JP2012134479A - 応力変調iii−v族半導体装置および関連方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 66
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 94
- 239000000203 mixture Substances 0.000 claims description 45
- 229910052782 aluminium Inorganic materials 0.000 claims description 27
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 13
- 239000010703 silicon Substances 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 230000005669 field effect Effects 0.000 claims description 3
- 229910002704 AlGaN Inorganic materials 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 description 13
- 230000006911 nucleation Effects 0.000 description 13
- 238000010899 nucleation Methods 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 230000015556 catabolic process Effects 0.000 description 9
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 6
- 229910002601 GaN Inorganic materials 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- AUCDRFABNLOFRE-UHFFFAOYSA-N alumane;indium Chemical compound [AlH3].[In] AUCDRFABNLOFRE-UHFFFAOYSA-N 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 229910021478 group 5 element Inorganic materials 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- H—ELECTRICITY
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
- H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
- H01L29/7787—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT with wide bandgap charge-carrier supplying layer, e.g. direct single heterostructure MODFET
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
- H01L29/205—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66431—Unipolar field-effect transistors with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
Abstract
【解決手段】III−V族半導体装置は、基板102の上およびIII−V族半導体装置の活性領域112を支持するバッファ層110の下に配置された組成傾斜本体108を備える。組成傾斜本体108は、基板102に圧縮応力を与える第1の領域を含む。組成傾斜本体108は、第1の領域上に応力変調領域をさらに含み、その応力変調領域は基板102に引張応力を与える。
【選択図】図1
Description
本願において、“III−V族半導体”は、少なくとも1つのIII族元素と少なくとも1つのV族元素とを含む化合物半導体を指し、例えば、窒化ガリウム(GaN)、砒化ガリウム(GaAs)、窒化インジウムアルミニウムガリウム、窒化インジウムガリウムおよび同様のものであるが、それらに限定されない。同様に、“III族窒化物半導体”は、窒素と少なくとも1つのIII族元素とを含む化合物半導体を指し、例えば、GaN、AlGaN、InN、InGaN、InAlGaNおよび同様のものであるが、それらに限定されない。
Claims (20)
- III−V族半導体装置であって、
基板の上および前記III−V族半導体装置の活性領域を支持するバッファ層の下に配置された組成傾斜本体を備え、
前記組成傾斜本体は、前記基板に圧縮応力を与える第1の領域と、該第1の領域上に応力変調領域とを含み、前記応力変調領域は前記基板に引張応力を与えることを特徴とするIII−V族半導体装置。 - 前記組成傾斜本体は前記応力変調領域上に第2の領域を含み、前記第2の領域は前記基板に圧縮応力を与える、請求項1に記載のIII−V族半導体装置。
- 前記第1の領域は第1のアルミニウム含有量を有する応力層を含み、前記応力変調領域は前記応力層の前記アルミニウム含有量より大きい第2のアルミニウム含有量を有する応力変調層を含む、請求項1に記載のIII−V族半導体装置。
- 前記基板はシリコンからなる、請求項1に記載のIII−V族半導体装置。
- 前記組成傾斜本体はAlGaNの組成傾斜層を備える、請求項1に記載のIII−V族半導体装置。
- 前記バッファ層はIII−V族半導体材料の実質的に連続的な層を備える、請求項1に記載のIII−V族半導体装置。
- 前記バッファ層はGaNからなる、請求項1に記載のIII−V族半導体装置。
- 前記バッファ層の厚さは約1.3μmより大きい、請求項1に記載のIII−V族半導体装置。
- 前記活性領域はヘテロ接合電界効果トランジスタ(HFET)を備える、請求項1に記載のIII−V族半導体装置。
- III−V族半導体装置を製造する方法であって、該方法は、
前記III−V族半導体装置のための基板を準備する工程と、
前記基板に圧縮応力を与えるように、前記基板上に組成傾斜本体の第1の領域を形成する工程と、
前記第1の領域上に前記組成傾斜本体の応力変調領域を形成する工程であって、前記応力変調領域は前記基板に引張応力を与える、工程と、
を含むことを特徴とするIII−V族半導体装置の製造方法。 - 前記応力変調領域上に前記組成傾斜本体の第2の領域を形成する工程をさらに含み、前記第2の領域は前記基板に圧縮応力を与える、請求項10に記載の方法。
- 前記第1の領域を形成する工程は、前記基板上に第1のアルミニウム含有量を有する第1の応力層を形成する工程と、前記第1の応力層上に前記第1のアルミニウム含有量より小さい第2のアルミニウム含有量を有する第2の応力層を形成する工程とを含む、請求項10に記載の方法。
- 前記応力変調領域を形成する工程は、前記第2のアルミニウム含有量より大きい第3のアルミニウム含有量を有する応力変調層を形成する工程を含む、請求項12に記載の方法。
- 前記組成傾斜本体上に実質的に連続的なバッファ層を形成し、該実質的に連続的なバッファ層上に活性領域を形成する工程をさらに含む、請求項10に記載の方法。
- 前記実質的に連続的なバッファ層の厚さは1.3μmより大きい、請求項14に記載の方法。
- III−V族半導体装置であって、
基板の上および前記III−V族半導体装置の活性領域を支持するバッファ層の下に配置された組成傾斜本体を備え、
前記組成傾斜本体は、第1のアルミニウム含有量を有する第1の応力層と、前記第1のアルミニウム含有量より小さい第2のアルミニウム含有量を有する第2の応力層と、前記第2の応力層の上に形成された、前記第2のアルミニウム含有量より大きい第3のアルミニウム含有量を有する応力変調層とを有することを特徴とするIII−V族半導体装置。 - 前記組成傾斜本体は、前記応力変調層上に、前記第3のアルミニウム含有量より小さいアルミニウム含有量を有する別の応力層をさらに含む、請求項16に記載のIII−V族半導体装置。
- 前記第3のアルミニウム含有量は前記第1のアルミニウム含有量より大きい、請求項16に記載のIII−V族半導体装置。
- 前記第1の応力層、前記第2の応力層および前記応力変調層の各々はAlGaNを含む、請求項16に記載のIII−V族半導体装置。
- 前記活性領域はヘテロ接合電界効果トランジスタ(HFET)を備える、請求項16に記載のIII−V族半導体装置。
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US12/928,946 | 2010-12-21 | ||
US12/928,946 US20120153351A1 (en) | 2010-12-21 | 2010-12-21 | Stress modulated group III-V semiconductor device and related method |
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JP2012134479A true JP2012134479A (ja) | 2012-07-12 |
JP5731367B2 JP5731367B2 (ja) | 2015-06-10 |
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JP2019117935A (ja) * | 2013-05-03 | 2019-07-18 | 日本テキサス・インスツルメンツ合同会社 | Iii−窒化物トランジスタレイアウト |
WO2023127520A1 (ja) * | 2021-12-27 | 2023-07-06 | ローム株式会社 | 窒化物半導体装置およびその製造方法 |
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US20120153351A1 (en) | 2012-06-21 |
EP2469583A3 (en) | 2013-09-18 |
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