JP2012162650A5 - - Google Patents

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Publication number
JP2012162650A5
JP2012162650A5 JP2011024149A JP2011024149A JP2012162650A5 JP 2012162650 A5 JP2012162650 A5 JP 2012162650A5 JP 2011024149 A JP2011024149 A JP 2011024149A JP 2011024149 A JP2011024149 A JP 2011024149A JP 2012162650 A5 JP2012162650 A5 JP 2012162650A5
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JP
Japan
Prior art keywords
resin composition
conductive resin
powder
magnesium oxide
inorganic oxide
Prior art date
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Application number
JP2011024149A
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English (en)
Japanese (ja)
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JP2012162650A (ja
JP5795168B2 (ja
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Priority to JP2011024149A priority Critical patent/JP5795168B2/ja
Priority claimed from JP2011024149A external-priority patent/JP5795168B2/ja
Publication of JP2012162650A publication Critical patent/JP2012162650A/ja
Publication of JP2012162650A5 publication Critical patent/JP2012162650A5/ja
Application granted granted Critical
Publication of JP5795168B2 publication Critical patent/JP5795168B2/ja
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JP2011024149A 2011-02-07 2011-02-07 熱伝導性樹脂組成物及び半導体パッケージ Active JP5795168B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011024149A JP5795168B2 (ja) 2011-02-07 2011-02-07 熱伝導性樹脂組成物及び半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011024149A JP5795168B2 (ja) 2011-02-07 2011-02-07 熱伝導性樹脂組成物及び半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2012162650A JP2012162650A (ja) 2012-08-30
JP2012162650A5 true JP2012162650A5 (enrdf_load_stackoverflow) 2013-11-07
JP5795168B2 JP5795168B2 (ja) 2015-10-14

Family

ID=46842362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011024149A Active JP5795168B2 (ja) 2011-02-07 2011-02-07 熱伝導性樹脂組成物及び半導体パッケージ

Country Status (1)

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JP (1) JP5795168B2 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015059130A (ja) 2013-09-17 2015-03-30 明和化成株式会社 エポキシ樹脂組成物、その用途及びエポキシ樹脂組成物用充填材
JP6156061B2 (ja) * 2013-10-29 2017-07-05 株式会社デンソー 送風装置
JP6879690B2 (ja) 2016-08-05 2021-06-02 スリーエム イノベイティブ プロパティズ カンパニー 放熱用樹脂組成物、その硬化物、及びこれらの使用方法
JP6335374B2 (ja) * 2017-07-25 2018-05-30 明和化成株式会社 エポキシ樹脂組成物及びその用途
EP4299161A4 (en) * 2021-02-25 2024-08-28 Mitsubishi Gas Chemical Company, Inc. Oxygen scavenger powder

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185474A (ja) * 1984-10-03 1986-05-01 Daicel Chem Ind Ltd 熱伝導性樹脂組成物
JPH0710939B2 (ja) * 1985-07-17 1995-02-08 宇部興産株式会社 電子部品封止用樹脂組成物
JPS62135516A (ja) * 1985-12-09 1987-06-18 Polyplastics Co 電気部品封止剤
JPH01236270A (ja) * 1988-03-17 1989-09-21 Showa Denko Kk 樹脂組成物
JPH08143781A (ja) * 1994-11-22 1996-06-04 Sumitomo Bakelite Co Ltd 熱硬化性樹脂組成物
JPH08157693A (ja) * 1994-12-06 1996-06-18 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JPH11260839A (ja) * 1998-03-16 1999-09-24 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート
JP2002038010A (ja) * 2000-07-26 2002-02-06 Idemitsu Petrochem Co Ltd 電気絶縁・放熱部品用成形材料及びそれを用いた画像形成装置用部品
JP3995421B2 (ja) * 2001-01-19 2007-10-24 株式会社ルネサステクノロジ 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
JP5507477B2 (ja) * 2011-01-20 2014-05-28 パナソニック株式会社 半導体封止用エポキシ樹脂組成物および半導体装置

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