JP2012144384A - 導電性酸化亜鉛膜の製造方法 - Google Patents
導電性酸化亜鉛膜の製造方法 Download PDFInfo
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 title claims abstract description 147
- 239000011787 zinc oxide Substances 0.000 title claims abstract description 72
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 72
- 239000013078 crystal Substances 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 150000007524 organic acids Chemical class 0.000 claims abstract description 27
- 238000000151 deposition Methods 0.000 claims abstract description 16
- 230000008021 deposition Effects 0.000 claims abstract description 8
- 239000007791 liquid phase Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 35
- 239000007921 spray Substances 0.000 claims description 13
- 238000001556 precipitation Methods 0.000 claims description 12
- 230000001678 irradiating effect Effects 0.000 claims description 6
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 3
- SEACYXSIPDVVMV-UHFFFAOYSA-L eosin Y Chemical compound [Na+].[Na+].[O-]C(=O)C1=CC=CC=C1C1=C2C=C(Br)C(=O)C(Br)=C2OC2=C(Br)C([O-])=C(Br)C=C21 SEACYXSIPDVVMV-UHFFFAOYSA-L 0.000 claims description 3
- 230000009477 glass transition Effects 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 239000011976 maleic acid Substances 0.000 claims description 3
- ACTRVOBWPAIOHC-UHFFFAOYSA-N succimer Chemical compound OC(=O)C(S)C(S)C(O)=O ACTRVOBWPAIOHC-UHFFFAOYSA-N 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- 150000001735 carboxylic acids Chemical class 0.000 claims 2
- 238000006243 chemical reaction Methods 0.000 abstract description 14
- 230000007613 environmental effect Effects 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 63
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 16
- 235000011114 ammonium hydroxide Nutrition 0.000 description 16
- 239000007864 aqueous solution Substances 0.000 description 14
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 description 11
- 239000000243 solution Substances 0.000 description 10
- 150000003751 zinc Chemical class 0.000 description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 8
- 239000012528 membrane Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 239000000969 carrier Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000000635 electron micrograph Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910021480 group 4 element Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000001699 photocatalysis Effects 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- 206010021143 Hypoxia Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- -1 organic acid salt Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 229940038773 trisodium citrate Drugs 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G9/00—Compounds of zinc
- C01G9/02—Oxides; Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1233—Organic substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1229—Composition of the substrate
- C23C18/1245—Inorganic substrates other than metallic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1291—Process of deposition of the inorganic material by heating of the substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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Abstract
【解決手段】クエン酸の存在下、液相析出法によって酸化亜鉛(ZnO)の結晶を基板上に析出させる。クエン酸がZnOの(0001)面の表面に吸着することによって、析出反応において結晶のc軸方向の異方性成長が抑制され、基板表面に緻密な結晶膜が形成される。その後、形成されたZnO結晶膜に対して紫外線を照射することによって、膜内に取り込まれた有機酸を光分解する。その結果、有機酸にトラップされていたキャリアが結晶膜内に放出され、ZnO結晶膜に好適な導電性が付与される。
【選択図】図1
Description
亜鉛塩を純水に溶解して亜鉛塩水溶液(亜鉛イオン水溶液)を調整する。本発明における亜鉛塩としては、硝酸亜鉛[Zn(NO3)2]、硫酸亜鉛[ZnSO4]、塩化亜鉛[ZnCl2]などを挙げることができる。たとえば、亜鉛塩として硝酸亜鉛[Zn(NO3)2]を用いた場合、硝酸亜鉛水溶液においては、下記式(1)に示すように、亜鉛が二価のイオンとして電離する。
アンモニア水(水酸化アンモニウム水溶液)を調整する。アンモニア水は、下記式(2)に示す平衡状態をとる。
工程1で調整した亜鉛塩水溶液と工程2で調整した有機酸含有アンモニア水とを混合して析出反応液とする。析出反応液は、下記式(3)に示す平衡状態をとってZn(NH3)4 2+の過飽和状態となる。
次に、上述した析出反応液を基板に接触させた状態で加熱して適切な成膜温度(50℃〜100℃)にまで昇温する。すると、析出反応系の過飽和状態が加熱によって変化し、上記式(4)に示すようにZnOが基板の表面に直接析出する。
工程4においては、基板上にZnO結晶膜が形成される際、膜内に有機酸が取り込まれる。その結果、結晶膜内に有機酸に由来する欠陥が生じ、その欠陥がキャリアを生成する。しかし、生成されたキャリアは有機酸にそのままトラップされるため、工程3が終了した時点のZnO結晶膜は、ほとんど導電性を示さない。よって、工程5においては、ZnOの光触媒活性を利用して結晶膜内に取り込まれた有機酸を除去する。すなわち、ZnO結晶膜に対して紫外線を照射することによって、膜内の有機酸を光分解する。その結果、有機酸にトラップされていたキャリアが結晶膜内に放出され、ZnO結晶膜に好適な導電性が付与される。なお、使用する紫外線は、結晶膜内の全体にわたって到達して有機酸をくまなく分解することができるように、透過率などを考慮して適切な波長光を選択することが好ましい。
亜鉛塩水溶液として、10 mM硝酸亜鉛(Zn(NO3)2)水溶液を調製した。これとは別に、28%アンモニア水(NH3)にクエン酸三ナトリウムを添加してクエン酸含有アンモニア水を調整した(アンモニア濃度:0.89 M)。なお、本実験においては、クエン酸の濃度が異なる4種類のクエン酸含有アンモニア水(クエン酸濃度/無添加、0.5 mM、2.0 mM、10 mM)を用意した。
次に、クエン酸濃度の異なるクエン酸含有アンモニア水(0.5 mM、2.0 mM、10 mM)を使用して作製した3種類の酸化亜鉛膜のそれぞれに対して、ブラックライトを使用して300〜400nmのブロードな波長の紫外線を照射した。なお、照射時間については、複数の時間条件(0min,30min,90min,180min,360min)を設けた。その後、それぞれの酸化亜鉛膜について室温で二端子抵抗測定を行った。図5は、3種類の酸化亜鉛膜のそれぞれについて、紫外線の照射時間(min)と比抵抗(Ω・cm)の関係を示した図である。
12,14…スプレーノズル
16…硝酸亜鉛水溶液
18…クエン酸含有アンモニア水
20…基板
100 スピンスプレー装置
Claims (7)
- 導電性の酸化亜鉛膜を製造する方法であって、
有機酸の存在下、液相析出法によって酸化亜鉛膜を基板に析出させる析出工程と、
前記基板に紫外線を照射して前記酸化亜鉛膜から前記有機酸を除去する工程と、
を含む製造方法。 - 前記有機酸は、カルボン酸である、請求項1に記載の製造方法。
- 前記カルボン酸は、クエン酸、マレイン酸、ジメルカプトコハク酸、フェノールフタレイン、eosin-Yからなる群から選択される、請求項2に記載の製造方法。
- 前記析出工程は、スピンスプレー法によって行われる、請求項1〜3のいずれか一項に記載の製造方法。
- 前記基板は、前記析出工程の温度条件よりも低いガラス転移点を有する材料によって形成される、1〜4のいずれか一項に記載の製造方法。
- 有機酸の存在下、液相析出法によって酸化亜鉛膜を基板に析出させる析出工程と、
前記基板に紫外線を照射して前記酸化亜鉛の結晶膜内から前記有機酸を除去する工程とから製造されうる導電性酸化亜鉛膜。 - 請求項6に記載の導電性酸化亜鉛膜を備える透明電極。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011002026A JP2012144384A (ja) | 2011-01-07 | 2011-01-07 | 導電性酸化亜鉛膜の製造方法 |
| PCT/JP2012/000029 WO2012093658A1 (ja) | 2011-01-07 | 2012-01-05 | 導電性酸化亜鉛膜の製造方法 |
| US13/978,082 US20140008109A1 (en) | 2011-01-07 | 2012-01-05 | Method for producing conductive zinc oxide film |
| EP12732208.9A EP2660204A4 (en) | 2011-01-07 | 2012-01-05 | Method for producing conductive zinc oxide film |
Applications Claiming Priority (1)
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| JP2011002026A JP2012144384A (ja) | 2011-01-07 | 2011-01-07 | 導電性酸化亜鉛膜の製造方法 |
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| JP2012144384A true JP2012144384A (ja) | 2012-08-02 |
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| JP2011002026A Pending JP2012144384A (ja) | 2011-01-07 | 2011-01-07 | 導電性酸化亜鉛膜の製造方法 |
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| Country | Link |
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| US (1) | US20140008109A1 (ja) |
| EP (1) | EP2660204A4 (ja) |
| JP (1) | JP2012144384A (ja) |
| WO (1) | WO2012093658A1 (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103523818A (zh) * | 2013-10-31 | 2014-01-22 | 东南大学 | 一种高度取向ZnO纳米锥阵列结构材料的制备方法 |
| CN103603040A (zh) * | 2013-10-31 | 2014-02-26 | 东南大学 | 一种制备ZnO纳米锥阵列的低温液相生长方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017075077A (ja) * | 2015-10-16 | 2017-04-20 | Necトーキン株式会社 | 酸化亜鉛膜の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001011642A (ja) * | 1999-06-25 | 2001-01-16 | Osaka City | 透明導電性酸化亜鉛皮膜及びその作製方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4110752B2 (ja) * | 2001-06-28 | 2008-07-02 | 富士ゼロックス株式会社 | 基材上に設けた透明導電膜を低抵抗化する方法。 |
| US6896981B2 (en) * | 2001-07-24 | 2005-05-24 | Bridgestone Corporation | Transparent conductive film and touch panel |
| JP4807933B2 (ja) * | 2003-12-17 | 2011-11-02 | 株式会社アルバック | 透明導電膜の形成方法及び透明電極 |
| TW200834610A (en) * | 2007-01-10 | 2008-08-16 | Nitto Denko Corp | Transparent conductive film and method for producing the same |
| EP2115185B1 (en) * | 2007-02-26 | 2015-11-11 | LG Chem, Ltd. | Conductive laminated body and method for preparing the same |
| JP4947051B2 (ja) * | 2007-02-26 | 2012-06-06 | 株式会社村田製作所 | 導電膜および導電膜の製造方法 |
| JP4537434B2 (ja) * | 2007-08-31 | 2010-09-01 | 株式会社日立製作所 | 酸化亜鉛薄膜、及びそれを用いた透明導電膜、及び表示素子 |
| EP2071586A4 (en) * | 2007-09-05 | 2014-03-05 | Murata Manufacturing Co | TRANSPARENT CONDUCTIVE FILM AND METHOD FOR PRODUCING A TRANSPARENT CONDUCTIVE FILM |
| JP5432501B2 (ja) * | 2008-05-13 | 2014-03-05 | 日東電工株式会社 | 透明導電フィルム及びその製造方法 |
| EP2484633B1 (en) * | 2009-09-28 | 2016-12-21 | Dai-Ichi Kogyo Seiyaku Co., Ltd. | Metal-salt-containing composition, substrate, and method for producing substrate |
-
2011
- 2011-01-07 JP JP2011002026A patent/JP2012144384A/ja active Pending
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2012
- 2012-01-05 EP EP12732208.9A patent/EP2660204A4/en not_active Withdrawn
- 2012-01-05 WO PCT/JP2012/000029 patent/WO2012093658A1/ja not_active Ceased
- 2012-01-05 US US13/978,082 patent/US20140008109A1/en not_active Abandoned
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001011642A (ja) * | 1999-06-25 | 2001-01-16 | Osaka City | 透明導電性酸化亜鉛皮膜及びその作製方法 |
Non-Patent Citations (4)
| Title |
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| JPN6012015708; Hajime Wagata et al.: '"Control of the Microstructure and Crystalline Orientation of ZnO Films on a Seed-free Glass Substra' Crystal Growth Design Vol.10, No.11, 2010, p.4968-4975 * |
| JPN6012015711; 我田元 他: '"スピンスプレー法による酸化亜鉛膜の作製と評価"' 日本セラミックス協会第22回秋季シンポジウム講演予稿集 , 20090916, p.342下段 * |
| JPN6012015714; 堀茂雄 他: '"電解析出法による多孔質酸化亜鉛薄膜の構造制御とその電池特性評価"' 電気化学会第77回大会講演要旨集 , 20100326, p.107上段 * |
| JPN6012015717; Chueh-Jung HUANG et al.: '"Characteristics of ZnO Thin Films Prepared by Acidic Sol Method"' Japanese Journal of Applied Physics Vol.46, No.8A, 2007, p.5264-5268 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103523818A (zh) * | 2013-10-31 | 2014-01-22 | 东南大学 | 一种高度取向ZnO纳米锥阵列结构材料的制备方法 |
| CN103603040A (zh) * | 2013-10-31 | 2014-02-26 | 东南大学 | 一种制备ZnO纳米锥阵列的低温液相生长方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2660204A1 (en) | 2013-11-06 |
| WO2012093658A1 (ja) | 2012-07-12 |
| US20140008109A1 (en) | 2014-01-09 |
| EP2660204A4 (en) | 2017-07-19 |
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