に示す記憶部の一変形例を示す平面図で
ある。
FIG. 3 is a plan view showing a modified example of the storage section shown in FIG. 2. FIG.

第3図に示す記憶部は、パッド部4と、コンタクト部7
と、拡散部8とを含んで構成される。
The storage section shown in FIG. 3 includes a pad section 4 and a contact section 7.
and a diffusion section 8.

この記憶部は大電流による絶縁破壊を利用するもので、
電流はパッド部4と裏面電極との間に流すが、少ない電
流で破壊が起こるよう拡散面積は小さくしである。
This memory section utilizes dielectric breakdown caused by large currents.
A current is passed between the pad portion 4 and the back electrode, but the diffusion area is kept small so that destruction occurs with a small amount of current.

また、第4図は第2図に示す記憶部の他の変形例である
。第4図に示す記憶部はパッド部4と、ヒユーズ部9と
を含んで構成される。
Further, FIG. 4 shows another modification of the storage section shown in FIG. 2. The storage section shown in FIG. 4 includes a pad section 4 and a fuse section 9.

光量ランクの書き込みは、パッド部4と共通電極の間に
電流を流しヒユーズ部9を溶断させて行う。
Writing of the light intensity rank is performed by passing a current between the pad section 4 and the common electrode to blow out the fuse section 9.

いずれにしても溶断により光量ランクを書き込むヒユー
ズタイプでは、電気的に読取可能であることはもちろん
であるが外観からの目視によっても読取可能である。
In any case, the fuse type, in which the light intensity rank is written by blowing, can not only be read electrically, but also visually from the outside.

〔発明の効果〕〔Effect of the invention〕

本発明のLEDアレイチップは、光量測定と同時に光量
ランクを記憶部に書込むことにより、容易かつ確実に選
別ができるとともに、書込みのための設備の変更は電気
特性チエツク用ブローバに4本程度の針の追加と数十ボ
ルトの電源のコントロールという軽微な変更で充分であ
り、実装時に外部より電気的に光量ランクを読出し、光
量ランクに応じて電流を調整するようにしておけば、光
量調整が容易になるという効果がある。
The LED array chip of the present invention can be easily and reliably sorted by writing the light intensity rank into the storage unit at the same time as the light intensity measurement, and the equipment for writing can be changed by using about four blowers for checking electrical characteristics. A minor change such as adding a needle and controlling the power supply of several tens of volts is sufficient, and if the light intensity rank is read out electrically from the outside at the time of installation and the current is adjusted according to the light intensity rank, the light intensity adjustment is possible. This has the effect of making it easier.

詳細平面図である。It is a detailed plan view.

1・・・・・・ボリディングパット、2・・・・・・発
光部、3・・・・・・記憶部、4・・・・・・パッド部
、5,7・・・・・・コンタクト部、6,8・・・・・
・拡散部、9・・・・・・ヒユーズ部。
1... Bolding pad, 2... Light emitting part, 3... Memory part, 4... Pad part, 5, 7... Contact part, 6, 8...
- Diffusion part, 9...Fuse part.

Claims (1)

【特許請求の範囲】[Claims] 発光部と、前記発光部をワイヤに接続するためのボリデ
ィングパットと、前記発光部の光量ランクを書き込むた
めの記憶部とを含むことを特徴とするLEDアレイチッ
プ。
An LED array chip comprising: a light emitting section; a bollarding pad for connecting the light emitting section to a wire; and a storage section for writing a light intensity rank of the light emitting section.
JP63288584A 1988-11-14 1988-11-14 Led array chip Pending JPH02134261A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63288584A JPH02134261A (en) 1988-11-14 1988-11-14 Led array chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63288584A JPH02134261A (en) 1988-11-14 1988-11-14 Led array chip

Publications (1)

Publication Number Publication Date
JPH02134261A true JPH02134261A (en) 1990-05-23

Family

ID=17732162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63288584A Pending JPH02134261A (en) 1988-11-14 1988-11-14 Led array chip

Country Status (1)

Country Link
JP (1) JPH02134261A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012175054A (en) * 2011-02-24 2012-09-10 Citizen Electronics Co Ltd Led package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012175054A (en) * 2011-02-24 2012-09-10 Citizen Electronics Co Ltd Led package

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