JP2012150780A - Input device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an input device which can reduce influence of a level difference between wiring layers and improve flatness of a surface.SOLUTION: An input device has: a first transparent base material 20 and a second transparent base material 30 which are arranged face-to-face with a space between them; a first transparent electrode layer 21 and a second transparent electrode layer 31 which are formed in input areas on opposing surfaces of the first transparent base material 20 and the second transparent base material 30, respectively; a first wiring layer 22 and a second wiring layer 32 which are formed by being connected with the first transparent electrode layer 21 and the second transparent electrode layer 31 in non-input areas surrounding the input areas, respectively; and an adhesive layer 51 which bonds the first transparent base material 20 and the second transparent base material 30 laminated in the non-input areas. In an area in which the adhesive layer 51 is laminated, a first level difference part 25 formed by the first transparent base material 20 and the first wiring layer 22 and a second level difference part 35 formed by the second transparent base material 30 and the second wiring layer 32 are arranged with a predetermined interval in planar view.

Description

  The present invention relates to an input device, and more particularly to an input device in which a pair of transparent substrates are bonded via an adhesive layer.

  Currently, as a display unit of a portable electronic device or the like, a translucent input device for inputting coordinates by directly operating a menu item or object of a display image with a finger or the like is used. There are various methods for operating such an input device. For example, a resistance film type input device described in Patent Document 1 is known.

  In the resistance film type input device, a pair of transparent base materials are arranged to face each other with a space, and are bonded via an adhesive layer. A transparent electrode film is formed on each of the input areas of the opposing surfaces of the pair of transparent substrates, and a wiring layer for outputting input position information is formed on the non-input area surrounding the input area. When an arbitrary part of the input area is pressed during an input operation of the resistance film type input device, a pair of transparent electrode films come into contact with each other, and input position information can be detected by reading a resistance value change at the contact point. it can.

  Patent Document 1 discloses a resistance film type input device that can cope with a narrow frame. In the input device of Patent Document 1, wiring layers are arranged so as to surround an input region in a pair of transparent base materials, and each wiring layer is configured to overlap in a plan view. Then, by providing an insulating sheet between the opposing wiring layers, a short circuit between the wiring layers is prevented, and the frame is narrowed.

  However, the step formed by the wiring layer is not taken into account, and the effect of the step between the wiring layer and the transparent substrate becomes large when a pair of transparent substrates are bonded together. In some cases, unevenness was reflected on the surface side. Such irregularities are directly visible to the operator, which causes the appearance quality of the input device surface to be impaired. In order to prevent this, there is a method of flattening the surface of the input device by laminating a step between the wiring layer and the transparent substrate by laminating a flattening layer having a thickness equivalent to the wiring layer in the non-input region. It was examined.

  FIG. 12 shows (a) a partial enlarged plan view of the first transparent base material 120 and (b) a partial enlarged plan view of the second transparent base material 130 for the input device 110 of the prior art. As shown in FIG. 12A, the first wiring layer 122 connected to the first transparent electrode layer 121 is drawn out to a connecting portion 122b with an FPC (Flexible Printed Circuit). In the non-input region of the first transparent base material 120, a metal first planarization layer 123 is laminated in order to relax the step between the first wiring layer 122 and the first transparent base material 120. Further, as shown in FIG. 12B, the second wiring layer 132 connected to the second transparent electrode layer 131 is drawn out to the connecting portion 132b with the FPC. Also in the non-input region of the second transparent base material 130, the metal second planarization layer 133 is laminated. Thus, by providing the planarization layer in the non-input region of each base material, when the first transparent base material 120 and the second transparent base material 130 are bonded together, the portion where the wiring layer is formed and the wiring layer are Lamination can be performed with a substantially constant gap between the base materials in the portion where the film is not formed.

JP 2004-234268 A

  However, as shown in FIGS. 12A and 12B, it is necessary to ensure electrical insulation with a predetermined gap between the wiring layer and the planarization layer. This is because if the planarization layer and the wiring layer are electrically connected, they will be susceptible to electromagnetic noise from electronic devices, etc., which may cause malfunction and make it impossible to accurately detect input position information. It is because there is sex.

  FIG. 13 is a partial cross-sectional enlarged view of the input device 110 cut at a position corresponding to the line XIII-XIII in FIGS. 12A and 12B, and in particular, the distance between the planarization layer and the wiring layer. It is a figure shown about the vicinity. As shown in FIG. 13, in the conventional input device 110, the first transparent base material 120 and the second transparent base material 130 are bonded via an adhesive layer 151. Compared with the region where each wiring layer and each planarizing layer are formed, in the region where each wiring layer and each planarizing layer are not formed, the distance between the layers bonded by the adhesive layer 151 is large. Therefore, in the area where each wiring layer and each planarizing layer are not formed, the first transparent base material 120 is pulled toward the second transparent base material 130 with a greater force due to the viscoelasticity of the adhesive layer 151. In some cases, a dent was generated on the surface of the device 110. Since the input device 110 is stacked on a display device and used in a display unit of an electronic device or the like, the unevenness on the surface of the input device 110 may become a defect in appearance quality, and further improvement is necessary.

  An object of the present invention is to solve the above-described problems, and to provide an input device capable of reducing the influence of a step of a wiring layer and improving the flatness of a surface.

  The input device of the present invention includes a first transparent base material and a second transparent base material, which are arranged to face each other with a space, and input regions on opposing surfaces of the first transparent base material and the second transparent base material, respectively. First wiring formed by connecting the first transparent electrode layer and the second transparent electrode layer, and the first transparent electrode layer and the second transparent electrode layer, respectively, in the non-input region surrounding the input region. A layer and a second wiring layer, and an adhesive layer that adheres the first transparent base material and the second transparent base material stacked in the non-input region, and in the region where the adhesive layer is stacked, The first step portion formed by the first transparent base material and the first wiring layer and the second step portion formed by the second transparent base material and the second wiring layer are in plan view. It is characterized by being formed with a predetermined interval.

  According to this, since the first step portion and the second step portion are formed with a predetermined interval in a plan view, the gap between the substrates bonded by the adhesive layer can be reduced. Therefore, the influence of the level difference of the wiring layer can be reduced, and the flatness of the surface of the input device can be improved when the substrates are bonded via the adhesive layer.

  In the input device of the present invention, a first planarization layer is disposed in the non-input region of the first transparent base material with a predetermined distance from the first wiring layer, and the second transparent In the non-input area of the base material, a second planarizing layer is disposed with a predetermined interval from the second wiring layer, and is formed by the opposing first wiring layer and the first planarizing layer. It is preferable that the formed first recess and the second recess formed by the opposing second wiring layer and the second planarization layer are formed with a predetermined interval in plan view. . According to this, a wiring layer or a planarization layer is formed at a location facing the first recess in the second transparent substrate, and a wiring layer is also formed at a location facing the second recess in the first transparent substrate. Alternatively, a planarization layer is formed. Therefore, the gap between the substrates bonded by the adhesive layer is reduced, and the influence of each recess can be reduced, so that the flatness of the input device surface can be further improved. Furthermore, since the planarization layer is arranged with a predetermined distance from each wiring layer, it is less susceptible to the influence of external electromagnetic noise.

  In the input device according to the aspect of the invention, the first wiring layer has a protruding portion that faces the first planarizing layer, and the first planarizing layer has a notch that faces the protruding portion, and the opposing It is preferable that the first recess is formed by the protruding portion and the cutout portion. According to this, the first recess and the second recess can be formed with a predetermined interval in plan view without increasing the area of the non-input region of the first transparent substrate. Therefore, it is possible to realize a narrow frame of the input device, reduce the influence of the concave portion, and improve the flatness of the surface of the input device.

  The second wiring layer has a protrusion toward the second planarization layer, the second planarization layer has a notch facing the protrusion, and the protrusion and the notch facing each other. Thus, the second recess can be formed. According to this, the first recess and the second recess can be formed with a predetermined interval in plan view without increasing the area of the non-input region of the second transparent base material. Accordingly, it is possible to realize a narrow frame of the input device, reduce the influence of the concave portion, and improve the flatness of the surface of the input device.

  In the input device according to the aspect of the invention, at least one of the first wiring layer and the second wiring layer may be disposed on at least one of the first planarization layer and the second planarization layer in a region where the adhesive layer is stacked. And has at least one of the first planarization layer and the second planarization layer having a sloped portion facing the taper, and the tip is formed so as to be inclined toward the surface. It is preferable that the detail and the inclined portion are formed with a predetermined interval. If it carries out like this, a 1st recessed part and a 2nd recessed part can be formed providing a predetermined space | interval by planar view, and the flatness of the input device surface can be improved. In addition, since the tapered portion and the inclined portion are provided, generation of a saddle phenomenon due to screen printing can be suppressed, so that flatness can be improved more effectively.

  It is preferable that the tapered portion is formed at an inclination angle of 30 degrees to 60 degrees facing at least one of the first planarization layer and the second planarization layer. According to this, it is possible to form the taper without increasing the area of the non-input region, and it is possible to more reliably suppress the occurrence of the saddle phenomenon and improve the flatness of the input device surface.

  In the input device of the present invention, it is preferable that the planarizing layer is formed of the same material as the wiring layer. According to this, since the planarization layer and the wiring layer can be formed in the same process, the manufacturing process of the input device can be simplified and the manufacturing cost can be reduced. In addition, since the wiring layer and the planarization layer can be easily formed to have the same thickness, the flatness of the input device surface can be improved. Furthermore, when a transparent base material is bonded through an adhesive layer, it becomes possible to ensure good adhesion over the outer periphery of the base material.

  According to the input device of the present invention, since the first step portion and the second step portion are formed with a predetermined interval in a plan view, the gap between the substrates to be bonded with the adhesive layer can be reduced. it can. Therefore, the influence of the level difference of the wiring layer can be reduced, and the flatness of the surface of the input device can be improved when the substrates are bonded via the adhesive layer.

1 is a perspective view of an input device according to a first embodiment of the present invention. It is a disassembled perspective view of the input device in the 1st Embodiment of this invention. It is sectional drawing of the input device cut | disconnected by the III-III line | wire of FIG. It is a top view of the 1st transparent substrate in the input device of a 1st embodiment. It is a top view of the 2nd transparent substrate in the input device of a 1st embodiment. FIG. 6 is a partially enlarged cross-sectional view of the input device taken along a line corresponding to line VI-VI in FIGS. 4 and 5. It is the elements on larger scale of (a) 1st transparent base material and (b) 2nd transparent base material in 2nd Embodiment. It is sectional drawing of the input device cut | disconnected by the VIII-VIII line | wire of Fig.7 (a) and FIG.7 (b). It is the elements on larger scale of (a) 1st transparent base material and (b) 2nd transparent base material which show the modification of 2nd Embodiment. It is the elements on larger scale of (a) 1st transparent base material and (b) 2nd transparent base material which show another modification of 2nd Embodiment. It is a partial expanded sectional view of an input device showing a 3rd embodiment. It is the partial enlarged plan view of the (a) 1st transparent base material of the input device of a prior art example, and the (b) partial enlarged plan view of a 2nd transparent base material. It is the elements on larger scale of the input device cut | disconnected in the location corresponding to the XIII-XIII line | wire of FIG. It is a cross-sectional schematic diagram for demonstrating the subject in the conventional input device.

<First Embodiment>
Hereinafter, an input device 10 according to a first embodiment of the present invention will be described with reference to the drawings. In addition, in order to make the drawing easy to see, the ratio of dimensions of each component is appropriately changed.

  FIG. 1 is a perspective view of the input device 10 of the present embodiment, and FIG. 2 is an exploded perspective view of the input device 10. As shown in FIGS. 1 and 2, in the input device 10 of the present embodiment, a first transparent substrate 20 and a second transparent substrate 30 are laminated via an adhesive layer 51, and the first transparent substrate 20 The decorative sheet 40 is laminated on the input surface side with an adhesive layer 50 interposed therebetween.

  As shown in FIG. 2, a first transparent electrode layer 21 and a second transparent electrode for detecting input position information are provided in the input region 11 on the opposing surfaces of the first transparent substrate 20 and the second transparent substrate 30. Electrode layers 31 are stacked. A first wiring layer 22 for outputting input position information is laminated on the non-input area 12 of the first transparent base material 20 and is electrically connected to the first transparent electrode layer 21. Similarly, a second wiring layer 32 is formed in the non-input region 12 of the second transparent substrate 30, and the second wiring layer 32 is electrically connected to the second transparent electrode layer 31.

  Moreover, as shown in FIG.1 and FIG.2, the decorating sheet 40 is laminated | stacked through the adhesion layer 50 on the input surface side of the 1st transparent base material 20, and the non-input area | region 12 of the decorating sheet 40 is laminated | stacked. Is formed by coloring the decorative layer 41. The decorative sheet 40 constitutes an input surface of the input device 10 and has an effect of shielding the wiring layer of each transparent base material by the decorative layer 41 so that the operator does not directly recognize the wiring layer. In addition, a pattern, a mark, a character, or the like other than coloring may be drawn on the decorative layer 41, and it is possible to constitute a part of the design of the mounted electronic device. For the decorative sheet 40, a film-like transparent resin material such as PET can be used. In the present embodiment, a PET film having a thickness of about 130 μm is used.

  3 is a cross-sectional view of the input device 10 taken along line III-III in FIG. As shown in FIG. 3, the first transparent substrate 20 and the second transparent substrate 30 are arranged so that the transparent electrode layers face each other with a predetermined interval, and are laminated on the non-input region 12. The adhesive layer 51 is adhered through the adhesive layer 51.

  During an input operation of the input device 10, when an arbitrary portion of the input surface is pressed with a finger or a pen-shaped input device, the flexible first transparent substrate 20 is bent and the first transparent electrode layer 21 and the first transparent electrode layer 21 are 2 The transparent electrode layer 31 comes into contact. A voltage is applied to the first transparent electrode layer 21 in the Y1-Y2 direction, and when each transparent electrode layer comes into contact with the pressing operation, a potential gradient is generated in the Y1-Y2 direction, whereby the Y coordinate can be detected. . Similarly, a voltage is applied to the second transparent electrode layer 31 in the X1-X2 direction, and the X coordinate can be detected by a potential gradient generated by the contact of the transparent electrode layer.

  The first transparent base material 20 disposed on the input surface side is a film-like material that can be deformed by an input operation, and for example, a transparent resin material such as PET (polyethylene terephthalate) is used. The thickness is about 100 μm to 200 μm. The second transparent substrate 30 is formed of a transparent resin, and for example, a resin material such as PC (polycarbonate), PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PMMA (polymethyl methacrylate resin) is used. it can. The thickness is formed to be about 0.5 mm to 2.0 mm so as to have a strength capable of supporting the deformation of the first transparent substrate 20 by the pressing operation.

  Further, as the second transparent base material 30, a film-like transparent resin material made of PET or the like may be used similarly to the first transparent base material 20. In that case, it is necessary to separately provide a support member for supporting the pressing operation and to laminate the second transparent substrate 30. A transparent resin material having a thickness of about 0.5 mm to 2.0 mm can be used for the support member.

The first transparent electrode layer 21 and the second transparent electrode layer 31 formed on the first transparent substrate 20 and the second transparent substrate 30 are both ITO (Indium Tin Oxide) having translucency in the visible light region, A transparent conductive material such as SnO ₂ or ZnO is used, and the film is formed by sputtering or vapor deposition. The thickness is 0.01 μm to 0.05 μm, for example, about 0.02 μm. In addition to the sputtering method and the vapor deposition method, a film on which a transparent electrode film is formed in advance is prepared, and the film can be formed by a method in which only the transparent electrode film is transferred to a base material or a method in which a liquid raw material is applied. Is possible.

  The first wiring layer 22 and the second wiring layer 32 formed in the non-input area 12 of the first transparent base material 20 and the second transparent base material 30 are made by screen printing using a conductive paste such as copper or silver. And a printing method such as an ink jet printing method. Each wiring layer can be formed with a thickness of about 5 μm to 40 μm.

  Next, the configuration of each wiring layer of the input device 10 according to the first embodiment of the present invention and the configuration of a planarization layer provided to alleviate the step between each wiring layer and the transparent substrate will be described.

  FIG. 4 shows a plan view of the first transparent substrate 20, and FIG. 5 shows a plan view of the second transparent substrate 30. 4 and 5 are both plan views when viewed from the input surface side of the input device 10.

  As shown in FIG. 4, in the non-input area 12 of the first transparent substrate 20, a first wiring layer 22 composed of a plurality of wiring portions is formed so as to surround the input area 11. The first wiring layer 22 extends in the X1-X2 direction and extends in the Y1-side wiring portions 22c and 22g and the Y1-side wiring portion 22d and extends in the X1-X2 direction. The X2-side wiring part 22e and the dummy wiring part 22f are formed. The non-input area 12 on the Y1 side is provided with a connection portion 22b for outputting input position information, and is connected to a circuit board such as an FPC (Flexible Printed Circuit). The Y1-side wiring part 22c electrically connects the first transparent electrode layer 21 and the connection part 22b. Also. The Y2 side wiring part 22d connects the first transparent electrode layer 21 and the connection part 22b via the X2 side wiring part 22e and the Y1 side wiring part 22g. The dummy wiring portion 22f formed in the non-input area 12 on the X1 side is provided in order to keep the distance between the transparent base materials constant over the outer periphery of the non-input area 12. Although the dummy wiring part 22f can be formed separately from the first wiring layer 22, it is actually formed in one process using the same material for the dummy wiring part 22f and the first wiring layer 22. Is. If it carries out like this, the manufacturing man-hour of the input device 10 can be simplified and manufacturing cost can be suppressed.

  As shown in FIG. 4, in the non-input region 12 on the Y1 side of the first transparent base material 20, the first planarizing layer 23 is relaxed in order to reduce the step between the first wiring layer 22 and the first transparent base material 20. Is provided. The first planarization layer 23 is formed with a thickness equivalent to that of the first wiring layer 22, and the step of the first wiring layer 22 can be reduced. In addition, at the X1 side end of the Y1 side wiring portion 22c of the first wiring layer 22, a protruding portion 22a toward the first planarizing layer 23 is formed, and the first planarizing layer 23 is spaced from the protruding portion 22a. A notch 23a is formed so as to face each other. A first recess 24 is formed by the protrusion 22a and the cutout 23a.

  As shown in FIG. 5, a second wiring layer 32 composed of a plurality of wiring portions is formed in the non-input area 12 of the second transparent substrate 30 so as to surround the input area 11. The X1-side wiring part 32c is formed to extend in the Y1-Y2 direction in the non-input area 12 on the X1 side, and the X2-side wiring part 32d extends in the Y1-Y2 direction in the non-input area 12 on the X2 side. Is formed. The X1 side wiring part 32 c and the X2 side wiring part 32 d are electrically connected to the second transparent electrode layer 31. The non-input area 12 on the Y1 side has a connection portion 32b for connecting to the FPC. The X1 side wiring portion 32c is connected to the connection portion 32b via the Y1 side wiring portion 32e, and the X2 side The wiring part 32d is connected to the connection part 32b via the Y1-side wiring part 32f. Further, the dummy wiring portion 32g formed in the non-input area 12 on the Y2 side is provided in order to make the distance between the transparent base materials constant over the outer periphery of the non-input area 12. The dummy wiring part 32g may be provided separately from the second wiring layer 32, but it is preferable to form the dummy wiring part 32g in one process using the same material as the second wiring layer 32, and the manufacturing process of the input device 10 The manufacturing cost can be reduced.

  As shown in FIG. 5, in the non-input region 12 on the Y1 side of the second transparent base material 30, the second flattening layer 33 is provided to alleviate the step between the second wiring layer 32 and the second transparent base material 30. Is provided. By forming the second planarizing layer 33 with a thickness equivalent to that of the second wiring layer 32, the step with the second wiring layer 32 can be reduced. In the second transparent substrate 30, the X1 side end portion of the Y1 side wiring portion 32 e of the second wiring layer 32 and the second planarizing layer 33 facing the Y1 side wiring portion 32 e with a predetermined distance are second. A recess 34 is formed.

  The first planarization layer 23 and the second planarization layer 33 are preferably formed using the same material as the first wiring layer 22 and the second wiring layer 32 in the same process. According to this, the manufacturing process of the input device 10 can be simplified and the manufacturing cost can be reduced. The first planarization layer 23 and the second planarization layer 33 can be formed by a printing method such as a screen printing method or an ink jet printing method, as with each wiring layer. By forming in the same printing process, it is possible to easily form each wiring layer and each planarizing layer with the same thickness, so that the flatness of the surface of the input device 10 can be improved. In addition, as shown in FIG. 2, the first transparent base material 20 and the second transparent base material 30 are bonded via an adhesive layer 51 arranged along the outer edge of the base material. By forming the layer and each wiring layer with the same material, it is possible to ensure good adhesion over the outer periphery of the substrate.

  In the present embodiment, the first wiring layer 22 and the first planarization layer 23 are formed with a thickness of about 10 μm to 30 μm, and the second wiring layer 32 and the second planarization layer 33 are about 10 μm to 30 μm. Is formed.

  In addition, if each wiring layer and each planarization layer are electrically connected, it becomes easy to be affected by electromagnetic noise from an external electronic device or the like, and the input device 10 malfunctions and inputs position information. There is a possibility that it cannot be detected accurately. Therefore, it is preferable that each planarization layer and each wiring layer are formed with a predetermined interval to ensure electrical insulation. It is preferable that the distance between the first planarization layer 23 and the first wiring layer 22 and the distance between the second planarization layer 33 and the second wiring layer 32 are about 0.5 mm to 2.0 mm, respectively. When the interval is smaller than 0.5 mm, the wiring layer and the planarizing layer may come into contact with each other due to printing displacement or sagging in the printing process, which is not preferable. On the other hand, if it is larger than 2.0 mm, the area of the non-input region 12 becomes large, and it is difficult to reduce the size of the input device 10.

  FIG. 6 is a partially enlarged cross-sectional view of the input device 10 cut at a position corresponding to the line VI-VI in FIGS. 4 and 5, and in particular, a cross section near the recess formed by the wiring layer and the planarizing layer. The figure is shown. As shown in FIG. 6, the first transparent substrate 20 and the second transparent substrate 30 are bonded via an adhesive layer 51. Although not particularly illustrated, the adhesive layer 51 is a double-sided tape having a configuration in which an adhesive material made of an acrylic transparent resin is laminated on both surfaces of a transparent resin base material such as PET. The adhesive layer 51 is made of an adhesive material having viscoelasticity so that the step can be absorbed and bonded, but the size of the step that can be actually absorbed is relative to the thickness of the adhesive layer 51. About 1/3. Although the step absorption performance can be improved by increasing the thickness of the adhesive layer 51, it is difficult to make the input device 10 thinner. Moreover, since the distance between transparent base materials increases, input resistance at the time of operation may become large. Therefore, it is desired to achieve good flatness of the surface of the input device 10 by using the adhesive layer 51 as thin as possible.

  In this embodiment, as shown in FIG. 4, the 1st recessed part 24 is formed of the protrusion part 22a and the notch part 23a which oppose. Further, as shown in FIG. 5, the second wiring layer 32 includes the X1 side end portion of the Y1 side wiring portion 32e and the flattening layer 33 facing the Y1 side wiring portion 32e with a predetermined interval. A recess 34 is formed. As shown in FIG. 6, the first recess 24 and the second recess 34 are formed with a predetermined interval in plan view.

  In the region where the recesses are formed, the gap between the substrates bonded by the adhesive layer 51 becomes large, so the first transparent substrate 20 and the decorative sheet 40 that are film-like materials are pulled by the adhesive layer 51 and deformed. It becomes easy. However, in the present embodiment, the second planarization layer 33 is provided facing the first recess 24, and the first wiring layer 22 is provided facing the second recess 34, so that the adhesive layer The gap between the substrates bonded at 51 can be reduced, and the influence of the steps of the first recess 24 and the second recess 34 can be reduced. Thereby, the steps of the first recess 24 and the second recess 34 are absorbed by the viscoelasticity of the adhesive layer 51, respectively, and the unevenness on the surface of the input device 10 can be reduced to an invisible level. The flatness of the film can be improved.

  The distance between the first recess 24 and the second recess 34 is preferably about 0.1 mm to 2.0 mm. As the distance between the first recess 24 and the second recess 34 is increased, the step absorbability by the adhesive layer 51 can be improved. However, if the distance is larger than 2.0 mm, there is a possibility that the input device 10 may be downsized. There is. Therefore, when the distance between the first planarizing layer 23 and the first wiring layer 22 is 0.8 mm, the protruding amount of the protruding portion 22a is formed to be about 0.9 mm to 2.8 mm.

  In the present embodiment, the Y1 side wiring portion 22c of the first wiring layer 22 may be formed so as to increase in width toward the first planarization layer 23 without providing the protruding portion 22a. Also by this, the 1st recessed part 24 and the 2nd recessed part 34 can be formed with a predetermined space | interval by planar view. However, if the width of the Y1 side wiring portion 22c is increased, the area of the non-input region 12 on the Y1 side is increased, which is a problem in reducing the size of the input device 10. By providing the protrusion 22a and the notch 23a opposite to the protrusion 22a as in the present embodiment, it is possible to improve the flatness of the surface of the input device 10 without increasing the area of the non-input region 12. Become.

  As shown in FIG. 4, when a plurality of wiring parts (Y1 side wiring parts 22c, 22g) are arranged in parallel in the first transparent substrate 20, the opposing Y1 side wiring part 22c and the Y1 side wiring are arranged. A recess is formed by the portion 22g, and a recess is formed by the Y1-side wiring portion 22g and the first planarization layer 23. As shown in FIG. 5, in the second transparent substrate 30, a protruding portion 32 a toward the second planarization layer 33 is formed at the X2 side end portion of the Y1 side wiring portion 32 f of the second wiring layer 32. The second planarizing layer 33 is formed with a notch 33a so as to face the protruding portion 32a with a gap. The protrusion 32a and the notch 33a form a recess. By so doing, the concave portions can be formed with a predetermined interval in plan view, and the steps of the concave portions can be absorbed by the viscoelasticity of the adhesive layer 51. Therefore, even when a plurality of wiring layers are arranged in parallel, according to the present invention, it is possible to reduce the influence of the recess and improve the flatness of the input device 10.

<Second Embodiment>
7A and 7B are partial enlarged plan views of (a) the first transparent base material 20 and (b) the second transparent base material 30 in the second embodiment. FIG. 8 shows the VIII in FIG. 7 when the input device 10 is assembled by laminating the first transparent base material 20 and the second transparent base material 30 shown in FIGS. 7 (a) and 7 (b). Sectional drawing of the input device 10 cut | disconnected by the -VIII line is shown.

  As shown in FIG. 7A, in the first transparent substrate 20, the first wiring layer 22 is formed so as to surround the input region 11, and the first wiring layer is formed in the non-input region 12 on the Y1 side. A first planarization layer 23 is formed to alleviate the step between 22 and the first transparent substrate 20. As shown in FIG. 7A, the first wiring layer 22 includes a plurality of wiring portions, and extends in the X1-X2 direction and is arranged in the non-input region 12 on the Y1 side. And the first planarization layer 23 are formed at a predetermined interval. Similarly, the Y1-side wiring portion 22g and the first planarization layer 23 are formed with a predetermined interval. A first recess 24 is formed by the first wiring layer 22 and the first planarization layer 23 facing each other.

  As shown in FIG. 7B, the second transparent base material 30 is formed with a second wiring layer 32 so as to surround the input area 11, and the non-input area on the Y1 side of the second transparent base material 30. 12 is provided with a second planarization layer 33 in order to relax the step between the second wiring layer 32 and the second transparent substrate 30. As shown in FIG. 7B, a tapered portion 32h is formed at the X1 side end of the Y1 side wiring portion 32e of the second wiring layer 32 so as to incline toward the second planarization layer 33. . The second planarizing layer 33 is formed with an inclined portion 33h facing the tapered portion 32h, and the tapered portion 32h and the inclined portion 33h are formed at a predetermined interval. Thereby, the 2nd recessed part 34 is formed. Similarly, a tip 32h is formed at the end of the Y2 side wiring layer 32f on the X2 side, and a second recess 34 is formed by an inclined portion 33h facing the tip 32h.

  As shown in FIG. 7 (a), the first recess 24 is formed along the X1-X2 direction, while the second recess 34 is formed inclined as shown in FIG. 7 (b). Yes. Therefore, as shown in FIG. 8, the first recess 24 and the second recess 34 are formed with a predetermined interval in plan view. That is, a tapered portion 32 h is formed at a location facing the first recess 24, and a first planarizing layer 23 is formed at a location facing the second recess 34. Thereby, the gap between the base materials bonded by the adhesive layer 51 is reduced, and the flatness of the surface of the input device 10 can be improved by reducing the influence of the step.

  The distance between the opposing tapered portion 32h and the inclined portion 33h (the width of the second recess 34) is preferably about 0.5 mm to 2.0 mm. In this way, insulation between the second wiring layer 32 and the first planarization layer 23 can be obtained reliably, and the input device 10 can be narrowed. The inclination angle of the tapered portion 32h is preferably in the range of 30 to 60 degrees. If the inclination angle is 30 degrees or more, the first recess 24 and the second recess 34 can be more reliably formed at a predetermined interval in plan view in the region where the adhesive layer 51 is laminated. Moreover, if the inclination angle is 60 degrees or less, the surface area of the input device 10 can be improved without increasing the area of the non-input region 12. In the present embodiment, the tapered portion 32h is formed at an inclination angle of about 45 degrees. Moreover, since the 2nd recessed part 34 is inclined and formed, the space | interval of the 1st recessed part 24 and the 2nd recessed part 34 is changing along the X1-X2 direction, and 0.1 mm-in this embodiment. It is formed with an interval of about 5.0 mm.

  In the input device 10 shown in FIGS. 7 and 8, the second transparent base material 30 is formed with the tapered portion 32h and the inclined portion 33h. However, the present invention is not limited to this mode, and the first transparent base material 20 is not limited thereto. Even when the first wiring layer 22 and the first planarization layer 23 are provided with a tapered portion 22h (not shown) and an inclined portion 23h (not shown), the same effect can be obtained.

  The first wiring layer 22, the first planarizing layer 23, the second wiring layer 32, and the second planarizing layer 33 use a conductive paste such as copper or silver, and a printing method such as a screen printing method or an inkjet printing method. It is formed by.

  In the case of the screen printing method, it is known that a saddle phenomenon occurs in which a peripheral portion of a printed pattern is raised. Usually, the increase in thickness due to the saddle phenomenon is as small as about 10 μm, and there is little occurrence of irregularities that impair the appearance quality of the input device. However, as shown in FIG. 14, when the saddle phenomenon occurs in the input device 110 of the conventional example, the thickness of the end portion 122a of the first wiring layer 122 and the end portion 132a of the second wiring layer 132 are overlapped, and the input device 110 The surface becomes convex. Moreover, in the area | region in which each wiring layer and each planarization layer are not formed, it is pulled to the 2nd transparent base material 130 side by the adhesive force of the adhesion layer 151, and the surface of the input device 110 becomes concave. As a result, the unevenness is more emphasized and easily visible. Moreover, as shown in FIG. 14, the decoration sheet 140 is laminated | stacked on the surface of the input device 110, and the colored decoration layer 141 is provided in the non-input area | region. The decorative layer 141 is provided for the purpose of preventing the wiring layer and the like from being visually recognized from the outside. However, the decorative layer 141 is not only colored, but also has various designs and glossiness, and has higher design. Things are often required. In a region where such a decoration layer 141 is provided, even a minute unevenness is easily visible to the operator, which may cause a problem in appearance quality.

  In the present embodiment, even when the second wiring layer 32 and the second planarization layer 33 are formed by a screen printing method, as shown in FIG. 7, the tapered portion 32h and the inclined portion 33h are provided. Therefore, the occurrence of the saddle phenomenon can be suppressed, and the flatness can be improved more effectively.

  In the present embodiment, when the second wiring layer 32 and the second planarization layer 33 are formed by a screen printing method, a screen mask made of a screen mesh and an emulsion can be used. In the screen mask, an opening made of a screen mesh is formed, and an emulsion is formed in other areas. The screen mask is disposed on the second transparent substrate 30 with a predetermined gap, and the conductive paste is pushed out through the opening of the screen mask by sliding the squeegee after applying the conductive paste on the screen mask. Thus, the second wiring layer 32 and the second planarization layer 33 are transferred onto the second transparent substrate 30.

  In this printing process, it is preferable to slide the squeegee along the protruding direction of the tapered portion 32h. For example, printing can be performed by sliding the squeegee in the direction from Y1 to Y2 along the Y1-Y2 direction shown in FIG. As a result, the pressure applied by the squeegee from the outer edge of the screen mask opening to the inside of the opening is made more uniform, so the thickness of the conductive paste is uniform from the outer edge to the inside of the tapered portion 32h. Printed. Therefore, it is possible to suppress the generation of saddles. Moreover, the generation of saddles can be more reliably suppressed by setting the inclination angle of the tapered portion 32h to 30 degrees or more.

  Therefore, even if the decorative layer 41 is laminated on the input surface side of the first transparent base material 20 as shown in FIG. 8, according to the input device 10 of the present embodiment, the surface flatness is improved. Can be improved, and good appearance quality can be obtained.

  FIG. 9 is a partially enlarged plan view of (a) the first transparent base material 20 and (b) the second transparent base material 30, showing a modification of the second embodiment. In the present modification, the second transparent base material 30 is formed with a tapered portion 32h and an inclined portion 33h, and a second concave portion 34 is formed. The first transparent base material 20 is formed with a protruding portion 22a protruding toward the first planarizing layer 23 at the X1 side end of the Y1-side wiring portion 22c. A notch 23a is formed with a predetermined distance from 22a. A first recessed portion 24 is formed by the protruding portion 22a and the cutout portion 23a facing each other. Even in such an embodiment, the first recess 24 and the second recess 34 are formed with a predetermined interval in a plan view, so that the flatness of the surface of the input device 10 can be improved. Even when the first wiring layer 22 and the first planarization layer 23 are formed by screen printing, the saddle phenomenon is relatively less likely to occur if the pattern is small. Therefore, the saddle phenomenon can be achieved by forming the protrusion 22a. Is effectively suppressed.

  FIG. 10 is a partially enlarged plan view of (a) the first transparent base material 20 and (b) the second transparent base material 30, showing another modification of the second embodiment. As shown in FIG. 10, a tapered portion 32 h and an inclined portion 33 h are formed on the second transparent substrate 30, and a tapered portion 22 h and an inclined portion 23 h are formed on the first transparent substrate 20. In this case, the tapered detail 22h and the tapered detail 32h are formed at different inclination angles. For example, the taper 22h is formed at an inclination angle of about 30 degrees, and the taper 32h is formed at an inclination angle of about 60 degrees. Even in such an aspect, since the first recess 24 and the second recess 34 are formed with a predetermined interval in a plan view in the region bonded by the adhesive layer 51, the surface of the input device 10 The flatness of the film can be improved. In this case, since the first recess 24 and the second recess 34 have different inclination angles, the distance between the first recess 24 and the second recess 34 changes along the X1-X2 direction. In this modification, the first recess 24 and the second recess 34 are formed with an interval of about 0.1 mm to 5.0 mm. Further, the first transparent base material 20 and the inclined portion 23 h are formed on the first transparent base material 20, and the tapered portion 32 h and the inclined portion 33 h are formed on the second transparent base material 30. It is possible to reliably suppress the occurrence of the saddle phenomenon in both of the second transparent base materials 30.

<Third Embodiment>
In the input device 10 of the first embodiment and the second embodiment, the configuration in which the first planarization layer 23 and the second planarization layer 33 are arranged in the non-input region 12 has been described. However, the present invention is not limited to this, and even if the planarization layer is not formed, the flatness of the surface of the input device 10 can be improved according to the present invention.

  FIG. 11 is a partially enlarged cross-sectional view of the input device 10 showing the third embodiment. The first step portion 25 between the first wiring layer 22 and the first transparent substrate 20, the second wiring layer 32, Sectional drawing of the 2nd level | step-difference part 35 vicinity with 2 transparent base materials 30 is shown.

  As shown in FIG. 11, also in the input device 10 of the present modification, the protruding portion 22 a is formed in the first wiring layer 22, whereby the first step portion 25 and the second step portion 35 are predetermined in plan view. Formed at intervals. By setting it as such a structure, the gap between the base materials adhere | attached by the adhesion layer 51 becomes small, and each level | step difference is absorbed by the viscoelasticity of the adhesion layer 51. FIG. Therefore, also in this modification, it becomes possible to reduce the influence of the step of the wiring layer, and when the substrates are bonded together via the adhesive layer 51, the flatness of the surface of the input device 10 can be improved. It becomes possible.

DESCRIPTION OF SYMBOLS 10 Input device 11 Input area 12 Non-input area 20 1st transparent base material 21 1st transparent electrode layer 22 1st wiring layer 22a Protrusion part 22h Tapered 23 1st planarization layer 23a Notch part 23h Inclined part 24 1st recessed part 25 1st step part 30 2nd transparent base material 31 2nd transparent electrode layer 32 2nd wiring layer 32a Protrusion part 32h Tapered 33 2nd planarization layer 33a Notch part 33h Inclined part 34 2nd recessed part 35 2nd step part 40 decorative sheet 41 decorative layer 50, 51 adhesive layer

Claims (7)

A first transparent base material and a second transparent base material which are arranged to face each other with a space;
A first transparent electrode layer and a second transparent electrode layer respectively formed in input regions of opposing surfaces of the first transparent substrate and the second transparent substrate;
A first wiring layer and a second wiring layer formed in connection with the first transparent electrode layer and the second transparent electrode layer, respectively, in a non-input region surrounding the input region;
A pressure-sensitive adhesive layer that bonds the first transparent base material and the second transparent base material laminated in the non-input area;
In the region where the adhesive layer is laminated, the first step portion formed by the first transparent base material and the first wiring layer, and the second transparent base material and the second wiring layer are formed. The input device, wherein the second step portion is formed with a predetermined interval in plan view. In the non-input area of the first transparent substrate, a first planarization layer is disposed with a predetermined distance from the first wiring layer, and in the non-input area of the second transparent substrate A second planarization layer is disposed at a predetermined distance from the second wiring layer,
A first recess formed by the opposing first wiring layer and the first planarization layer and a second recess formed by the opposing second wiring layer and the second planarization layer are planar. The input device according to claim 1, wherein the input device is formed with a predetermined interval visually.   The first wiring layer has a protrusion toward the first planarization layer, the first planarization layer has a notch facing the protrusion, and the protrusion and the notch facing each other. The input device according to claim 2, wherein the first concave portion is formed.   The second wiring layer has a protrusion toward the second planarization layer, the second planarization layer has a notch facing the protrusion, and the protrusion and the notch facing each other. The input device according to claim 2, wherein the second recess is formed. At least one of the first wiring layer and the second wiring layer is formed so as to be inclined toward at least one of the first planarization layer and the second planarization layer in a region where the adhesive layer is laminated. Has a tapered detail,
At least one of the first planarization layer and the second planarization layer has an inclined portion facing the tapered portion,
The input device according to claim 2, wherein the tapered portion and the inclined portion are formed with a predetermined interval.   The input device according to claim 5, wherein the tapered portion is formed at an inclination angle of 30 to 60 degrees facing at least one of the first planarization layer and the second planarization layer. . The input device according to claim 2, wherein the planarizing layer is made of the same material as the wiring layer.