JP2012164956A5 - - Google Patents
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- Publication number
- JP2012164956A5 JP2012164956A5 JP2011223051A JP2011223051A JP2012164956A5 JP 2012164956 A5 JP2012164956 A5 JP 2012164956A5 JP 2011223051 A JP2011223051 A JP 2011223051A JP 2011223051 A JP2011223051 A JP 2011223051A JP 2012164956 A5 JP2012164956 A5 JP 2012164956A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- support device
- component support
- placement region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims 11
- 150000001721 carbon Chemical group 0.000 claims 2
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 239000002041 carbon nanotube Substances 0.000 claims 1
- 229910021393 carbon nanotube Inorganic materials 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 229910003472 fullerene Inorganic materials 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 239000002114 nanocomposite Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011223051A JP5709719B2 (ja) | 2011-01-18 | 2011-10-07 | 電子部品支持装置及び電子デバイス |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011007519 | 2011-01-18 | ||
| JP2011007519 | 2011-01-18 | ||
| JP2011223051A JP5709719B2 (ja) | 2011-01-18 | 2011-10-07 | 電子部品支持装置及び電子デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012164956A JP2012164956A (ja) | 2012-08-30 |
| JP2012164956A5 true JP2012164956A5 (enrdf_load_stackoverflow) | 2014-10-23 |
| JP5709719B2 JP5709719B2 (ja) | 2015-04-30 |
Family
ID=46844012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011223051A Active JP5709719B2 (ja) | 2011-01-18 | 2011-10-07 | 電子部品支持装置及び電子デバイス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5709719B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014034024A1 (ja) | 2012-08-30 | 2014-03-06 | パナソニック株式会社 | 電子部品パッケージおよびその製造方法 |
| CN104335343A (zh) | 2012-09-05 | 2015-02-04 | 松下知识产权经营株式会社 | 半导体装置及其制造方法 |
| US9524917B2 (en) * | 2014-04-23 | 2016-12-20 | Optiz, Inc. | Chip level heat dissipation using silicon |
| WO2020004459A1 (ja) * | 2018-06-26 | 2020-01-02 | 京セラ株式会社 | 電子素子搭載用基板、電子装置および電子モジュール |
| CN114614228A (zh) * | 2020-12-09 | 2022-06-10 | 深南电路股份有限公司 | 耦合器及电子设备 |
| JP2024075487A (ja) * | 2022-11-22 | 2024-06-03 | アブソリックス インコーポレイテッド | パッケージング基板及びこれを含む半導体パッケージ |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008294253A (ja) * | 2007-05-25 | 2008-12-04 | Ngk Spark Plug Co Ltd | 発光素子実装用配線基板 |
| JP2009117489A (ja) * | 2007-11-02 | 2009-05-28 | Sharp Corp | 半導体素子パッケージ及び実装基板 |
| JP5357706B2 (ja) * | 2009-11-10 | 2013-12-04 | パナソニック株式会社 | 半導体実装構造体 |
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2011
- 2011-10-07 JP JP2011223051A patent/JP5709719B2/ja active Active