JP5888964B2

JP5888964B2 - Touch panel

Info

Publication number: JP5888964B2
Application number: JP2011275841A
Authority: JP
Inventors: 麻衣子菊地
Original assignee: Fujitsu Component Ltd
Current assignee: Fujitsu Component Ltd
Priority date: 2011-12-16
Filing date: 2011-12-16
Publication date: 2016-03-22
Anticipated expiration: 2031-12-16
Also published as: JP2013125525A

Description

本発明は、タッチパネルに関するものである。 The present invention relates to a touch panel.

近年、パーソナルコンピュータ、携帯電話機など、様々な電子機器、情報端末機器の入力装置としてタッチパネルが広く用いられるようになっている。
タッチパネルは、パネル表面の所望位置を操作者がペンや指で触れることにより、表示装置に要求される二次元座標データを入力指示するものであり、特に、それ自体透明な構造を有するタッチパネルが、広く利用されている。
このようなタッチパネルのうち、抵抗膜方式のタッチパネルでは、ＩＴＯ（インジウムと錫の酸化物との合金）等の透明導電膜をもつ透明電極基板を上下に対向させ、空隙を介して外枠部分を固定して構成されている。
上下透明電極基板の一方には電位分布が印加され、もう一方の透明電極基板が電位検出の役割をなす。
このような上下透明電極基板のうちの上の透明電極基板を押下げることで、上下透明電極基板が接触した箇所の電位を検出することで押下げ位置を導く。上下の透明電極基板のそれぞれ電極面の外枠部分には導電インクによる印刷配線（電極部）が形成され、それら電極部を介して透明電極基板に電位分布を印加し、あるいは電位を検出するのである。 In recent years, touch panels have been widely used as input devices for various electronic devices and information terminal devices such as personal computers and mobile phones.
The touch panel is an instruction to input the two-dimensional coordinate data required for the display device when the operator touches a desired position on the panel surface with a pen or a finger. Widely used.
Among such touch panels, in a resistive film type touch panel, a transparent electrode substrate having a transparent conductive film such as ITO (alloy of indium and tin oxide) is vertically opposed, and an outer frame portion is formed through a gap. Fixed and configured.
A potential distribution is applied to one of the upper and lower transparent electrode substrates, and the other transparent electrode substrate serves to detect the potential.
By depressing the upper transparent electrode substrate among such upper and lower transparent electrode substrates, the depressing position is derived by detecting the potential at the location where the upper and lower transparent electrode substrates are in contact. Printed wiring (electrode part) made of conductive ink is formed on the outer frame part of each electrode surface of the upper and lower transparent electrode substrates, and potential distribution is applied to the transparent electrode substrate through these electrode parts, or the potential is detected. is there.

例えば特許文献１参照。このタッチパネルは、「ポリエーテルサルホンフィルムから成る透明な上基板２の下面に、ＩＴＯの透明電極４とその両端の銀ペーストの電極端子６ａ，６ｂと銀ペーストの引き廻し電極７，８と外部接続端子９が形成されたものである。ガラス板から成る下基板１２の上面にはＩＴＯの透明電極１４とその両端の銀ペーストの電極端子１６ａ，１６ｂが形成されている。ＩＴＯの透明電極１４の上には高さ５μｍで５ｍｍ間隔にドット状のスペーサー（図示省略）が形成されている。上基板２の電極端子６ａと電極端子６ｂとを結ぶ方向と下基板１２の電極端子１６ａと電極端子１６ｂとを結ぶ方向が直交するように重なり、両面テープ１７で貼り合わされている。下基板１２の電極端子１６ａ，１６ｂと上基板２の引き廻し電極８は両面テープ１７に設けられた間隙部分で銀ペーストによって導通がとられている。」と開示されている。 For example, see Patent Document 1. This touch panel is composed of a transparent upper substrate 2 made of a polyethersulfone film, an ITO transparent electrode 4, silver paste electrode terminals 6a and 6b at both ends, silver paste routing electrodes 7 and 8, and an external A connection terminal 9 is formed on the upper surface of a lower substrate 12 made of a glass plate, and an ITO transparent electrode 14 and silver paste electrode terminals 16a and 16b at both ends thereof are formed. A dot-like spacer (not shown) is formed at a height of 5 μm and spaced at an interval of 5 mm on the upper surface of the substrate 10. The direction connecting the electrode terminals 6a and 6b of the upper substrate 2 and the electrode terminals 16a and electrodes of the lower substrate 12 The terminals 16b are overlapped so as to be orthogonal to each other and are bonded together with a double-sided tape 17. The electrode terminals 16a and 16b of the lower substrate 12 and the routing electrode 8 of the upper substrate 2 are both surfaces. Conducted by the silver paste is taken at the gap portion provided in-loop 17. "And discloses.

ところで、上述のようなタッチパネルを用いた電子機器においては、近年はデザイン性も重要視されており、特に、全体が突出部を抑えた、いわゆるフラットサーフェス化が望まれている。そのために、タッチパネル一面に例えば意匠性印刷を施したカバーフィルム（加飾フィルム）を貼り付けることでフラットサーフェス化が試みられている。 By the way, in the electronic device using the touch panel as described above, in recent years, the design is also regarded as important, and in particular, so-called flat surface formation in which the entire protrusion is suppressed is desired. Therefore, flat surface formation is tried by sticking the cover film (decorative film) which performed the design printing, for example on the touch panel whole surface.

特開２００５−２６７０５８号公報Japanese Patent Laying-Open No. 2005-267058

しかしながら、特許文献１で開示されるタッチパネルでは、上基板の電極端子と電極端子とを結ぶ方向と下基板の電極端子と電極端子とを結ぶ方向が直交するように重なり、下基板の電極端子と上基板の引き廻し電極は両面テープにより貼り合わされて構成されているものの、引き廻し電極に対応してタッチパネル表面に反映される突出部の解消をしようとして、タッチパネルの一面に加飾フィルムを貼り付けたとしても、加飾フィルムに電極の部分による突出部が反映され、加飾フィルム表面に突出部が出現されてしまう。
また、タッチパネルに加飾フィルムを貼り合わせることにより、タッチパネル表面の入力操作を行う入力エリアにおいて、上下の透明電極部分を接触させてスイッチ操作を実行する際の押圧操作抵抗、負荷が増すことは避けられず、特に、タッチパネルの一面と加飾フィルムとの両面テープによる貼り合わせ位置のうち、タッチパネルの加飾フィルムとの貼り合わせ位置近傍の入力エリアの押圧操作抵抗が増大し、操作位置がずれる懸念がある。
よって、タッチパネルにカバーフィルムを貼ることで、貼り付け部位における導体に起因する隆起に対応してカバーフィルム外面に反映される凹凸を好適に修正することができるタッチパネルが求められている。 However, in the touch panel disclosed in Patent Document 1, the direction connecting the electrode terminals on the upper substrate and the electrode terminal on the lower substrate overlap with each other so that the direction connecting the electrode terminals on the lower substrate and the electrode terminals are orthogonal to each other. The routing electrode on the upper substrate is composed of double-sided tape, but a decorative film is pasted on one side of the touch panel to eliminate the protrusion reflected on the surface of the touch panel corresponding to the routing electrode. Even if, the protrusion part by the part of an electrode is reflected in a decoration film, and a protrusion part will appear on the decoration film surface.
In addition, by sticking a decorative film to the touch panel, avoid increasing the pressure operation resistance and load when performing the switch operation by bringing the upper and lower transparent electrodes into contact in the input area where the input operation is performed on the touch panel surface. In particular, of the bonding positions of the touch panel with the double-sided tape between the one side of the touch panel and the decorative film, the pressing operation resistance of the input area near the bonding position with the decorative film of the touch panel increases, and the operation position may be shifted. There is.
Therefore, the touch panel which can correct suitably the unevenness | corrugation reflected on the outer surface of a cover film corresponding to the protrusion resulting from the conductor in a sticking site | part by sticking a cover film on a touch panel is calculated | required.

本発明の一態様では、第１導電膜を一面に備える第１基板と、第１導電膜に対向かつ離間する第２導電膜を一面に備える第２基板と、第１基板及び第２基板の少なくとも一方の外縁に沿って形成され、第１導電膜及び第２導電膜のいずれか一方に接続される導体と、第２基板の他面に貼り合わされるカバーフィルムと、第２基板とカバーフィルムとの間に配置され、導体の厚みにより第２基板の他面に生ずる隆起を受容してカバーフィルムの外面を平坦化する隆起受容部と、を具備することを特徴とするタッチパネルを提供する。 In one embodiment of the present invention, a first substrate having a first conductive film on one surface, a second substrate having a second conductive film facing and spaced apart from the first conductive film on one surface, and the first substrate and the second substrate. A conductor formed along at least one outer edge and connected to one of the first conductive film and the second conductive film, a cover film bonded to the other surface of the second substrate, and the second substrate and the cover film And a bulge receiving portion that receives the bulge formed on the other surface of the second substrate due to the thickness of the conductor and flattens the outer surface of the cover film.

上記構成において、隆起受容部は、カバーフィルムを第２基板に貼り合わせる接着層に設けることができる。 In the above configuration, the bulge receiving portion can be provided in the adhesive layer that bonds the cover film to the second substrate.

また、隆起受容部は、電極部に対応するパターンで接着層に凹設される溝で構成することができる。 Further, the bulge receiving portion can be configured by a groove that is recessed in the adhesive layer in a pattern corresponding to the electrode portion.

また、隆起受容部は、電極部に対応するパターンで接着層を除去した空隙で構成することができる。 Further, the bulge receiving portion can be constituted by a gap from which the adhesive layer is removed with a pattern corresponding to the electrode portion.

また、隆起受容部は、カバーフィルムに積層される額縁状の装飾層に電極部に対応するパターンで凹設される溝を含む。 In addition, the ridge receiving portion includes a groove that is recessed in a pattern corresponding to the electrode portion in the frame-shaped decorative layer laminated on the cover film.

本発明の別の態様では、第１導電膜を一面に備える第１基板と、第１導電膜に対向かつ離間する第２導電膜を一面に備える第２基板と、第１基板及び第２基板の少なくとも一方の外縁に沿って形成され、第１導電膜及び第２導電膜のいずれか一方に接続される導体と、第２基板の他面に貼り合わされるカバーフィルムと、第２基板とカバーフィルムとの間に配置され、導体の厚みにより第２基板の他面に生ずる隆起に対応する形状を有してカバーフィルムの外面を凹凸化する擬似隆起部と、を具備することを特徴とするタッチパネルを提供する。 In another aspect of the present invention, a first substrate having a first conductive film on one side, a second substrate having a second conductive film on one side facing and spaced apart from the first conductive film, a first substrate and a second substrate A conductor formed along at least one outer edge of the first conductive film and connected to one of the first conductive film and the second conductive film; a cover film bonded to the other surface of the second substrate; and a second substrate and a cover A pseudo-bulged portion that is arranged between the film and has a shape corresponding to a bulge formed on the other surface of the second substrate due to the thickness of the conductor, and which makes the outer surface of the cover film uneven. Provide a touch panel.

上記構成において、擬似隆起部は、カバーフィルムを第２基板に貼り合わせる接着層に設けることができる。 In the above configuration, the pseudo raised portion can be provided in the adhesive layer that bonds the cover film to the second substrate.

また、擬似隆起部は、カバーフィルムに積層される額縁状の装飾層に設けることができる。 Further, the pseudo raised portion can be provided in a frame-shaped decorative layer laminated on the cover film.

本発明のさらに別の態様では、第１導電膜を一面に備える第１基板と、第１導電膜に対向かつ離間する第２導電膜を一面に備える第２基板と、第２基板の他面に貼り合わされるカバーフィルムと、第１導電膜の入力可能領域の一部を覆う位置でカバーフィルムに積層される額縁の装飾層と、入力可能領域の一部に沿って配置され、カバーフィルムの外面を局部的に突出させる肉厚部と、を具備することを特徴とするタッチパネルを提供する。 In yet another aspect of the present invention, a first substrate having a first conductive film on one surface, a second substrate having a second conductive film facing and spaced apart from the first conductive film on one surface, and the other surface of the second substrate. A cover film that is bonded to the cover film, a frame decorative layer that is laminated on the cover film at a position that covers a part of the input-enabled area of the first conductive film, and a part of the input-enabled area, There is provided a touch panel comprising: a thick portion that locally projects an outer surface.

上記構成において、第１基板及び第２基板の少なくとも一方の外縁に沿って形成され、第１導電膜及び第２導電膜のいずれか一方に接続される導体をさらに具備し、肉厚部は、導体の厚みにより第２基板の他面に生ずる隆起に対応する形状を有する。 In the above-described configuration, it further includes a conductor that is formed along at least one outer edge of the first substrate and the second substrate and is connected to one of the first conductive film and the second conductive film. It has a shape corresponding to a bulge generated on the other surface of the second substrate by the thickness of the conductor.

また、肉厚部は、カバーフィルムを第２基板に貼り合わせる接着層に設けることができる。 The thick portion can be provided in an adhesive layer that bonds the cover film to the second substrate.

さらに、肉厚部は、装飾層に設けることができる。 Furthermore, a thick part can be provided in a decoration layer.

本発明によれば、タッチパネルにカバーフィルムを貼ることで、貼り付け部位における導体に起因する隆起に対応してカバーフィルム外面に反映される表面の凹凸を好適に修正することができるタッチパネルを提供することができる。 ADVANTAGE OF THE INVENTION According to this invention, the touchscreen which can correct suitably the unevenness | corrugation of the surface reflected on the outer surface of a cover film corresponding to the protrusion resulting from the conductor in a sticking part is provided by sticking a cover film on a touchscreen. be able to.

本発明にかかるタッチパネルを示す模式的な分解斜視説明図である。It is typical disassembled perspective explanatory drawing which shows the touchscreen concerning this invention. 図１に示すタッチパネルの平面説明図である。It is a plane explanatory view of the touch panel shown in FIG. 図２示すタッチパネルのＡ−Ａ線に沿う模式的な切断断面説明図である。FIG. 3 is a schematic cross-sectional explanatory view taken along line AA of the touch panel shown in FIG. 2. 本発明にかかるタッチパネルの一実施形態を示す模式的な断面説明図である。It is typical sectional explanatory drawing which shows one Embodiment of the touchscreen concerning this invention. 本発明にかかるタッチパネルの別の実施形態を示す模式的な断面説明図である。It is typical sectional explanatory drawing which shows another embodiment of the touchscreen concerning this invention. 本発明にかかるタッチパネルの別の実施形態を示す模式的な断面説明図である。It is typical sectional explanatory drawing which shows another embodiment of the touchscreen concerning this invention. 本発明にかかるタッチパネルの別の実施形態のカバーフィルムの平面説明図である。It is a plane explanatory view of the cover film of another embodiment of the touch panel concerning the present invention. 図７に示すタッチパネルの模式的な断面説明図である。It is typical cross-sectional explanatory drawing of the touch panel shown in FIG. 本発明にかかるタッチパネルの別の実施形態のカバーフィルムの平面説明図である。It is a plane explanatory view of the cover film of another embodiment of the touch panel concerning the present invention. 図８に示すタッチパネルによる、押圧操作時の模式的な断面説明図である。It is typical cross-sectional explanatory drawing at the time of pressing operation with the touchscreen shown in FIG.

以下、本発明にかかるタッチパネルについて、一実施形態を挙げ、添付図に基づいて、詳細に説明する。
図１、図２にタッチパネル１を示す。
このタッチパネル１は、第１導電膜（後述）を一面に備える第１基板２ａと、第１導電膜に対向かつ離間する第２導電膜（後述）を一面に備える第２基板２ｂと、第２基板２ｂの他面に貼り合わされるカバーフィルム３とを有する。これら第１、第２基板２ａ、２ｂの一面に設けられる第１、第２導電膜は、例えばＩＴＯ（インジウムと錫の酸化物との合金）等の透明導電膜である。また、第１、第２導電膜が形成される第１、第２基板２ａ、２ｂの一面には、第１基板２ａ及び第２基板２ｂの少なくとも一方の外縁に沿って形成され、第１導電膜及び第２導電膜のいずれか一方に接続される導体４が形成される。これら第１、第２基板２ａ、２ｂは、第１及び第２導電膜を互いに対向させて空隙を隔てた状態で貼り合わせ手段（後述）により貼り合わされている。
そして、タッチパネル１には、第１基板２ａとカバーフィルム３との間に配置され、導体４の厚みにより第２基板２ｂの他面に生ずる隆起を受容してカバーフィルム３の外面を平坦化する隆起受容部（後述）が設けられている。 DESCRIPTION OF EMBODIMENTS Hereinafter, a touch panel according to the present invention will be described in detail with reference to the accompanying drawings with an embodiment.
1 and 2 show the touch panel 1.
The touch panel 1 includes a first substrate 2a having a first conductive film (described later) on one side, a second substrate 2b having a second conductive film (described later) facing and spaced apart from the first conductive film, and a second substrate 2b. And a cover film 3 bonded to the other surface of the substrate 2b. The first and second conductive films provided on one surface of the first and second substrates 2a and 2b are transparent conductive films such as ITO (an alloy of indium and tin oxide). In addition, the first and second substrates 2a and 2b on which the first and second conductive films are formed are formed along at least one outer edge of the first substrate 2a and the second substrate 2b. A conductor 4 connected to one of the film and the second conductive film is formed. The first and second substrates 2a and 2b are bonded to each other by a bonding means (described later) in a state where the first and second conductive films are opposed to each other and spaced from each other.
The touch panel 1 is disposed between the first substrate 2 a and the cover film 3, and receives the bumps generated on the other surface of the second substrate 2 b due to the thickness of the conductor 4 to flatten the outer surface of the cover film 3. A bulge receiving portion (described later) is provided.

カバーフィルム３には、第２基板２ｂの他面との貼り合わせ面における外枠部３Ｅに、額縁状の装飾層として印刷層３Ｐが形成されている。
印刷層３Ｐは、第１、第２基板２ａ、２ｂの一面に形成した導体４の形成領域２Ｅを越えて基板部２の中央寄りに、形成領域２Ｅを覆うように形成される。
なお、カバーフィルム３の印刷層３Ｐを除く中央寄りのエリアは、基板部２の入力エリアＩと合わせて透明状に維持されている。 In the cover film 3, a printing layer 3P is formed as a frame-shaped decoration layer on the outer frame portion 3E on the bonding surface with the other surface of the second substrate 2b.
The print layer 3P is formed so as to cover the formation region 2E near the center of the substrate portion 2 beyond the formation region 2E of the conductor 4 formed on one surface of the first and second substrates 2a and 2b.
The area near the center of the cover film 3 excluding the printing layer 3 </ b> P is kept transparent together with the input area I of the substrate unit 2.

第１、第２基板２ａ、２ｂの一面に形成した導体４は、第１基板２ａの形成領域２Ｅの縦方向二辺に沿って形成された電極部４ａ、４ｂと、第２基板２ｂの横方向二辺に沿って形成された電極部４ｃ、４ｄと、これら電極部４ａ、４ｂ及び４ｃ、４ｄと外部に信号を取り出すためのターミナル部（後述）とを電気的に接続する配線部４ａ’〜４ｄ’とを含んでいる（図２、３参照）。これら電極部４ａ、４ｂ及び４ｃ、４ｄ、並びに配線部４ａ’〜４ｄ’は、銀含有の導電性インク材料や、カーボン含有の導電性インク材料を用いて形成することができる。 The conductor 4 formed on one surface of the first and second substrates 2a and 2b includes electrode portions 4a and 4b formed along two longitudinal sides of the formation region 2E of the first substrate 2a, and the side of the second substrate 2b. Wiring portion 4a ′ for electrically connecting electrode portions 4c and 4d formed along two sides in the direction and these electrode portions 4a, 4b and 4c and 4d and a terminal portion (described later) for taking out signals to the outside. -4d '(see FIGS. 2 and 3). The electrode portions 4a, 4b and 4c, 4d and the wiring portions 4a 'to 4d' can be formed using a silver-containing conductive ink material or a carbon-containing conductive ink material.

第１基板２ａには、ガラス基板の他に、光透過率が高く、成形精度に優れ、硬質である樹脂材料が好適である。樹脂材料としては、例えばポリエチレンテレフタレート（ＰＥＴ）他、ポリエーテルサルフォン（ＰＥＳ）、ポリエーテルエーテルケトン（ＰＥＥＫ）、ポリカーボネート（ＰＣ）、ポリプロピレン（ＰＰ）、ポリアミド（ＰＡ）等が挙げられる。 For the first substrate 2a, in addition to the glass substrate, a resin material having high light transmittance, excellent molding accuracy, and being hard is suitable. Examples of the resin material include polyethylene terephthalate (PET), polyethersulfone (PES), polyetheretherketone (PEEK), polycarbonate (PC), polypropylene (PP), and polyamide (PA).

第２基板２ｂは、第１基板２ａと同等の面積の樹脂材料（例えばポリエチレンテレフタレートＰＥＴ）で構成され、ＩＴＯ（インジウムと錫の酸化物との合金）等の透明導電膜（図示省略）を真空蒸着法、スパッタリング法、ＣＶＤ法、印刷法等で成膜したもので構成される。 The second substrate 2b is made of a resin material (for example, polyethylene terephthalate PET) having an area equivalent to that of the first substrate 2a, and a transparent conductive film (not shown) such as ITO (an alloy of indium and tin oxide) is vacuumed. The film is formed by vapor deposition, sputtering, CVD, printing, or the like.

以上の第１、第２基板２ａ、２ｂは、空隙を隔てた状態で互いに形成領域２Ｅを介して貼り合わせ手段として例えば両面テープ５により貼り合わせて構成している（図３参照）。両面テープとしては、透明又は不透明のものを用いることができる。勿論、両面テープのほか、粘着剤を用いることもできる。
また、第１、第２基板２ａ、２ｂの形成領域２Ｅには、両面テープ５により貼り合わされてないターミナル部２Ｐが設けられている。ターミナル部２Ｐには、電極部４ａ、４ｂ及び４ｃ、４ｄに接続される配線部４ａ’〜４ｄ’の先端部が配設され、外部に信号を取り出すためのＦＰＣケーブル６が電気的に接続されている（図１参照）。 The first and second substrates 2a and 2b described above are configured to be bonded together by, for example, a double-sided tape 5 as a bonding means through a formation region 2E with a gap therebetween (see FIG. 3). As the double-sided tape, a transparent or opaque tape can be used. Of course, besides the double-sided tape, an adhesive can also be used.
Further, in the formation region 2E of the first and second substrates 2a and 2b, a terminal portion 2P that is not bonded by the double-sided tape 5 is provided. The terminal portion 2P is provided with tip portions of wiring portions 4a ′ to 4d ′ connected to the electrode portions 4a, 4b and 4c, 4d, and is electrically connected to an FPC cable 6 for taking out a signal to the outside. (See FIG. 1).

次に、貼り合わされた第１、第２基板２ａ、２ｂに光学用透明接着層７を用いて一体的に貼り合わされるカバーフィルム３について説明する。光学用透明接着層７は、ＯＣＡ（Optical Clear Adhesive）テープをいい、光学的に高透明性の接着剤転写テープを用いることができる。勿論、ＯＣＡテープの他、光学用透明粘着シートを用いることもできる。
カバーフィルム３は、樹脂材料として、例えばポリエチレンテレフタレート（ＰＥＴ）フィルムを用いている。
カバーフィルム３における外枠部３Ｅの印刷層３Ｐは、意匠性を考慮して、基板部２に形成された導体４である、電極部４ａ、４ｂ及び４ｃ、４ｄ、並びに配線部４ａ’〜４ｄ’が呈する色に合わせて同色に形成されている。例えば、電極部４ａ〜４ｄに銀含有の導電性インク材料を用いた場合は、印刷層３Ｐは、銀色に印刷して形成することができ、一方、電極部４ａ〜４ｄにカーボン含有の導電性インク材料を用いた場合は、印刷層３Ｐは、黒色に印刷して形成することができる。 Next, the cover film 3 that is integrally bonded to the bonded first and second substrates 2a and 2b using the optical transparent adhesive layer 7 will be described. The optical transparent adhesive layer 7 refers to an OCA (Optical Clear Adhesive) tape, and an optically highly transparent adhesive transfer tape can be used. Of course, an optical transparent adhesive sheet can be used in addition to the OCA tape.
The cover film 3 uses, for example, a polyethylene terephthalate (PET) film as a resin material.
The printed layer 3P of the outer frame portion 3E in the cover film 3 is an electrode portion 4a, 4b and 4c, 4d, and wiring portions 4a ′ to 4d, which are conductors 4 formed on the substrate portion 2 in consideration of design. It is formed in the same color according to the color exhibited by '. For example, when a silver-containing conductive ink material is used for the electrode portions 4a to 4d, the printed layer 3P can be formed by printing in silver, while the electrode portions 4a to 4d have a carbon-containing conductive property. When an ink material is used, the printing layer 3P can be formed by printing in black.

以上、タッチパネル１について概略的に説明したが、さらに細部構造についての具体例を図４〜図８に模式的に示し、説明する。
図４に示すタッチパネル１では、基板部２の形成領域２Ｅにおいて、第１基板２ａと第２基板２ｂとは、両面テープ５により空隙Ｇを隔てた状態で貼り合わされている。なお、図では、基板部２の形成領域２Ｅを両面テープ５により貼り合わせることにより、第２基板２ｂの他面２ｂｕには、電極部４ａの厚みが反映され、隆起２ｔが出現することを示している。また、空隙Ｇは、押込み操作を行う入力エリアＩとして構成され、図示は省略するが、ドットスペーサが配設されている。
そして、第２基板２ｂの他面２ｂｕとカバーフィルム３間には、第１基板２ａに形成した電極部４ａにより第２基板２ｂの他面２ｂｕに生ずる隆起２ｔを受容して、カバーフィルム３の外面３ｕを平坦化する隆起受容部１０が、印刷層３Ｐと、カバーフィルム３の貼り合わせ側全体に形成された光学用透明接着層７とに設けられている。すなわち、隆起受容部１０は、印刷層３Ｐ側に、印刷層３Ｐ全体が第一層３Ｐ_１、第二層３Ｐ_２に分けて形成されているところ、第２基板２ｂの他面２ｂｕに生ずる隆起２ｔに対応して第二層３Ｐ２を欠いて溝３Ｐｄとすると共に、光学用透明接着層７側に、隆起２ｔを受容する溝７ｄｐを設けることで構成されている。これにより、カバーフィルム３の外面３ｕに電極部４ａの厚みによって出現された隆起２ｔが反映されないようにカバーフィルム３の外面３ｕを平坦化している。 Although the touch panel 1 has been schematically described above, specific examples of the detailed structure are schematically shown in FIGS. 4 to 8 and described.
In the touch panel 1 shown in FIG. 4, the first substrate 2 a and the second substrate 2 b are bonded to each other with the gap G separated by the double-sided tape 5 in the formation region 2 </ b> E of the substrate portion 2. The figure shows that the thickness of the electrode portion 4a is reflected on the other surface 2bu of the second substrate 2b by bonding the formation region 2E of the substrate portion 2 with the double-sided tape 5, and the protrusion 2t appears. ing. In addition, the gap G is configured as an input area I for performing a pushing operation, and a dot spacer is provided although illustration is omitted.
And between the other surface 2bu of the 2nd board | substrate 2b and the cover film 3, the protrusion 2t which arises on the other surface 2bu of the 2nd board | substrate 2b by the electrode part 4a formed in the 1st board | substrate 2a is received, and the cover film 3 A bump receiving portion 10 for flattening the outer surface 3u is provided on the printing layer 3P and the optical transparent adhesive layer 7 formed on the entire bonding side of the cover film 3. That is, the bulge receiving portion 10 is formed on the other side 2bu of the second substrate 2b when the entire printed layer 3P is divided into the first layer 3P ₁ and the second layer 3P ₂ on the printed layer 3P side. Corresponding to 2t, the second layer 3P2 is omitted to form a groove 3Pd, and a groove 7dp for receiving the ridge 2t is provided on the optical transparent adhesive layer 7 side. Accordingly, the outer surface 3u of the cover film 3 is flattened so that the protrusion 2t that appears due to the thickness of the electrode portion 4a is not reflected on the outer surface 3u of the cover film 3.

以上のような貼り合わせ構造のタッチパネル１によれば、基板部２の形成領域２Ｅが、電極部４ａの厚みにより突出しても、第２基板２ｂの他面２ｂｕに生ずる隆起２ｔに対応して、カバーフィルム３側の外枠部３Ｅにおける印刷層３Ｐの第二層３Ｐ_２を欠き、光学用透明接着層７側に、隆起２ｔを受容する溝７ｄｐを設けることで隆起受容部１０を構成したので、電極部４ａの厚みによって出現された隆起２ｔを吸収することができ、カバーフィルム３の外面３ｕ上が、略平坦化され、タッチパネル１全体のフラットサーフェス化が損なうことはない。 According to the touch panel 1 having the bonded structure as described above, even if the formation region 2E of the substrate portion 2 protrudes due to the thickness of the electrode portion 4a, it corresponds to the protrusion 2t generated on the other surface 2bu of the second substrate 2b. lack second layer 3P ₂ of the printed layer 3P in the outer frame portion 3E of the cover film 3 side, the optical transparent adhesive layer 7 side, since it is configured a raised receiving portion 10 by providing grooves 7dp for receiving a raised 2t The protrusion 2t that appears due to the thickness of the electrode portion 4a can be absorbed, and the outer surface 3u of the cover film 3 is substantially flattened, so that the flat surface of the entire touch panel 1 is not impaired.

タッチパネル１は、タッチパネル１全体のフラットサーフェス化のために、図５に示すような貼り合わせ構造とすることもできる。
この場合では、カバーフィルム３側の外枠部３Ｅにおける印刷層３Ｐの厚さは変えず、カバーフィルム３の貼り合わせ側全体に形成される光学用透明接着層７を第１次接着層７ａ、第２次接着層７ｂと二段階に分けて形成し、第１次接着層７ａは印刷層３Ｐの厚さを含めてカバーフィルム３全体の厚さが一定となるようにし、第２次接着層７ｂを、第２基板２ｂ上に形成された電極部４ａに対応する部位を除去して、隆起受容部としての空隙７ｂｇとなるようにしている。 The touch panel 1 may have a bonded structure as shown in FIG. 5 in order to make the entire touch panel 1 into a flat surface.
In this case, the thickness of the printed layer 3P in the outer frame portion 3E on the cover film 3 side is not changed, and the optical transparent adhesive layer 7 formed on the entire bonding side of the cover film 3 is the primary adhesive layer 7a, The secondary adhesive layer 7b is formed in two stages, and the primary adhesive layer 7a is formed so that the entire thickness of the cover film 3 including the thickness of the printing layer 3P is constant, and the secondary adhesive layer 7b is removed from the portion corresponding to the electrode portion 4a formed on the second substrate 2b so as to be a gap 7bg as a bump receiving portion.

タッチパネル１は、タッチパネル１全体のフラットサーフェス化のために、図６に示すような貼り合わせ構造とすることもできる。
この場合では、カバーフィルム３側の外枠部３Ｅにおける印刷層３Ｐの厚さは変えず、カバーフィルム３の貼り合わせ側全体に形成される光学用透明接着層７を、第２基板２ｂ上に形成された電極部４ａに対応する部位を除去して、隆起受容部としての空隙７ｇとなるようにしている。 The touch panel 1 may have a bonded structure as shown in FIG. 6 in order to make the entire touch panel 1 into a flat surface.
In this case, the thickness of the printed layer 3P in the outer frame portion 3E on the cover film 3 side is not changed, and the optical transparent adhesive layer 7 formed on the entire bonding side of the cover film 3 is formed on the second substrate 2b. A portion corresponding to the formed electrode portion 4a is removed to form a gap 7g as a bump receiving portion.

このように、タッチパネル１は、図４〜図６に示すようにカバーフィルム３側を加工して貼り合わせることで、タッチパネル１全体のフラットサーフェス化を達成でき、外観上好ましい、タッチパネル１を提供することができる。 As described above, the touch panel 1 provides the touch panel 1 that can achieve a flat surface of the entire touch panel 1 by processing and bonding the cover film 3 side as shown in FIGS. be able to.

以上は、タッチパネル１全体のフラットサーフェス化のための貼り合わせ構造を挙げ、説明した。
タッチパネル１の外観性の向上を図るには、タッチパネル１全体のフラットサーフェス化に限らない。
すなわち、ここでは、導体４、すなわち電極部４ａの厚みにより基板部２の形成領域２Ｅに出現する直線状の隆起２ｔを、敢えてカバーフィルム３の外面３ｕにまで及ばせて隆起部２０とすると共に、この隆起部２０と平行にカバーフィルム３の外面３ｕを凹凸化する擬似隆起部２０ｐを設けている。擬似隆起部２０ｐは、カバーフィルム３の外枠部３Ｅ表面のうち、図中、垂直枠部３Ｅｖに、所定間隔毎に、平行に付与されている（図７、図８参照）。すなわち、カバーフィルム３の外枠部３Ｅ表面全体が電極部４ａの厚みによりカバーフィルム３の外面３ｕに出現する隆起部２０と同等の擬似隆起部２０ｐを、一定間隔ごとに付与することで、タッチパネル１全体のフラットサーフェス化を目指すのではなく、カバーフィルム３の外面３ｕの外観上の不自然さをなくすことを目指している。 The above has described and explained the bonding structure for flattening the entire touch panel 1.
In order to improve the appearance of the touch panel 1, the touch panel 1 is not limited to the flat surface.
That is, here, the linear protrusion 2t that appears in the formation region 2E of the substrate part 2 due to the thickness of the conductor 4, that is, the electrode part 4a, is extended to the outer surface 3u of the cover film 3 to form the protruding part 20. In parallel with the raised portion 20, a pseudo raised portion 20p for making the outer surface 3u of the cover film 3 uneven is provided. The pseudo raised portions 20p are provided in parallel to the vertical frame portion 3Ev of the surface of the outer frame portion 3E of the cover film 3 at predetermined intervals in the drawing (see FIGS. 7 and 8). That is, the touch panel is provided by providing pseudo-protrusions 20p equivalent to the protuberances 20 appearing on the outer surface 3u of the cover film 3 with the thickness of the electrode part 4a over the entire outer frame part 3E surface of the cover film 3 at regular intervals. The aim is not to make the entire surface flat, but to eliminate the unnatural appearance of the outer surface 3u of the cover film 3.

なお、擬似隆起部２０ｐは、カバーフィルム３の外枠部３Ｅ表面のうち、基板部２の形成領域２Ｅにおける導体４、すなわち、電極部４ａ〜４ｄ、並びに配線部４ａ’〜４ｄ’によってカバーフィルム３の外面３ｕに出現する凹凸の度合いが大きい方を優先して設けることもできる。すなわち、図９に示すように、電極部４ｃ、４ｄと、電極部４ａ〜４ｄにつながる配線部４ａ’〜４ｄ’が形成される水平枠部３Ｅｈ側に所定間隔毎に、直線状の光学用透明接着層８を設けることもできる。この場合、カバーフィルム３の外枠部３Ｅには、電極部４ｃ、４ｄの形成方向と平行に、擬似隆起部２０ｐが形成される。 The pseudo raised portion 20p is covered with the conductor 4, that is, the electrode portions 4a to 4d and the wiring portions 4a ′ to 4d ′ in the formation region 2E of the substrate portion 2 on the surface of the outer frame portion 3E of the cover film 3. It is also possible to preferentially provide the one having a larger degree of unevenness appearing on the outer surface 3u. That is, as shown in FIG. 9, linear optical elements are provided at predetermined intervals on the horizontal frame portion 3Eh side where the electrode portions 4c and 4d and the wiring portions 4a ′ to 4d ′ connected to the electrode portions 4a to 4d are formed. A transparent adhesive layer 8 can also be provided. In this case, a pseudo raised portion 20p is formed on the outer frame portion 3E of the cover film 3 in parallel with the forming direction of the electrode portions 4c and 4d.

以上のような擬似隆起部２０ｐは、図８に示すように、カバーフィルム３の光学用透明接着層７と基板部２の第２基板２ｂ間に、直線状の光学用透明接着層８を介在形成することで達成される。すなわち、第２基板２ｂ上に出現する直線状の隆起２ｔを挟んで、隆起２ｔに平行に光学用透明接着層８を形成する。 As shown in FIG. 8, the pseudo raised portion 20 p as described above has a linear optical transparent adhesive layer 8 interposed between the optical transparent adhesive layer 7 of the cover film 3 and the second substrate 2 b of the substrate portion 2. Achieved by forming. That is, the optical transparent adhesive layer 8 is formed in parallel with the ridge 2t with the linear ridge 2t appearing on the second substrate 2b interposed therebetween.

また、本発明にかかるタッチパネル１では、光学用透明接着層７と基板部２の第２基板２ｂ間に、カバーフィルム３に印刷層３Ｐに沿って外枠部３Ｅ内側に、カバーフィルム３の外面３ｕを局部的に突出させる肉厚部３０を形成することができる。
カバーフィルム３の印刷層３Ｐの下方の入力可能エリアＩは、タッチパネルとして使用可能なエリアである。この印刷層３Ｐに沿って外枠部３Ｅ内側に肉厚部３０を形成して第１、第２基板２ａ、２ｂを接触させてスイッチ操作を行うと、印刷層３Ｐを介して押込むことになるので、印刷層３Ｐの存在によって押込み荷重が増大する。
しかしながら、カバーフィルム３の外面３ｕに出現した擬似隆起部２０ｐを押込むことで、その押込み力によって、印刷層３Ｐに沿って外枠部３Ｅ内側に設けられた肉厚部３０を通じて第１、第２基板２ａ、２ｂが撓みやすくなり、スイッチ操作を実行することができる。
また、カバーフィルム３の印刷層３Ｐに沿って外枠部３Ｅ内側に肉厚部３０を設けたことで、特に、基板部２とカバーフィルム３との貼り合わせ位置近傍であるカバーフィルム３の外枠部３Ｅおよび、外枠部３Ｅの角部近傍の入力エリアＩが、押込み位置がずれることなく、押下げ操作時の撓み変形を拡大することができるので、必要操作力が増して操作性が低下するのを解消することができるという効果も奏することができる。 Further, in the touch panel 1 according to the present invention, the outer surface of the cover film 3 is disposed between the optical transparent adhesive layer 7 and the second substrate 2b of the substrate portion 2 on the cover film 3 along the printed layer 3P and inside the outer frame portion 3E. The thick part 30 which makes 3u protrude locally can be formed.
An input enabled area I below the print layer 3P of the cover film 3 is an area that can be used as a touch panel. When the thick portion 30 is formed inside the outer frame portion 3E along the printed layer 3P and the first and second substrates 2a and 2b are brought into contact with each other and the switch operation is performed, the thick layer 30 is pushed through the printed layer 3P. Therefore, the indentation load increases due to the presence of the printing layer 3P.
However, by pressing the pseudo raised portion 20p that has appeared on the outer surface 3u of the cover film 3, the first and first through the thick portion 30 provided inside the outer frame portion 3E along the printed layer 3P by the pressing force. The two substrates 2a and 2b are easily bent, and a switch operation can be executed.
Further, by providing the thick portion 30 inside the outer frame portion 3E along the printed layer 3P of the cover film 3, in particular, the outside of the cover film 3 that is in the vicinity of the bonding position between the substrate portion 2 and the cover film 3 Since the frame area 3E and the input area I in the vicinity of the corner of the outer frame section 3E can expand the bending deformation during the pressing operation without shifting the pressing position, the required operating force is increased and the operability is improved. The effect that it can eliminate that it falls can also be show | played.

以上、直線状の光学用透明接着層８によりカバーフィルム３の外面３ｕに擬似隆起部２０ｐを出現させる例を挙げて説明したが、光学用透明接着層８の他に、印刷層３Ｐの厚さを調整することでもカバーフィルム３の外面３ｕに擬似隆起部２０ｐを出現させることは可能である。 As described above, the example in which the pseudo raised portion 20p appears on the outer surface 3u of the cover film 3 by the linear optical transparent adhesive layer 8 has been described. However, in addition to the optical transparent adhesive layer 8, the thickness of the printing layer 3P is described. It is also possible to cause the pseudo raised portion 20p to appear on the outer surface 3u of the cover film 3 by adjusting.

１タッチパネル
２基板部
２ａ第１基板
２ｂ第２基板
２ｂｕ他面
２Ｅ形成領域
２Ｐターミナル部
２ｔ隆起
３カバーフィルム
３ｕ外面
３Ｅ外枠部
３Ｅｖ垂直枠部
３Ｅｈ水平枠部
３Ｐ印刷層
３Ｐ_１第一層
３Ｐ_２第二層
３Ｐｄ溝
４導体
４ａ〜４ｄ電極部
４ａ’〜４ｄ’ 配線部
５両面テープ
６ＦＰＣケーブル
７、８光学用透明接着層
７ａ第１次接着層
７ｂ第２次接着層
７ｂｇ空隙
７ｄｐ溝
７ｇ空隙
１０隆起受容部
２０隆起部
２０ｐ擬似隆起部
３０肉厚部
Ｉ入力エリア
Ｇ空隙 DESCRIPTION OF SYMBOLS 1 Touch panel 2 Board | substrate part 2a 1st board | substrate 2b 2nd board | substrate 2bu Other surface 2E formation area 2P Terminal part 2t Protrusion 3 Cover film 3u Outer surface 3E Outer frame part 3Ev Vertical frame part 3Eh Horizontal frame part 3P Print layer 3P ₁ 1st layer 3P ₂ Second layer 3 Pd groove 4 Conductor 4 a to 4 d Electrode part 4 a ′ to 4 d ′ Wiring part 5 Double-sided tape 6 FPC cable 7, 8 Optical transparent adhesive layer 7 a Primary adhesive layer 7 b Secondary adhesive layer 7 bg Gap 7 dp groove 7g Gap 10 Bump receiving part 20 Bump 20p Pseudo bump 30 Thick part I Input area G Gap

Claims

A first substrate having a first conductive film on one side;
A second substrate provided on one side with a second conductive film facing and spaced apart from the first conductive film;
An electrode part formed along an outer edge of at least one of the first substrate and the second substrate and connected to one of the first conductive film and the second conductive film;
A cover film bonded to the other surface of the second substrate;
A bump receiving portion that is disposed between the second substrate and the cover film and receives a bump generated on the other surface of the second substrate due to the thickness of the electrode portion ;
The raised receiving portion is provided in an adhesive layer that bonds the cover film to the second substrate,
The touch panel , wherein the adhesive layer has the cover film bonded to the entire surface of the second substrate .

The raised receiving portion is a groove which is recessed into the adhesive layer, the touch panel according to claim 1.

A secondary adhesive layer disposed between the adhesive layer and the second substrate;
The touch panel according to claim 1 , wherein the bulge receiving portion is a gap from which a part of the secondary adhesive layer is removed.

The touch panel as set forth in claim 1, wherein the raised receiving part includes a groove that is recessed in a pattern corresponding to the electrode part in a frame-like decorative layer laminated on the cover film.

A first substrate having a first conductive film on one side;
A second substrate provided on one side with a second conductive film facing and spaced apart from the first conductive film;
A conductor formed along an outer edge of at least one of the first substrate and the second substrate and connected to one of the first conductive film and the second conductive film;
A cover film bonded to the other surface of the second substrate;
A pseudo ridge disposed between the second substrate and the cover film, having a shape corresponding to a ridge formed on the other surface of the second substrate due to the thickness of the conductor, and making the outer surface of the cover film uneven. And
A touch panel comprising:

The touch panel as set forth in claim 5 , wherein the pseudo raised portion is provided in an adhesive layer that bonds the cover film to the second substrate.

The touch panel according to claim 5 , wherein the pseudo raised portion is provided in a frame-like decorative layer laminated on the cover film.

A first substrate having a first conductive film on one side;
A second substrate provided on one side with a second conductive film facing and spaced apart from the first conductive film;
A cover film bonded to the other surface of the second substrate;
A decorative layer of a frame that is laminated on the cover film at a position covering a part of the input-enabled area of the first conductive film;
A thick portion disposed between the decorative layer of the frame and the second substrate ;
A touch panel comprising:

A conductor formed along an outer edge of at least one of the first substrate and the second substrate and connected to one of the first conductive film and the second conductive film;
The touch panel according to claim 8 , wherein the thick portion has a shape corresponding to a bulge generated on the other surface of the second substrate due to the thickness of the conductor.

The touch panel according to claim 8 or 9 , wherein the thick portion is provided in an adhesive layer that bonds the cover film to the second substrate.

The touch panel according to claim 8 or 9 , wherein the thick portion is provided in the decorative layer.